TM8706 tenx technology 4 Bit Microcontroller GENERAL DESCRIPTION The TM8706 is an embedded high-performance 4-bit microcomputer with LCD/LED driver. It contains all the necessary functions, such as 4-bit parallel processing ALU, ROM, RAM, I/O ports, timer, clock generator, dual clock operation, Resistance to Frequency Converter(RFC), EL panel driver, LCD driver, look-up table, watchdog timer and key matrix scanning circuitry in a signal chip. FEATURE 1. Low power dissipation. 2. Powerful instruction set (178 instructions). Binary addition, subtraction, BCD adjust, logical operation in direct and index addressing mode. Single-bit manipulation (set, reset, decision for branch). Various conditional branch. 16 working registers and manipulation. Table look-up. LCD driver data transfer. 3. Memory capacity. ROM capacity RAM capacity 4096 512 x 16 bits. x 4 bits. 4. LCD driver output. 9 common outputs and 41 segment outputs (up to drive 369 LCD segments). 1/2 Duty, 1/3 Duty, 1/4 Duty, 1/5 Duty, 1/6Duty, 1/7Duty, 1/8Duty or 1/9Duty is selected by MASK option. 1/2 Bias, 1/3 Bias or 1/4 Bias is selected by MASK option. Single instruction to turn off all segments. COM5~9,SEG1~41 could be defined as CMOS or P_open drain type output by mask option. 5. Input/output ports. Port IOA 4 pins (with internal pull-low), muxed with SEG24~SEG27. Port IOB 4 pins (with internal pull-low). muxed with SEG28~SEG31 Port IOC 4 pins (with internal pull-low, low-level-hold), muxed with SEG32 ~ SEG35. IOC port had built in the input signal chattering prevention circuitry. Port IOD 4 pins (with internal pull-low), muxed with SEG36 ~ SEG39. IOD port had built in the input signal chattering prevention circuitry. 6. 8 level subroutine nesting. 7. Interrupt function. External factors 4 (INT pin, Port IOC, IOD & KI input). tenx technology, inc. Rev 2.4 03/12/01 TM8706 Internal factors 4 (Pre-Divider, Timer1, Timer2 & RFC). 8. Built-in EL-light driver. ELC, ELP (Muxed with SEG28, SEG29). 9. Built in Alarm, clock or single tone melody generator. BZB, BZ (Muxed with SEG30, SEG31). 10. Built-in resistance to frequency converter. CX, RR, RT, RH (Muxed with SEG24 ~ SEG27). 11. Built in key matrix scanning function. K1~K16 (Shared with SEG1~SEG16). KI1~KI4 (Muxed with SEG32 ~ SEG35). 12. Two 6-bit programmable timer with programmable clock source. 13. Watch dog timer. 14. Built-in Voltage doubler, halver, tripler, quartic charge pump circuit. 15. Dual clock operation slow clock oscillation can be defined as X’tal or external RC type oscillator by mask option. fast clock oscillation can be defined as 3.58MHz ceramic resonator, internal R or external R type oscillator by mask option. 16. HALT function. 17. STOP function. APPLICATION Timer / Calendar / Calculator / Thermometer BLOCK DIAGRAM 2 tenx technology, inc. Rev 2.4 03/12/01 TM8706 B1-4 ELC, ELP BZB,BZ A1-4 CX RR,RT,RH C1-4 KI1~4 D1-4 B-PORT EL DRIVER ALARM A-PORT RFC C-PORT KEY-IN D-PORT COM1-9 SEG1-41 VDD1-4 LCD DRIVER SEGMENT PLA 4 BITS DATA BUS FREQUENCY GENERATOR PREDIVIDER INDEX ROM 256(16-N) X 8 BITS CONTROL CIRCUIT CUP0,1,2 XTIN,OUT CFIN,OUT RESET INT INSTRUCTION DECODER 8 LEVELS STACK 6 BITS PRESET TIMER 1 & 2 OSCILLATOR DATA RAM 512 X 4 BITS ALU 12 BITS PROGRAM COUNTER PROGRAM ROM (2048+128N) X 16 BITS TM8706 BLOCK DIAGRAM N:0->16 PAD DIAGRAM 3 tenx technology, inc. Rev 2.4 03/12/01 TM8706 50 60 40 66 1 30 10 20 The substrate of chip should be connected to GND. PAD COORDINATE 4 tenx technology, inc. Rev 2.4 03/12/01 TM8706 No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Name BAK XIN XOUT CFIN CFOUT GND VDD1 VDD2 VDD3 VDD4 CUP0 CUP1 CUP2 COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 SEG1(K1) SEG2(K2) SEG3(K3) SEG4(K4) SEG5(K5) SEG6(K6) SEG7(K7) SEG8(K8) SEG9(K9) SEG10(K10) SEG11(K11) X 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 89.50 204.50 319.50 434.50 549.50 669.50 789.50 909.50 1029.50 1149.50 1269.50 1389.50 1509.50 1629.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 Y 1229.50 1114.50 999.50 884.50 769.50 654.50 539.50 424.50 309.50 194.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 197.50 322.50 439.50 554.50 669.50 784.50 899.50 1014.50 1129.50 No 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 Name SEG12(K12) SEG13(K13) SEG14(K14) SEG15(K15) SEG16(K16) SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24/IOA1/CX SEG25/IOA2/RR SEG26/IOA3/RT SEG27/IOA4/RH SEG28/IOB1/ELC SEG29/IOB2/ELP SEG30/IOB3/BZB SEG31/IOB4/BZ SEG32/IOC1/KI1 SEG33/IOC2/KI2 SEG34/IOC3/KI3 SEG35/IOC4/KI4 SEG36/IOD1 SEG37/IOD2 SEG38/IOD3 SEG39/IOD4 SEG40 SEG41 RESET INT TEST X 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1558.50 1430.45 1305.00 1164.50 1024.00 881.50 766.50 651.50 536.50 421.50 306.50 191.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 Y 1244.50 1359.50 1474.50 1589.50 1704.50 1819.50 1934.50 2049.50 2175.00 2300.00 2477.00 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2477.00 2300.00 2175.00 2049.50 1934.50 1819.50 1704.50 1589.50 1474.50 1359.50 PIN DESCRIPTION 5 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Name I/O Description BAK P VDD1,2,3,4 P RESET INT I I TEST CUP0,1,2 O XIN XOUT I O CFIN CFOUT I O COM1~9 O SEG1-41 IOA1-4 IOB1-4 IOC1-4 IOD1~4 CX RR/RT/RH ELC/ELP BZB/BZ K1~K16 KI1~4 GND O I/O I/O I/O I/O I O O O O I P Positive Back-up voltage. At Li power mode, connect a 0.1u capacitor to GND. LCD supply voltage, and positive supply voltage. .In Ag Mode, connect positive power to VDD1. .In Li or ExtV power mode, connect positive power to VDD2. Input pin for external reset request signal, built-in internal pull-down resistor. Input pin for external INT request signal. . Falling edge or rising edge triggered is defined by mask option. . Internal pull-down or pull-up resistor is defined by mask option. Test signal input pin. Switching pins for supply the LCD driving voltage to the VDD1, 2,3,4 pins. . Connect the CUP0, CUP1 and CUP2 pins with non-polarized electrolytic capacitors when chip operated in 1/2, 1/3 or 1/4 bias mode. . In no BIAS mode application, leave these pins opened. Time base counter frequency (clock specified. LCD alternating frequency. Alarm signal frequency) or system clock oscillation. . The usage of 32KHz Crystal oscillator or external RC oscillator is defined by mask option. System clock oscillation for FAST clock only or DUAL clock operation. . The usage of 3.58MHz ceramic/resonator oscillator or external R type oscillator is defined by mask option Output pins for driving the common pins of the LCD panel. COM5~9 could be defined as COMS or Open Drain type output. Output pins for driving the LCD panel segment. Input / Output port A, (muxed with SEG24~27) Input / Output port B, (muxed with SEG28~31) Input / Output port C, (muxed with SEG32~35) Input / Output port D, (muxed with SEG36~39) 1 input pin and 3 output pins for RFC application. (muxed with SEG24~27) Output port for El panel driver. (muxed with SEG28~29) Output port for alarm, clock or single tone melody generator. (muxed with SEG30~31) Output port for key matrix scanning.(Shared with SEG1~SEG16) Input port for key matrix scanning.(Muxed with SEG32~SEG35) Negative supply voltage. ABSOLOUTE MAXIMUM RATINGS 6 tenx technology, inc. Rev 2.4 03/12/01 TM8706 GND= 0V Name Symbol Range Unit VDD1 -0.3 to 5.5 V VDD2 -0.3 to 5.5 V VDD3 -0.3 to 8.5 V VDD4 -0.3 to 8.5 V Maximum Input Voltage Vin -0.3 to VDD1/2+0.3 V Maximum output Voltage Vout1 -0.3 to VDD1/2+0.3 V Vout2 -0.3 to VDD3+0.3 V Vout3 -0.3 to VDD4+0.3 V Maximum Operating Temperature Topg -20 to +70 ℃ Maximum Storage Temperature Tstg -25 to +125 ℃ Maximum Supply Voltage POWER CONSUMPTION at Ta=-20℃ to 70℃,GND= 0V Name HALT mode Sym. Condition IHALT1 Only 32.768KHz Crystal oscillator operating, Min. Typ. Max. Unit 2 uA 2 uA without loading. Ag mode, VDD1=1.5V, BCF = 0 IHALT2 Only 32.768KHz Crystal oscillator operating, without loading. Li mode, VDD2=3.0V, BCF = 0 STOP mode ISTOP 1 uA Note : When RC oscillator function is operating, the current consumption will depend on the frequency of oscillation. ALLOWABLE OPERATING CONDITIONS at Ta=-20℃ to 70℃,GND= 0V 7 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Name Supply Voltage Symb. Condition Min. Max. Unit VDD1 1.2 5.25 V VDD2 2.4 5.25 V VDD3 2.4 8.0 V VDD4 2.4 8.0 V Oscillator Start-Up Voltage VDDB Crystal Mode 1.3 V Voltage VDDB Crystal Mode 1.2 V Supply Voltage VDD1 Ag Mode 1.2 1.65 V Supply Voltage VDD2 EXT-V, Li Mode 2.4 5.25 V Input “H” Voltage Vih1 Ag Battery Mode Input “L” Voltage Vil1 Input “H” Voltage Vih2 Input “L” Voltage Vil2 Input “H” Voltage Vih3 Input “L” Voltage Vil3 Input “H” Voltage Vih4 Input “L” Voltage Vil4 Input “H” Voltage Vih5 Input “L” Voltage Vil5 or EXT-V Mode Input “H” Voltage Vih6 RC Mode Input “L” Voltage Vil6 Oscillator Sustain Operating Freq VDD1-0.7 VDD1+0.7 -0.7 Li Battery Mode 0.7 VDD2-0.7 VDD2+0.7 V V V -0.7 0.7 V OSCIN at Ag 0.8xVDD1 VDD1 V Battery Mode 0 0.2xVDD1 V VDD2 V 0.2xVDD2 V VDD2 V 0 0.2xVDD2 V 0.8xVDDO VDDO V 0 0.2xVDDO V OSCIN at Li Battery 0.8xVDD2 Mode 0 CFIN at Li Battery 0.8xVDD2 Fopg1 Crystal Mode 32 Fopg2 RC Mode 10 1000 KHZ Fopg3 CF Mode 1000 3580 KHz 8 KHZ tenx technology, inc. Rev 2.4 03/12/01 TM8706 INTERNAL RC FREQUENCY RANGE Option Mode BAK Min. Typ. Max. 250KHz 1.2V~1.5V 300KHz 350KHz 400KHz 2.4V~5.0V 200KHz 250KHz 300KHz 1.2V~1.5V 550KHz 650KHz 750KHz 2.4V~5.0V 400KHz 500KHz 600KHz 500KHz ELECTRICAL CHARACTERISTICS at#1:VDD1=1.2V(Ag); at#2:VDD2=2.4V(Li): at#3:VDD2=4V(Ext-V); Input Resistance Name “L” Level Hold Tr(IOC) IOC Pull-Down Tr INT Pull-up Tr INT Pull-Down Tr RES Pull-Down R Symb. Condition Min. Typ. Max. Unit Rllh1 Vi=0.2VDD1,#1 10 40 100 Kohm Rllh2 Vi=0.2VDD2,#2 10 40 100 Kohm Rllh3 Vi=0.2VDD2,#3 5 20 50 Kohm Rmad1 Vi=VDD1,#1 200 500 1000 Kohm Rmad2 Vi=VDD2,#2 200 500 1000 Kohm Rmad3 Vi=VDD2,#3 100 250 500 Kohm Rintu1 Vi=VDD1,#1 200 500 1000 Kohm Rintu2 Vi=VDD2,#2 200 500 1000 Kohm Rintu3 Vi=VDD2,#3 100 250 500 Kohm Rintd1 Vi=GND,#1 200 500 1000 Kohm Rintd2 Vi=GND,#2 200 500 1000 Kohm Rintd3 Vi=GND,#3 100 250 500 Kohm Rres1 Vi=GND or VDD1,#1 5 20 50 Kohm Rres2 Vi=GND or VDD2,#2 5 20 50 Kohm Rres3 Vi=GND or VDD2,#3 5 20 50 Kohm DC Output Characteristics 9 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Name Symb. Condition Port Voh1c Ioh=-200uA,#1 Output ”H” Voltage Output ”L” Voltage Min. Typ. Max. Unit 0.8 0.9 1.0 V Voh2c Ioh=-1mA,#2 COM5~9 1.5 1.8 2.1 V Voh3c Ioh=-3mA,#3 SEG1~41 2.5 3.0 3.5 V Vol1c Iol=400uA,#1 0.2 0.3 0.4 V Vol2c Iol=2mA,#2 0.3 0.6 0.9 V Vol3c Iol=6mA,#3 0.5 1.0 1.5 V Segment Driver Output Characteristics Name Symb. Condition For Min. Typ. Max. Unit. Static Display Mode Output ”H” Voltage Voh1d Ioh=-1uA,#1 1.0 V Voh2d Ioh=-1uA,#2 2.2 V 3.8 V SEG-n Voh3d Ioh=-1uA,#3 Output ”L” Voltage Output ”H” Voltage Vol1d Iol=1uA,#1 0.2 V Vol2d Iol=1uA,#2 0.2 V Vol3d Iol=1uA,#3 0.2 V Voh1e Ioh=-10uA,#1 1.0 V Voh2e Ioh=-10uA,#2 2.2 V 3.8 V Voh3e Ioh=-10uA,#3 Output ”L” Voltage COM-n Vol1e Iol=10uA,#1 0.2 V Vol2e Iol=10uA,#2 0.2 V Vol3e Iol=10uA,#3 0.2 V 1/2 Bias Display Mode Output ”H” Voltage Voh12f Ioh=-1uA,#1,#2 Voh3f Output ”L” Voltage Output ”H” Voltage V 3.8 V Vol12f Iol=1uA,#1,#2 0.2 V Vol3f 0.2 V Iol=1uA,#3 Voh12g Ioh=-10uA,#1,#2 Voh3g Ioh=-10uA,#3 Output ”M” Voltage SEG-n Ioh=-1uA,#3 2.2 COM-n Vom12g Iol/h=+/-10uA,#1,#2 Vom3g Iol/h=+/-10uA,#3 COM-n 2.2 V 3.8 V 1.0 1.4 V 1.8 2.2 V 1/3 Bias display Mode 10 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Output ”H” Voltage Output ”M1” Voltage Voh12h Ioh=-1uA,#1,#2 3.4 V Voh3h Ioh=-1uA,#3 5.8 V Vom1h Iol/h=+/-10uA,#1,#2 1.0 1.4 V 1.8 2.2 V Vom22h Iol/h=+/-10uA,#1,#2 2.2 2.6 V Vom23h Iol/h=+/-10uA,#3 3.8 4.2 V Vol12h Iol=1uA,#1,#2 0.2 V Vol3h 0.2 V SEG-n Vom13h Iol/h=+/-10uA,#3 Output ”M2” Voltage Output ”L” Voltage Output ”H” Voltage Output ”M1” Voltage Iol=1uA,#3 Voh12i Ioh=-10uA,#1,#2 3.4 V Voh3i 5.8 V Ioh=-10uA,#3 Vom12i Iol/h=+/-10uA,#1,#2 1.0 1.4 V 1.8 2.2 V Vom22i Iol/h=+/-10uA,#1,#2 2.2 2.6 V Vom23i Iol/h=+/-10uA,#3 3.8 4.2 V Vom13i Iol/h=+/-10uA,#3 Output ”M2” Voltage Output ”L” Voltage COM-n Vol12i Iol=10uA,#1,#2 0.2 V Vol3i Iol=10uA,#3 0.2 V 1/4 Bias display Mode Output ”H” Voltage Voh12j Ioh=-1uA,#1,#2 Output ”M2” Voltage Vom22j Iol/h=+/-10uA,#1,#2 Output ”L” Voltage Vol12j SEG-n 2.2 Iol=1uA,#1,#2 Output ”H” Voltage Voh12k Ioh=-10uA,#1,#2 Output ”M1” Voltage Vom12k Iol/h=+/-10uA,#1,#2 Output ”M3” Voltage Vom22k Iol/h=+/-10uA,#1,#2 Output ”L” Voltage 4.6 V 2.6 V 0.2 V 4.6 COM-n Vol12k Iol=10uA,#1,#2 V 1.0 1.4 V 3.4 3.8 V 0.2 V TYPICAL APPLICATION CIRCUIT 11 tenx technology, inc. Rev 2.4 03/12/01 TM8706 This application circuit is simply an example, and is not guaranteed to work. LCD Panel 3.58MHz Crystal COM1~9, SEG1~41 CFIN CFOUT CUP0 0.1uf CUP1 0.1uf 15P CUP2 XIN 15P 32.768KHz Crystal VDD4 XOUT VDD3 VDD2 RH VDD1 RT 0.1u 0.1u BAK RR 0.1u CX 1.5V TM8706 L ELP EL Plant RESET I/O Port 0.1uf GND 0.1u External INT. 0.1u INT ELC IOA,IOB,IOC,IOD Choke Buzzer BZ(BZB) K1~K16 KI1~KI4 Key Scanning Key Matrix Ag power mode, 1/4 Bias, 1/9 Duty 12 tenx technology, inc. Rev 2.4 03/12/01