LIGITEK LG-008DBK-CT

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
LED SMD
Pb
Lead-Free Parts
LG-008DBK-CT
DATA SHEET
DOC. NO :
QW0905-LG-008DBK-CT
REV.
:
A
DATE
:
29 - Dec. - 2006
LIGITEK ELECTRONICS CO.,LTD.
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Page 1/10
PART NO. LG-008DBK-CT
Features:
1. Side view Blue LED.
2. White SMT package.
3. Leadframe package with individual 2 pin.
4.Wide viewing angle.
5.Soldering methods:IR reflow soldering.
6.Feature of the device:more light due to higher optical efficiency;extremely
wide viewing angle;ideal for backlighting and coupling in light guide.
7.Pb free
Applications:
1. LCD back light.
2. Mobile phones.
3. Indicators.
4. Switch lights.
Device Selection Guide:
PART NO
LG-008DBK-CT
COLOR
MATERIAL
InGaN/GaN
Emitted
Lens
Blue
Water Clear
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PART NO. LG-008DBK-CT
Page 2/10
Package Dimensions
0.5
Andoe
0.62
2.8
2.45
0.62
0.8
0.08±0.08
Cathode
0.35
0.8
Polarity
1.2
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
1.4
1
0.9
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
1.4
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PART NO. LG-008DBK-CT
Page 3/10
Absolute Maximum Ratings at Ta=25 ℃
Symbol
Ratings
UNIT
Power Dissipation
PD
80
mW
Peak Forward Current
Duty 1/10@10KHz
IFP
100
mA
Forward Current
IF
20
mA
Reverse Current @5V
Ir
50
μA
Electrostatic Discharge
ESD
± 2000
V
Operating Temperature
Topr
- 40 ~ + 85
℃
Storage Temperature
Tstg
- 40 ~ + 90
℃
Soldering Temperature
Tsol
Parameter
Max 260℃ for 5 sec Max
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Symbol
Min.
Typ.
Max.
Unit
Luminous Intensity
Iv
50
90
----
mcd
IF=20mA
Peak Wavelength
λP
----
465
----
nm
IF=20mA
Domainant Wavelength
λD
----
470
----
nm
IF=20mA
△λ
----
30
----
nm
IF=20mA
VF
----
3.3
3.6
V
IF=20mA
2θ 1/2
----
115
----
deg
IF=20mA
Items
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±10% testing tolerance.
Condition
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PART NO. LG-008DBK-CT
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative Intensity@20mA
Normalize@25 ℃
1.2
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
400
450
500
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0
-40
-20
-0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
550
100
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PART NO. LG-008DBK-CT
Carrier Tape Dimensions
4.0±0.2
1.5
0.23
Cathode
1.75
3.5
8.0±0.3
3.05
2.0
1.35
0.95
Andoe
4.0±0.2
Polarity
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-008DBK-CT
8.0mm tape,7"reel
3000 devices
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PART NO. LG-008DBK-CT
Page 6/10
Label Explanation
立碁電子工業股份有限公司
LIGITEK LED
LIGITEK ELECTRONICS CO., LTD.
Pb
BIN : Luminous Intensity
PART NO. : LG-008DBK-CT
HUE : Dominant Wavelength
LOT NO. : MC9500126
Q'TY(PCS) : 3000 PCS
BIN/HUE : Q / 0F
3.3 - 3.4 : Forward Voltage
3.3 - 3.4
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178±1.5
6.0±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
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PART NO. LG-008DBK-CT
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
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PART NO. LG-008DBK-CT
Soldering Iron:
Basic spec is ≦ 5 seconds when 260 ℃.
Power dissipation of iron should be smaller than 25W,and temperature should be controllable.
Surface temperature of the device should be under 280 ℃ for 3 seconds.
Reflow Temp/Time(Pb-free)
260° C Max.
10 sec. Max.
1 - 5° C / sec
180 - 200°C
Pre-heating
1 - 5° C / sec
120sec.Max.
60sec.Max.
Above 220°C
Reflow Temp/Time(Lead solder)
Temp.
(℃ )
240
Rising
+5 ℃/sec
150
Cooling
-5 ℃/sec
Preheat
120
60 ~ 120 sec
5sec
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
Time
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PART NO. LG-008DBK-CT
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Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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PART NO. LG-008DBK-CT
Page 10/10
Reliability Test:
(1)Test items and results
Classification
Test Condition
Test Item
Sample
Size
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs
22
High Temperature
Storage Test
1.Ta=105 ℃± 5℃
2.t= 500 hrs
22
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs
22
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta= 85℃± 5 ℃
3.RH=90 %~95 %
4.t= 500 hrs ±2hrs
22
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃ ±5℃ &
-40 ℃± 5℃
( 30 min) ( 30 min)
3.total 100 cycles
22
1.T.Sol=260 ℃±5 ℃
2.Dwell Time= 10 Max .
22
1.105 ℃ ~ 25 ℃ ~ - 40 ℃
30mins 15mins 30mins
2.10 0 Cyeles
22
Endurance
Test
Thermal Shock Test
Environmental
Test
Reflow Soldering Test
Temperature
Cycling
(2)Criteria for judging the damage
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
Vf
If=20mA
-
U.S.L x1.2
Reverse Current
Ir
Vr=5V
-
U.S.L x2.0
Luminous Intensity
Iv
If=20mA
L.S.L x 0.5
-
Note:
1.U.S.L.:Upper Standard Level.
2.L.S.L.:Lower Standard Level.