LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only INFRARED EMITTING DIODES Pb Lead-Free Parts LIR3333-PF/TBS-1 DATA SHEET DOC. NO : REV. DATE QW0905- LIR3333-PF/TBS-1 A : 15 - May. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LIR3333-PF/TBS-1 Page 1/9 Package Dimensions P2 H H2 W2 H1 L W0 W1 W3 D - + P1 F P T Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LIR3333-PF/TBS-1 Page 2/9 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN 0.5 TYP 1.0MIN 2.54TYP + NOTE:1.All dimension are in millimeters tolerance is 0.25 unless otherwise noted 2.Specifications are subject to change without notice Features: 1. High radiant intensity. 2. Suitable for pulsed applications. 3. Low average degradation. Descriptions: The LIR3333/TBS-1-PF series are high power solution grown efficiency Gallium Arsenide infrared emitting diodes encapsulated in blue transparent plastic T-1 3/4 package individually Device Selection Guide: PART NO MATERIAL LENS COLOR LIR3333-PF/TBS-1 AlGaAs/GaAs Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LIR3333-PF/TBS-1 Page 3/9 Absolute Maximum Ratings at Ta=25 Ratings Symbol Parameter UNIT IR Forward Current IF 50 mA Peak Forward Current (300PPS,10 s Pulse) IFP 1 A Power Dissipation PD 100 mW Reverse Voltage Vr 5 V Electrostatic Discharge ESD 2000 V Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +85 Electrical Optical Characteristics (Aa=25 SYMBOL Min. Typ. Radiant Intensity Le 6.0 Aperture Radiant Incidence Ee 0.9 Peak Emission Wavelength peak PARAMETER Spectral Line Half Width Forward Voltage (@ 40 ms) VF Reverse Current Viewing Angle 1/2 Max. UNIT TEST CONDITION 10.0 mW/sr IF=20mA 1.4 mW/cm IF=20mA 940 nm IF=20mA 50 nm IF=20mA V IF=20mA 1.2 2 1.6 100 IR 2 ) 20 Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The radiant intensity data did not including 15% testing tolerance. A deg VR=5V LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/9 PART NO. LIR3333-PF/TBS-1 Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Tape Feed Hole Diameter ------- D Component Lead Pitch ------- F Front-To-Rear Deflection ------- H TBS-1 Feed Hole To Bottom Of Component Minimum Maximum mm inch mm inch 3.8 0.15 4.2 0.17 2.3 0.09 3.0 0.12 ------- ------- 2.0 0.08 17.5 0.69 18.5 0.73 ------- 36 1.42 11 0.43 H1 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 ------- W0 REMARK:TBS=Tape And Box Straight Leads Dimensions Symbol Information Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2000PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LIR3333-PF/TBS-1 Page 5/9 Typical Electro-Optical Characteristics Curve IR CHIP Fig.1 Forward Current vs. Forward Voltage Fig.2 Relative Radiant Power vs. Wavelength 1.0 Relative Radiant Power Normalize @20mA Forward Current[mA] 1000 100 10 1 0.1 0.0 1.0 1.5 2.0 0.5 0.0 2.5 800 850 Fig.4 Relative Radiant Power vs. Forward Peak Current Fig.3 Relative Radiant Power vs. Forward DC Current 10.0 Relative Radiant Power Normalize @100 mA 10.0 1.0 0.1 1 10 1.0 0.1 100 10 100 IFDC [mA] 1000 IFPK [mA] Fig.5 Forward DC Voltage vs. Temperature Fig.6 Relative Radiant Power vs. Temperature 1.2 3.0 Relative Radiant Power Normalize @ 20mA, 25 ℃ Forward DC Voltage Normalize @20mA, 25 ℃ 1100 Wavelength[nm] Forward Voltage[V] Relative Radiant Power Normalize @20mA 950 1000 1050 900 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 Ambient Temperature(°C) 100 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature(°C) 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LIR3333-PF/TBS-1 Page 6/9 Storage time: 1.The operation of Temperatures and RH are : 5 ~35 ,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 they should be treated at 60 5 fo r 15hrs. ~ 35 ,RH<60%, Drive Method: LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LIR3333-PF/TBS-1 Page 7/9 Mounting: 1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (O) (X) (O) 2. The LED lamps are designed for high-density mounting and have a structure which can alleviate mechanical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 15 45 Anode side(cathode side on GaAlAs chips) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LIR3333-PF/TBS-1 Page 8/9 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp( C) 260 C3sec Max 260 5 /sec max 120 25 0 0 2 /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/9 PART NO. LIR3333-PF/TBS-1 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=85 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs Thermal Shock Test 5 &-40 1.Ta=105 (10min) (10min) 2.total 10 cycles The purpose of this test is the resistance of the device under tropical for hours. 5 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solder Resistance Test 1.T.Sol=260 5 2.Dwell time= 10 1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 5 2.Dwell time=5 1sec This test intended to see soldering well performed or not.