LIGITEK LPD3330-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PHOTO DIODE SILICON PIN LED LAMPS
Pb
Lead-Free Parts
LPD3330-PF
DATA SHEET
DOC. NO :
QW0905-LPD3330-PF
REV.
:
A
DATE
:
07 - Aug. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LPD3330-PF
Page1/3
Package Dimension
5.0
5.9
7.6
8.6
Description
The LPD3330-PF series are silicon
planar P/N photodiodes incorporated in
plastic package that simultaneously
serve as filter and are also Transparent
for infrared emission their terminals are
soldering tabs arranged in 2.54mm
center to center spacing due to their
design the diodes can vertically be
assembled on pc boards arrays can be
realized by multiple arrangement
versatile photodetectors are suitable for
diodes as well as voltaic cell operation
the signal noise ratio is particularly
favorable even at low illuminance the P/N
photodiode are outstanding for low
junction capacitance high cut-off
frequency and fast switching times.
They are particularly suitable for IR
sound transmission and remote control
the cathode of LPD3330-PF photodiode
is marked by a stamping on the package
edge
1.5MAX
□0.5
TYP
25.0MIN
2.54TYP
1.0MIN
NOTE:1.All dimension are In millimeters tolerance Is ±0.25 unless otherwise noted
2.Specifications are subject to change without notice
•MAXIMUM RATINGS (TA=25℃)
Symbol
Rating
Reverse Break Down Voltage
VBR
30
V
Power Dissipation
PD
150
mW
Operating Temperature
Topr
-30 ﹣ +60
℃
Storage Temperature
Tstg
-40 ﹣ +60
℃
Characteristic
nit
• ELECTRICAL CHARACTERISTICS AT (TA=℃)
Characteristic
Symbol
Dark Current
ID
Short Circuit Current
Isc
Open Circuit Voltage
Voc
Total Capacitance
CT
Peak Wavelength of Max Sensitivity
Rise Time,Fall Time
Test Condition
VR=10V
Ee=0mW/c㎡
VR=5V λP=940nm
Ee=0.5mW/c㎡
λP=940nm
Typ
Max
Unit
-
1.0
30
nA
1.5
2.0
-
uA
_
350
-
mV
-
20
-
pF
-
940
-
nm
-
50
-
ns
Ee=0.5mW/c㎡
VR=3V f=1MHZ Ee=0mW/c㎡
λsmax
tr,tf
Min
VR=10V RL=1KΩ
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LPD3330-PF
Page 2/3
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0°
2° /sec
max
0
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/3
PART NO. LPD3330-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11