3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT2003L-WR 3.0mm ROUND LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES Approved by Checked by Prepared by Tung Yang Min Bao 3.0mm ROUND LED LAMP MT2003L-WR Description This warm white lamp is made with InGaN/Sapphire chip and white 4.1 diffused epoxy resin. 24.0 MIN. 1.5 TYP. 0.5 MAX. 5.1 1.0 3.0 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is±0.25mm unless otherwise noted. Description LED Chip Part No. Lens Color Material MT2003L-WR InGaN/Sapphire Emitting Color Warm White VER.: 01 White diffused Date: 2007/11/27 Page: 1/6 3.0mm ROUND LED LAMP MT2003L-WR Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 120 mW Reverse Voltage VR 5 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 50 μA If(Peak) 100 mA Operating Temperature Range Topr. -25 to +85 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol. Electrostatic discharge ESD. Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity IV If=20mA 1520 1800 Forward Voltage Vf If=20mA Correlated Colour Temperature CCT If=20mA Ir Vr=5V 2θ1/2 If=20mA Reverse (Leakage) Current Viewing Angle 3.2 3000 Max. Unit mcd 4.0 3500 50 65 V o K µA deg Notes: 1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2007/11/27 Page: 2/6 3.0mm ROUND LED LAMP MT2003L-WR Relative Response Typical Electrical / Optical Characteristics Curves : Wavelength(nm) WHITE LED SPECTRUM VS. WAVELENGTH 2500 Relative Luminous Intensity Forward Current IF(mA) 50 40 30 20 10 2.0 2.6 3.0 3.4 3.8 2000 1500 1000 500 4.2 Forward Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE 0.0 20.0 10.0 30.0 Forward Current (mA) FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 50 20° 10° Forward Current IF(mA) 30° 40 40° 30 1.0 20 50° 0.9 60° 0.8 70° 80° 90° 10 0.7 0 20 40 60 Temperature (℃) 80 100 0.5 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM FORWARD CURRENT VS. AMBIENT TEMPERATURE VER.: 01 Date: 2007/11/27 Page: 3/6 3.0mm ROUND LED LAMP MT2003L-WR Specifications for Bin Grading: BIN U V Iv(mcd) MIN. 1520 2130 MAX. 2130 3000 Vf(V) MIN. 2.8 3.0 3.2 3.4 3.6 3.8 MAX. 3.0 3.2 3.4 3.6 3.8 4.0 Specifications for Vf Group: Group V7 V8 V9 V10 V11 V12 Specifications for Colour Temperature Group: CCT (oK) @20mA MIN. 3000 3100 3200 3300 3400 MAX. 3100 3200 3300 3400 3500 VER.: 01 Date: 2007/11/27 Page: 4/6 3.0mm ROUND LED LAMP MT2003L-WR Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) Hand soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/11/27 Page: 5/6