MARKTECH MT640-G-A

3Northway Lane North Latham,New York 12110.
Tollfree:1.800.984.5337
Phone:1.518.956.2980
Fax:1.518.785.4725
Http://www.marktechopto.com
SPECIFICATION
PART NO. : MT640-G-A
3.0mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
3.0mm ROUND LED LAMP
MT640-G-A
Description
This green lamp is made with GaP/GaP chip and green diffused epoxy
resin.
3.8
3.1
5.04
1.3
24.0 MIN.
1.5TYP.
0.5MAX.
2.54±0.1
A
K
Notes:
1. All dimensions are in mm.
2. Tolerance is ± 0.25mm unless otherwise noted.
Description
LED Chip
Part
No.
MT640-G-A
Material
Emitting Color
GaP/GaP
Green
VER.: 01
Lens Color
Green diffused
Date: 2007/10/31
Page: 1/5
3.0mm ROUND LED LAMP
MT640-G-A
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
78
mW
Reverse Voltage
VR
5
V
D.C. Forward Current
If
30
mA
Reverse (Leakage) Current
Ir
100
μA
If(Peak)
100
mA
Operating Temperature Range
Topr.
-40 to +95
℃
Storage Temperature Range
Tstg.
-40 to +100
℃
Soldering Temperature(1.6mm from body)
Tsol
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Dip Soldering : 260℃ for 5 sec.
Hand Soldering : 350℃ for 3 sec.
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Luminous Intensity
IV
If=20mA
9.8
20.0
37.2
mcd
Forward Voltage
Vf
If=20mA
2.1
2.6
V
Peak Wavelength
λp
If=20mA
567
Dominant Wavelength
λd
If=20mA
Reverse (Leakage) Current
Ir
Vr=5V
2θ1/2
If=20mA
40
deg
∆λ
If=20mA
30
nm
Viewing Angle
Spectrum Line Halfwidth
564
572
nm
579
nm
100
µA
Notes:1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01
Date: 2007/10/31
Page: 2/5
3.0mm ROUND LED LAMP
MT640-G-A
Typical Electrical / Optical Characteristics Curves :
50
Relative Luminous Intensity
Forward Current IF(mA)
50
40
30
20
10
1.2
1.6
2.0
2.4
2.8
40
30
20
10
0
3.2
20.0
10.0
0.0
30.0
Forward Current (mA)
Applied Voltage (V)
FORWARD CURRENT VS.APPLIED VOLTAGE
FORWARD CURRENT VS. LUMINOUS INTENSITY
0°
20°
10°
Forward Current IF(mA)
50
30°
40
40°
30
1.0
50°
0.9
20
60°
0.8
70°
80°
90°
10
0.7
0
20
40
60
Temperature (℃)
80
100
0.5
0.3
0.1
0.2
0.4
0.6
RADIATION DIAGRAM
FORWARD CURRENT VS. AMBIENT TEMPERATURE
VER.: 01
Date: 2007/10/31
Page: 3/5
3.0mm ROUND LED LAMP
MT640-G-A
Specifications for Bin Grading:
Iv(mcd)
BIN
MIN.
MAX.
D
9.8
13.7
E
13.7
19.0
F
19.0
26.6
G
26.6
37.2
Specifications for Vf Group:
Vf(V)
Group
MIN.
MAX.
V1
1.6
1.8
V2
1.8
2.0
V3
2.0
2.2
V4
2.2
2.4
V5
2.4
2.6
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group:
λD(nm) @20mA
Group
MIN.
MAX.
X4
564
567
X5
567
570
X6
570
573
X7
573
576
X8
576
579
VER.: 01
Date: 2007/10/31
Page: 4/5
3.0mm ROUND LED LAMP
MT640-G-A
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1.
Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2)
Solder dip: Preheat: 90℃ max. (Backside of PCB), Within 60 seconds
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds
(3)
Soldering iron : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max.
Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01
Date: 2007/10/31
Page: 5/5