E2A0027-16-X1 ¡ Semiconductor MSM6889 ¡ Semiconductor This version: Jan. 1998 MSM6889 Previous version: Nov. 1996 Multi-Function Telecommunication LSI GENERAL DESCRIPTION The MSM6889 is best suited to be used as a signal transmitter/receiver LSI for a telemetering system that employs a no-ringing communication system. The meter terminal of a telemetering system consists of this device, meter, NCU, and communication controller. The MSM6889 contains a PB tone detector, a call progress tone (CPT) detector, a PB tone generator, and a 300-bps full-duplex modem conforming to ITU-T V.21. FEATURES • Power supply : +5 V ±10%, +2.5 V or higher for digital interface. • Power consumption Operating mode : 9 mA Typ., 12 mA Max. Power down mode : 0.1 mA Max. • The operating mode can be selected from PB tone transmit, PB tone detect, and FSK modem (answer/originate). The FSK modem cannot be operated concurrently with other functions. Modem test modes are also available. • The call progress tone (CPT) detector operates in PB tone transmit mode or in FSK modem mode. • PB receiver output is 3-state, and externally connectable to 4-bit input for PB tone generator through the bus line. • Modem transmit/receive data, carrier detect, request to send, and call progress tone detect have their dedicated pins. • Prefilter and smoothing filter are provided in analog input and output. • On-chip 3.579545 MHz crystal oscillator • 3.579545 MHz master clock output pin (CMOS compatible) • Power down mode • Modem : Conforms to ITU-T V.21 (300 bps, full-duplex) • Transmit analog signals (modem signal, DTMF tone) : Level is independently adjustable externally. Carrier detect level is also adjustable externally. • Package options: 42-pin plastic DIP (DIP42-P-600-2.54) (Product name : MSM6889RS) 56-pin plastic QFP (QFP56-P-1519-1.00-K) (Product name : MSM6889GS–K) 1/21 + - - + PB Tone Generator DET CONTROL TIMING STATUS I/O * * TD RS CLK RD CD CP SP PB1 PB2 PB3 X'tal Power ON +5 V (A) 0 V (A) +5 V (D) 0 V (D) Digital Interface VD2 * PON VA AG VD DG MODE SELECT & TEST * * * * * * * * * * * TEN PBG1 PBG2 PBG3 PBG4 ICT3 ICT2 ICT1 MODE3 MODE2 VR1 FSK Modem Carrier Detect 400 Hz PB-Tone Receiver X1 3.58 MHz MODE1 Vref - + 2765 Hz X2 SG LPF Pre-LPF PB4 VR2 PB MOD GAT1 GAT2 SMOOTH AO SG GAR AIN- AIN+ 8 Note) PB1 to PB4: 3-State Outputs *With pull-up resistor Microcontroller ¡ Semiconductor MSM6889 BLOCK DIAGRAM 2/21 ¡ Semiconductor MSM6889 PIN CONFIGURATION (TOP VIEW) 42 VD VA 1 GAR 2 41 VD2 AIN+ 3 40 NC AIN– 4 39 PON AO 5 38 SP SG 6 37 PB4 GAT1 7 36 PB3 GAT2 8 35 PB2 MOD 9 34 PB1 PB 10 33 CP VR1 11 32 CD VR2 12 31 RD AG 13 30 CLK PBG1 14 29 X2 PBG2 15 28 X1 PBG3 16 27 MODE3 PBG4 17 26 MODE2 TEN 18 25 MODE1 TD 19 24 ICT3 RS 20 23 ICT2 DG 21 22 ICT1 42-Pin Plastic DIP NC : No connect pin 3/21 43 SG 44 GAT1 45 GAT2 46 MOD 47 PB 48 NC 49 NC 50 VR1 51 VR2 52 AG 53 PBG1 54 PBG2 55 NC MSM6889 56 PBG3 ¡ Semiconductor NC 1 42 NC PBG4 2 41 AO TEN 3 40 AIN– TD 4 39 AIN+ NC 5 38 NC RS 6 37 GAR DG 7 36 NC ICT1 8 35 VA ICT2 9 34 VD NC 10 33 NC PB4 28 PB3 27 PB2 26 PB1 25 NC 24 CP 23 CD 22 29 NC NC 21 MODE3 14 RD 20 30 SP CLK 19 MODE2 13 NC 18 31 PON X2 17 MODE1 12 X1 16 32 VD2 NC 15 ICT3 11 56-Pin Plastic QFP NC : No connect pin 4/21 ¡ Semiconductor MSM6889 PIN DESCRIPTION Pin Number RS GS Name I/O Description +5 V Power Supply (Analog Circuit). When power is turned on or the power down mode is released, the 1 35 VA — 2 37 GAR O Output, non-inverting input and inverting input pins of on-chip 3 39 AIN+ I operational amplifier. 4 40 AIN– I No hybrid transformer is required by use of these pins. (See Fig. 2.) 5 41 AO O 6 43 SG O On-chip signal ground, having a potential of about +2.5 V. 7 44 GAT1 I PB is the PB tone output and MOD is the modem signal output. 8 45 GAT2 O By connecting external resistors to GAT1 and GAT2 pins, signal level can 9 46 MOD O be set at required values for the modem signal and 10 47 PB O the PB tone that are output from AO, independently. (See Fig. 3.) device must be put into the PB tone transmit mode or PB tone detect mode. Analog signal output. PB tone or modem transmit signal is output from this pin. These pins are used to externally adjust the received carrier 11 50 VR1 O detect(CD) signal level. The potential of VR1 to SG is about +1.1 V. The carrier detect level can be set at the required value by a on-chip resistor 12 51 VR2 I divider between VR1 and SG. The given potential to VR2 is set about +0.88 V with high resistance inside the IC. (See Fig. 4.) 13 52 AG — 14 53 PBG1 I* 15 54 PBG2 I* 16 56 PBG3 I* 17 2 PBG4 I* Analog Ground, 0 V. Inputs used to specify PB tone to be sent. PB1 to PB4 can be connected externally like 4-bit bus line. Data is latched at the falling edge of TEN. (See Fig. 7 and Fig. 8.) * Digital input pulled up by a high resistance inside the IC. 5/21 ¡ Semiconductor MSM6889 Pin Number RS GS Name I/O Description PB tone transmit enable. 18 3 TEN I* PBG1 to PBG4 data are latched at the falling edge of TEN, and PB tone is generated at digital "0" level. (See Fig. 7.) Modem transmit serial data input. 19 4 TD I* Data stream less than 300 bps should be input. Digital "1" and "0" correspond to "Mark" and "Space" respectively. Request to send data input . 20 6 RS I* 21 7 DG — 22 8 ICT1 I* 23 9 ICT2 I* Used to check performance characteristics of the IC. 24 11 ICT3 I* Independent of operating mode. Leave these pins open. 25 12 MODE1 I* 26 13 MODE2 I* 27 14 MODE3 I* 28 16 X1 I 29 17 X2 O 30 19 CLK O While RS is at digital "0" level, modem transmit is enabled. Digital Ground, 0 V. Input used to select call progress tone (CPT) detect output waveform. (See Fig. 9.) Inputs used to specify operating mode. (See Table 1.) 3.579545 MHz crystal resonator should be connected to X1 and X2. When applying external clock to the device, it should be connected to X2 through the AC coupling capacitor of 100 pF and X1 has to be open. 3.579545 MHz clock output. Modem receive serial data output. 31 20 RD O Digital "1" and "0" correspond to "Mark" and "Space" respectively. When CD (Carrier Detect) is off, RD is hold at "Mark" state. 32 22 CD O Carrier Detect output. Digital "0" and "1" represent "Detect" and "No-detect" respectively. * Digital input pulled up by a high resistance inside the IC. 6/21 ¡ Semiconductor MSM6889 Pin Number RS GS Name I/O Description Call progress tone (CPT) detect output. 33 23 CP O When a CPT is detected, the waveform selected by ICT1 is output. (See Fig. 9. ) 34 25 PB1 O 35 26 PB2 O 36 27 PB3 O 37 28 PB4 O 38 30 SP O Receive PB tone code outputs. The output impedance of these pins becomes high except when the device operates as PB tone receiver. (See Fig. 7 and Fig. 8. ) PB tone receive data present. Digital "1" represents that this pin is receiving the PB tone. (See Fig. 8. ) 39 31 PON I 40 — NC — Power down mode select. Digital "1" on this pin puts the whole circuit of the device into the power down state. No connection. Power supply for digital interface output. The supply voltage from +2.5 V to VD is possible for VD2. For example, when the device interfaces to the MCU working on +3 V 41 32 VD2 — supply, the +3 V supply has to be applied to the VD2 pin. Note that this function is effective to all of digital output pins except X1, X2, and CLK. There is no restriction regarding the power supplies (VD and VD2) applying procedure. +5 V power supply (digital circuit). 42 34 VD — When power is turned on or the power down mode is released, the device must be put into the PB tone transmit mode or PB tone detect mode. 7/21 ¡ Semiconductor MSM6889 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Condition VA, VD Power Supply Voltage VD2 Input Pin Voltage –0.3 to 7 Ta = 25˚C V –0.3 to VD with respect to AG and DG –0.3 to VA(VD) + 0.3 — –65 to 150 Within 10 sec 260 Storage Temperature Pin Soldering Temperature Unit ˚C RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Digital Input Voltage Symbol VA, VD VD2 VIH VIL Condition — — Min. Typ. Max. 4.5 5.0 5.5 2.5 — VD 2.0 — VD 0 — 0.8 Unit V V IOH When VD2 = VD –0.05 — — IOL (excluding) X2 — — 0.4 Operating Temperature Top — –40 — +85 °C Input Clock Frequency fCLK — % Digital Output Current Bypass Capacitance Frequency Deviation Crystal Temperature Characteristics Equivalent Series Resistance Load Capacitance VA VD, VD2 mA –0.1 — +0.1 0.1 + 10 — — 1 — — At 25°C ±5°C –100 — +100 At –40°C to ±85°C –50 — +50 — — — 50 W — — 16 — pF — mF ppm 8/21 ¡ Semiconductor MSM6889 ELECTRICAL CHARACTERISTICS DC and Digital Interface Characteristics (VA, VD, VD2 = +5 V ±10%, Ta = –40˚C to +85˚C) Parameter Symbol Condition Power Supply IAD IA + ID + ID2 Current IPD (VD2 = VD) Digital Input IIH Current* IIL Digital Output VOH Voltage VOL VD2 = VD Min. Typ. Max. Unit — 9 12 mA PON = "1" — 0.01 0.1 mA VI = VIH Max. –10 — 10 VI = VIL Min. –100 — 10 IO = IOH Min. 2.4 — VD2 IO = IOL Max. 0 — 0.4 PON = "0" µA V * Internal pull-up resistor Analog Interface and Dynamic Characteristics (VD = VA = 5 V ±10%, Ta = –40˚C to +85˚C) Parameter Condition RL ≥ 20 kW Min. Typ. Max. Unit –3 1.55 –1 1.95 +1 2.46 dBm VP-P –8.5 –6.5 –4.5 dBm –7.5 –5.5 –3.5 dBm Modem Transmit Level MOD PB Tone Send Level PB Output Voltage Swing Output Load Resistance RL ≥ 20 kW AO MOD, PB, GAT2, AO 2.2 3 — Vp-p 20 — — kW Signal Level Relative Value MODEM "Mark" & "Space" Signals PB Tone High-Gr. Tone & Low-Gr. Tone –2 0 0 1 2 2 dB dB VA – 0.1 2 VA 2 VA + 0.1 2 V "1" 976 980 984 "0" 1176 1180 1184 "1" 1646 1650 1654 "0" "Mark" and "Space" Signals RL ≥ 20 kW Low-Group Tone High-Group Tone Output DC Voltage MOD, PB AO (When GAT1 and GAT2 are Modem Transmit Carrier connected) Originate MARK Mode SPACE Frequency Out-of-band Energy PB Tone Frequency PB Tone Distortion PBG1 to PBG4 Input Data Setup Time PBG1 to PBG4 Input Data Hold Time Answer MARK Mode SPACE TD Hz 1846 1850 1854 4 to 8 kHz P : In-band Signal Energy (0.3 kHz to 3.4 kHz) 8 to 12 kHz Measured at primary side 12 kHz to of transformer line. — — P-20 dB — — P-40 dB — — P-60 dB With respect to nominal frequency Harmonics/Fundamental –1.5 — +1.5 % — — –23 dB TPBGS, Fig. 7 250 — — ns TPBGH, Fig. 7 250 — — ns 9/21 ¡ Semiconductor MSM6889 Analog Interface and Dynamic Characteristics (Continued) (VD = VA = 5 V ±10%, Ta = –40˚C to +85˚C) Parameter Condition Min. Typ. Max. Unit Input Impedance AIN+, 0 to 10 kHz 20 — — kW Modem Receive Signal Level AIN+, FSK Demodulator Signal — — –6 dBm VR2; Open OFFÆON — — –42 dBm Originate mode: 1750 Hz ONÆOFF –48 — — dBm 1 — — dB 10 — 40 ms Carrier Detect (CD) Signal Level CD Level Hysteresis Answer mode: 1080 Hz Answer mode: 1080 Hz Originate mode: 1750 Hz CD Delay Time –60 dBm Æ –20 dBm Step CD Hold Time –20 dBm Æ –60 dBm Step 0 — 40 ms Demod. Data Bias Distortion 300 bps, 1/0 Alternative Pattern — — ±10 % NRTS Signal-to-Modem vNRTS/v Receive Modem Signal Receive Signal Ratio NRTS: 2765 Hz ±30 Hz — — –2 dB CPT Detect Level 400 Hz –40 — –6 dBm CPT Non-detect Level 400 Hz — — –60 dBm 380 — 420 Hz R > 20% (square waves output) 500 — — (See Fig. 9) — — 300 — 20 — CPT Detect Frequency CPT Non-detect Frequency R > 20% (square waves output) (See Fig. 9) CPT Detect Delay Time — CPT Detect Hold Time PB Tone Detect Amplitude — For Each Signal Tone Hz ms — 20 — ms –46 — –6 dBm PB Tone Non-detect Amplitude For Each Signal Tone — — –60 dBm Detect Frequency With respect to Nominal Frequency — — ±1.5 % Non-detect Frequency With respect to Nominal Frequency ±3.8 — — % Allowable twist High-Gr. Tone/Low-Gr. Tone –6 — +6 dB — –12 — dB 37 — — dB Allowable Noise Level Dial Tone Rejection Ratio Noise (0.3 kHz to 3.4 kHz) Level/Tone Level 380 Hz to 420 Hz Signal Repetition Time TC 120 — — ms Time to Receive Ts 49 — — ms Invalid Tone Duration TI — — 24 ms Output Delay Time TG 24 39 49 ms Interdigit Pause TP 30 — — ms Acceptable Drop Out TB — — 2 ms SP Delay Time TSP 6 8 10 ms Output Trailing edge Delay TD 21 28 35 ms Fig. 1 10/21 ¡ Semiconductor MSM6889 TC TS TP TB AIN Signal TG PB1 to PB4 SP TD TSP Figure 1 11/21 ¡ Semiconductor MSM6889 FUNCTIONAL DESCRIPTION AND APPLICATION Resistance Hybrid Condition (Ideal Condition) 600 W : 600 W C1 3 2.2 mF RL VT VR VT1,VR1 4 R3 R1 600 W 2 AIN+ AIN– + VT2,VR2 – GAR R2 + AO 5 VAO – R2,R3 ≥ 20 kW Figure 2 C1 is an ignorable impedance in the voice frequency band; therefore, if a line transformer and phone line impedance are ideal (RL = 600 W pure resistance), the signal levels at each point are as shown below. VT, VR VT1, VR1 VAO VT2 VR2 : : : : : Transmit at 2W on phone line, receive signal level (balanced) Transmit at pin 3 (AIN+), receive signal level (unbalanced) Transmit signal level at pin 5 (AO) (unbalanced) Leaking of transmit signal into receive circuit (unbalanced) Receive signal level of the device (unbalanced) 1) VT = VT1 = 1/2 ¥ VAO The transmit signal level (voltage) on phone line is half the level at the output pin (AO) of the device. (600 W : a 600 W line transformer is used) 2) VR1 = VR 3) VT2 = VT1 ¥ (1+ R3 R3 ) + VAO ¥ (– ) R2 R2 = 1 VAO ¥ (1+ R3 ) – VAO ¥ R3 = 1 VAO ¥ (1– R3 ) 2 R2 R2 2 R2 Then, where R2 = R3 (e.g., 51 kW), VT2 = 0. This means that the transmit signal is no longer leaking into the receive circuit. 4) VR2 = VR1 ¥ (1+ R3 ) , where R2 = R3, VR2 = 2 ¥ VR1 = 2 ¥ VR R2 12/21 ¡ Semiconductor MSM6889 Setup of Transmit Signal Levels LPF VAO 5 8 AO + _ GAT2 R4 7 R5 R6 10 VP 9 VM GAT1 PB PB Tone Generator MOD Modulator R4,R5,R6 ≥ 20 kW Figure 3 The modulation analog signal and PB tone from the modem are not sent at a time. The signal to be sent is determined by the operating mode specified. This device is provided with the pins for specifying levels of these transmit signals independently. The answer tones, which are generated from MODULATOR, are handled as modem signals. VM : Modem signal level (voltage) at MOD (pin 9) VP : PB tone level (voltage) at PB (pin 10) When the external resistors are R4, R5 and R6, the signal levels at AO (pin 5) are as shown below. VAO (modem) = R4 ¥ VM R5 VAO (PB) R4 ¥ VP R6 = Note : R4, R5, R6 ≥ 20 kW As described in "Resistance Hybrid Condition", signal levels actually sent over a phone line will be half the above mentioned values under the ideal condition. 13/21 ¡ Semiconductor MSM6889 External Setup of Carrier Detect Level 11 R1 12 R2 6 VR1 VR2 SG VREF r1 r2 COMP R1//r1 + R2//r2 ≥ 20 kW r1: 250 kW, r2 : 1 MW Figure 4 Operating Mode Table 1 Operating Mode Table Mode Select Functional Block Operating Mode 1 2 3 0 0 0 PB Tone Transmit 1 0 0 PB Tone Detect 0 1 0 1 1 0 0 0 1 1 0 1 PB GEN. PB REC. CPT REC. FSK MODEM ICT1 = “1” ICT1 = “0” * * * Originate Mode * * Modem (O) Answer Mode * * O * * Test (ALB) A * * O * * A * * Modem (A) Analog Loop Back 0 1 1 Remote Digtal Loop 1 1 1 Back Test (RDLB) * : Active When power is turned on or the power down mode is released, put the device into the PB tone transmit mode or PB tone detect mode. 14/21 ¡ Semiconductor MSM6889 Signal flow concept for the modem normal operating mode is shown in Fig. 5. AIN Receive Filter Demodulator Transmit Filter Modulator RD Receive Data Line AO TD Transmit Data Figure 5 In the test modes, signal flow shown in Fig. 6 is used. O/(originate)/A(answer) in the test mode is the expression where the modulator side is referred to as the basis. AIN Receive Filter Demodulator Transmit Filter Modulator Receive Filter Demodulator Transmit Filter Modulator RD Receive Data [ALB] AO AIN TD RD Transmit Data Receive Data [RDLB] AO TD Transmit Data Figure 6 15/21 ¡ Semiconductor MSM6889 PB Tone Transmit Mode and PB Tone Detect Mode When PBG1 to PBG4 are externally connected to PB1 to PB4 so as to use them as 4-bit bus lines, their tone generation timings are as shown below. 1) PB Tone Transmit Mode When TEN is in the digital "0" state, PB tone is generated according to Table 2. TEN TPBGS TPBGH PBG1/PB1 PBG2/PB2 PBG3/PB3 PBG4/PB4 PB 941 Hz + 1477 Hz Figure 7 2) PB Tone Detect Mode 941 Hz + 1477 Hz 852 Hz + 1209 Hz AIN TG "0" TD "1" PB1/PBG1 "0" "1" PB2/PBG2 PB3/PBG3 PB4/PBG4 SP "1" "1" "0" "1" TSP Figure 8 16/21 ¡ Semiconductor MSM6889 Table 2 PB Tone Code Table Low-Group Freq. (Hz) Button 697 1 * 2 * 3 770 852 941 * 6 * 1633 * 9 * 0 1 1 0 1 0 0 0 1 0 1 0 1 1 0 0 1 1 1 1 0 0 0 1 0 0 1 1 0 1 0 1 0 1 1 1 1 0 0 * 1 1 0 1 * 1 1 1 0 * 1 1 1 1 * 0 0 0 0 * * # * * * * * * * * * PBG4 PBG3 PBG2 PBG1 0 0 0 1 1 * * PB1/ 0 * 0 PB2/ 0 * * PB3/ 0 * 8 PB4/ 0 * 7 D 1477 * * 5 C 1336 * * B 1209 * 4 A High-Group Freq. (Hz) Call Progress Tone (CPT) Detect Mode 400 Hz AIN R = TW/(TD + TW) ¥ 100 [%] CP ICT1 = "1" TW TD CP ICT1 = "0" Figure 9 17/21 ¡ Semiconductor MSM6889 APPLICATION CIRCUIT Pin Connection MSM6889RS 1 R3 C2 + – C1 2 3 4 R1 R2 5 + 6 – 7 R4 8 R5 9 R6 10 11 12 C3 + – 13 14 15 16 17 18 19 20 21 VA VD GAR VD2 AIN+ NC AIN– PON AO SP SG PB4 GAT1 PB3 GAT2 PB2 MOD PB1 PB CP VR1 CD VR2 RD AG CLK PBG1 X2 PBG2 X1 PBG3 MODE3 PBG4 MODE2 TEN MODE1 TD ICT3 RS ICT2 DG ICT1 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 3.579545 MHz 26 25 24 23 22 R1 = 600 W, R2 = R3 = R4 = R5 = R6 = 51 kW C1 = 2 mF, C2 = C3 = 10 mF 18/21 ¡ Semiconductor MSM6889 Bypass Capacitor Connections The MSM6889 contains analog circuits. Note that noise occurred in the power supply by trouble in other circuits may cause degradation in characteristics of the device. The examples of connected bypass capacitors of the MSM6889 are shown below. MSM6889 VA, VD 10 mF to 47 mF SG AG, DG MSM6889 VA, VD 1 mF 10 mF to 47 mF SG 1 mF AG, DG MSM6889 VA, VD 10 mF 10 mF to 47 mF *1 mF SG 10 mF AG, DG * Laminated ceramic capacitor 19/21 ¡ Semiconductor MSM6889 PACKAGE DIMENSIONS (Unit : mm) DIP42-P-600-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 6.20 TYP. 20/21 ¡ Semiconductor MSM6889 (Unit : mm) QFP56-P-1519-1.00-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.46 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 21/21