VISHAY TSMF1000

TSMF1000/1020/1030/1040
VISHAY
Vishay Semiconductors
High Speed IR Emitting Diode in SMD Package
Description
TSMF1000
TSMF1000 series are high speed infrared emitting
diodes in GaAlAs/GaAs/GaAlAs double hetero technology (DH) molded in clear SMD package with dome
lens.
DH chip technology represents best performance for
speed, radiant power, forward voltage and longterm
reliability.
TSMF1020
TSMF1030
TSMF1040
Features
• High speed
• Extra high radiant power
• Low forward voltage
•
•
•
•
•
•
16758
Applications
Suitable for high pulse current operation
Angle of half intensity ϕ = ± 17°
Peak wavelength λp = 870 nm
Longterm reliability
Matched with PIN Photodiode TEMD1000
Versatile terminal configurations
IrDA compatible data transmission
Miniature light barrier
For control and drive circuits
Photointerrupters
Incremental sensors
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Symbol
Value
Reverse Voltage
Parameter
Test condition
VR
5
Unit
V
Forward Current
IF
100
mA
mA
Peak Forward Current
tp/T = 0.5, tp = 100 µs
IFM
200
Surge Forward Current
tp = 100 µs
IFSM
0.8
A
PV
190
mW
Power Dissipation
Junction Temperature
Operating Temperature Range
Storage Temperature Range
t ≤ 5sec
Soldering Temperature
Thermal Resistance Junction/Ambient
Tj
100
°C
Tamb
- 40 to + 85
°C
Tstg
- 40 to + 100
°C
Tsd
<260
°C
RthJA
400
K/W
Basic Characteristics
Tamb = 25 °C, unless otherwise specified
Tamb = 25 °C, unless otherwise specified
Parameter
Forward Voltage
Test condition
IF = 20 mA
IF = 1 A, tp = 100 µs
Symbol
VF
Max
Unit
1.3
1.5
V
VF
2.4
V
- 1.7
mV/K
IF = 1.0mA
Reverse Current
VR = 5 V
IR
Junction Capacitance
VR = 0 V, f = 1 MHz, E = 0
Cj
Rev. 6, 21-May-03
Typ.
TKVF
Temp. Coefficient of VF
Document Number 81061
Min
10
160
µA
pF
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TSMF1000/1020/1030/1040
VISHAY
Vishay Semiconductors
Parameter
Radiant Intensity
Test condition
IF = 20 mA
Symbol
Min
Typ.
Ie
2.5
5
Max
mW/sr
Unit
IF = 100 mA, tp = 100 µs
Ie
25
mW/sr
Radiant Power
IF = 100 mA, tp = 20 ms
φe
35
mW
Temp. Coefficient of φe
IF = 20 mA
TKφe
- 0.6
%/K
ϕ
± 17
deg
Angle of Half Intensity
Peak Wavelength
IF = 20 mA
λp
870
nm
Spectral Bandwidth
IF = 20 mA
∆λ
40
nm
Temp. Coefficient of λp
IF = 20 mA
TKλp
0.2
nm/K
Rise Time
IF = 20 mA
tr
30
ns
Fall Time
IF = 20 mA
tf
30
ns
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
10000
I F - Forward Current ( mA )
200
PV - Power Dissipation ( mW )
180
160
140
120
100
80
60
40
Tamb < 60°C
t p /T = 0.005
0.01
1000
0.02
0.05
100
0.2
0.5
DC
0.1
10
20
0
0
T amb - Ambient Temperature ( ° C )
16187
1
0.01
10 20 30 40 50 60 70 80 90 100
Figure 1. Power Dissipation vs. Ambient Temperature
0.1
1
100
10
t p - Pulse Length ( ms )
95 9985
Figure 3. Pulse Forward Current vs. Pulse Duration
10 4
100
80
60
40
20
0
16188
I F - Forward Current ( mA)
I F - Forward Current ( mA )
120
10 2
10 1
10 0
0
10 20 30 40 50
T amb - Ambient Temperature ( ° C )
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0
60 70 80 90 100
Figure 2. Forward Current vs. Ambient Temperature
2
10 3
94 8880
1
2
3
4
V F - Forward Voltage ( V )
Figure 4. Forward Current vs. Forward Voltage
Document Number 81061
Rev. 6, 21-May-03
TSMF1000/1020/1030/1040
VISHAY
Vishay Semiconductors
1.6
V Frel - Relative Forward Voltage
1.2
1.1
1.2
I e rel , Φ e rel
I F = 10 mA
1.0
0.9
0.8
0.4
0.8
0
-10 0 10
0.7
0
20
40
60
80
100
T amb - Ambient Temperature ( ° C )
94 7990 e
50
Figure 8. Rel. Radiant Intensity/Power vs. Ambient Temperature
1.25
Φˇ e rel - Relative Radiant Power
1000
100
10
1
0.1
10 0
16189
10 1
10 2
10 3
I F - Forward Current ( mA )
1.0
0.75
0.5
0.25
I F = 100 mA
0
820
10 4
Figure 9. Relative Radiant Power vs. Wavelength
0°
Srel - Relative Sensitivity
1000
100
10
1
920
870
λ - Wavelength ( nm )
15821
Figure 6. Radiant Intensity vs. Forward Current
Φe - Radiant Power ( mW )
140
100
T amb - Ambient Temperature ( ° C )
94 7993 e
Figure 5. Relative Forward Voltage vs. Ambient Temperature
I e - Radiant Intensity ( mW/sr )
I F = 20 mA
10°
20 °
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
0.1
10 0
94 8007
10 1
10 2
10 3
I F - Forward Current ( mA )
Document Number 81061
Rev. 6, 21-May-03
0.6
10 4
Figure 7. Radiant Power vs. Forward Current
80°
0.4
0.2
0
0.2
0.4
0.6
94 8248
Figure 10. Relative Radiant Sensitivity vs. Angular Displacement
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TSMF1000/1020/1030/1040
VISHAY
Vishay Semiconductors
Package Dimensions in mm
TSMF1000
16159
Package Dimensions in mm
TSMF1020
16160
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Document Number 81061
Rev. 6, 21-May-03
VISHAY
TSMF1000/1020/1030/1040
Vishay Semiconductors
Package Dimensions in mm
TSMF1030
16228
Package Dimensions in mm
TSMF1040
16760
Document Number 81061
Rev. 6, 21-May-03
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5
TSMF1000/1020/1030/1040
VISHAY
Vishay Semiconductors
Reel Dimensions
18033
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6
Document Number 81061
Rev. 6, 21-May-03
VISHAY
TSMF1000/1020/1030/1040
Vishay Semiconductors
Taping TSMF1000
18030
Taping TSMF1020
18031
Document Number 81061
Rev. 6, 21-May-03
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TSMF1000/1020/1030/1040
VISHAY
Vishay Semiconductors
Taping TSMF1030
18032
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change
(Burn out will happen).
2. Storage
2.1 Storage temperature and rel. humidity conditions
are: 5°C to 35°C, R.H. 60%
2.2 Floor life must not exceed 168 h, acc. to JEDEC
level 3, J-STD-020.
Once the package is opened, the products should be
used within a week. Otherwise, they should be kept in
a damp proof box with desiccant.
Considering tape life, we suggest to use products
within one year from production date.
2.3 If opened more than one week in an atmosphere
5°C to 35°C, R.H. 60%, devices should be treated at
60°C ± 5°C for 15 hrs.
2.4 If humidity indicator in the package shows pink
color (normal blue), then devices should be treated
with the same conditions as 2.3
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Reflow Solder Profile
260
240
220
Temperature ( q C )
Precautions For Use
200
+ 5 qC/s
– 5 qC/s
180
160
140
120
60 s to 120 s
5s
100
80
60
0
17172
20 40 60 80 100 120 140 160 180 200 220
Time ( s )
Document Number 81061
Rev. 6, 21-May-03
TSMF1000/1020/1030/1040
VISHAY
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 81061
Rev. 6, 21-May-03
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