Surface Mount PPTC FSMD2920 Series FEATURES RoHS ü AGENCY RECOGNITION •2920 size, Surface mountable, •Application: All high-density boards •Operation Current: 300mA ~ 3.0A •Maximum Voltage: 6V ~ 60V •Temperature Range: -40°C to 85°C •RoHS Compliant •UL (E211981) •C-UL (E211981) •TUV (R50090556) ELECTRICAL CHARACTERISTICS (23°C) Part Number Max Time to Trip Hold Current Trip Current Rated Voltage Maximum Current Typical Power Current Time Resistance Tolerance RMIN R1MAX IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec OHMS OHMS FSMD030-2920 0.30 0.60 60 10 1.5 1.5 3.0 1.000 4.80 FSMD050-2920 0.50 1.00 60 10 1.5 2.5 4.0 0.300 1.40 FSMD075-2920 0.75 1.50 33 40 1.5 8.0 0.3 0.180 1.00 FSMD100-2920 1.10 2.20 33 40 1.5 8.0 0.5 0.090 0.41 FSMD125-2920 1.25 2.50 33 40 1.5 8.0 2.0 0.050 0.25 FSMD150-2920 1.50 3.00 33 40 1.5 8.0 2.0 0.050 0.23 FSMD185-2920 1.85 3.70 33 40 1.5 8.0 2.5 0.040 0.15 FSMD200-2920 2.00 4.00 16 40 1.5 8.0 4.5 0.035 0.12 FSMD250-2920 2.50 5.00 16 40 1.5 8.0 16.0 0.025 0.085 FSMD260-2920 2.60 5.20 6 40 1.5 8.0 20.0 0.020 0.075 IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damge at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power disipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: Tin-plated copper FSMD2920 PRODUCT DIMENSIONS (MILLIMETERS) Part A B Min C Max Min D D Number Min Max Max Min FSMD030-2920 6.73 7.98 4.80 5.44 0.60 1.15 0.35 FSMD050-2920 6.73 7.98 4.80 5.44 0.60 1.15 0.35 FSMD075-2920 6.73 7.98 4.80 5.44 0.35 1.15 0.35 FSMD100-2920 6.73 7.98 4.80 5.44 0.40 1.00 0.35 FSMD125-2920 6.73 7.98 4.80 5.44 0.40 0.90 0.35 FSMD150-2920 6.73 7.98 4.80 5.44 0.40 0.90 0.35 A Top and bottom view FSMD185-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 FSMD200-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 FSMD250-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 FSMD260-2920 6.73 7.98 4.80 5.44 0.30 0.90 0.35 B Side view RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C C5ED04 REV 2007.8.14 Surface Mount PPTC FSMD2920 Series RoHS ü THERMAL DERATING CURVE Percent of Rated Hold and Trip Current Thermal Derating Curve, FSMD Series 200% 150% 100% A= FSMD125 ~ FSMD260 B= FSMD030 ~ FSMD100 A 50% B 0% -40 0 -20 20 40 60 80 Ambient Temperature (C) TYPICAL TIME-TO-TRIP AT 23°C A B C A = FSMD030-2920 D EFGHI 100 B = FSMD050-2920 C = FSMD075-2920 Time-to-trip (S) 10 D = FSMD100-2920 1 E = FSMD125-2920 0.1 F = FSMD150-2920 G = FSMD185-2920 0.01 H = FSMD200-2920 0.001 0.1 1 10 100 I = FSMD250-2920 J = FSMD260-2920 Fault current (A) PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimension in the table below provide the recommended pad layout for each FSMD2920 device NOMINAL PAD DIMENSIONS (MILLIMETERS) Solder Reflow 20 to 40 Seconds 260 °C Ramp-up 3°C/Second Max 5.6 Ramp-down 6°C/Second Max 217 °C f 200 °C 150 °C Preheat 25 °C 60 to 180 Seconds 2.3 5.1 60 to 150 Seconds 2.3 Solder Reflow Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only) 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned by using standard industry methods and solvents. 5. Storage Environment: <30°C / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED04 REV 2007.8.14