SURFACE MOUNT PPTC FSMD1206 Series FEATURES • • • • • • RoHS AGENCY RECOGNITION 1206 size, Surface mount Application: All high-density boards Operation Current: 0.05mA ~ 2A Maximum Voltage: 6V ~ 60V Temperature Range: -40°C to 85°C RoHS Compliant •UL (E211981) •C-UL (E211981) •TUV (R50090556) ELECTRICAL CHARACTERISTICS (23°C) Hold Current IH, A Trip Current IT, A FSMD005-1206R 0.05 0.15 60 10 FSMD010-1206R 0.1 0.25 60 FSMD012-1206R 0.12 0.39 FSMD016-1206R 0.16 0.45 FSMD020-1206R 0.2 FSMD025-1206R 0.25 FSMD025-24-1206R FSMD035-1206R Part Number Rated Maximum Voltage Current VMAX, Vdc IMAX, A Typical Power Max Time to Trip Resistance Tolerance RMIN R1MAX Pd, W Current Amp Time Sec 0.4 0.25 1.5 3.6 50.0 10 0.4 0.5 1.0 1.6 15.0 48 100 0.6 1.0 0.2 1.4 6.5 48 100 0.6 1.0 0.3 1.1 5.0 0.4 30 100 0.4 8.0 0.1 0.6 2.5 0.5 16 100 0.6 8.0 0.08 0.55 2.3 0.25 0.5 24 40 0.6 8.0 0.08 0.55 2.3 0.35 0.75 16 100 0.4 8.0 0.1 0.3 1.2 FSMD035-30-1206R 0.35 0.75 30 40 0.6 8.0 0.1 0.3 1.2 FSMD050-1206R 0.5 1.0 8 100 0.4 8.0 0.1 0.15 0.7 FSMD050-24-1206R 0.5 1.0 24 100 0.6 8.0 0.1 0.15 0.75 FSMD075-1206R 0.75 1.5 6 100 0.6 8.0 0.2 0.09 0.29 FSMD075-16-1206R 0.75 1.5 16 100 0.6 8.0 0.2 0.09 0.29 FSMD100-1206R 1.0 1.8 6 100 0.6 8.0 0.3 0.055 0.21 FSMD110-1206R 1.1 2.2 6 100 0.8 8.0 0.3 0.04 0.18 FSMD150-1206R 1.5 3.0 6 100 0.8 8.0 1.0 0.04 0.12 FSMD200-1206R 2 3.5 6 100 0.8 8.0 1.5 0.018 0.08 OHMS OHMS IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure Tin FSMD1206 PRODUCT DIMENSIONS (MILLIMETERS) Part Number FSMD005-1206R FSMD010-1206R FSMD012-1206R FSMD016-1206R FSMD020-1206R FSMD025-1206R FSMD025-24-1206R FSMD035-1206R FSMD035-30-1206R FSMD050-1206R FSMD050-24-1206R FSMD075-1206R FSMD075-16-1206R FSMD100-1206R FSMD110-1206R FSMD150-1206R FSMD200-1206R A Min 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 B Max 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 Min 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 C Max 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 Min 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.90 0.25 0.90 0.45 0.45 0.45 0.45 0.80 0.85 D Max 0.85 0.85 0.85 0.75 0.75 0.75 0.75 0.75 1.30 0.55 1.30 1.25 1.25 1.00 1.00 1.40 1.60 Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.25 0.10 0.25 0.25 0.25 0.25 0.25 0.25 0.25 E Max 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Max 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 D E Marking B A Top and Bottom View C Side View Page 1 of 2 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED03 C3CG01 2014.02.10 SURFACE MOUNT PPTC FSMD1206 Series RoHS THERMAL DERATING CURVE Thermal Derating curve, FSMD1206 Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (°C) TYPICAL TIME-TO-TRIP AT 23°C FSMD1206 Series A B C DE F G H I J K L 100 Time-to-trip (S) 10 Z 1 0.1 0.01 0.1 1 Fault current (A) 10 100 Z= FSMD005-1206R A= FSMD010-1206R B= FSMD012-1206R C= FSMD016-1206R D= FSMD020-1206R E= FSMD025-1206R / 025-24-1206R F= FSMD035-1206R / 035-60-1206R G= FSMD050-1206R / 050-24-1206R H= FSMD075-1206R / 075-16-1206R I= FSMD100-1206R J= FSMD110-1206R K= FSMD150-1206R L= FSMD200-1206R PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimension in the table below provide the recommended pad layout for each FSMD1210 device NOMINAL PAD DIMENSIONS (MILLIMETERS) SOLDER REFLOW 20 to 40 Seconds 260 °C Ramp-up 3°C/Second Max C (1.90) Ramp-down 6°C/Second Max 217 °C f 200 °C 150 °C B (1.0) A (2.0) Preheat B (1.0) 25 °C 60 to 180 Seconds 60 to 150 Seconds Solder Reflow Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only) 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned by using standard industry methods and solvents. 5. Storage Environment: <30°C / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. Page 2 of 2 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail [email protected] C5ED03 C3CG01 2014.02.10