SEMIHOW KSB13003A

KSB130
003A
KSB13003A
◎ SEMIHOW REV.A1,Oct 2007
KSB130
003A
KSB13003A
High
g Voltage
g Switch Mode Application
pp
• High Speed Switching
• Suitable for Electronic Ballast up to 21W
Absolute Maximum Ratings
CHARACTERISTICS
SYMBOL
RATING
UNIT
VCBO
VCEO
VEBO
IC
ICP
IB
PC
TJ
TSTG
700
400
9
1.5
3
0.75
1.10
150
-65~150
V
V
V
A
A
A
W
℃
℃
Collector-Base Voltage
Collector-Emitter
Collector
Emitter Voltage
Emitter-Base Voltage
Collector Current(DC)
Collector Current(Pulse)
Base Current
Collector Dissipation(Tc=25℃)
Junction Temperature
Storage Temperature
Electrical Characteristics
CHARACTERISTICS
1.5 Amperes
NPN Silicon Power Transistor
1.1 Watts
TC=25℃ unless otherwise noted
TO-92
1. Base
2. Collector
3. Emitter
3
1
2
TC=25℃ unless otherwise noted
SYMBOL
Test Condition
Min
Typ.
Max
Unit
Collector-Base Breakdown Voltage
VCBO
IC=500μA, IE=0
700
V
Collector-Emitter Breakdown Voltage
VCEO
IC=5mA, IB=0
400
V
Emitter Cut-off Current
IEBO
VEB=9V,IC=0
*DC Current Gain
hFE1
hFE2
VCE=2V,IC=0.5A
VCE=2V,IC=1A
*Collector-Emitter Saturation Voltage
VCE(sat)
IC=0.5A,IB=0.1A
IC=1A,IB=0.25A
IC=1.5A,IB=0.5A
0.5
1.0
3.0
V
V
V
*Base-Emitter Saturation Voltage
VBE(sat)
IC=0.5A,IB=0.1A
IC=1A,IB=0.25A
1.0
1.2
V
V
Cob
VCB=10V, f=0.1MHz
C
Current
t Gain
G i Bandwidth
B d idth P
Product
d t
fT
VCE=10V,I
10V IC=0.1A
0 1A
Turn on Time
ton
Storage Time
tstg
Fall Time
tF
Output Capacitance
10
8
5
㎂
35
㎊
21
㎒
4
Vcc=125V, Ic=2A
IB1=0.2A, IB2= -0.2A
RL=125Ω
1.1
㎲
4.0
㎲
0.7
㎲
* Pulse Test: Pulse Width≤300μs, Duty Cycle≤2%
Note.
hFE1
Classification
Package Mark information.
R
O
Y
G
9 ~ 16
14 ~ 21
19 ~ 26
25 ~ 35
S
A
13003
YWW Z
S
YWW
Z
SemiHow Symbol
Y; year code, WW; week code
hFE1 Classification
◎ SEMIHOW REV.A1,Oct 2007
KSB130
003A
Typical Characteristics
◎ SEMIHOW REV.A1,Oct 2007
KSB130
003A
Typical Characteristics
◎ SEMIHOW REV.A1,Oct 2007
KSB130
003A
Package Dimension
TOTO
-92
3.71±0.2
4.58±0.25
3°
4.58±0.25
4°
14.47
7±0.5
0.46±0.1
1 27t
1.27typ
3.6±0.25
1.02±±0.1
3.71±0.225
1.27typ
Dimensions in Millimeters
◎ SEMIHOW REV.A1,Oct 2007
KSB130
003A
Package Dimension
W
W1
W0
H0
H
W2
H1
TOTO
-92 TAPING
D0
F1 F2
P1
P
P2
Dimension [mm]
Item
Symbol
Reference
Tolerance
Component pitch
P
12.7
±0.5
Side lead to center of feed hole
P1
3.85
±0.5
Center lead to center of feed hole
P2
6.35
±0.5
FI,F2
2.5
+0.2/-0.1
Carrier Tape width
W
18.0
+1.0/-0.5
Adhesive tape width
W0
6.0
±0.5
Tape feed hole location
W1
9.0
±0.5
Adhesive tape position
W2
Lead pitch
1.0 MAX
Center of feed hole to bottom of component
H
19.5
±1
Center of feed hole to lead form
H0
16.0
±0.5
Component height
H1
Tape feed hole diameter
D0
27.0 max
4.0
±0.2
◎ SEMIHOW REV.A1,Oct 2007