CALMIRCO XRN740

XRN740-XXXX
CALIFORNIA MICRO DEVICES
Stable Extended Capability Chip Series
California Micro Devices Hx (Stable Extended Capability
Chip) Series offer exceptional stability and low noise.
Available in the standard center tapped configuration,
they have low electro migration qualities and extremely
low TCR.
Electrical Specifications
Parameter
Conditions
TCR
–55°C to 125°C
±100ppm
Ma x
TTCR
–55°C to 125°C
± 5 p p m/ ° C
Ma x
Op e r a t i n g Vo l t a g e
–55°C to 125°C
100Vdc
Ma x
Powe r Ra t i n g
@ 7 0 ° C ( D e r a t e l i n e a r l y t o ze r o @ 1 5 0 ° C )
1 2 5 mw
Ma x
Derat i on
3 0 ° C fo r 2 ye a r s
± 0 . 1 %∆
Ma x
T h e r m a l S h o ck
Me t h o d 1 0 7 MI L - STD- 2 0 2 F
± 0 . 2 %∆R
Ma x
Hi g h Te mp e r a t u r e Ex p o s u r e
1 0 0 Hr s @ 1 5 0 ° C Amb i e n t
±0.15%
Ma x
Mo i s t u r e Re s i s t a n c e
Me t h o d 1 0 6 MI L - STD- 2 0 2 F
± 0 . 2 %∆R
Ma x
L i fe
Noi se
Me t h o d 1 0 8 MI L - STD- 2 0 2 F ( 1 2 5 ° C/ 1 0 0 0 h r )
Me t h o d 3 0 8 MI L - STD- 2 0 2 F u p t o 2 5 0 KΩ
≥250KΩ
@2 5 ° C
± 0 . 2 %∆R
–35dB
–20dB
1 X 1 0 12Ω
Ma x
Ma x
I nsul at i on Resi st ance
Va l u e s
Bonding Area
R1
R2
Mi n
1MΩ to 20MΩ standard. Standard ratio tolerance between
resistors = ±1%. Tighter ratio tolerance available.
Laser Code Area
Mechanical Specifications
Formats
Die Size: 45±3 mils square
Bonding Pads: 4x4 mils typical
Ω to 20 MΩ
Ω
1 MΩ
Notes
Substrate
Silicon 10±2 mils thick
Isolation Layer
Si02 10,000Å thick, min
Resistor
Proprietary Silicon Chrome
Backing
Lapped (gold optional)
Bond Pads
Aluminum 10,000Å thick, min
1. Code boxes are available for alphanumeric laser
marking on the chip.
Pa ck a g i n g
Two inch square trays of 400 chips maximum is standard.
2. Resistor pattern may vary from one value to another.
Pa r t N u m b e r D e s i g n a t i o n
XRN740
1005
Series
Resistance Value
Fi rst 3 di gi t s are
si gni fi cant
va l u e .
Last di gi t
represents
nu mb e r o f
ze r o s.
R i ndi cates
d e c i ma l p o i n t .
F
A
G
W
P
Tolerance
TCR
Bond Pads
Backing
Ratio Tolerance
D = ±0.5%
No Let t er = ±100ppm
G = Gol d
W = Gol d
St d = ±1%
F = ±1%
A = ±50ppm
No Let t er =
Al u mi nu m
L = Lapped
P = ±0.5%
G = ±2%
B = ±25ppm
No Let t er =
Ei t her
J = ±5%
K = ±10%
C1360800
© 2000 California Micro Devices Corp. All rights reserved.
8/9/2000
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
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