PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo SMD LED : NO. 61L20001 KL-170YGX ELECTRONICS CORPORATION SHEET 1 OF 9 REV. 1 UNIT:MM TOLERANCE: ± 0.15 1.25 0.13 1 2 CATHODE MARK 2 0.25 1.3 0.75 1.2 0.4 0.4 2 1 Part No. Emitting Color Material Lens Type KL-170YGX Green GaP Water Clear Iv (IF=20mA) MIN (mcd) TYP (mcd) 5 12 Viewing Angle 2θ1/2 120∘ PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo ELECTRONICS CORPORATION SMD LED : KL-170YGX SHEET 2 OF 9 G Absolute maximum ratings (TA=25℃) Reverse voltage Forward current Forward current(Peak) NO. 61L20001 Green (GaP) REV. 1 Unit VR IF IFP 5 25 100 V mA mA Pd 40 mW TOP ℃ ℃ ℃ ℃ 1/10 Duty Cycle,0.1ms Pulse Width Power dissipation LED LAMPS: Operating temperature Storage temperature TST -40~+85 -40~+85 LED DISPLAYS: Operating temperature Storage temperature TA TSTG -40~+85 -40~+85 Operating characteristics (TA=25℃) Forward voltage(typ.) IF=20mA Forward voltage(max.) IF=20mA Reverse current(max.) VR=5V Wavelength at dominant emission(typ.) IF=20mA Wavelength at peak emission(typ.) IF=20mA Spectral line half-width IF=20mA Capacitance VF=0V,f=1MHz G Green (GaP) Unit VF 2.2 V VF 2.6 V IR 10 uA λD 570 nm λP 568 nm Δλ 30 nm C 45 pF PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo SMD LED : KL-170YGX ELECTRONICS CORPORATION Luminous Intensity Relative Value at IF=10mA 50 Forward Current(mA) NO.61L20001 40 30 20 10 0 SHEET 3 OF 9 5.0 4.0 3.0 2.0 1.0 0 1.2 1.6 2.0 2.4 2.8 3.2 0 10 20 30 40 50 Forward Voltage(V) IF-Forward Current(mA) Forward Current Vs. Forward Voltage Luminous Intensity Vs. Forward Current Relative Luminous Intensity 50 Forward Current IF (mA) REV. 1 40 30 20 10 2 1 0.5 0.2 0.1 0 0 20 40 60 80 100 Ambient Temperature TA(℃) Forward Current Derating Curve -30 -20 -10 0 10 20 30 40 50 60 70 Ambient Temperature TA(℃) Luminous Intensity Vs. Ambient Temperature PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo SMD LED : ELECTRONICS CORPORATION NO. 61L20001 KL-170YGX 0∘ 10∘ SHEET 4 OF 9 20∘ 30∘ 1.0 40∘ 50∘ 60∘ 70∘ 80∘ 90∘ 0.5 0∘ View Angle 2θ1/2=120∘ 0.5 REV. 1 PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo SMD LED : ELECTRONICS CORPORATION NO. 61L20001 KL-170YGX SHEET 5 OF 9 UNIT:MM TOLERANCE: ± 0.25 PACKAGE:2000 OR 1000PCS/REEL REEL”T”:14mmTYP 1.75±0.1 TYPE 4.0 TYP 4.0 TYP 1.5 TYP 2.0 TYP 0.25 TYP 8.0±0.3 3.5±0.05 1.29 TYP REV. 1 PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo SMD LED : ELECTRONICS CORPORATION NO. 61L20001 KL-170YGX SHEET 6 OF 9 UNIT:MM The following soldering patterns are recommended for reflow-soldering: 1.2 For reflow soldering 1.2 1.1 1.2 REV. 1 PRODUCT SPECIFICATION DATE: 05/20/2004 ELECTRONICS CORPORATION NO. 61L20001 KL-170YGX SHEET 7 OF 9 UNIT:MM TOLERANCE: ± 0.25 15 TYP 12.5 TYP R6.5 63 180 cosmo SMD LED : REV. 1 PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo SMD LED : NO. 61L20001 KL-170YGX ELECTRONICS CORPORATION SHEET 8 OF 9 REV. 1 SOLDERING SMT REFLOW SOLDERING INSTRUCTIONS 4℃/SEC. MAX. 230℃ 10 SEC MAX TEMPERATURE 140~160℃ 4℃/SEC MAX. 35 SEC MAX 60~120 SEC TIME SOLDERING INSRTUCTIONS DIP AND WAVE SOLDERING TYPES IRON SOLDERING(WITH 1.5mm IRON TIP) DISTANCE FORM TEMPERATURE OF SOLDERING SOLDER JOINT IRON TO CASE MAXLMUM DISTANCE FROM SOLDERING SOLDER JOINT TO CASE TIME TEMPERATURE OF THE SOLDERING BATH MAXLMUM SOLDERING TIME ≦260℃ 3S ＞2mm ≦260℃ 3S ＞2mm ≦260℃ 5S ＞4mm ≦260℃ 5S ＞4mm ≦260℃ 3S ＞2mm ≦260℃ 3S ＞2mm LEDS DISPLAYS PRODUCT SPECIFICATION DATE: 05/20/2004 cosmo ELECTRONICS CORPORATION SMD LED : NO. 61L20001 KL-170YGX SHEET 9 OF 9 REV. 1 SMD HANDLING AND APPLICATION PRECAUTIONS STORAGE (1.1)It is recommended to store the devices in accordance with the following conditions: Humidity: 60%RH Max. Temperature: 5℃~30℃ (41℉~86℉) (1.2)Shelf life in sealed bag: 12 month at <5℃~30℃ and <30%RH. After the package is opened, the products should be used within 72hrs. Or they should be kept at ≦20%RH in zip -locked sealed bags. DRY PACK AND BAKING SMD LEDs are MOISTURE SENSITIVE devices. Avoid absorbing moisture at any time during transportation and/or storage. It is recommended to bake before soldering when the pack is unsealed after 72 hrs, or any suspicious moisture being found. Bake devices in accordance with the following conditions: (a) 60±3℃ x (12~24hrs) and <5%RH, taped reel type (b) 100±3℃ x (45min~1hr), loose packing type, or (c) 130±3℃ x (15~30min), loose packing type ELECTRIC STATIC DISCHARGE(ESD) PROTECTION Materials with GaN, InGaN, AlInGaP are STATIC SENSITIVE devices. They will be packed in anti-static bags. ESD protection must be deliberatively observed from the initial design stage. The static -electric discharge may result in severe malfunction of the devices. In the events of manual working in process, make sure the devices are well protected from ESD at any time. Surge before and during handling products.