HANBIT HFDOM

HANBiT
HFDOM-44LX Series
44Pin Flash Disk Module for 128MB,192M, 256M, True IDE Interface
Mode, 5.0V
Part No. HFDOM44LX-xxxx
GENERAL DESCRIPTION
The HFDOM40LX series 44Pin Flash Disk on Module is a flash technology based with True IDE interface flash memory
card for Lexar controller. It is constructed with flash disk controller chip and NAND-type (Samsung) flash memory device.
The HFDOM44LX series operates in 5.0-Volt power supplies. It comes in capacity of 128, 192MB and up to 256 MB
formatted 44Pin type .
By optimizing flash memory management, the life of this HFDOM44LX series can be extended to its maximum level.
Because the ECC function is included, the correctness of data transfer between the HFDOM44LX series and a True IDE
compatible interface device can be guaranteed.
The HFDOM44LX series is fully compatible with applications such as CPU card / board, set top box, industry / military PC,
security equipment, measuring instrument and embedded systems.
FEATURES
-
True IDE compatible host interface
Direct plug in for 2.5″ IDE Connectors
44 pin 2.00mm IDE Connector
Ultra-High Performance
Support for CIS implemented with 256 bytes of attribute memory
5.0V operation voltage
Burst Rate (to/from Host): up to 16.6MB/s (PIO mode 4)
Sustained Write (Host to flash): minimum of 1.2MB/s
Data Transfer Rate (device to PC via USB interface): up to 850KB/s
Capacity : Min. 128MB ~ Max. 256MB
Auto Sleep Mode
Low Power Dissipation
Low VCC Program Inhibit Function
PRODUCT SPECIFICATIONS
Capacities :
128, 192 and up to 256 MB (formatted)
Operating Voltage : 5.0V ±10%
Power consumptions :
Read mode
65 mA (typ)
Write mode
65 mA (typ)
Sleep mode
300 uA (typ)
Environment conditions :
Operating temperature
0°C to + 70°C
Storage temperature
- 25°C to + 85°C
Relative humidity
95%(Max)
Mechanical conditions :
Weight : Maximum 10.1g
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ELECTRICAL SPECIFICATIONS
Table 1.1 Absolute Maximum Ratings
Parameters
Symbol
Min
Max
Unit
Storage Temperature
Tstg
-65
150
°C
Power Supply Voltage
Vcc
-0.3
7
V
Test Condition
Input or Output Voltage
Vin, Vout
GND-0.5
Vcc+0.5
V
NOTE :Stress above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only and functional operation of the
device at these or any conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Table 1.2 Recommended Operating Conditions
Parameters
Symbol
Min
Max
Unit
Operating Temperature
Ta
0
70
°C
Supply Voltage
Vcc
4.5
5.5
V
Test Condition
Table 1.3 DC Characteristics (Ta = 0 to +70°C, Vcc = 5V ± 10%, Vcc = 3V ± 5%)
Parameters
Power Supply voltage
Symbol
Min
Max
Unit
Vdd
3.15
5.5
V
Input Low Voltage
Vil
-0.5
0.8
V
Input High Voltage
Vih
2.0
Vdd+0.3
V
Output Low Voltage
Vol
-
0.4
V
Output High Voltage
Voh
2.4
-
V
Il
-5
5
uA
Cout
-
10
pF
Input Leakage
Output Capacitance
Read Current
Irc
55
mA
Write Current
Iwr
55
mA
Sleep Current
Isc
200
uA
Test Condition
CAPACITY SPECIFICATIONS
Table 1.4 Capacity Specifications
Part Number
Capacity (Unformatted)
Sectors/Card
Cylinders
Heads
Sectors/Track
HFDOM-44LX128
128,188,416 bytes
250,368
978
8
32
HFDOM-44LX192
193,462,272 bytes
377,856
738
16
32
HFDOM-44LX256
257,949,696 bytes
503,808
984
16
32
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PHYSYCAL SPECIFICATIONS
51.80 ± 0.1mm
1
Jumper
Slave
Master
1,2
2,3
Close
Close
25.00 ± 0.1mm
4.30± 0.1mm
44.00 ± 0.1mm
4.00 ± 0.1mm
1.90mm ± 0.08mm
1
43
2
44
2.00mm ± 0.02mm
Figure 1.1 44 pin Type Flash Disk Module Dimensions
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INSTALLTION GUIDE
1) Setting Method (for example)
①
Make sure your computer is turned off before you open the case.
②
Plug the carefully into the 44pin IDE slot on your computer.
Caution: Make sure to align pin1 on host adapter interface connector with pin 1 on your Flash Disk Module. Pin 1
is indicated by a triangle on the Flash Disk Module connector.
③
The Flash Disk Module is used power connector cable of the computer.
Caution: If you need to remove your Flash Disk Module, use both hands to pull it out carefully.
④
Check all cable connections and then replace your computer cover.
2) BIOS setting Method (for example)
Before you format or partition your new drive, you must configure your computer's BIOS so that the computer can
recognize your new drive.
①
Turn your computer on. As your computer start up, watch the screen for a message describing how to run the
system setup program on the screen (sometimes called BIOS or CMOS setup). This is usually done by pressing a
special key, such as Delete, Esc or F1 during startup. See your computer manual for details. Press the appropriate
key to run the system setup program.
②
If your BIOS provides automatic drive detection (an "AUTO" drive type), select this option. ( We
recommend to use Normal / CHS mode to partition your Flash Disk Module to get the maximum formatted
capacity. )
This allows your computer to configure itself automatically for your new drive.
If your BIOS dose not provide “AUTO” drive detection, select "User-defined" drive setting and enter the
CHS values from the table. BIOS Settings (see specification) Capacity Cylinders Heads Sectors(unformatted)
③
Save the settings and exit the System Setup program. ( your computer will automatically reboot ) After you
configure your computer, you can use the standard DOS commands to partition and format your Flash Disk Module,
as described below.
3) Formatting Method (for example)
To partition your new Flash Disk Module with Microsoft DOS program :
①
Insert a bootable DOS diskette into your diskette drive and restart your computer.
②
Insert a DOS program diskette that contains the FDISK.EXE and FORMAT.COM
programs into your diskette drive. Use the same DOS version that is on your bootable diskette. At the A:\ > prompt,
type “FDISK” and press Enter.
③
Select “Create DOS partition or logical DOS drive” by pressing 1. Then press Enter.
④
Select “Create primary DOS partition” by pressing 1 again. Then press Enter.
Create your first drive partition. If you are creating a partition that will be used to boot your computer (drive C),
make sure that the partition is marked active.
⑤
Create an extended partition and additional logical drives as necessary, until all the space on your new hard drive
has been partitioned.
⑥
When the partitioning is complete, FDISK reboots your computer.
Caution: Make sure to use the correct drive letters so that you do not format a drive that already contains data.
⑦
At the A:\ > prompt, type “format D:/s”, where D is HFDOM44LX, Repeat the format process for all the new
partitions you have created.
⑧
After you format your drive, it is ready to use.
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1. PIN INFORMATION
PIN ASSIGNMENTS AND PIN TYPE
Table 2.1 Pin Assignment and Pin type
Pin
Signal
Pin Type
Pin
Signal
Pin Type
1
/RESET
I
2
GND3
GND3
3
D07
I/O
4
D08
I/O
5
D06
I/O
6
D09
I/O
7
D05
I/O
8
D10
I/O
9
D04
I/O
10
D11
I/O
11
D03
I/O
12
D12
I/O
13
D02
I/O
14
D13
I/O
15
D01
I/O
16
D14
I/O
17
D00
I/O
18
D15
I/O
19
GND1
GND1
20
NC
KEY(no pin)
21
DREQ
DREQ
22
GND4
GND4
23
/OW
/OW
24
GND5
GND5
25
/OR
/OR
26
GND6
GND6
27
IOCHRDY
IORDY
28
H_SEL
CSEL
29
/DACK
/DACK
30
GND7
GND7
31
INT
IRQ
32
/IO16
/IOIS16
33
A01
I
34
/PDIAG
I/O
35
A00
I
36
A02
I
37
/CS0
/CS0
38
/CS1
I
39
/DASP (LED)
I/O
40
GND8
GND8
41
VCC1
VCC1
42
VCC2
VCC2
43
GND2
GND2
44
NC
RSVD2
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Signal Descriptions
Table 2.2 Signal Descriptions
Signal Name
Dir.
Pin
I
33,35,36
-PDIAG
I/O
34
-DASP(LED)
I/O
39
I
37,38
A[2:0]
-CS0, -CS1
3,4,5,6,
Description
In True IDE Mode only A[2:0] are used to select the one of eight registers in
the Task File, the remaining address lines should be grounded by the host.
This input / output is the Pass Diagnostic signal in the Master / Slave
handshake protocol.
This signal used either to drive an LED whenever the Disk Module is being
accessed or as indication of a second drive present. This signal is active low
when the Disk Module is busy.
CS0 is the chip select for the task file registers while CS2 is used to select
the Alternate Status Register and the Device Control Register.
All Task File operations occur in byte mode on the low order bus D00-D07
while all data transfers are 16 bit using D00-D15.
7,8,9,10,
D[15:00]
I/O
11,12,13,
14,15,16,
17,18
2,19,22,
GND[8:1]
--
24,26,
Ground.
30,40, 43
-IOR
I
25
This is an I/O Read strobe generated by the host.
-IOW
I
23
The I/O Write strobe pulse is used to clock I/O data on the Card Data bus
into the Storage Card controller registers when the Storage Card is
configured to use the I/O interface. The clocking will occur on the negative to
positive edge of the signal (trailing edge).
IRQ
O
31
In True IDE Mode signal is the active high Interrupt Request to the host.
-RESET
I
1
This input pin is the active low hardware reset from the host.
IORDY
O
27
This output signal may be used as IORDY.
-IOCS16
O
32
This output signal is asserted low when this device is expecting a word data
transfer cycle.
VCC[2:1]
I
41, 42
NC
(Not Connect)
--
20, 44
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This input pin is used for VCC(5V).
This pin is not used for signal on the module.
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HFDOM-44LX Series
BLOCK DIAGRAM
True IDE
Mode
Interface
Figure 2.1 Flash Disk Module Block Diagram
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2. INTERFACE BUS TIMING
ACCESS SPCIFICATIONS
IDE MODE I/O ACCESS SPECIFICATIONS
In this True IDE Mode the Flash Disk Module protocol and configuration are disabled and only I/O operations to the
Task File and Data Register are allowed. In this mode no Memory or Attribute Registers are accessible to the host.
Table 3.1 IDE Mode I/O Read Access
Mode
-CE2
-CE1
A2-A0
-IORD
-IOWR
D15 - D8
D7 – D0
Invalid Mode
L
L
x
x
x
High-Z
High-Z
Standby Mode
H
H
x
x
x
High-Z
High-Z
Task File Read
H
L
1-7h
L
H
High-Z
Data Out
Data Register Read
L
H
L
L
H
Odd Byte out
Even Byte out
Table 3.2 IDE Mode I/O Read Timing
Parameter
Symbol
IEEE Symbol
Min. ns
Data Delay after IORD
td (IORD)
tlGLQV
Data Hold following IORD
th (IORD)
tlGHQX
0
IORD Width Time
tw (IORD)
tlGLIGH
165
Address Setup before IORD
tsuA (IORD)
tAVIGL
70
Address Hold following IORD
thA (IORD)
tlGHAX
20
CE Setup before IORD
tsuCE (IORD)
tELIGL
5
CE Hold following IORD
thCE (IORD)
tlGHEH
20
IOIS16 Delay Falling from Address
tdfIOIS16 (ADR)
tAVISL
Max. ns
100
35
IOIS16 Delay Rising from Address
tdrIOIS16 (ADR)
tAVISH
35
NOTE: The maximum load on -IOIS16 is 1 LSTTL with 50pF total load. All times are in nanoseconds. Minimum time
from
–WAIT high to -IORD high is 0nsec, but minimum -IORD width must still be met.
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Figure 3.1 IDE Mode I/O Read Timing Example
Table 3.1 IDE Mode I/O Write Access
Mode
-CE2
-CE1
A2-A0
-IORD
-IOWR
D15 - D8
D7 – D0
Invalid Mode
L
L
x
x
x
High-Z
High-Z
Standby Mode
H
H
x
x
x
High-Z
High-Z
Task File Read
L
H
1-7h
H
L
x
Data In
Data Register Read
H
L
6h
H
L
x
Control In
Table 3.3 IDE Mode I/O Write Timing
Parameter
Symbol
IEEE Symbol
Min. ns
Data Setup before IOWR
tsu(IOWR)
tDVIWH
100
Data Hold following IOWR
th(IOWR)
tlWHDX
0
IOWR Width Time
twI(OWR)
tlWLIWH
165
Address Setup before IOWR
tsuA(IOWR)
tAVIWL
70
Address Hold following IOWR
thA(IOWR)
tlWHAX
20
CE Setup before IOWR
tsuCE(IOWR)
tELIWL
5
CE Hold following IOWR
thCE(IOWR)
tlWHEH
20
IOIS16 Delay Falling from Address
tdfIOIS16(ADR)
tAVISL
Max. ns
35
IOIS16 Delay Rising from Address
tdrIOIS16(ADR)
tAVISH
35
NOTE: The maximum load on -IOIS16 is 1 LSTTL with 50pF total load. All times are in nanoseconds. Minimum time
from
-WAIT high to -IOWR high is 0nsec, but minimum -IOWR width must still be met.
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Figure 3.2 IDE Mode I/O Write Timing Example
Ordering Infomation
NO
Parts
Size
Capacity
Media
transfer
mode
Operation
Mode
1
DO44LX128
51.80x25.0x1.9mm
128Mbyte
BYTE
True IDE
2
DO44LX192
51.80x25.0x1.9mm
192Mbyte
BYTE
True IDE
3
DO44LX256
51.80x25.0x1.9mm
256Mbyte
BYTE
True IDE
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