HMC140 MICROWAVE CORPORATION GaAs MMIC DOUBLE-BALANCED MIXER 1.0 - 2.0 GHz SEPTEMBER 1999 Features General Description CONVERSION LOSS: 10 dB The HMC140 chip is a miniature doublebalanced mixer which can be used as an upconverter or downconverter. The chip is especially suitable for Telecom and EW / ECM applications because of its small size and consistent IC performance. The chip can be integrated directly into hybrid MICs without DC bias or external baluns to provide an extremely compact mixer. LO TO RF ISOLATION: 40 dB PASSIVE : NO DC BIAS REQ'D Mixers 4 Guaranteed Performance With LO Drive of +13 dBm, -55 to +85 deg C Parameter Min. Frequency Range, RF & LO Frequency Range, IF Typ. Max. Units 1.0 - 2.0 GHz DC - 1 GHz Conversion Loss 10 12 dB Noise Figure (SSB) 10 12 dB LO to RF Isolation 35 40 dB LO to IF Isolation 20 25 dB IP3 (Input) 13 18 dBm IP2 (Input) 30 40 dBm 1 dB Gain Compression (Input) 5 10 dBm Local Oscillator Drive Level 10 13 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 14 Phone: 978-250-3343 Fax: 978-250-3373 20 dBm Web Site: www.hittite.com MICROWAVE CORPORATION HMC140 DOUBLE-BALANCED MIXER 1.0 - 2.0 GHz SEPTEMBER 1999 Conversion Loss Isolation 0 -10 -5 RF/ IF ISOLATION (dB) -10 -15 -20 LO/ IF -30 4 LO/ RF -40 -50 -20 0 0.5 1 1.5 2 2.5 3 0 0.5 1 FREQUENCY (GHz) 1.5 2 2.5 3 FREQUENCY (GHz) Return Loss 0 RETURN LOSS (dB) IF -5 -10 RF -15 LO -20 0 12 Elizabeth Drive, Chelmsford, MA 01824 0.5 1 1.5 2 FREQUENCY (GHz) Phone: 978-250-3343 2.5 3 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 15 Mixers CONVERSION LOSS (dB) 0 MICROWAVE CORPORATION HMC140 DOUBLE-BALANCED MIXER 1.0 - 2.0 GHz SEPTEMBER 1999 Absolute Maximum Ratings Schematic RF (PIN 7) +27 dBm -65 to +150 deg C -55 to +125 deg C IF (PIN 5) 4 Mixers LO (PIN 2) LO Drive Storage Temperature Operating Temperature Outline Drawing 1.168 (0.046) 1.041 (0.041) 0.584 (0.023) 0.127 (0.005) IF LO RF N/C 1.041 (0.041) IF(ALTERNATE) Hittite 3601 1.168 (0.046) 0.584 (0.023) 0.584 (0.023) 0.432 (0.017) 0.127 (0.005) 0.584 (0.023) 0.737 (0.029) IF(ALTERNATE) DIE THICKNESS IS 0.180 (0.007) BACKSIDE IS GROUND BOND PADS ARE 0.100 (0.004) SQUARE ALL DIMENSION IN MILLIMETERS (INCHES( ALL TOLERANCES ARE ± 0.025 (±0.001) BOND PAD METALLIZATION : GOLD BACKSIDE METALLIZATION: NONE 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 16 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com MICROWAVE CORPORATION HMC140 DOUBLE-BALANCED MIXER 1.0 - 2.0 GHz SEPTEMBER 1999 Handling Precautions Follow these precautions to avoid permanent damage. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes ( see page 8 - 2 ). Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. 4 Mixers Mounting The chip is not back-metallized and can be die mounted with electrically conductive epoxy only. The mounting surface should be clean and flat. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as possible. 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 17