HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 Features General Description RUGGED SMT BGA PACKAGE The HMC265CB1 is a 20 – 31 GHz surface mount sub - harmonically pumped (x2) MMIC downconverter with integrated LO & IF amplifiers in a rugged Ball Grid Array (BGA) package. The 2LO to RF & IF isolations are an excellent 30 & 50 dB respectively, eliminating the need for additional filtering. The LO amplifier is a single bias (+3V to +4V) two stage design with only – 4 dBm drive requirement. This GaAs PHEMT based downconverter chip was designed to be used in LMDS, microwave point-to-point radios, and SATCOM applications. All data is with the non-hermetic, epoxy sealed BGA packaged device mounted in a 50 ohm test fixture. Utilizing the HMC265CB1 eliminates the need for wirebonding, thereby providing a consistent connection interface for the customer. Utilizing the HMC265CB1 eliminates the need for wirebonding, thereby providing a consistent interface for the user. INTEGRATED LO AMPLIFIER: -4dBm INPUT SUB-HARMONICALLY PUMPED (x2) LO HIGH 2LO/RF ISOLATION: > 35dB INTEGRATED IF AMPLIFIER: 3 dB CONV GAIN SMT MIXERS 4 Guaranteed Performance, Parameter As a Function of LO Drive & Vdd, - 55 to + 85 deg C IF = 1 GHz LO= - 4dBm & Vdd = +4V IF = 1 GHz LO= - 4dBm & Vdd = +4V IF = 1 GHz LO= - 4dBm & Vdd = +3V Min. Min. Min. Typ. Max. Typ. Max. Typ. Units Max. Frequency Range, RF 20 - 31 27 - 30 21 - 30 GHz Frequency Range LO 10 - 15.5 13.5 - 15 10.5 - 15 GHz 0.8 - 2.8 GHz 2.5 dB 13 dB Frequency Range, IF Conversion Gain RF to IF 0.7 - 3 -2 Noise Figure (SSB) 0.7 - 3 3 0 13 3 -1 13 2LO to RF Isolation 18 25 26 30 16 25 dB 2LO to IF Isolation 42 50 48 55 45 50 dB 2 8 dBm 0 dBm IP3 (Input) 2 8 6 10 1 dB Compression (Input) -1 +2 0 +3 Local Oscillator Drive Level Supply Voltage (Vdd) -8 -4 +8 -8 -4 +8 -8 -4 +8 dBm 3.75 4.0 4.25 3.75 4.0 4.25 2.75 3.0 3.25 Vdc 50 65 50 65 40 55 mA Supply Current (Idd) 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 146 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 Conversion Gain vs. Temperature @ LO = -4 dBm Vdd= +3V Conversion Gain vs. Temperature @ LO = -4 dBm Vdd= +4V 10 10 -55 C 5 CONVERSION GAIN (dB) 0 +25 C +85 C -5 -10 5 0 -5 +25 C +85 C -10 -15 -15 -20 18 20 22 24 26 28 30 32 34 18 20 22 RF FREQUENCY (GHz) 24 26 28 30 32 Conversion Gain vs. LO Drive @ Vdd = +3V Conversion Gain vs. LO Drive @ Vdd = +4V 10 10 -2 dBm 0 -5 -6 dBm -2 dBm -10 -4 dBm -8 dBm -15 5 0 -5 -6 dBm 0 dBm -10 -4 dBm -8 dBm -15 -20 -20 18 20 22 24 26 28 30 32 34 18 20 22 RF FREQUENCY (GHz) 24 26 28 30 32 34 RF FREQUENCY (GHz) Isolation @ LO = -4 dBm Vdd = +4V Isolation @ LO = -4 dBm Vdd = +3V 10 10 0 0 LO/RF -10 2LO/RF LO/IF LO/RF -20 ISOLATION (dB) -10 -30 -40 RF/IF -50 2LO/RF LO/IF -20 -30 -40 RF/IF -50 -60 -60 2LO/IF 2LO/IF -70 -70 18 20 22 24 26 28 30 32 34 12 Elizabeth Drive, Chelmsford, MA 01824 18 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) RF FREQUENCY (GHz) Phone: 978-250-3343 4 SMT 5 CONVERSION GAIN (dB) CONVERSION GAIN (dB) 0 dBm ISOLATION (dB) 34 RF FREQUENCY (GHz) MIXERS CONVERSION GAIN (dB) -55 C Fax: 978-250-3373 Web Site: www.hittite.com 4 - 147 HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 IP2 vs. LO Drive @ Vdd = +3V IP3 vs. LO Drive @ Vdd = +4V SECOND ORDER INTERCEPT (dBm) THIRD ORDER INTERCEPT (dBm) 20 -2 dBm 16 12 8 -6 dBm 4 -4 dBm 0 86 -2 dBm 82 78 74 -6 dBm 20 22 24 26 28 30 32 34 18 20 22 RF FREQUENCY (GHz) 26 28 30 32 34 IF Return Loss @ LO = -4 dBm, Vdd = +4V 0 -2 -4 -4 RETURN LOSS (dB) 0 -2 -6 -8 -10 -12 RF -14 24 RF FREQUENCY (GHz) LO & RF Return Loss @ LO = -4 dBm, Vdd = +4V RETURN LOSS (dB) -4 dBm 70 18 -16 -6 -8 -10 -12 -14 -16 LO -18 -18 -20 -20 0 5 10 15 20 25 30 35 40 0 1 FREQUENCY (GHz) 2 3 4 5 6 IF FREQUENCY (GHz) P1dB @ LO = -4 dBm, Vdd = +4V IF Bandwidth @ LO = -4 dBm 5 5 IF CONVERSION GAIN (dB) 4 3 2 P1dB (dBm) SMT MIXERS 4 90 1 0 -1 -2 -3 Vdd= +4V 0 -5 Vdd= +3V -10 -15 -4 -5 -20 18 20 22 24 26 28 30 32 34 RF FREQUENCY (GHz) 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 148 0 1 2 3 4 5 6 IF FREQUENCY (GHz) Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 Schematic Absolute Maximum Ratings RF (20 - 31 GHz) +13 dBm LO Drive (Vdd = +5V) +13 dBm Vdd +8 Vdc Storage Temperature -65 to +150 deg C Operating Temperature -55 to +85 deg C LO In (10 - 15.5 GHz @-4 dBm TYP.) ( See Mounting, Note Page 4 - 150) SMT Outline Drawing 4 MIXERS Vdd (+3 to +4V) (0.7 - 3 GHz) RF / IF Input (Vdd = +5V) 1. MATERIAL: PACKAGE BODY: WHITE ALUMINA (99.0%) BALL CONTACTS : SILVER-COPPER BALL, EUTECTICALLY ATTACHED LID : PLASTIC, B-STAGE EPOXY ATTACHED 2. PLATING : ELECTROLYTIC GOLD 50-225 MICROINCHES OVER ELECTROLYTIC NICKEL 75 TO 225 MICROINCHES. 3. DIMENSIONS ARE IN INCHES (MILLIMETERS).UNLESS OTHERWISE SPECIFIED ALL TOLERANCES ARE ± 0.005 (± 0.13). 4. ALL UNLABELED BALL CONTACTS ARE GROUND. 5. ALL GROUNDS MUST BE SOLDERED TO THE PCB RF GROUND 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 149 HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 Mounting The BGA package is back-metallized and can be mounted with either eutectic solder or electrically conductive epoxy. The mounting surface should be clean and flat. Placement of the BGA package can be done manually or with available automatic placement machines. Eutectic Attach: SMT MIXERS 4 Eutectic solder paste may be applied manually or automatically by screen print/dispense methods to the PCB. Geometry and process should be such as to supply sufficient solder volume to obtain adequate solder fillets around the balls of the package after reflow without shorting RF/DC ball signal contacts. The solder should be reflowed in an infrared reflow oven with the appropriate temperature profile for that solder. The finished fillet should resemble a cylindrical column with a flared pedestal at the substrate surface when viewed from the side. Do not expose the BGA package to temperature greater than 220oC for more than 20 seconds. Epoxy Attach: Electrically conductive epoxy may be applied in the same manner as mentioned above. Again geometry and process parameters should be such as to supply sufficient epoxy around each of the balls of the package without shorting RF/DC ball signal contact . Cure the epoxy per the recommended manufacture's schedule. Handling Precautions: Follow these precautions to avoid permanent damage. Cleanliness: Handle the devices in a clean environment. Static Sensitivity: Follow ESD precautions to protect against ESD strikes ( see page 8 - 2 ). Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the BGA package along the edges with a vacuum collet or with a sharp pair of bent tweezers. Avoiding damaging the solder balls on the package bottom. 12 Elizabeth Drive, Chelmsford, MA 01824 4 - 150 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com HMC265CB1 MICROWAVE CORPORATION HMC265CB1 SUB-HARMONIC SMT MIXER 20 - 31 GHz FEBRUARY 2001 NOTES: SMT MIXERS 4 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com 4 - 151