2.0x1.25mm SMD CHIP LED LAMP APTK2012MGC MEGA GREEN Description Features 2.0mmx1.25mm SMT LED, 0.75mm THICKNESS. The Mega Green source color devices are made with LOW POWER CONSUMPTION. DH InGaAlP on GaAs substrate Light Emitting Diode. WIDE VIEWING ANGLE. IDEAL FOR BACK LIGHT AND INDICATOR. VARIOUS COLORS AND LENS TYPES AVAILABLE. PACKAGE:2000PCS/REEL Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1121 REV NO: V.2 DATE: FEB/28/2005 PAGE: 1 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000313 Selection Guide Part No. Dice APTK2012MGC Iv (mcd) @ 20mA Lens Type MEGA GREEN (InGaAlP) Viewing Angle Min. Typ. 2θ θ1/2 36 80 100° WATER CLEAR Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device λpeak Peak Wavelength Mega Green λD Dominate Wavelength ∆λ1/2 Typ. Max. Units Test Conditions 574 nm IF=20mA Mega Green 568 nm IF=20mA Spectral Line Half-width Mega Green 26 nm IF=20mA C Capacitance Mega Green 20 pF VF=0V;f=1MHz VF Forward Voltage Mega Green 2.1 2.5 V IF=20mA IR Reverse Current Mega Green 10 uA VR = 5V Absolute Maximum Ratings at TA=25°C Parameter Mega Green Units Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA 5 V Reverse Voltage Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1121 REV NO: V.2 DATE: FEB/28/2005 PAGE: 2 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000313 Mega Green APTK2012MGC SPEC NO: DSAD1121 REV NO: V.2 DATE: FEB/28/2005 PAGE: 3 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000313 APTK2012MGC APTK2012MGC SMT SMT Reflow Reflow Soldering Soldering Instructions Instructions Number reflow process shall lessorthan 2 times and cooling Number ofofreflow process shall be 2be times less and cooling process to normal temperature is required between first and process to normal temperature is required between first and second soldering process. second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1121 REV NO: V.2 DATE: FEB/28/2005 PAGE: 4 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000313