KODENSHI KK74HC164AN

TECHNICAL DATA
KK74HC164А
8-Bit Serial-Input/Parallel-Output
Shift Register
High-Performance Silicon-Gate CMOS
The KK74HC164A is identical in pinout to the LS/ALS164. The
device inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LS/ALSTTL outputs.
The KK74HC164A is an 8-bit, serial-input to parallel-output shift
register. Two serial data inputs, A1 and A2, are provided so that one input
may be used as a data enable. Data is entered on each rising edge of the
clock. The active-low asynchronous Reset overrides theClock and Serial
Data inputs.
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION
KK74HC164АN Plastic
KK74HC164АD SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
FUNCTION TABLE
Inputs
PIN 14 =VCC
PIN 7 = GND
Outputs
RESET
CLOCK
A1 A2
L
X
X X
QA QB…QH
L
L… L
H
X X
no change
H
H D
D
QAn…QGn
H
D H
D
QAn…QGn
D = data input
X = don’t care
QAn - QGn = data shifted from the previous stage on a
rising edge at the clock input.
1
KK74HC164А
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
-0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
-1.5 to VCC +1.5
V
DC Output Voltage (Referenced to GND)
-0.5 to VCC +0.5
V
DC Input Current, per Pin
±20
mA
IOUT
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
mW
-65 to +150
°C
260
°C
VOUT
IIN
Tstg
TL
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
Min
Max
Unit
2.0
6.0
V
0
VCC
V
-55
+125
°C
0
0
0
1000
500
400
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
2
KK74HC164А
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC
Symbol
Parameter
Test Conditions
Guaranteed Limit
V
25 °C
to
-55°C
≤85
°C
≤125
°C
Unit
VIH
Minimum HighLevel Input Voltage
VOUT=0.1 V or VCC-0.1 V
⎢IOUT⎢≤ 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low Level Input Voltage
VOUT=0.1 V or VCC-0.1 V
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
VOH
Minimum HighLevel Output Voltage
VIN= VIH or VIL
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN=VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
VIN= VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
VOL
Maximum LowLevel Output Voltage
VIN=VIH or VIL
⎢IOUT⎢ ≤ 20 µA
V
IIN
Maximum Input
Leakage Current
VIN=VCC or GND
6.0
±0.1
±1.0
±1.0
µA
ICC
Maximum Quiescent
Supply Current
(per Package)
VIN=VCC or GND
IOUT=0µA
6.0
8.0
80
160
µA
3
KK74HC164А
AC ELECTRICAL CHARACTERISTICS(CL=50pF,Input tr=tf=6.0 ns)
VCC
Symbol
fmax
tPLH, tPHL
tPHL
tTLH, tTHL
Guaranteed Limit
V
25 °C
to
-55°C
≤85°C
≤125°C
Unit
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
4.5
6.0
6.0
30
35
4.8
24
28
4.0
20
24
MHz
Maximum Propagation Delay,Clock to Q (Figures
1 and 4)
2.0
4.5
6.0
175
35
30
220
44
37
265
53
45
ns
Maximum Propagation Delay,Reset to Q
(Figures 2 and 4)
2.0
4.5
6.0
205
41
35
255
51
43
310
62
53
ns
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
-
10
10
10
pF
Parameter
CIN
Maximum Input Capacitance
tSU
Minimum Setup Time,A1 or A2 to Clock
(Figure 3)
2.0
4.5
6.0
50
10
9
65
13
11
75
15
13
ns
th
Minimum Hold Time, Clock to A1 or A2
(Figure 3)
2.0
4.5
6.0
5
5
5
5
5
5
5
5
5
ns
trec
Minimum Recovery Time, Reset Inactive to
Clock (Figure 2)
2.0
4.5
6.0
5
5
5
5
5
5
5
5
5
ns
tw
Minimum Pulse Width, Reset (Figure 2)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
tw
Minimum Pulse Width, Clock (Figure 1)
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
tr, tf
Maximum Input Rise and Fall Times (Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
ns
CPD
Power Dissipation Capacitance (Per Package)
Typical @25°C,VCC=5.0 V
Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
140
pF
4
KK74HC164А
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
Figure 3. Switching Waveforms
Figure 4. Test Circuit
TIMING DIAGRAM
EXPANDED LOGIC DIAGRAM
5
KK74HC164А
N SUFFIX PLASTIC DIP
(MS - 001AA)
A
Dimension, mm
8
14
B
7
1
Symbol
MIN
MAX
A
18.67
19.69
B
6.1
7.11
5.33
C
F
L
C
-T- SEATING
PLANE
N
G
M
K
J
H
D
0.25 (0.010) M T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D
0.36
0.56
F
1.14
1.78
G
2.54
H
7.62
J
0°
10°
K
2.92
3.81
L
7.62
8.26
M
0.2
0.36
N
0.38
D SUFFIX SOIC
(MS - 012AB)
Dimension, mm
A
14
8
H
B
1
G
P
7
R x 45
C
-TK
D
SEATING
PLANE
J
0.25 (0.010) M T C M
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B ‑ 0.25 mm (0.010) per side.
F
M
Symbol
MIN
MAX
A
8.55
8.75
B
3.8
4
C
1.35
1.75
D
0.33
0.51
F
0.4
1.27
G
1.27
H
5.27
J
0°
8°
K
0.1
0.25
M
0.19
0.25
P
5.8
6.2
R
0.25
0.5
6