NUMONYX 28F128W30

Numonyx™ Wireless Flash Memory (W30)
28F640W30, 28F320W30, 28F128W30
Datasheet
Product Features
„
„
„
„
High Performance Read-While-Write/Erase
— Burst Frequency at 40 MHz
— 70 ns Initial Access Speed
— 25 ns Page-Mode Read Speed
— 20 ns Burst-Mode Read Speed
— Burst-Mode and Page-Mode in All Blocks
and across All Partition Boundaries
— Burst Suspend Feature
— Enhanced Factory Programming:
3.5 µs per Word Program Time
— Programmable WAIT Signal Polarity
Flash Power
— VCC = 1.70 V – 1.90 V
— VCCQ = 2.20 V – 3.30 V
— Standby Current (130 nm) = 8 µA (typ.)
— Read Current = 7 mA
(4 word burst, typical)
Flash Software
— 5 µs/9 µs (typ.) Program/Erase Suspend
Latency Time
— Numonyx™ Flash Data Integrator (FDI) and
Common Flash Interface (CFI) Compatible
Quality and Reliability
— Operating Temperature:
–40 °C to +85 °C
— 100K Minimum Erase Cycles
— 130 nm ETOX™ VIII Process
— 180 nm ETOX™ VII Process
„
„
„
Flash Architecture
— Multiple 4-Mbit Partitions
— Dual Operation: RWW or RWE
— Parameter Block Size = 4-Kword
— Main block size = 32-Kword
— Top or Bottom Parameter Blocks
Flash Security
— 128-bit Protection Register: 64 Unique
Device Identifier Bits; 64 User OTP
Protection Register Bits
— Absolute Write Protection with VPP at
Ground
— Program and Erase Lockout during Power
Transitions
— Individual and Instantaneous Block
Locking/Unlocking with Lock-Down
Density and Packaging
— 130 nm: 32Mb, 64Mb, and 128Mb in VF
BGA Package; 64Mb, 128Mb in QUAD+
Package
— 180 nm: 32Mb and 128Mb Densities in VF
BGA Package; 64Mb Density in µBGA*
Package
— 56 Active Ball Matrix, 0.75 mm Ball-Pitch
— 16-bit Data Bus
Order Number: 290702-13
November 2007
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN NUMONYX'S TERMS AND
CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx
products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.
Legal L ines and D isc laim er s
Numonyx B.V. may make changes to specifications and product descriptions at any time, without notice.
Numonyx B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented
subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or
otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting
Numonyx's website at http://www.numonyx.com.
Numonyx, the Numonyx logo, and StrataFlash are trademarks or registered trademarks of Numonyx B.V. or its subsidiaries in other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007, Numonyx B.V., All Rights Reserved.
Datasheet
2
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Contents
1.0
Introduction .............................................................................................................. 7
1.1
Document Purpose .............................................................................................. 7
1.2
Nomenclature ..................................................................................................... 7
1.3
Conventions ....................................................................................................... 8
2.0
Functional Overview .................................................................................................. 9
2.1
Overview ........................................................................................................... 9
2.2
Memory Map and Partitioning .............................................................................. 10
3.0
Package Information ............................................................................................... 13
3.1
W30 Flash Memory Device – 130 nm Lithography .................................................. 13
3.2
W30 Flash Memory Device – 180 nm Lithography .................................................. 15
4.0
Ballout and Signal Descriptions ............................................................................... 18
4.1
Signal Ballout ................................................................................................... 18
4.2
Signal Descriptions ............................................................................................ 20
5.0
Maximum Ratings and Operating Conditions............................................................ 24
5.1
Absolute Maximum Ratings................................................................................. 24
5.2
Operating Conditions ......................................................................................... 24
6.0
Electrical Specifications ........................................................................................... 26
6.1
DC Current Characteristics.................................................................................. 26
6.2
DC Voltage Characteristics.................................................................................. 27
7.0
AC Characteristics ................................................................................................... 28
7.1
Read Operations - 130 nm Lithography ................................................................ 28
7.2
Read Operations - 180 nm Lithography ................................................................ 29
7.3
AC Write Characteristics ..................................................................................... 38
7.4
Erase and Program Times................................................................................... 43
8.0
Power and Reset Specifications ............................................................................... 44
8.1
Active Power..................................................................................................... 44
8.2
Automatic Power Savings (APS) .......................................................................... 44
8.3
Standby Power.................................................................................................. 44
8.4
Power-Up/Down Characteristics........................................................................... 44
8.4.1 System Reset and RST#.......................................................................... 45
8.4.2 VCC, VPP, and RST# Transitions............................................................... 45
8.5
Power Supply Decoupling ................................................................................... 45
8.6
Reset Specifications........................................................................................... 46
8.7
AC I/O Test Conditions....................................................................................... 46
8.8
Flash Device Capacitance ................................................................................... 47
9.0
Flash Device Operations .......................................................................................... 48
9.1
Bus Operations ................................................................................................. 48
9.1.1 Read .................................................................................................... 48
9.1.2 Burst Suspend ....................................................................................... 49
9.1.3 Standby ................................................................................................ 49
9.1.4 Reset.................................................................................................... 50
9.1.5 Write .................................................................................................... 50
9.2
Flash Device Commands..................................................................................... 50
9.3
Command Sequencing ....................................................................................... 53
10.0 Read Operations ...................................................................................................... 55
10.1 Read Array ....................................................................................................... 55
November 2007
Order Number: 290702-13
Datasheet
3
Numonyx™ Wireless Flash Memory (W30)
10.2
10.3
10.4
10.5
Read Device ID .................................................................................................55
Read Query (CFI) ..............................................................................................56
Read Status Register..........................................................................................56
Clear Status Register .........................................................................................58
11.0 Program Operations .................................................................................................59
11.1 Word Program ...................................................................................................59
11.2 Factory Programming .........................................................................................60
11.3 Enhanced Factory Program (EFP) .........................................................................61
11.3.1 EFP Requirements and Considerations .......................................................61
11.3.2 Setup....................................................................................................62
11.3.3 Program ................................................................................................62
11.3.4 Verify....................................................................................................62
11.3.5 Exit.......................................................................................................63
12.0 Program and Erase Operations.................................................................................65
12.1 Program/Erase Suspend and Resume ...................................................................65
12.2 Block Erase .......................................................................................................67
12.3 Read-While-Write and Read-While-Erase ...............................................................69
13.0 Security Modes ........................................................................................................71
13.1 Block Lock Operations ........................................................................................71
13.1.1 Lock......................................................................................................72
13.1.2 Unlock...................................................................................................72
13.1.3 Lock-Down ............................................................................................72
13.1.4 Block Lock Status ...................................................................................73
13.1.5 Lock During Erase Suspend ......................................................................73
13.1.6 Status Register Error Checking .................................................................74
13.1.7 WP# Lock-Down Control ..........................................................................74
13.2 Protection Register.............................................................................................75
13.2.1 Reading the Protection Register ................................................................76
13.2.2 Programing the Protection Register ...........................................................76
13.2.3 Locking the Protection Register.................................................................76
13.3 VPP Protection...................................................................................................78
14.0 Set Read Configuration Register ..............................................................................79
14.1 Read Mode (RCR[15]) ........................................................................................80
14.2 First Access Latency Count (RCR[13:11]) ..............................................................80
14.2.1 Latency Count Settings............................................................................81
14.3 WAIT Signal Polarity (RCR[10]) ...........................................................................81
14.4 WAIT Signal Function .........................................................................................82
14.5 Data Hold (RCR[9])............................................................................................82
14.6 WAIT Delay (RCR[8]) .........................................................................................83
14.7 Burst Sequence (RCR[7])....................................................................................83
14.8 Clock Edge (RCR[6]) ..........................................................................................85
14.9 Burst Wrap (RCR[3]) ..........................................................................................85
14.10 Burst Length (RCR[2:0]).....................................................................................85
A
Write State Machine.................................................................................................86
B
Common Flash Interface ..........................................................................................89
C
Ordering Information ...............................................................................................99
Datasheet
4
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Revision History
Date of
Revision
Version
09/19/00
-001
Initial release
-002
28F3208W30 product references removed (product was discontinued)
28F640W30 product added
Revised Table 2, Signal Descriptions (DQ15–0, ADV#, WAIT, S-UB#, S-LB#, VCCQ)
Revised Section 3.1, Bus Operations
Revised Table 5, Command Bus Definitions, Notes 1 and 2
Revised Section 4.2.2, First Latency Count (LC2–0); revised Figure 6, Data Output with LC
Setting at Code 3; added Figure 7, First Access Latency Configuration
Revised Section 4.2.3, WAIT Signal Polarity (WT)
Added Section 4.2.4, WAIT Signal Function
Revised Section 4.2.5, Data Output Configuration (DOC)
Added Figure 8, Data Output Configuration with WAIT Signal Delay
Revised Table 13, Status Register DWS and PWS Description
Revised entire Section 5.0, Program and Erase Voltages
Revised entire Section 5.3, Enhanced Factory Programming (EFP)
Revised entire Section 8.0, Flash Security Modes
Revised entire Section 9.0, Flash Protection Register; added Table 15, Simultaneous
Operations Allowed with the Protection Register
Revised Section 10.1, Power-Up/Down Characteristics
Revised Section 11.3, DC Characteristics. Changed ICCS,ICCWS, ICCES Specs from 18 µA to
21µA; changed ICCR Spec from 12 mA to 15 mA (burst length = 4)
Added Figure 20, WAIT Signal in Synchronous Non-Read Array Operation Waveform
Added Figure 21, WAIT Signal in Asynchronous Page-Mode Read Operation Waveform
Added Figure 22, WAIT Signal in Asynchronous Single-Word Read Operation Waveform
Revised Figure 23, Write Waveform
Revised Section 12.4, Reset Operations
Clarified Section 13.2, SRAM Write Operation, Note 2
Revised Section 14.0, Ordering Information
Minor text edits
04/05/02
-003
Deleted SRAM Section
Added 128M DC and AC Specifications
Added Burst Suspend
Added Read While Write Transition Waveforms
Various text edits
04/24/02
-004
Revised Device ID
Revised Write Speed Bin
Various text edits
-005
Added Latency Count Tables
Updated Packing Ball-Out and Dimension
Various text edits
Minor text clarifications
01/14/03
-006
Revised Table 20, DC Current Characteristics, ICCS
Revised Table 20, DC Current Characteristics, ICCAPS
Removed Numonyx Burst order
Minor text edits
Updated Package Drawing and Dimensions
03/22/03
-007
Revised Table 22, Read Operations, tAPA
Added note to table 15, Configuration Register Descriptions
Added note to section 3.1.1, Read
03/14/01
10/20/02
November 2007
Order Number: 290702-13
Description
Datasheet
5
Numonyx™ Wireless Flash Memory (W30)
Date of
Revision
Version
Description
11/17/03
-008
Updated Block Lock Operations (Sect. 7.1 and Fig. 11)
Updated improved AC timings
Added QUAD+ package option, and Appendix D
Minor text edits including new product-naming conventions
05/06/04
-009
Corrected Absolute Maximum Rating for VCCQ (Sect. 10.1, Table 18)
Minor text edits
05/17/04
-010
Restructured the datasheet according to new layout.
06/2005
-011
Timing Diagram Nomenclature Synergy with other product families
Added Ordering information
Minor Text Edits
08/2007
-012
Updated ordering information
November 2007
13
Datasheet
6
Applied Numonyx branding.
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
1.0
Introduction
The Numonyx™ Wireless Flash Memory (W30) device combines state-of-the-art
Numonyx™ Flash technology to provide a versatile memory solution for high
performance, low power, board constraint memory applications. The W30 flash memory
device offers a multi-partition, dual-operation flash architecture that enables the flash
device to read from one partition while programming or erasing in another partition.
This Read-While-Write or Read-While-Erase capability makes it possible to achieve
higher data throughput rates compared to single partition devices. Two processors can
interleave code execution, because program and erase operations can now occur as
background processes.
The W30 flash memory device incorporates an Enhanced Factory Programming (EFP)
mode to improve 12 V factory programming performance. This feature helps eliminate
manufacturing bottlenecks associated with programming high-density flash memory
devices. The EFP program time is 3.5 µs per word, compared to the standard factory
program time of 8.0 µs per word, so EFP mode saves significant factory programming
time for improved factory efficiency.
The W30 flash memory device also includes block lock-down and programmable
WAIT signal polarity, and is supported by an array of software tools.
1.1
Document Purpose
This datasheet contains information about the Product Name device family. Throughout
this document, this device family is referred to as the W30 flash memory device.
• This chapter provides a flash memory overview.
• Chapter 2.0 through Chapter 8.0 describe the memory functionality.
• Chapter 6.0 describes the electrical specifications for extended temperature
product offerings.
• Appendix A describes the Write State Machine (WSM),
• Appendix B describes the Numonyx™ Common Flash Interface (CFI) as it applies to
the W30 flash memory device.
• Appendix C provides ordering information for the Product Name device family.
1.2
Nomenclature
Acronyms that describe product features or usage are defined here:
• APS - Automatic Power Savings
• BBA - Block Base Address
• CFI - Common Flash Interface
• CUI - Command User Interface
• DU - Do not Use
• EFP - Enhanced Factory Programming
• FDI - Flash Data Integrator
• NC - No Connect
• OTP - One-Time Programmable
• PBA - Partition Base Address
• RCR - Read Configuration Register
November 2007
Order Number: 290702-13
Datasheet
7
Numonyx™ Wireless Flash Memory (W30)
• RWE - Read-While-Erase
• RWW - Read-While-Write
• SCSP - Stacked Chip Scale Package
• SRD - Status Register Data
• VF BGA - Very-thin, Fine-pitch, Ball Grid Array
• WSM - Write State Machine
1.3
Conventions
The following abbreviated terms and phrases are used throughout this document:
• 1.8 V refers to the VCC operating voltage range of 1.7 V – 1.9 V (except where
noted).
• 3.0 V refers to the VCCQ operating voltage range of 2.2 V - 3.3 V.
• VPP = 12 V refers to 12 V ± 5%.
• When referring to registers, the term set means the bit is a logical 1, and cleared
means the bit is a logical 0.
• The terms pin and signal are often used interchangeably to refer to the external
signal connections on the package. (Ball is the term used for BGA).
• A word is 2 bytes, or 16 bits.
• Signal names are in all CAPS (for example, WAIT).
• Voltage applied to the signal is subscripted (for example, VPP).
Throughout this document, references are made to top, bottom, parameter, and
partition. To clarify these references, the following conventions have been adopted:
• A block is a group of bits (or words) that erase simultaneously with one block
erase instruction.
• A main block contains 32 Kwords.
• A parameter block contains 4 Kwords.
• The Block Base Address (BBA) is the first address of a block.
• A partition is a group of blocks that share erase and program circuitry and a
common status register.
• The Partition Base Address (PBA) is the first address of a partition. For example,
on a 32-Mbit top-parameter flash device, partition number 5 has a PBA of
0x140000.
• The top partition is located at the highest physical flash device address. This
partition can be a main partition or a parameter partition.
• The bottom partition is located at the lowest physical flash device address. This
partition can be a main partition or a parameter partition.
• A main partition contains only main blocks.
• A parameter partition contains a mixture of main blocks and parameter blocks.
• A top parameter device (TPD) has the parameter partition at the top of the
memory map with the parameter blocks at the top of that partition. This flash
device type was formerly referred to as a top-boot flash device.
• A bottom parameter device (BPD) has the parameter partition at the bottom of
the memory map with the parameter blocks at the bottom of that partition. This
flash device type was formerly referred to as a bottom-boot block flash device.
Datasheet
8
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
2.0
Functional Overview
This section provides an overview of the W30 flash memory device features and
architecture.
2.1
Overview
The W30 flash memory device provides Read-While-Write (RWW) and Read-WhiteErase (RWE) capability. This capability provides high-performance synchronous and
asynchronous reads in package-compatible densities using a 16-bit data bus.
Individually-erasable memory blocks are optimally sized for code and data storage.
Eight 4-Kword parameter blocks are located in the parameter partition at either the top
or bottom of the memory map. The rest of the memory array is grouped into 32-Kword
main blocks.
The memory architecture for the W30 flash memory device consists of multiple 4-Mbit
partitions, the exact number depending on the flash device density. By dividing the
memory array into partitions, program or erase operations can take place
simultaneously during read operations. Burst reads can traverse partition boundaries,
but user application code is responsible for ensuring that burst reads do not extend into
a partition that is actively programming or erasing. Although each partition has burstread, write, and erase capabilities, simultaneous operation is limited to write or erase in
one partition while other partitions are in a read mode.
Augmented erase-suspend functionality further enhances the RWW capabilities of the
W30 flash memory device. An erase can be suspended to perform a program or read
operation within any block, except a block that is erase-suspended. A program
operation nested within a suspended erase can subsequently be suspended to read yet
another memory location.
After power-up or reset, the W30 flash memory device defaults to asynchronous read
configuration. Writing to the flash memory device Read Configuration Register (RCR)
enables synchronous burst-mode read operation. In synchronous mode, the CLK input
increments an internal burst address generator. CLK also synchronizes the flash
memory device with the host CPU and outputs data on every, or on every other, valid
CLK cycle after an initial latency. A programmable WAIT output signals to the CPU when
data from the flash memory device is ready.
In addition to its improved architecture and interface, the W30 flash memory device
incorporates Enhanced Factory Programming (EFP), a feature that enables fast
programming and low-power designs. The EFP feature provides fast program
performance, which can increase the manufacturing throughput of a factory.
The W30 flash memory device supports read operations at 1.8 V and erase and
program operations at 1.8 V or 12 V. With the 1.8-V option, VCC and VPP can be tied
together for an ultra-low-power design. In addition to voltage flexibility, the dedicated
VPP input provides extensive data protection when VPP < VPPLK.
A 128-bit protection register can implement new security techniques and data
protection schemes:
• A combination of factory-programmed and user-OTP data cells provide unique flash
device identification, help implement fraud or cloning prevention schemes, or help
protect content.
• Zero-latency locking/unlocking on any memory block provides instant and
complete protection for critical system code and data.
• An additional block lock-down capability provides hardware protection where
software commands alone cannot change the block protection status.
November 2007
Order Number: 290702-13
Datasheet
9
Numonyx™ Wireless Flash Memory (W30)
The flash device Command User Interface (CUI) links the system processor to the
internal flash memory operation. A valid command sequence written to the CUI initiates
the flash device Write State Machine (WSM) operation, which automatically executes
the algorithms, timings, and verifications necessary to manage flash memory program
and erase. An internal status register provides ready/busy indication results of the
operation (success, fail, and so on).
Three power-saving features– Automatic Power Savings (APS), standby, and RST#–
can significantly reduce power consumption.
• The flash device automatically enters APS mode following read cycle completion.
• Standby mode begins when the system deselects the flash memory by de-asserting
CE#.
• Driving RST# low produces power savings similar to standby mode. It also resets
the part to read-array mode (important for system-level reset), clears internal
status registers, and provides an additional level of flash device write protection.
2.2
Memory Map and Partitioning
The W30 flash memory device is divided into 4-Mbit physical partitions. This
partitioning allows simultaneous RWW or RWE operations, and enables users to
segment code and data areas on 4-Mbit boundaries. The flash memory array is
asymmetrically blocked, which enables system code and data integration within a
single flash device. Each block can be erased independently in block erase mode.
Simultaneous program and erase operations are not allowed; only one partition at a
time can be actively programming or erasing. See Table 1, “Bottom Parameter Memory
Map” on page 11 and Table 2, “Top Parameter Memory Map” on page 11.
• The 32-Mbit flash device has eight partitions.
• The 64-Mbit flash device has 16 partitions.
• The 128-Mbit flash device has 32 partitions.
Each flash device density contains one parameter partition and several main partitions.
The 4-Mbit parameter partition contains eight 4-Kword parameter blocks and seven 32Kword main blocks. Each 4-Mbit main partition contains eight 32-Kword blocks.
The bulk of the flash memory array is divided into main blocks that can store code or
data, and parameter blocks that allow storage of frequently updated small parameters
that are normally stored in EEPROM. By using software techniques, the word-rewrite
functionality of EEPROMs can be emulated.
.
Datasheet
10
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
.
Bottom Parameter Memory Map
Blk #
128 Mbit
32
262
7F8000-7FFFFF
..
.
64 Mbit
..
.
Blk #
..
.
32 Mbit
32
135
400000-407FFF
3F8000-3FFFFF
134
3F8000-3FFFFF
..
.
..
.
..
.
..
.
134
..
.
32
32
71
200000-207FFF
71
200000-207FFF
1F8000-1FFFFF
70
1F8000-1FFFFF
70
1F8000-1FFFFF
..
.
100000-107FFF
32
38
0F8000-0FFFFF
38
0F8000-0FFFFF
38
0F8000-0FFFFF
0C0000-0C7FFF
32
30
0B8000-0BFFFF
30
0B8000-0BFFFF
30
0B8000-0BFFFF
080000-087FFF
32
22
078000-07FFFF
22
078000-07FFFF
22
078000-07FFFF
8
008000-00FFFF
8
008000-00FFFF
4
7
007000-007FFF
7
007000-007FFF
7
007000-007FFF
4
0
..
.
008000-00FFFF
..
.
8
..
.
32
..
.
..
.
038000-03FFFF
..
.
040000-047FFF
14
..
.
15
038000-03FFFF
..
.
040000-047FFF
14
..
.
15
038000-03FFFF
..
.
040000-047FFF
14
..
.
15
32
..
.
32
..
.
..
.
23
..
.
080000-087FFF
..
.
23
..
.
080000-087FFF
..
.
23
..
.
32
..
.
..
.
31
..
.
0C0000-0C7FFF
..
.
31
..
.
0C0000-0C7FFF
..
.
31
..
.
32
..
.
..
.
..
.
39
..
.
..
.
100000-107FFF
..
.
..
.
39
..
.
..
.
100000-107FFF
..
.
39
..
.
32
..
.
..
.
70
..
.
32
000000-000FFF
0
000000-000FFF
0
000000-000FFF
Top Parameter Memory Map
262
7FF000-7FFFFF
..
.
3FF000-3FFFFF
4
63
1F8000-1F8FFF
127
3F8000-3F8FFF
255
7F8000-7F8FFF
32
62
1F0000-1F7FFF
126
3F0000-3F7FFF
254
7F0000-7F7FFF
..
.
134
..
.
1FF000-1FFFFF
..
.
70
..
.
4
..
.
128 Mbit
..
.
Blk #
..
.
64 Mbit
..
.
Blk #
..
.
32 Mbit
..
.
Blk #
..
.
Size
(KW)
..
.
One Partition
Parameter
Partition
Table 2:
Blk #
..
.
Four
Partitions
One
Partition
One Partition
Parameter
One
Partition
One
Partition
Main Partitions
Eight
Partitions
Sixteen
Partitions
Size
(KW)
..
.
Table 1:
32
56
1C0000-1C7FFF
120
3C0000-3C7FFF
248
7C0000-7C7FFF
November 2007
Order Number: 290702-13
Datasheet
11
Numonyx™ Wireless Flash Memory (W30)
Datasheet
12
Top Parameter Memory Map
32
55
1B8000-1BFFFF
119
3B8000-3BFFFF
247
7B8000-7BFFFF
780000-787FFF
32
47
178000-17FFFF
111
378000-37FFFF
239
778000-77FFFF
39
138000-13FFFF
103
338000-33FFFF
231
738000-73FFFF
700000-707FFF
32
31
0F8000-0FFFFF
95
2F8000-2FFFFF
223
6F8000-6FFFFF
32
0
600000-607FFF
32
63
1F8000-1FFFFF
191
5F8000-5FFFFF
32
0
..
.
192
000000-007FFF
128
400000-407FFF
32
127
3F8000-3FFFFF
..
.
200000-207FFF
..
.
64
..
.
000000-007FFF
..
.
..
.
224
..
.
300000-307FFF
..
.
96
..
.
100000-107FFF
..
.
32
..
.
32
..
.
..
.
32
..
.
740000-747FFF
..
.
232
..
.
340000-347FFF
..
.
104
..
.
140000-147FFF
..
.
40
..
.
32
..
.
..
.
240
..
.
380000-387FFF
..
.
112
..
.
18000-187FFF
..
.
48
..
.
32
..
.
..
.
128 Mbit
..
.
Blk #
..
.
64 Mbit
..
.
Blk #
..
.
32 Mbit
..
.
Blk #
..
.
Size
(KW)
..
.
One
Partition
Four
Partitions
Sixteen
Partitions
Eight
Partitions
Main Partitions
One
Partition
One
Partition
Table 2:
32
0
000000-007FFF
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
3.0
Package Information
3.1
W30 Flash Memory Device – 130 nm Lithography
Figure 1:
32 Mb, 64 Mb, and 128 Mb VF BGA Package Drawing
Ball A1
Corner
Ball A1
Corner
S1
D
1
E
2
3
4
5
6
7
8
8
A
A
B
B
C
C
D
D
E
E
F
F
G
G
7
6
5
4
3
2
S2
1
e
b
Top View - Bump Side Down
Bottom View - Ball Side Up
A1
A2
A
Seating
Y
Plane
Table 3:
2 Mb, 64 Mb, and 128 Mb VF BGA Package Specifications
Millimeters
Dimension
Inches
Symbol
Min
Nom
Max
Min
Nom
Max
-
1.000
-
-
0.0394
Package Height
A
-
Ball Height
A1
0.150
-
-
0.0059
-
-
Package Body Thickness
A2
-
0.665
-
-
0.0262
-
Ball (Lead) Width
b
0.325
0.375
0.425
0.0128
0.0148
0.0167
Package Body Width (32 Mb, 64 Mb)
D
7.600
7.700
7.800
0.2992
0.3031
0.3071
Package Body Width (128 Mb)
D
10.900
11.000
11.10
0
0.4291
0.4331
0.4370
Package Body Length (32 Mb, 64 Mb, 128 Mb)
E
8.900
9.000
9.100
0.3504
0.3543
0.3583
[e]
-
0.750
-
-
0.0295
-
N
-
56
-
-
56
-
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Y
-
-
0.100
-
-
0.0039
Corner to Ball A1 Distance Along D (32 Mb, 64 Mb)
S1
1.125
1.225
1.325
0.0443
0.0482
0.0522
Corner to Ball A1 Distance Along D (128 Mb)
S1
2.775
2.2875
2.975
0.1093
0.1132
0.1171
Corner to Ball A1 Distance Along E (32 Mb, 64 Mb,128
Mb)
S2
2.150
2.250
2.350
0.0846
0.0886
0.0925
November 2007
Order Number: 290702-13
Datasheet
13
Numonyx™ Wireless Flash Memory (W30)
Figure 2:
32Mb, 64Mb and 128Mb QUAD+ Package Drawing
S1
A1 Index
Mark
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
S2
A
A
B
B
C
C
D
D
E
E
F
D
F
G
G
H
H
J
J
K
K
L
L
M
M
e
b
E
Bottom View - Ball Up
Top View - Ball Down
A2
A1
A
Y
Drawing not to scale.
Dimensions
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Length
Package Body Width
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along E
Corner to Ball A1 Distance Along D
Datasheet
14
Symbol
A
A1
A2
b
D
E
e
N
Y
S1
S2
Min
Millimeters
Nom
Max
1.200
0.200
0.325
9.900
7.900
1.100
0.500
Notes
Min
Inches
Nom
Max
0.0472
0.0079
0.860
0.375
10.000
8.000
0.800
88
1.200
0.600
0.425
10.100
8.100
0.0128
0.3898
0.3110
0.100
1.300
0.700
0.0433
0.0197
0.0339
0.0148
0.3937
0.3150
0.0315
88
0.0472
0.0236
0.0167
0.3976
0.3189
0.0039
0.0512
0.0276
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
3.2
W30 Flash Memory Device – 180 nm Lithography
Figure 3:
64Mb ∝ΒΓΑ∗ ΧΣΠ Παχκαγε Δραωινγ ανδ Διμενσιονσ
Pin # 1
Indicator
s
D
1
2
3
4
5
6
7
1
Pin # 1
Corner
s2
8
8
7
6
5
4
3
2
1
A
A
B
B
C
D
C
D
E
E
E
F
F
G
G
b
Top View - Silicon backside
e
Bottom View - Bump side Up
Complete Ink M ark Not
A1
A2
A
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
November 2007
Order Number: 290702-13
Y
Plan
Side
Symbol
A
A1
A2
b
D
E
[e]
N
Y
S1
S2
Seati
Millimeters
Min
0.850
0.150
0.612
0.300
7.600
8.900
1.125
2.150
Nom
Max
1.000
0.712
0.350
7.700
9.000
0.750
56
0.812
0.400
7.800
9.100
Inches
Min
0.0335
0.0059
0.0241
0.0118
0.2992
0.3503
0.100
1.325
2.350
0.0443
0.0846
1.225
2.250
Notes
Nom
Max
0.0394
0.0280
0.0138
0.3031
0.3543
0.0295
56
0.0320
0.0157
0.3071
0.3583
0.0482
0.0886
0.0039
0.0522
0.0925
Datasheet
15
Numonyx™ Wireless Flash Memory (W30)
Figure 4:
32Mb VF BGA Package Drawing
Ball A1
Corner
Ball A1
Corner
D
1
E
2
3
S1
4
5
6
7
8
8
A
A
B
B
C
C
D
D
E
E
F
F
G
G
7
6
5
4
3
2
1
S2
e
b
Top View - Bump Side Down
Bottom View - Ball Side Up
A1
A2
A
Seating
Y
Plane
Side View
Note: Drawing not to scale
Figure 5:
128Mb VF BGA Package Drawing
Ball A1
Corner
1
E
S1
D
2
3
4
5
6
7
8
9 10
10
A
A
B
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
9
8
7
6
5
4
3
Ball A1
Corner
S2
2 1
e
b
Top View - Bump Side
Down
Bottom View - Ball Side
Up
A1
A2
A
Seating
Plane
Y
Side View
Note: Drawing not to scal e
Datasheet
16
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 4:
32Mb and 128Mb VF BGA Package Dimensions
Millimeters
Dimension
Inches
Symbol
Min
Nom
Max
Min
Nom
Max
-
1.000
0.0335
-
0.0394
Package Height
A
0.850
Ball Height
A1
0.150
-
-
0.0059
-
-
Package Body Thickness
A2
0.615
0.665
0.715
0.0242
0.0262
0.0281
Ball (Lead) Width
b
0.325
0.375
0.425
0.0128
0.0148
0.0167
Package Body Width 32Mb
D
7.600
7.700
7.800
0.2992
0.3031
0.3071
Package Body Length32Mb
E
8.900
9.000
9.100
0.3503
0.3543
0.3583
Package Body Width 128Mb
D
12.400
12.500
12.600
0.4882
0.4921
0.4961
Package Body Length 128Mb
E
11.900
12.000
12.100
0.4685
0.4724
0.4764
[e]
-
0.750
-
-
0.0295
-
Ball (Lead) Count 32Mb
N
-
56
-
-
56
-
Ball (Lead) Count 128Mb
N
-
60
-
-
60
-
Pitch
Seating Plane Coplanarity
Y
-
-
0.100
-
-
0.0039
Corner to Ball A1 Distance Along D 32Mb
S1
1.125
1.225
1.325
0.0443
0.0482
0.0522
Corner to Ball A1 Distance Along E 32Mb
S2
2.150
2.250
2.350
0.0846
0.0886
0.0925
Corner to Ball A1 Distance Along D 128Mb
S1
2.775
2.875
2.975
0.1093
0.1132
0.1171
Corner to Ball A1 Distance Along E 128Mb
S2
2.900
3.000
3.1000
0.1142
0.1181
0.1220
November 2007
Order Number: 290702-13
Datasheet
17
Numonyx™ Wireless Flash Memory (W30)
4.0
Ballout and Signal Descriptions
4.1
Signal Ballout
The W30 flash memory device is available in the 56-ball VF BGA and µBGA Chip Scale
Package with 0.75 mm ball pitch, or the QUAD+ SCSP package. Figure 6 shows the VF
BGA and µBGA package ballout. Figure 7 shows the QUAD+ package ballout.
Figure 6:
56-Ball VF BGA/ µBGA Ballout
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
A
A
A11
A8
VSS
VCC
VPP
A18
A6
A4
A4
A6
A18
VPP
VCC
VSS
A8
A11
B
B
A12
A9
A20
CLK
RST#
A17
A5
A3
A3
A5
A17
RST#
CLK
A20
A9
A12
C
C
A13
A10
A21
ADV#
WE#
A19
A7
A2
A2
A7
A19
WE#
ADV#
A21
A10
A13
D
D
A15
A14
WAIT
A16
DQ12
WP#
A22
A1
A1
A22
WP#
DQ12
A16
WAIT
A14
A15
E
E
VCCQ
DQ15
DQ6
DQ4
DQ2
DQ1
CE#
A0
A0
CE#
DQ1
DQ2
DQ4
DQ11
DQ10
DQ9
DQ0
OE#
OE#
DQ0
DQ9
DQ10
DQ11
DQ6
DQ15
VCCQ
F
F
VSS
DQ14 DQ13
DQ13 DQ14
VSS
G
G
DQ7
VSSQ
DQ5
VCC
DQ3
VCCQ
Top View - Ball Side Down
Complete Ink Mark Not Shown
DQ8
VSSQ
VSSQ
DQ8
VCCQ
DQ3
VCC
DQ5
VSSQ
DQ7
Bottom View - Ball Side Up
Notes:
1.
On lower density flash memory devices, the upper address balls can be treated as NC. (that is, on 32-Mbit density, A22
and A21 are NC).
2.
See Appendix C, “Ordering Information” on page 99 for mechanical specifications for the package.
Datasheet
18
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 7:
88-Ball (80 Active Balls) QUAD+ Ballout
A
1
2
3
4
5
DU
DU
A4
A18
A19
VSS
A5
R-LB#
A23
VSS
A3
A17
A24
F-VPP,
F-VPEN
A2
A7
A25
F-WP#
A1
A6
R-UB#
A0
D8
D2
D10
R-OE#
D0
D1
D9
6
7
8
DU
DU
A21
A11
A22
A12
R-WE# P1-CS#
A9
A13
ADV#
A20
A10
A15
F-RST# F-WE#
A8
A14
A16
D5
D13
WAIT
F2-CE#
D3
D12
D14
D7
F2-OE#
D11
D4
D6
D15
VCCQ
B
F1-VCC F2-VCC
C
S-CS2
CLK
D
E
F
G
H
J
S-CS1# F1-OE#
K
F1-CE# P2-CS# F3-CE# S-VCC
P-VCC F2-VCC
VCCQ
P-Mode,
P-CRE
L
M
VSS
VSS
DU
DU
VCCQ
F1-VCC
VSS
VSS
VSS
VSS
DU
DU
Top View - Ball Side Down
Legend:
Global
SRAM/PSRAM specific
Flash specific
Notes:
1.
On lower density flash memory devices, the upper address balls can be treated as NC (that is, on 64-Mb density,
A[25:23]are NC)
2.
See Appendix C, “Ordering Information” on page 99 for mechanical specifications for the package.
November 2007
Order Number: 290702-13
Datasheet
19
Numonyx™ Wireless Flash Memory (W30)
4.2
Signal Descriptions
• Table 5 describes the signals for the 56-ball VF BGA and µBGA Chip Scale Package.
• Table 6 describes the signals for the QUAD+ package ballout.
Table 5:
Signal Descriptions - µBGA Package & VF BGA Package
Symbol
Type
A[22:0]
Input
Name and Function
ADDRESS INPUTS: For memory addresses. 32 Mbit: A[20:0]; 64 Mbit: A[21:0]; 128 Mbit: A[22:0]
DATA INPUTS/OUTPUTS:
• Inputs data and commands during write cycles.
• Outputs data during reads.
Data pins are High-Z when the flash device or its outputs are deselected. Data is internally latched
during writes.
D[15:0]
Input/
Output
ADV#
Input
ADDRESS VALID: ADV# indicates valid address presence on address inputs. During synchronous
read operations, all addresses are latched on the rising edge of ADV#, or the next valid CLK edge with
ADV# low, whichever occurs first.
CE#
Input
CHIP ENABLE:
• Asserting CE# activates internal control logic, I/O buffers, decoders, and sense amps.
• De-asserting CE# deselects the flash device, places it in standby mode, and tri-states all outputs.
CLK
Input
CLOCK: CLK synchronizes the flash device to the system bus frequency during synchronous reads and
increments an internal address generator. During synchronous read operations, addresses are latched
on ADV#’s rising edge or CLK’s rising (or falling) edge, whichever occurs first.
OE#
Input
OUTPUT ENABLE:
• When asserted, OE# enables the flash device output data buffers during a read cycle.
• When OE# is deasserted, data outputs are placed in a high-impedance state.
RST#
Input
RESET: When low, RST# resets internal automation and inhibits write operations. This reset provides
data protection during power transitions. De-asserting RST# enables normal operation and places the
flash device in asynchronous read-array mode.
WAIT
Output
WAIT: The WAIT signal indicates valid data during synchronous read modes. It can be configured to
be asserted-high or asserted-low, based on bit 10 of the Read Configuration Register. WAIT is tristated if CE# is deasserted. WAIT is not gated by OE#.
WE#
Input
WRITE ENABLE: WE# controls writes to the CUI and array. Addresses and data are latched on the
rising edge of WE#.
WP#
Input
WRITE PROTECT: Disables/enables the lock-down function. When WP# is asserted, the lock-down
mechanism is enabled and blocks marked lock-down cannot be unlocked through software. See
Section 13.1, “Block Lock Operations” on page 71 for details on block locking.
VPP
Power/
Input
ERASE AND PROGRAM POWER: A valid voltage on this pin allows erasing or programming. Flash
memory contents cannot be altered when VPP < VPPLK . Do not attempt block erase and program
operations at invalid VPP voltages.
Set VPP = VCC for in-system program and erase operations. To accommodate resistor or diode drops
from the system supply, the VIH level of VPP can be as low as VPPL min. VPP must remain above VPPL
min to perform in-system flash device modification. VPP can be 0 V during read operations.
VPPH can be applied to main blocks for 1000 cycles maximum and to parameter blocks for 2500 cycles.
VPP can be connected to 12 V for a cumulative total not to exceed 80 hours. Extended use of this pin
at 12 V might reduce block cycling capability.
VCC
Power
FLASH DEVICE POWER SUPPLY: Writes are inhibited at VCC < VLKO. Do not attempt flash device
operations at invalid VCC voltages.
VCCQ
Power
OUTPUT POWER SUPPLY: Enables all outputs to be driven at VCCQ.
VSS
Power
GROUND: Pins for all internal flash device circuitry must be connected to system ground.
VSSQ
Power
OUTPUT GROUND: Provides ground to all outputs which are driven by VCCQ. This signal can be tied
directly to VSS.
DU
—
DO NOT USE: Do not use this pin. Do not connect this pin to any power supplies, signals, or other
pins; this pin must be floated.
NC
—
NO CONNECT: No internal connection; can be driven or floated.
Datasheet
20
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 6:
Symbol
Signal Descriptions - QUAD+ Package (Sheet 1 of 3)
Type
Description
ADDRESS INPUTS: Inputs for all die addresses during read and write operations.
• 128-Mbit Die : AMAX = A22
A[MAX:MIN]
Input
• 64-Mbit Die : AMAX = A21
• 32-Mbit Die : AMAX = A20
A0 is the lowest-order 16-bit wide address.
A[25:24] denote high-order addresses reserved for future flash device densities.
DQ[15:0]
Input/
Output
DATA INPUTS/OUTPUTS:
• Inputs data and commands during write cycles.
• Outputs data during read cycles.
Data signals float when the flash device or its outputs are deselected. Data are internally latched
during writes on the flash device.
Input
FLASH CHIP ENABLE: Low-true input.
F[3:1]-CE# low selects the associated flash memory die.
• When asserted, flash memory internal control logic, input buffers, decoders, and sense amplifiers
are active.
• When deasserted, the associated flash die is deselected, power is reduced to standby levels, and
data and WAIT outputs are placed in high-Z state.
• F1-CE# selects or deselects flash die #1.
• F2-CE# selects or deselects flash die #2 and is RFU on combinations with only one flash die.
• F3-CE# selects or deselects flash die #3 and is RFU on stacked combinations with only one or two
flash dies.
Input
SRAM CHIP SELECT: Low-true / High-true input (S-CS1# / S-CS2 respectively).
• When either/both SRAM Chip Select signals are asserted, SRAM internal control logic, input
buffers, decoders, and sense amplifiers are active.
• When either/both SRAM Chip Select signals are deasserted, the SRAM is deselected and its power
is reduced to standby levels.
S-CS1# and S-CS2 are available on stacked combinations with SRAM die and are RFU on stacked
combinations without SRAM die.
Input
PSRAM CHIP SELECT: Low-true input.
• When asserted, PSRAM internal control logic, input buffers, decoders, and sense amplifiers are
active.
• When deasserted, the PSRAM is deselected and its power is reduced to standby levels.
• P1-CS# selects PSRAM die #1 and is available only on stacked combinations with PSRAM die. This
ball is an RFU on stacked combinations without PSRAM.
• P2-CS# selects PSRAM die #2 and is available only on stacked combinations with two PSRAM dies.
This ball is an RFU on stacked combinations without PSRAM or with a single PSRAM.
Input
FLASH OUTPUT ENABLE: Low-true input.
• Fx-OE# low enables the output buffers on the selected flash memory device.
• F[2:1]-OE# high disables the output buffers on the selected flash memory device, placing them in
High-Z.
• F1-OE# controls the outputs of flash die #1.
• F2-OE# controls the outputs of flash die #2 and flash die #3. F2-OE# is available on stacked
combinations with two or three flash die, and is RFU on stacked combinations with only one flash
die.
R-OE#
Input
RAM OUTPUT ENABLE: Low-true input.
• R-OE# low enables the output buffers on the selected RAM.
• R-OE# high disables the RAM output buffers, and places the selected RAM outputs in High-Z.
R-OE# is available on stacked combinations with PSRAM or SRAM die, and is an RFU on flash-only
stacked combinations.
F-WE#
Input
FLASH WRITE ENABLE: Low-true input.
F-WE# controls writes to the selected flash die. Address and data are latched on the rising edge of
F-WE#.
F[3:1]-CE#
S-CS1#
S-CS2
P[2:1]-CS#
F[2:1]-OE#
November 2007
Order Number: 290702-13
Datasheet
21
Numonyx™ Wireless Flash Memory (W30)
Table 6:
Signal Descriptions - QUAD+ Package (Sheet 2 of 3)
Symbol
Type
R-WE#
Input
RAM WRITE ENABLE: Low-true input.
R-WE# controls writes to the selected RAM die.
R-WE# is available on stacked combinations with PSRAM or SRAM die, and is an RFU on flash-only
stacked combinations.
Input
CLOCK: Synchronizes the flash die with the system bus clock in synchronous read mode and
increments the internal address generator.
• During synchronous read operations, addresses are latched on the rising edge of ADV#, or on the
next valid CLK edge with ADV# low, whichever occurs first.
• During asynchronous mode read operations, addresses are latched on the rising edge ADV#, or
are continuously flow-through when ADV# is kept asserted.
Output
WAIT: Output signal.
Indicates invalid data during synchronous array or non-array flash memory reads. Read Configuration
Register bit 10 (RCR[10]) determines WAIT-asserted polarity (high or low). WAIT is High-Z if F-CE# is
deasserted; WAIT is not gated by F-OE#.
• In synchronous array or non-array flash memory read modes, WAIT indicates invalid data when
asserted and valid data when deasserted.
• In asynchronous flash memory page read, and all flash memory write modes, WAIT is asserted.
Input
FLASH WRITE PROTECT: Low-true input.
F-WP# enables/disables the lock-down protection mechanism of the selected flash die.
• F-WP# low enables the lock-down mechanism where locked down blocks cannot be unlocked using
software commands.
• F-WP# high disables the lock-down mechanism, allowing locked down blocks to be unlocked using
software commands.
Input
ADDRESS VALID: Low-true input.
• During synchronous flash memory read operations, addresses are latched on the rising edge of
ADV#, or on the next valid CLK edge with ADV# low, whichever occurs first.
• During asynchronous flash memory read operations, addresses are latched on the rising edge of
ADV#, or are continuously flow-through when ADV# is kept asserted.
Input
RAM UPPER / LOWER BYTE ENABLES: Low-true input.
During RAM read and write cycles:
• R-UB# low enables the RAM high order bytes on D[15:8].
• R-LB# low enables the RAM low-order bytes on D[7:0].
R-UB# and R-LB# are available on stacked combinations with PSRAM or SRAM die, and are RFU on
flash-only stacked combinations.
Input
FLASH RESET: Low-true input.
• F-RST# low initializes flash device internal circuitry and disables flash device operations.
• F-RST# high enables flash device operation.
Exit from reset places the flash device in asynchronous read array mode.
Input
P-Mode (PSRAM Mode): Low-true input.
P-Mode programs the Configuration Register, and enters/exits the Low Power Mode of the PSRAM die.
P-Mode is available on stacked combinations with asynchronous-only PSRAM die.
• P-CRE (PSRAM Configuration Register Enable): High-true input.
• P-CRE is high, write operations load the Refresh Control Register or Bus Control Register.
• P-CRE applies only on combinations with synchronous PSRAM die.
P-Mode, P-CRE is an RFU on stacked combinations without PSRAM die.
Power
FLASH PROGRAM AND ERASE POWER: Valid F-VPP voltage on this ball enables flash memory
device program/erase operations.
Flash memory array contents cannot be altered when F-VPP(F-VPEN) < VPPLK (VPENLK). Do not attempt
erase / program operations at invalid F-VPP (F-VPEN) voltages.
F-VPEN (Erase/Program/Block Lock Enables) is not available for L18/L30 SCSP products.
CLK
WAIT
F-WP#
ADV#
R-UB#
R-LB#
F-RST#
P-Mode,
P-CRE
F-VPP,
F-VPEN
Datasheet
22
Description
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 6:
Symbol
Signal Descriptions - QUAD+ Package (Sheet 3 of 3)
Type
Description
F[2:1]-VCC
Power
FLASH LOGIC POWER:
• F1-VCC supplies power to the core logic of flash die #1.
• F2-VCC supplies power to the core logic of flash die #2 and flash die #3.
Write operations are inhibited when F-VCC < VLKO. Do not attempt flash device operations at invalid
F-VCC voltages.
F2-VCC is available on stacked combinations with two or three flash dies, and is an RFU on stacked
combinations with only one flash die.
S-VCC
Power
SRAM POWER SUPPLY: Supplies power for SRAM operations.
S-VCC is available on stacked combinations with SRAM die, and is RFU on stacked combinations
without SRAM die.
P-VCC
Power
PSRAM POWER SUPPLY: Supplies power for PSRAM operations.
P-VCC is available on stacked combinations with PSRAM die, and is RFU on stacked combinations
without PSRAM die.
VCCQ
Power
FLASH DEVICE I/O POWER: Supply power for the flash device input and output buffers.
VSS
Power
FLASH DEVICE GROUND: Connect to system ground. Do not float any VSS connection.
RFU
—
RESERVED for FUTURE USE: Reserved for future flash device functionality/ enhancements. Contact
Numonyx regarding the use of balls designated RFU.
DU
—
DO NOT USE: Do not connect to any other signal, or power supply; must be left floating.
November 2007
Order Number: 290702-13
Datasheet
23
Numonyx™ Wireless Flash Memory (W30)
5.0
Maximum Ratings and Operating Conditions
5.1
Absolute Maximum Ratings
Warning:
Stressing the flash device beyond the Absolute Maximum Ratings in Table 7 might
cause permanent damage. These are stress ratings only.
Notice: This datasheet contains information on products in the design phase of development. The information
here is subject to change without notice. Do not finalize a design with this information.
Table 7:
Absolute Maximum Ratings
Parameter
Maximum Rating
Temperature under Bias
–40 °C to +85 °C
Storage Temperature
–65 °C to +125 °C
Voltage on Any Pin (except VCC, VCCQ, VPP)
–0.5 V to +3.8 V
VPP Voltage
–0.2 V to +14 V
Note
1,2,3
VCC Voltage
–0.2 V to +2.45 V
1
VCCQ Voltage
–0.2 V to +3.8 V
1
Output Short Circuit Current
100 mA
4
Notes:
1.
All specified voltages are relative to VSS. Minimum DC voltage is –0.5 V on input/output pins and –0.2 V on
VCC and VPP pins. During transitions, this level might undershoot to
–2.0 V for periods < 20 ns. Maximum DC voltage on input/output pins is VCC +0.5 V which, during
transitions, might overshoot to VCC +2.0 V for periods < 20 ns.
2.
Maximum DC voltage on VPP might overshoot to +14.0 V for periods < 20 ns.
3.
VPP program voltage is normally VPPL. VPP can be 12 V ± 0.6 V for 1000 cycles on the main blocks and 2500
cycles on the parameter blocks during program/erase.
4.
Output shorted for no more than one second. No more than one output shorted at a time.
5.2
Operating Conditions
Do not operate the W30 flash memory device beyond the Operating Conditions in
Table 8. Extended exposure beyond these Operating Conditions might affect flash
device reliability.
Table 8:
Symbol
Extended Temperature Operation (Sheet 1 of 2)
Parameter 1
Min
Nom
Max
Unit
°C
TA
Operating Temperature
–40
25
85
VCC
VCC Supply Voltage
1.7
1.8
1.90
VCCQ
I/O Supply Voltage
2.2
3.0
3.3
VPPL
VPP Voltage Supply (Logic Level)
0.90
1.80
1.95
VPPH
Factory Programming VPP
11.4
12.0
12.6
tPPH
Maximum VPP Hours
-
-
80
Datasheet
24
VPP = 12 V
Notes
-
3
V
3
2
2
Hours
2
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 8:
Extended Temperature Operation (Sheet 2 of 2)
Parameter1
Symbol
Block
Erase
Cycles
Min
Nom
Max
Main and Parameter Blocks
VPP < VCC
100,000
-
-
Main Blocks
VPP = 12 V
-
-
1000
Parameter Blocks
VPP = 12 V
-
-
2500
Unit
Notes
2
Cycles
2
2
Notes:
1.
See
2.
3.
4.
Section 6.1, “DC Current Characteristics” on page 26 and Section 6.2, “DC Voltage
Characteristics” on page 27 for specific voltage-range specifications.
VPP is normally VPPL. VPP can be connected to 11.4 V–12.6 V for 1000 cycles on main blocks for extended
temperatures and 2500 cycles on parameter blocks at extended temperature.
Contact your Numonyx field representative for VCC/VCCQ operations down to 1.65 V.
See the tables in Section 6.0, “Electrical Specifications” on page 26 and in Section 7.0,
“AC Characteristics” on page 28 for operating characteristics
November 2007
Order Number: 290702-13
Datasheet
25
Numonyx™ Wireless Flash Memory (W30)
6.0
Electrical Specifications
6.1
DC Current Characteristics
Table 9:
DC Current Characteristics (Sheet 1 of 2)
VCCQ = 3.0 V
Sym
Parameter
ILI
Input Load
ILO
Output
Leakage
180 nm
ICCS
130 nm
ICCS
180 nm
ICCAPS
130 nm
ICCAPS
(1)
9
DQ[15:0]
VCC Standby
APS
Average
VCC
Read
32/64
Mbit
128 Mbit
Synchronous
CLK = 40 MHz
2
Test Conditions
Max
Typ
Max
-
±2
-
±2
µA
VCC = VCCMax
VCCQ = VCCQMax
VIN = VCCQ or GND
-
±10
-
±10
µA
VCC = VCCMax
VCCQ = VCCQMax
VIN = VCCQ or GND
6
21
6
30
µA
VCC = VCCMax
VCCQ = VCCQMax
CE# = VCCQ
RST# =VCCQ
µA
VCC = VCCMax
VCCQ = VCCQMax
CE# = VSSQ
RST# =VCCQ
All other inputs =VCCQ or VSSQ
10
2
Uni
t
Typ
8
50
8
70
6
21
6
30
8
50
8
70
4
7
4
10
mA
4 Word Read
7
15
7
15
mA
Burst length = 4
9
16
9
16
mA
Burst length = 8
11
19
11
19
mA
Burst length =16
11
Asynchronous
Page Mode
f=13 MHz
ICCR
Note
VCC = VCC Max
CE# = VIL
OE# = VIH
Inputs = VIH or VIL
12
22
12
22
mA
Burst length =
Continuous
18
40
18
40
mA
VPP = VPPL, Program in Progress
8
15
8
15
mA
VPP = VPPH, Program in Progress
18
40
18
40
mA
VPP = VPPL, Block Erase in Progress
8
15
8
15
mA
VPP = VPPH, Block Erase in Progress
ICCW
VCC Program
3,4,5
ICCE
VCC Block Erase
3,4,5
ICCWS
VCC Program Suspend
6
6
21
6
30
µA
CE# = VCC, Program Suspended
ICCES
VCC Erase Suspend
6
6
21
6
30
µA
CE# = VCC, Erase Suspended
IPPS
(IPPWS,
IPPES)
VPP Standby
VPP Program Suspend
VPP Erase Suspend
3
0.2
5
0.2
5
µA
VPP < VCC
IPPR
VPP Read
-
2
15
2
15
µA
VPP < VCC
IPPW
VPP Program
4
0.05
0.10
0.05
0.10
8
22
16
37
Datasheet
26
mA
VPP = VPPL, Program in Progress
VPP = VPPH, Program in Progress
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 9:
DC Current Characteristics (Sheet 2 of 2)
VCCQ= 3.0 V
Sym
IPPE
Parameter
(1)
32/64
Mbit
Note
VPP Erase
4
Uni
t
128 Mbit
Typ
Max
Typ
Max
0.05
0.10
0.05
0.10
8
22
8
22
mA
Test Conditions
VPP = VPPL, Erase in Progress
VPP = VPPH, Erase in Progress
Notes:
1.
All currents are RMS unless noted. Typical values at typical VCC , TA = +25°C.
2.
Automatic Power Savings (APS) reduces ICCR to approximately standby levels in static operation. See ICCRQ specification
for details.
3.
Sampled, not 100% tested.
4.
VCC read + program current is the sum of VCC read and VCC program currents.
5.
VCC read + erase current is the sum of VCC read and VCC erase currents.
6.
ICCES is specified with the flash device deselected. If the flash device is read while in erase suspend, the current is ICCES
plus ICCR.
7.
VPP < VPPLK inhibits erase and program operations. Do not use VPPL and VPPH outside their valid ranges.
8.
VIL can undershoot to –0.4V and VIH can overshoot to VCCQ+0.4V for durations of 20 ns or less.
9.
If VIN>VCC the input load current increases to 10 µA max.
10.
ICCS is the average current measured over any 5ms time interval 5 µs after a CE# de-assertion.
11.
Refer to section Section 8.2, “Automatic Power Savings (APS)” on page 44 for ICCAPS measurement
details.
6.2
DC Voltage Characteristics
Table 10: DC Voltage Characteristics
V CCQ= 3.0 V
Sym
Parameter
(1)
32/64 Mbit
Note
128 Mbit
Unit
Min
Max
Min
Max
Test Conditions
VIL
Input Low
8
0
0.4
0
0.4
V
VIH
Input High
-
VCCQ
– 0.4
VCCQ
VCCQ
– 0.4
VCCQ
V
VOL
Output Low
-
-
0.1
-
0.1
V
VCC = VCCMin
VCCQ = VCCQMin
IOL = 100 µA
VOH
Output High
-
VCCQ
– 0.1
-
VCCQ
– 0.1
-
V
VCC = VCCMin
VCCQ = VCCQMin
IOH = –100 µA
VPPLK
VPP Lock-Out
7
-
0.4
-
0.4
V
VLKO
VCC Lock
-
1.0
-
1.0
-
V
VCCQ Lock
-
0.9
-
0.9
-
V
VILKOQ
Note:
For all numbered note references in this table, refer to the notes in
page 26.
November 2007
Order Number: 290702-13
Table 9, “DC Current Characteristics” on
Datasheet
27
Numonyx™ Wireless Flash Memory (W30)
7.0
AC Characteristics
7.1
Read Operations - 130 nm Lithography
Table 11: Read Operations - 130 nm Lithography (Sheet 1 of 2)
32-Mbit
64-Mbit
#
Sym
Parameter
1
-70
128-Mbit
-85
-70
Units
Notes
Min
Max
Min
Max
Min
Max
70
-
85
-
70
-
ns
6
Asynchronous Specifications
R1
tAVAV
Read Cycle Time
R2
tAVQV
Address to Output Valid
-
70
-
85
-
70
ns
6
R3
tELQV
CE# Low to Output Valid
-
70
-
85
-
70
ns
6
R4
tGLQV
OE# Low to Output Valid
-
30
-
30
-
30
ns
3
R5
tPHQV
RST# High to Output Valid
-
150
-
150
-
150
ns
-
R6
tELQX
CE# Low to Output Low-Z
0
-
0
-
0
-
ns
4
R7
tGLQX
OE# Low to Output Low-Z
0
-
0
-
0
-
ns
3,4
R8
tEHQZ
CE# High to Output High-Z
-
20
-
20
-
20
ns
4
R9
tGHQZ
OE# High to Output High-Z
-
14
-
14
-
14
ns
3,4
R10
tOH
CE# (OE#) High to Output Low-Z
R11
tEHEL
CE# Pulse Width High
R12
tELTV
CE# Low to WAIT Valid
-
20
R13
tEHTZ
CE# High to WAIT High-Z
-
25
-
10
10
0
-
0
-
0
-
ns
3,4
20
-
20
-
20
-
ns
5
-
22
-
22
ns
5
-
25
-
25
ns
4,5
-
12
-
ns
-
-
12
-
ns
-
85
-
70
ns
6
Latching Specifications
R101
tAVVH
Address Setup to ADV# High
10
R102
tELVH
CE# Low to ADV# High
10
-
R103
tVLQV
ADV# Low to Output Valid
-
70
R104
tVLVH
ADV# Pulse Width Low
10
-
10
-
12
-
ns
-
R105
tVHVL
ADV# Pulse Width High
10
-
10
-
12
-
ns
-
R106
tVHAX
Address Hold from ADV# High
9
-
9
-
9
-
ns
2
R108
tAPA
Page Address Access Time
-
25
-
25
-
25
ns
-
-
40
-
33
-
40
MHz
-
Clock Specifications
R200
fCLK
CLK Frequency
R201
tCLK
CLK Period
25
-
30
-
25
-
ns
-
R202
tCH/L
CLK High or Low Time
9.5
-
9.5
-
9.5
-
ns
-
R203
tCHCL
CLK Fall or Rise Time
-
3
-
5
-
5
ns
-
Datasheet
28
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 11: Read Operations - 130 nm Lithography (Sheet 2 of 2)
32-Mbit
64-Mbit
#
Sym
Parameter
1
-70
128-Mbit
-85
-70
Units
Notes
ns
-
Min
Max
Min
Max
Min
Max
9
-
9
-
10
-
10
-
10
-
10
-
ns
-
9
-
9
-
9
-
ns
-
Synchronous Specifications
R301
tAVCH
Address Valid Setup to CLK
R302
tVLCH
ADV# Low Setup to CLK
R303
tELCH
CE# Low Setup to CLK
R304
tCHQV
CLK to Output Valid
-
20
-
22
-
20
ns
-
R305
tCHQX
Output Hold from CLK
5
-
5
-
5
-
ns
-
R306
tCHAX
Address Hold from CLK
10
-
10
-
10
-
ns
2
R307
tCHTV
CLK to WAIT Valid
-
20
-
22
-
22
ns
-
Notes:
1.
See Figure 22, “AC Input/Output Reference Waveform” on page 46 for timing measurements
and maximum allowable input slew rate.
2.
Address hold in synchronous-burst mode is defined as tCHAX or tVHAX , whichever timing specification is satisfied
first.
3.
OE# can be delayed by up to tELQV – tGLQV after the falling edge of CE# without impact to tELQV.
4.
Sampled, not 100% tested.
5.
Applies only to subsequent synchronous reads.
6.
During the initial access of a synchronous burst read, data from the first word might begin to be driven onto
the data bus as early as the first clock edge after tAVQV.
7.2
Read Operations - 180 nm Lithography
Table 12: Read Operations - 180 nm Lithography (Sheet 1 of 2)
32-Mbit
64-Mbit
#
Sym
Parameter
1
-70
Min
128-Mbit
-85
Max
Min
-90
Max
Min
Units
Notes
Max
Asynchronous Specifications
R1
tAVAV
Read Cycle Time
70
-
85
-
90
-
ns
6
R2
tAVQV
Address to Output Valid
-
70
-
85
-
90
ns
6
R3
tELQV
CE# Low to Output Valid
-
70
-
85
-
90
ns
6
R4
tGLQV
OE# Low to Output Valid
-
30
-
30
-
30
ns
3
R5
tPHQV
RST# High to Output Valid
-
150
-
150
-
150
ns
-
R6
tELQX
CE# Low to Output Low-Z
0
-
0
-
0
-
ns
4
R7
tGLQX
OE# Low to Output Low-Z
0
-
0
-
0
-
ns
3,4
R8
tEHQZ
CE# High to Output High-Z
-
20
-
20
-
20
ns
4
R9
tGHQZ
OE# High to Output High-Z
-
14
-
14
R10
tOH
CE# (OE#) High to Output Low-Z
0
-
0
-
0
R11
tEHEL
CE# Pulse Width High
20
-
20
-
R12
tELTV
CE# Low to WAIT Valid
-
20
-
22
R13
tEHTZ
CE# High to WAIT High-Z
-
25
-
25
November 2007
Order Number: 290702-13
14
ns
3,4
-
ns
3,4
20
-
ns
5
-
22
ns
5
-
25
ns
4,5
Datasheet
29
Numonyx™ Wireless Flash Memory (W30)
Table 12: Read Operations - 180 nm Lithography (Sheet 2 of 2)
32-Mbit
64-Mbit
#
Sym
Parameter
1
-70
128-Mbit
-85
-90
Units
Notes
-
Min
Max
Min
Max
Min
Max
-
10
-
12
-
ns
Latching Specifications
R101
tAVVH
Address Setup to ADV# High
10
R102
tELVH
CE# Low to ADV# High
10
-
10
-
12
-
ns
-
R103
tVLQV
ADV# Low to Output Valid
-
70
-
85
-
90
ns
6
R104
tVLVH
ADV# Pulse Width Low
10
-
10
-
12
-
ns
-
R105
tVHVL
ADV# Pulse Width High
10
-
10
-
12
-
ns
-
R106
tVHAX
Address Hold from ADV# High
9
-
9
-
9
-
ns
2
R108
tAPA
Page Address Access Time
-
25
-
25
-
30
ns
-
-
40
-
33
-
33
MHz
-
Clock Specifications
R200
fCLK
CLK Frequency
R201
tCLK
CLK Period
25
-
30
-
30
-
ns
-
R202
tCH/L
CLK High or Low Time
9.5
-
9.5
-
9.5
-
ns
-
R203
tCHCL
CLK Fall or Rise Time
-
3
5
-
5
ns
-
9
-
9
-
10
-
ns
-
10
-
10
-
10
-
ns
-
Synchronous Specifications
R301
tAVCH
Address Valid Setup to CLK
R302
tVLCH
ADV# Low Setup to CLK
R303
tELCH
CE# Low Setup to CLK
9
-
9
-
9
-
ns
-
R304
tCHQV
CLK to Output Valid
-
20
-
22
-
22
ns
-
R305
tCHQX
Output Hold from CLK
5
-
5
5
-
ns
-
R306
tCHAX
Address Hold from CLK
10
-
10
-
10
-
ns
2
R307
tCHTV
CLK to WAIT Valid
-
20
-
22
-
22
ns
-
Notes:
1.
See Figure 22, “AC Input/Output Reference Waveform” on page 46 for timing measurements
and maximum allowable input slew rate.
2.
Address hold in synchronous-burst mode is defined as tCHAX or tVHAX, whichever timing specification is satisfied
first.
3.
OE# can be delayed by up to tELQV– tGLQV after the falling edge of CE# without impact to tELQV.
4.
Sampled, not 100% tested.
5.
Applies only to subsequent synchronous reads.
6.
During the initial access of a synchronous burst read, data from the first word might begin to be driven onto
the data bus as early as the first clock edge after tAVQV.
Datasheet
30
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 8:
Asynchronous Read Operation Waveform
R1
Address [A]
VIH
Valid
Address
VIL
R2
CE# [E]
VIH
VIL
R3
OE# [G]
R8
VIH
R4
VIL
R7
WE# [W]
WAIT [T]
Data [D/Q]
VIL
VOH
High Z
High Z
Note 1
VOL
VOH
High Z
Valid
Output
VOL
R5
RST# [P]
R9
VIH
R10
VIH
VIL
Notes: .
1.
WAIT shown asserted (RCR[10]=0)
2.
ADV# assumed to be driven to VIL in this waveform
November 2007
Order Number: 290702-13
Datasheet
31
Numonyx™ Wireless Flash Memory (W30)
Figure 9:
Latched Asynchronous Read Operation Waveform
R1
A[MAX:2] [A]
A[1:0] [A]
VIH
VIL
Valid
Address
Valid
Address
VIH
Valid
Address
VIL
Valid
Address
R2
R101
R105
ADV# [V]
R106
VIH
VIL
R104
R103
CE# [E]
VIH
R3
VIL
R102
R4
R8
R6
OE# [G]
VIH
VIL
R7
WE# [W]
Data [Q]
VIL
VOH
High Z
Valid
Output
VOL
R5
RST# [P]
Datasheet
32
R9
VIH
R10
VIH
VIL
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 10: Page-Mode Read Operation Waveform
R1
VIH
A[MAX:2] [A]
Valid
Address
VIL
R2
VIH
A[1:0] [A]
Valid
Address
VIL
Valid
Address
Valid
Address
Valid
Address
R101
R105
R106
VIH
ADV# [V]
VIL
R104
R103
VIH
CE# [E]
R3
VIL
R102
R4
R8
R6
VIH
OE# [G]
VIL
R7
WE# [W]
WAIT [T]
Data [D/Q]
VIL
VOH
High Z
Note 1
R108
High Z
VOL
VOH
High Z
Valid
Output
VOL
R5
RST# [P]
Note:
R9
VIH
Valid
Output
Valid
Output
Valid
Output
R10
VIH
VIL
WAIT shown asserted (RCR[10] = 0).
November 2007
Order Number: 290702-13
Datasheet
33
Numonyx™ Wireless Flash Memory (W30)
Figure 11: Single Synchronous Read-Array Operation Waveform
R13
R12
Notes:
1.
2.
3.
Section 14.2, “First Access Latency Count (RCR[13:11])” on page 80 describes how to insert clock
cycles during the initial access.
WAIT (shown asserted; RCR[10]=0) can be configured to assert either during, or one data cycle before, valid data.
In this waveform, an x-word burst is initiated to the main array and it is terminated by a CE# de-assertion after the first
word in the burst. If this access had been done to Status, ID, or Query reads, the asserted (low) WAIT signal would have
remained asserted (low) as long as CE# is asserted (low).
Datasheet
34
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 12: Synchronous 4-Word Burst Read Operation Waveform
R11
R12
Notes:
1.
2.
R13
Section 14.2, “First Access Latency Count (RCR[13:11])” on page 80 describes how to insert clock
cycles during the initial access.
WAIT (shown asserted; RCR[10] = 0) can be configured to assert either during, or one data cycle before, valid data.
November 2007
Order Number: 290702-13
Datasheet
35
Numonyx™ Wireless Flash Memory (W30)
Figure 13: WAIT Functionality for EOWL (End-of-Word Line) Condition Waveform
R12
Notes:
1.
2.
Section 14.2, “First Access Latency Count (RCR[13:11])” on page 80 describes how to insert clock
cycles during the initial access.
WAIT (shown asserted; RCR[10]=0) can be configured to assert either during, or one data cycle before, valid data. (This
example assumes a wait delay of two clocks.)
Datasheet
36
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 14: WAIT Signal in Synchronous Non-Read Array Operation Waveform
R13
R12
Notes:
1.
2.
Section 14.2, “First Access Latency Count (RCR[13:11])” on page 80 describes how to insert clock
cycles during the initial access.
WAIT shown asserted (RCR[10]=0).
November 2007
Order Number: 290702-13
Datasheet
37
Numonyx™ Wireless Flash Memory (W30)
Figure 15: Burst Suspend
R304
R305
R305
R305
CLK
R1
R2
Address [A]
R101
R105
R106
ADV#
R3
R8
CE# [E]
R4
R9
R4
R9
OE# [G]
R13
R12
WAIT [T]
WE# [W]
R7
R6
DATA [D/Q]
Note:
1.
R304
Q1
Q0
R304
Q2
Q1
During Burst Suspend, the Clock signal can be held high or low.
7.3
AC Write Characteristics
Table 13: AC Write Characteristics (Sheet 1 of 2)
32-Mbit
64-Mbit
128-Mbit
#
W1
Sym
tPHWL (tPHEL)
Parameter
1,2
RST# High Recovery to WE# (CE#) Low
Notes
-70
-85 / -90
Unit
Min
Max
Min
Max
3
150
-
150
-
ns
0
-
0
-
ns
4
45
-
60
-
ns
W2
tELWL (tWLEL)
CE# (WE#) Setup to WE# (CE#) Low
W3
tWLWH (tELEH)
WE# (CE#) Write Pulse Width Low
W4
tDVWH (tDVEH)
Data Setup to WE# (CE#) High
45
-
60
-
ns
W5
tAVWH (tAVEH)
Address Setup to WE# (CE#) High
45
-
60
-
ns
W6
tWHEH (tEHWH)
CE# (WE#) Hold from WE# (CE#) High
0
-
0
-
ns
W7
tWHDX (tEHDX)
Data Hold from WE# (CE#) High
0
-
0
-
ns
W8
tWHAX (tEHAX)
Address Hold from WE# (CE#) High
W9
tWHWL (tEHEL)
WE# (CE#) Pulse Width High
W10
tVPWH (tVPEH)
VPP Setup to WE# (CE#) High
W11
tQVVL
W12
tQVBL
W13
tBHWH (tBHEH)
Datasheet
38
0
-
0
-
ns
5,6,7
25
-
25
-
ns
3
200
-
200
-
ns
VPP Hold from Valid SRD
3, 8
0
-
0
-
ns
WP# Hold from Valid SRD
3, 8
0
-
0
-
ns
3
200
-
200
-
ns
WP# Setup to WE# (CE#) High
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 13: AC Write Characteristics (Sheet 2 of 2)
32-Mbit
64-Mbit
128-Mbit
#
W14
Sym
tWHGL (tEHGL)
Parameter
1,2
Write Recovery before Read
Notes
-70
Unit
-85 / -90
Min
Max
Min
Max
-
0
-
0
-
ns
tAVQV
+ 40
-
tAVQV
+ 50
-
ns
W16
tWHQV
WE# High to Valid Data
3,6,1
0
W18
tWHAV
WE# High to Address Valid
3,9,1
0
0
-
0
-
ns
W19
tWHCV
WE# High to CLK Valid
3,10
20
-
20
-
ns
W20
tWHVH
WE# High to ADV# High
3,10
20
-
20
-
ns
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
Write timing characteristics during erase suspend are the same as during write-only operations.
A write operation can be terminated with either CE# or WE#.
Sampled, not 100% tested.
Write pulse width low (tWLWH or tELEH) is defined from CE# or WE# low (whichever occurs last) to CE# or WE# high
(whichever occurs first). Hence, tWLWH = tELEH = tWLEH = tELWH.
Write pulse width high (tWHWL or tEHEL) is defined from CE# or WE# high (whichever is first) to CE# or WE# low
(whichever is last). Hence, tWHWL = tEHEL = tWHEL = tEHWL.
System designers must take this into account, and can insert a software No-Op instruction to delay the first read after
issuing a command.
For commands other than resume commands.
VPP must be held at VPPL or VPPH until block erase or program success is determined.
Applicable during asynchronous reads following a write.
tWHCH/L OR tWHVH must be met when transitioning from a write cycle to a synchronous burst read. tWHCH/L and tWHVH
both refer to the address latching event (either the rising/falling clock edge or the rising ADV# edge, whichever occurs
first).
November 2007
Order Number: 290702-13
Datasheet
39
Numonyx™ Wireless Flash Memory (W30)
Figure 16: Write Operations Waveform
CLK [C]
VIH
VIL
W19
Address [A]
VIH
VIL
Note 1
Note 2
Note 3
Valid
Address
Note 4
Valid
Address
Note 5
Valid
Address
W5
W18
R101
R105
ADV# [V]
R106
W8
VIH
VIL
R104
CE# (WE#) [E(W)]
W20
VIH
Note 6
VIL
W2
OE# [G]
W6
VIH
VIL
W3
W14
W9
WE# (CE#) [W(E)]
VIH
Note 6
VIL
W1
Data [Q]
VIH
W7
Data In
W16
Valid
SRD
Data In
VIL
W4
RST# [P]
WP# [B]
VIH
VIL
W13
W12
W10
W11
VIH
VIL
VPPH
VPP [V]
VPPLK
VIL
Notes:
1.
2.
3.
4.
5.
6.
7.
VCC power-up and standby.
Write Program or Erase Setup command.
Write valid address and data (for program) or Erase Confirm command.
Automated program/erase delay.
Read status register data (SRD) to determine program/erase operation completion.
OE# and CE# must be asserted and WE# must be deasserted for read operations.
CLK is ignored (but can be kept active/toggling).
Datasheet
40
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 17: Asynchronous Read to Write Operation Waveform
R1
R2
W5
W8
Address [A]
R3
R8
CE# [E}
R4
R9
OE# [G]
W3
W2
W6
WE# [W]
R7
R6
W7
R10
Data [D/Q]
W4
D
Q
R5
RST# [P]
Figure 18: Asynchronous Write to Read Operation
W5
W8
R1
Address [A]
W2
W6
R10
CE# [E}
W3
W18
WE# [W]
W14
OE# [G]
W7
W4
Data [D/Q]
D
R4
R2
R3
R9
R8
Q
W1
RST # [P]
November 2007
Order Number: 290702-13
Datasheet
41
Numonyx™ Wireless Flash Memory (W30)
Figure 19: Synchronous Read to Write Operation
Latency Count
R301
R302
R306
CLK [C]
R2
W5
R101
W18
Address [A]
R105
R106
R104
R102
W20
ADV# [V]
R303
R3
R11
W6
CE# [E]
R4
R8
OE# [G]
W15
W19
W9
W8
W3
W2
WE#
R12
R307
WAIT [T]
R304
R13
R7
Data [D/Q]
R305
W7
Q
D
D
Figure 20: Synchronous Write To Read Operation
Lat ency Count
R302
R301
R2
CLK
W5
W8
R306
Address [A]
W20
R106
R104
ADV#
W6
W2
R303
R11
CE# [E}
W18
W19
W3
WE# [W]
R4
OE# [G]
R12
R307
WAIT [T ]
W7
W4
Data [D/Q]
R304
R3
D
Q
R304
R305
Q
W1
RST# [P]
Datasheet
42
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
7.4
Erase and Program Times
Table 14: Erase and Program Times
Operation
Symbol
Description1
Parameter
VPPH
V PPL
Notes
Unit
Typ
Max
Typ
Max
2.5
0.25
2.5
Erasing and Suspending
Erase Time
Suspend
Latency
W500
tERS/PB
4-Kword Parameter Block
2,3
0.3
W501
tERS/MB
32-Kword Main Block
2,3
0.7
4
0.4
4
s
W600
tSUSP/P
Program Suspend
2
5
10
5
10
µs
W601
tSUSP/E
Erase Suspend
2
5
20
5
20
µs
W200
tPROG/W
Single Word
2
12
150
8
130
µs
W201
tPROG/PB
4-Kword Parameter Block
2,3
0.05
.23
0.03
0.07
s
W202
tPROG/MB
32-Kword Main Block
2,3
0.4
1.8
0.24
0.6
s
s
Programming
Program
Time
Enhanced Factory Programming 5
Program
Operation
Latency
W400
tEFP/W
Single Word
4
N/A
N/A
3.5
16
µs
W401
tEFP/PB
4-Kword Parameter Block
2,3
N/A
N/A
15
-
ms
W402
tEFP/MB
32-Kword Main Block
2,3
N/A
N/A
120
-
ms
W403
tEFP/SETUP
EFP Setup
-
N/A
N/A
-
5
µs
W404
tEFP/TRAN
Program to Verify Transition
-
N/A
N/A
2.7
5.6
µs
W405
tEFP/VERIFY
Verify
-
N/A
N/A
1.7
130
µs
Notes:
1.
Unless noted otherwise, all parameters are measured at TA = +25 °C and nominal voltages, and are sampled, not 100%
tested.
2.
Excludes external system-level overhead.
3.
Exact results might vary based on system overhead.
4.
W400-Typ is the calculated delay for a single programming pulse. W400-Max includes the delay when programming
within a new word-line.
5.
Some EFP performance degradation might occur if block cycling exceeds 10.
November 2007
Order Number: 290702-13
Datasheet
43
Numonyx™ Wireless Flash Memory (W30)
8.0
Power and Reset Specifications
Product Name devices have a layered approach to power savings that can significantly
reduce overall system power consumption.
• The APS feature reduces power consumption when the flash device is selected but
idle.
• If CE# is deasserted, the memory enters its standby mode, where current
consumption is even lower.
• Asserting RST# provides current savings similar to standby mode.
The combination of these features can minimize memory power consumption, and
therefore, overall system power consumption.
8.1
Active Power
With CE# at VIL and RST# at VIH , the flash device is in the active mode. Refer to
Section 6.1, “DC Current Characteristics” on page 26, for ICC values. When the flash
device is in active state, it consumes the most power from the system. Minimizing flash
device active current therefore reduces system power consumption, especially in
battery-powered applications.
8.2
Automatic Power Savings (APS)
Automatic Power Saving (APS) provides low power operation during a read active state.
ICCAPS is the average current measured over any 5 ms time interval, 5 µs after CE# is
deasserted. During APS, average current is measured over the same time interval 5 µs
after the following events:
• There is no internal read, program or erase activity.
• CE# is asserted.
• The address lines are quiescent, and at VIL or VIH.
OE# can be driven during APS.
8.3
Standby Power
When CE# is deasserted, the flash device is deselected and placed in standby,
substantially reducing power consumption. In standby, the data outputs are placed in
High-Z, independent of the level placed on OE#. Standby current, ICCS, is the average
current measured over any 5 ms time interval, 5 µs after CE# is deasserted. During
standby, average current is measured over the same time interval 5 µs after CE# is
deasserted.
When the flash device is deselected (while CE# is deasserted) during a program or
erase operation, it continues to consume active power until the program or erase
operation completes.
8.4
Power-Up/Down Characteristics
The flash device is protected against accidental block erasure or programming during
power transitions. Power supply sequencing is not required if VCC and VPP are
connected together; so it does not matter whether VPP or VCC powers-up first. If VPP is
not connected to the system supply, then VCC must attain VCCMIN before applying VCCQ
and VPP. Do not drive flash device inputs before supply voltage = VCCQMIN. Power supply
transitions can occur only when RST# is low.
Datasheet
44
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
8.4.1
System Reset and RST#
The use of RST# during system reset is important with automated program/erase flash
devices, because the system expects to read from the flash memory when it comes out
of reset. If a CPU reset occurs without a flash memory reset, the CPU is not properly
initialized, because the flash memory might be providing status information instead of
array data.
Note:
To allow proper CPU/flash device initialization at system reset, connect RST# to the
system CPU RESET# signal.
System designers must guard against spurious writes when VCC voltages are above
VLKO. Because both WE# and CE# must be low for a command write, driving either
signal to VIH inhibits writes to the flash device. The CUI architecture provides additional
protection, because memory contents can be altered only after successful completion
of the two-step command sequences.
The flash device is also disabled until RST# is brought to VIH, regardless of its control
input states.
By holding the flash device in reset (RST# connected to system PowerGood) during
power-up/down, invalid bus conditions during power-up can be masked, providing yet
another level of memory protection.
8.4.2
VCC, VPP, and RST# Transitions
The CUI latches commands issued by system software, and is not altered by VPP or
CE# transitions or WSM actions. Read-array mode is the power-up default state after
the flash device exits from reset mode or after VCC transitions above VLKO (Lockout
voltage).
After completing program or block erase operations (even after VPP transitions below
VPPLK), the Read Array command must reset the CUI to read-array mode if flash
memory array access is desired.
8.5
Power Supply Decoupling
When the flash device is accessed, many internal conditions change. Circuits are
enabled to charge pumps and switch voltages. This internal activity produces transient
noise.
To minimize the effect of this transient noise, device decoupling capacitors are
required. Transient current magnitudes depend on the flash device output capacitive
and inductive loading. Two-line control and proper decoupling capacitor selection
suppresses these transient voltage peaks.
Note:
Each flash device must have a 0.1 µF ceramic capacitor connected between each power
(VCC, VCCQ, VPP), and ground (VSS, VSSQ) signal. High-frequency, inherently lowinductance capacitors must be as close as possible to the package signals.
November 2007
Order Number: 290702-13
Datasheet
45
Numonyx™ Wireless Flash Memory (W30)
8.6
Reset Specifications
Table 15: Reset Specifications
#
P1
tPLPH
P2
tPLRH
P3
tVCCPH
Notes:
1.
2.
3.
4.
5.
6.
Parameter1
Symbol
RST# Low to Reset during Read
Notes
Min
Max
Unit
1, 2, 3, 4
100
-
ns
RST# Low to Reset during Block Erase
1, 3, 4, 5
-
20
µs
RST# Low to Reset during Program
1, 3, 4, 5
-
10
µs
VCC Power Valid to Reset
1,3,4,5,6
60
-
µs
These specifications are valid for all product versions (packages and speeds).
The flash device might reset if tPLPH< tPLPHMin, but this is not guaranteed.
Not applicable if RST# is tied to VCC.
Sampled, but not 100% tested.
If RST# is tied to VCC, the flash device is not ready until tVCCPH occurs after when VCC > VCC Min.
If RST# is tied to any supply/signal with VCCQ voltage levels, the RST# input voltage must not exceed VCC until VCC >
VCC Min.
Figure 21: Reset Operations Waveforms
P1
(A) Reset during
read mode
RST# [P]
VIL
P2
(B) Reset during
program or block erase
P1 ≤ P2
RST# [P]
RST# [P]
Abort
Complete
R5
VIH
VIL
P2
(C) Reset during
program or block erase
P1 ≥ P2
R5
VIH
Abort
Complete
R5
VIH
VIL
P3
(D) VCC Power-up to
RST# high
8.7
VCC
VCC
0V
AC I/O Test Conditions
Figure 22: AC Input/Output Reference Waveform
VCCQ
Input
VCCQ/2
Test Points
VCCQ/2
Output
0V
Note:
Input timing begins, and output timing ends, at VCCQ/2. Input rise and fall times (10% to 90%) < 5 ns. Worst case speed
conditions are when VCC = VCC Min.
Datasheet
46
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 23: Transient Equivalent Testing Load Circuit
VCCQ
R1
Device
Under Test
Out
CL
Note:
See
R2
Table 16 for component values.
Table 16: Test Configuration Component Values for Worst Case Speed Conditions
Test Configuration
VCCQMin Standard Test
Note:
CL (pF)
R1 (kΩ)
R1 (kΩ)
30
25
25
CL includes jig capacitance.
Figure 24: Clock Input AC Waveform
R201
CLK [C]
VIH
VIL
R202
8.8
R203
Flash Device Capacitance
TA = +25 °C, f = 1 MHz
Parameter§
Typ
Max
Unit
Condition
Input Capacitance
6
8
pF
VIN = 0.0 V
Output Capacitance
8
12
pF
VOUT = 0.0 V
CE# Input Capacitance
10
12
pF
VIN = 0.0 V
Symbol
CIN
COUT
CCE
§
Sampled, not 100% tested.
November 2007
Order Number: 290702-13
Datasheet
47
Numonyx™ Wireless Flash Memory (W30)
9.0
Flash Device Operations
This chapter provides an overview of flash device operations. The W30 flash memory
device family includes an on-chip Write State Machine (WSM) to manage block erase
and program algorithms. The WSM Command User Interface (CUI) allows minimal
processor overhead with RAM-like interface timings.
9.1
Bus Operations
Table 17: Bus Operations Summary
Bus Operation
Read
RST#
CLK
ADV#
CE#
OE#
WE#
WAIT
DQ[15:0
]
Notes
Asynchronous
VIH
X
L
L
L
H
Asserted
Output
-
Synchronous
VIH
Running
L
L
L
H
Driven
Output
1
VIH
Halted
X
L
H
H
Active
Output
-
Write
Burst Suspend
VIH
X
L
L
H
L
Asserted
Input
2
Output Disable
VIH
X
X
L
H
H
Asserted
High-Z
3
Standby
VIH
X
X
H
X
X
High-Z
High-Z
3
Reset
VIL
X
X
X
X
X
High-Z
High-Z
3,4
Notes:
1.
WAIT is valid only during synchronous array-read operations.
2.
Refer to the Table 19, “Bus Cycle Definitions” on page 52 for valid DQ[15:0] during a write
operation.
3.
X = Don’t Care (H or L).
4.
RST# must be at VSS ± 0.2 V to meet the maximum specified power-down current.
9.1.1
Read
The W30 flash memory device has several read configurations:
• Asynchronous page mode read.
• Synchronous burst mode read — outputs four, eight, sixteen, or continuous words,
from main blocks and parameter blocks.
Several read modes are available in each partition:
• Read-array mode: read accesses return flash memory array data from the
addressed locations.
• Read identifier mode: reads return manufacturer and device identifier data,
block lock status, and protection register data. Identifier information can be
accessed starting at a 4-Mbit partition base addresses; the flash memory array is
not accessible in read identifier mode.
• Read query mode: reads return the flash device CFI data. CFI information can be
accessed starting at a 4-Mbit partition base addresses; the flash memory array is
not accessible in read query mode.
• Read status register mode: reads return status register data from the addressed
partition. The array data for that partition is not accessible. A system processor can
check the status register to determine the state of an addressed partition, or to
monitor program and erase progress.
All partitions support the synchronous burst mode that internally sequences addresses
with respect to the input CLK to select and supply data to the outputs.
Datasheet
48
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Identifier codes, query data, and status register read operations execute as singlesynchronous or asynchronous read cycles. WAIT is asserted during these reads.
Access to the modes listed above is independent of VPP. An appropriate CUI command
places the flash device in a read mode. At initial power-up or after reset, the flash
device defaults to asynchronous read-array mode.
Asserting CE# enables flash device read operations. The flash device internally decodes
upper address inputs to determine which partition is accessed.
• Asserting ADV# opens the internal address latches.
• Asserting OE# activates the outputs, and gates the selected data onto the I/O bus.
• In asynchronous mode, the address is latched when ADV# is deasserted (when the
flash device is configured to use ADV#).
• In synchronous mode, the address is latched by either the rising edge of ADV# or
the rising (or falling) CLK edge while ADV# remains asserted, whichever occurs
first.
WE# and RST# must be deasserted during read operations.
Note:
If only asynchronous reads are to be performed in your system, CLK must be tied to a
valid VIH level, the WAIT signal can be floated, and ADV# must be tied to ground.
9.1.2
Burst Suspend
The Burst Suspend feature allows the system to temporarily suspend a synchronous
burst operation if the system needs to use the flash device address and data bus for
other purposes. Burst accesses can be suspended during the initial latency (before data
is received) or after the flash device has output data. When a burst access is
suspended, internal array sensing continues and any previously latched internal data is
retained.
Burst Suspend occurs when CE# is asserted, the current address has been latched
(either ADV# rising edge or valid CLK edge), CLK is halted, and OE# is deasserted. CLK
can be halted when it is at VIH or VIL. To resume the burst access, OE# is reasserted
and CLK is restarted. Subsequent CLK edges resume the burst sequence where it left
off.
Within the flash device, CE# gates the WAIT signal. Therefore, during Burst Suspend,
WAIT remains asserted and does not revert to a high-impedance state when OE# is
deasserted. This WAIT state can cause contention with another flash device attempting
to control the system READY signal during a Burst Suspend. System using the Burst
Suspend feature must not connect the flash device WAIT signal directly to the system
READY signal.
Refer to Figure 15, “Burst Suspend” on page 38.
9.1.3
Standby
De-asserting CE# deselects the flash device and places it in standby mode,
substantially reducing flash device power consumption. In standby mode, outputs are
placed in a high-impedance state independent of OE#. If deselected during a program
or erase algorithm, the flash device consumes active power until the program or erase
operation completes.
November 2007
Order Number: 290702-13
Datasheet
49
Numonyx™ Wireless Flash Memory (W30)
9.1.4
Reset
The flash device enters a reset mode when RST# is asserted. In reset mode, internal
circuitry is turned off and outputs are placed in a high-impedance state.
After returning from reset, a time tPHQV is required until outputs are valid, and a delay
(tPHWV) is required before a write sequence can be initiated. After this wake-up
interval, normal operation is restored. The flash device defaults to read-array mode,
the status register is set to 80h, and the Read Configuration Register defaults to
asynchronous page-mode reads.
If RST# is asserted during an erase or program operation, the operation aborts and the
memory contents at the aborted block or address are invalid. See Figure 21, “Reset
Operations Waveforms” on page 46 for detailed information regarding reset timings.
As on any automated device, RST# must be asserted during system reset. When the
system comes out of reset, the processor expects to read from the flash memory array.
Automated flash memory devices provide status information when read during program
or erase operations. If a CPU reset occurs with no flash memory reset, the CPU might
not be properly initialized, because the flash memory device might be providing status
information instead of array data. 1.8 Volt Numonyx Flash memory devices allow
proper CPU initialization following a system reset through the use of the RST# input. In
this application, RST# is controlled by the same CPU reset signal, RESET#.
9.1.5
Write
A write occurs when CE# and WE# are asserted and OE# is deasserted. Flash memory
control commands are written to the CUI using standard microprocessor write timings.
Proper use of the ADV# input is needed for proper latching of the addresses. Refer to
Section 7.3, “AC Write Characteristics” on page 38 for details. The address and data are
latched on the rising edge of WE#. Write operations are asynchronous; CLK is ignored
(but can be kept active/toggling).
The CUI does not occupy an addressable memory location within any partition. The
system processor must access it at the correct address range, depending on the kind of
command executed. Programming or erasing can occur in only one partition at a time.
Other partitions must be in one of the read modes or erase suspend mode.
Table 18, “Command Codes and Descriptions” on page 51 shows the available
commands. Appendix A, “Write State Machine” on page 86 provides information about
moving between different operating modes using CUI commands.
9.2
Flash Device Commands
The flash device on-chip WSM manages erase and program algorithms. This local CPU
(WSM) controls the flash device in-system read, program, and erase operations. Bus
cycles to or from the flash memory device conform to standard microprocessor bus
cycles. The RST#, CE#, OE#, WE#, and ADV# control signals dictate data flow into and
out of the flash device. WAIT informs the CPU of valid data during burst reads.
Table 17, “Bus Operations Summary” on page 48 summarizes bus operations.
To select flash device operations, write specific commands into the flash device CUI.
Table 18, “Command Codes and Descriptions” on page 51 lists all possible command
codes and descriptions. Table 19, “Bus Cycle Definitions” on page 52 lists command
definitions. Because commands are partition-specific, you must issue write commands
within the target address range.
Datasheet
50
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 18: Command Codes and Descriptions (Sheet 1 of 2)
Operation
Code
Flash Device
Command
Description
FFh
Read Array
Places the selected partition in read-array mode.
70h
Read Status
Register
Places the selected partition in status register read mode. The partition enters
this mode after a Program or Erase command is issued to it.
90h
Read Identifier
Places the selected partition in read identifier mode. Flash device reads from
partition addresses output the manufacturer/device codes, configuration register
data, block lock status, or protection register data on D[15:0].
98h
Read Query
Places the addressed partition in read query mode. Flash device reads from the
partition addresses output the CFI information on D[7:0].
50h
Clear Status
Register
The WSM can set the block lock (SR[1]), VPP (SR[3]), program (SR[4]), and
erase (SR[5]) status bits of the status register, but WSM cannot clear these bits.
SR[5:3,1] can be cleared only by a flash device reset or through the Clear Status
Register command.
Read
•
Program
40h
Word Program
Setup
The first cycle of this preferred program command prepares the CUI for a
program operation.
• The second cycle latches the address and data, and executes the WSM
program algorithm at this location.
Status register updates occur when CE# or OE# is toggled. After programming,
use a Read Array command to read the array data.
10h
Alternate
Setup
Equivalent to a Program Setup command (40h).
30h
EFP Setup
This program command activates EFP mode.
• The first write cycle sets up the command.
• If the second cycle is an EFP Confirm command (D0h), subsequent writes
provide program data.
All other commands are ignored after EFP mode begins.
D0h
EFP Confirm
If the first command was EFP Setup (30h), the CUI latches the address and data,
and prepares the flash device for EFP mode.
20h
Erase Setup
This command prepares the CUI for Block Erase. The flash device erases the
block that the Erase Confirm command addresses. If the next command is not
Erase Confirm, the CUI sets status register bits SR[5:4] to indicate a command
sequence error, and places the partition in the read status register mode.
D0h
Erase Confirm
If the first command was Erase Setup (20h), the CUI latches the address and
data, and erases the block indicated by the erase confirm cycle address. During
program or erase, the partition responds only to Read Status Register, Program
Suspend, and Erase Suspend commands. CE# or OE# toggle updates the status
register data.
B0h
Program
Suspend or
Erase Suspend
This command, issued at any flash device address, suspends the currently
executing program or erase operation. Status register data indicates that the
operation was successfully suspended if SR[2] (program suspend) or SR[6]
(erase suspend) and SR[7] are set. The WSM remains in the suspended state
regardless of the control signal states (except RST#).
D0h
Suspend
Resume
This command, issued at any flash device address, resumes the suspended
program or erase operation.
60h
Lock Setup
This command prepares the CUI lock configuration. If the next command is not
Lock Block, Unlock Block, or Lock-Down, the CUI sets SR[5:4] to indicate a
command sequence error.
01h
Lock Block
If the previous command was Lock Setup (60h), the CUI locks the addressed
block.
D0h
Unlock Block
If the previous command was Lock Setup (60h), the CUI latches the address and
unlocks the addressed block. If previously locked-down, the operation has no
effect.
2Fh
Lock-Down
If the previous command was Lock Setup (60h), the CUI latches the address and
locks-down the addressed block.
Erase
Suspend
Block Locking
November 2007
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Datasheet
51
Numonyx™ Wireless Flash Memory (W30)
Table 18: Command Codes and Descriptions (Sheet 2 of 2)
Operation
Protection
Code
Description
C0h
Protection
Program
Setup
This command prepares the CUI for a protection register program operation. The
second cycle latches address and data, and starts the WSM protection register
program or lock algorithm. Toggling CE# or OE# updates the flash device status
register data. To read array data after programming, issue a Read Array
command.
60h
Configuration
Setup
This command prepares the CUI for flash device configuration. If Set
Configuration Register is not the next command, the CUI sets SR[5:4] to indicate
a command sequence error.
03h
Set
Configuration
Register
If the previous command was Configuration Setup (60h), the CUI latches the
address and writes the data from A[15:0] into the configuration register.
Subsequent read operations access the array data.
Configuration
Note:
Flash Device
Command
Do not use unassigned commands. Numonyx reserves the right to redefine these codes for future functions.
Table 19: Bus Cycle Definitions
Operation
Read
Command
Lock
Datasheet
52
First Bus Cycle
Second Bus Cycle
Oper
Addr1
Data2,3
Oper
Addr1
Data 2,3
Read Array/Reset
>1
Write
PnA
FFh
Read
Read
Address
Array
Data
Read Identifier
>2
Write
PnA
90h
Read
PBA+IA
IC
Read Query
>2
Write
PnA
98h
Read
PBA+QA
QD
2
Write
PnA
70h
Read
PnA
SRD
BA
D0h
Read Status Register
Program
and
Erase
Bus
Cycles
Clear Status Register
1
Write
XX
50h
Block Erase
2
Write
BA
20h
Write
Word Program
2
Write
WA
40h/10h
Write
WA
WD
>2
Write
WA
30h
Write
WA
D0h
Program/Erase Suspend
1
Write
XX
B0h
Program/Erase Resume
1
Write
XX
D0h
Lock Block
2
Write
BA
60h
Write
BA
01h
Unlock Block
2
Write
BA
60h
Write
BA
D0h
Lock-Down Block
2
Write
BA
60h
Write
BA
2Fh
EFP
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 19: Bus Cycle Definitions
Operation
Bus
Cycles
Command
Protection
Configuration
First Bus Cycle
Second Bus Cycle
Oper
Addr1
Data2,3
Oper
Addr1
Data2,3
Protection Program
2
Write
PA
C0h
Write
PA
PD
Lock Protection Program
2
Write
LPA
C0h
Write
LPA
FFFDh
Set Configuration
Register
2
Write
CD
60h
Write
CD
03h
Notes:
1.
First-cycle command addresses must be the same as the target address of the operation. Examples:
—The first-cycle address for the Read Identifier command must be the same as the Identification code address (IA).
—The first-cycle address for the Word Program command must be the same as the word address (WA) to be
programmed.
—The first-cycle address for the Erase/Program Suspend command must be the same as the address within the block
to be suspended.
XX= Any valid address within the flash device.
IA= Identification code address.
BA= Block Address. Any address within a specific block.
LPA= The Lock Protection Address is obtained from the CFI (through the Read Query command). The W30 flash
memory device family LPA is at 0080h.
PA= User programmable 4-word protection address.
PnA= Any address within a specific partition.
PBA= Partition Base Address. The first address of a particular partition.
QA= Query code address.
WA= Word address of memory location to be written.
2.
SRD= Status register data.
WD= Data to be written at location WA.
IC= Identifier code data.
PD= User programmable 4-word protection data.
QD= Query code data on D[7:0].
CD= Configuration register code data presented on flash device addresses A[15:0]. A[MAX:16] address bits can
select any partition. See Table 27, “Read Configuration Register Definitions” on page 79 for
configuration
register bits descriptions.
3.
Do not use commands other than those shown above. Other commands are reserved by Numonyx for future flash
device implementations.
9.3
Command Sequencing
When issuing a 2-cycle write sequence to the flash device, a read operation can occur
between the two write cycles. The setup phase of a 2-cycle write sequence places the
addressed partition into read-status mode, so if the same partition is read before the
second confirm write cycle is issued, status register data is returned. Reads from other
partitions, however, can return actual array data, if the addressed partition is already in
read-array mode. Figure 25 and Figure 26 illustrate these two conditions.
Figure 25: Normal Write and Read Cycles
Address [A]
Partition A
Partition A
Partition A
WE# [W]
OE# [G]
Data [Q]
November 2007
Order Number: 290702-13
20h
D0h
FFh
Block Erase Setup
Block Erase Conf irm
Read Array
Datasheet
53
Numonyx™ Wireless Flash Memory (W30)
Figure 26: Interleaving a 2-Cycle Write Sequence with an Array Read
Address [A]
Partition B
Partition A
Partition B
Partition A
WE# [W]
OE# [G]
Data [Q]
FFh
20h
Array Data
D0h
Read Array
Erase Setup
Bus Read
Erase Conf irm
By contrast, a write bus cycle must not interrupt a 2-cycle write sequence. Such an
interruption causes a command sequence error to appear in the status register.
Figure 27 illustrates a command sequence error.
Figure 27: Improper Command Sequencing
Address [A]
Partiti on X
Partitio n Y
Parti tion X
Partition X
WE# [W]
OE# [G]
Data [D/Q]
Datasheet
54
20h
FFh
D0h
SR Data
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
10.0
Read Operations
10.1
Read Array
The Read Array command places (or resets) the partition in read-array mode and is
used to read data from the flash memory array. Upon initial flash device power-up, or
after reset (RST# transitions from VIL to VIH), all partitions default to asynchronous
read-array mode.
To read array data from the flash device:
1. Write the Read Array command (FFh) to the CUI and specify the desired word
address.
1. Read from that address.
Note:
If a partition is already in read-array mode, you do not need to issue the Read Array
command to read from that partition.
If the Read Array command is written to a partition that is erasing or programming, the
flash device presents invalid data on the bus until the program or erase operation
completes.
After the program or erase finishes in that partition, valid array data can then be read.
If an Erase Suspend or Program Suspend command suspends the WSM, a subsequent
Read Array command places the addressed partition in read-array mode.
The Read Array command functions independently of VPP.
10.2
Read Device ID
The read identifier mode outputs the manufacturer/device identifier, block lock status,
protection register codes, and configuration register data. The identifier information is
contained within a separate memory space on the flash device, and can be accessed
along the 4-Mbit partition address range supplied by the Read Identifier command
(90h) address. Reads from addresses in Table 20 retrieve ID information. Issuing a
Read Identifier command to a partition that is programming or erasing places the
outputs of that partition in read ID mode while the partition continues to program or
erase in the background.
Table 20: Flash Device Identification Codes (Sheet 1 of 2)
Address1
Item
Manufacturer ID
Device ID
Block Lock Status (2)
November 2007
Order Number: 290702-13
Data
Base
Offset
Partition
00h
Partition
Block
01h
02h
Description
0089h
Numonyx
8852h
32-Mbit TPD
8853h
32-Mbit BPD
8854h
64-Mbit TPD
8855h
64-Mbit BPD
8856h
128-Mbit TPD
8857h
128-Mbit BPD
D0 = 0
Block is unlocked
D0 = 1
Block is locked
Datasheet
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Numonyx™ Wireless Flash Memory (W30)
Table 20: Flash Device Identification Codes (Sheet 2 of 2)
Address1
Item
Data
Base
Offset
Block
02h
Configuration Register
Partition
05h
Register Data
Protection Register Lock Status
Partition
80h
Lock Data
Protection Register
Partition
81h - 88h
Register Data
Block Lock-Down Status(2)
Description
D1 = 0
Block is not locked-down
D1 = 1
Block is locked down
Multiple reads required to read the
entire 128-bit Protection Register.
Notes:
1.
The address is constructed from a base address plus an offset. For example, to read the Block Lock Status for block
number 38 in a BPD, set the address to the BBA (0F8000h) plus the offset (02h), which in this example is 0F8002h.
Then examine bit 0 of the data to determine whether the block is locked.
2.
See Section 13.1.4, “Block Lock Status” on page 73 for valid lock status.
10.3
Read Query (CFI)
The W30 flash memory device contains a separate CFI query database that acts as an
on-chip datasheet. To access the CFI information within the W30 flash memory device,
issue the Read Query command and supply a specific address.
The address is constructed from the base address of a partition plus a particular offset
corresponding to the desired CFI field.
Appendix B, “Common Flash Interface” on page 89 shows accessible CFI fields and
their address offsets. Issuing the Read Query command to a partition that is
programming or erasing puts that partition in read query mode while the partition
continues to program or erase in the background.
10.4
Read Status Register
The flash device status register displays program and erase operation status. The
status of a partition can be read after writing the Read Status Register command to any
location within the address range of that partition. Read-status mode is the default
read mode following a Program, Erase, or Lock Block command sequence. Subsequent
single reads from that partition return the partition status until another valid command
is written.
The read-status mode supports single synchronous and single asynchronous reads
only; it does not support burst reads.
The first falling edge of OE# or CE# latches and updates Status Register data. The
operation does not affect the modes of other partitions. Because the Status Register is
8 bits wide, only DQ [7:0] contain valid status register data; DQ [15:8] contain zeros.
See Table 21, “Status Register Definitions” on page 57 and Table 22, “Status Register
Descriptions” on page 57.
Each 4-Mbit partition contains its own status register. Bits SR[6:0] are unique to each
partition, but SR[7], the Device WSM Status (DWS) bit, pertains to the entire flash
memory device. SR[7] provides the program and erase status of the entire flash
device. By contrast, the Partition WSM Status (PWS) bit, SR[0], provides program and
erase status of the addressed partition only. Status register bits SR[6:1] present
information about partition-specific program, erase, suspend, VPP, and block-lock
states. Table 23, “Status Register Device WSM and Partition Write Status Description”
on page 57 describes the DWS (SR[7]) and PWS (SR[0]) combinations.
Datasheet
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November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 21: Status Register Definitions
DWS
ESS
ES
PS
VPPS
PSS
DPS
PWS
7
6
5
4
3
2
1
0
Table 22: Status Register Descriptions
Bit
Name
State
7
DWS
Device WSM Status
6
ESS
Erase Suspend Status
5
ES
Erase Status
4
PS
Program Status
3
VPPS
VPP Status
2
PSS
Program Suspend
Status
1
Description
•
0
0 = Device WSM is Busy
1 = Device WSM is Ready
SR[7] indicates erase or program completion in
the flash device.
• SR[6:1] are invalid while SR[7] = 0.
See Table 23 for valid SR[7] and SR[0]
combinations.
0 = Erase in progress/completed
1 = Erase suspended
After issuing an Erase Suspend command, the WSM
halts and sets SR[7] and SR[6]. SR[6] remains set
until the flash device receives an Erase Resume
command.
0 = Erase successful
1 = Erase error
•
•
SR[5] is set if an attempted erase failed.
A Command Sequence Error is indicated when
SR[7,5:4] are set.
0 = Program successful
1 = Program error
SR[4] is set if the WSM failed to program a word.
0 = VPP OK
1 = VPP low detect, operation aborted
The WSM indicates the VPP level after program or erase
completes.
SR[3] does not provide continuous VPP feedback and is
not guaranteed when VPP≠VPPL/VPPH
0 = Program in progress/completed
1 = Program suspended
After receiving a Program Suspend command, the
WSM halts execution and sets SR[7] and SR[2]. These
bits remain set until a Resume command is received.
DPS
Device Protect Status
0 = Unlocked
1 = Aborted erase/program attempt on
a locked block
If an erase or program operation is attempted to a
locked block (if WP# = VIL), the WSM sets SR[1] and
aborts the operation.
PWS
Partition Write Status
0 = This partition is busy, but only if
SR[7]=0
1 = Another partition is busy, but only
if SR[7]=0
The addressed partition is erasing or programming. In
EFP mode, SR[0] indicates that a data-stream word
has finished programming or verifying, depending on
the particular EFP phase.
See Table 23 for valid SR[7] and SR[0]
combinations.
Table 23: Status Register Device WSM and Partition Write Status Description
DWS
(SR[7])
PWS
(SR[0])
0
0
The addressed partition is performing a program/erase operation.
EFP: the flash device has finished programming or verifying data, or is ready for data.
0
1
A partition other than the one currently addressed is performing a program/erase operation.
EFP: the flash device is either programming or verifying data.
1
0
No program/erase operation is in progress in any partition. Erase and Program suspend bits (SR[6,2])
indicate whether other partitions are suspended.
EFP: the flash device has exited EFP mode.
1
1
Does not occur in standard program or erase modes.
EFP: this combination does not occur.
Description
November 2007
Order Number: 290702-13
Datasheet
57
Numonyx™ Wireless Flash Memory (W30)
10.5
Clear Status Register
The Clear Status Register command clears the status register and leaves all partition
output states unchanged. The WSM can set all status register bits and clear bits
SR[7:6,2,0]. Because bits SR[5,4,3,1] indicate various error conditions, they can be
cleared only by the Clear Status Register command. By allowing system software to
reset these bits, several operations (such as cumulatively programming several
addresses or erasing multiple blocks in sequence) can be performed before reading the
status register to determine whether an error occurred.
If an error is detected, the Status Register must be cleared before beginning another
command or sequence. Flash device reset (RST# = VIL ) also clears the status register.
This command functions independently of VPP.
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November 2007
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Numonyx™ Wireless Flash Memory (W30)
11.0
Program Operations
11.1
Word Program
When the Word Program command is issued, the WSM executes a sequence of
internally timed events to program a word at the desired address, and to verify that the
bits are sufficiently programmed. Programming the flash memory array changes
specifically addressed bits to 0; 1 bits do not change the memory cell contents.
Programming can occur in only one partition at a time. All other partitions must be in
either a read mode or erase suspend mode. Only one partition can be in erase suspend
mode at a time.
To examine the status register can be examined for program progress, read any
address within the partition that is busy programming. However, while most status
register bits are partition-specific, the Device WSM Status bit, SR[7], is device-specific.
That is, if the status register is read from any other partition, SR[7] indicates the
program status of the entire flash memory device. This status bit permits the system
CPU to monitor the program progress while reading the status of other partitions.
CE# or OE# toggle (during polling) updates the status register. Several commands can
be issued to a partition that is programming: Read Status Register, Program Suspend,
Read Identifier, and Read Query. The Read Array command can also be issued, but the
read data is indeterminate.
After programming completes, three status register bits can signify various possible
error conditions:
• SR[4] indicates a program failure if set.
• If SR[3] is set, the WSM could not execute the Word Program command, because VPP
was outside the acceptable limits.
• If SR[1] is set, the program was aborted, because the WSM attempted to program
a locked block.
After the status register data is examined, clear it using the Clear Status Register
command before issuing a new command. The partition remains in status register
mode until another command is written to that partition. Any command can be issued
after the status register indicates program completion.
If CE# is deasserted while the flash device is programming, the flash devices do not
enter standby mode until the program operation completes.
November 2007
Order Number: 290702-13
Datasheet
59
Numonyx™ Wireless Flash Memory (W30)
Figure 28: Word Program Flowchart
WORD PROGRAM PROCEDURE
Bus
Command
Operation
Start
Write 40h,
Word Address
Write
Program
Setup
Data = 40h
Addr = Location to program (WA)
Write
Data
Data = Data to program (WD)
Addr = Location to program (WA)
Write Data
Word Address
Read
Suspend
Program
Loop
Read Status
Register
No
SR[7] =
0
Suspend
Program
Comments
Standby
Read SRD
Toggle CE# or OE# to update SRD
Check SR[7]
1 = WSM ready
0 = WSM busy
Yes
1
Repeat for subsequent programming operations.
Full status register check can be done after each program or
after a sequence of program operations.
Full Program
Status Check
(if desired)
Program
Complete
FULL PROGRAM STATUS CHECK PROCEDURE
Read Status
Register
SR[3] =
Bus
Command
Operation
1
SR[4] =
1
Program
Error
1
Device
Protect Error
0
SR[1] =
0
Program
Successful
11.2
Standby
Check SR[3]
1 = VPP error
Standby
Check SR[4]
1 = Data program error
Standby
Check SR[1]
1 = Attempted program to locked block
Program aborted
VPP Range
Error
0
Comments
SR[3] MUST be cleared before the WSM will allow further
program attempts
Only the Clear Staus Register command clears SR[4:3,1].
If an error is detected, clear the status register before
attempting a program retry or other error recovery.
Factory Programming
The standard factory programming mode uses the same commands and algorithm as
the Word Program mode (40h/10h). When VPP is at VPPL, program and erase currents
are drawn through VCC. If VPP is driven by a logic signal, VPPL must remain above the
VPPLMin value to perform in-system flash memory modifications. When VPP is
connected to a 12 V power supply, the flash device draws program and erase current
directly from VPP, which eliminates the need for an external switching transistor to
control the VPP voltage.
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Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 37, “Examples of VPP Power Supply Configurations” on page 78 shows examples
of flash device power supply usage in various configurations.
The 12-V VPP mode enhances programming performance during the short time period
typically found in manufacturing processes. However, this mode is not intended for
extended use.12 V can be applied to VPP during program and erase operations as
specified in Section 5.2, “Operating Conditions” on page 24. VPP can be connected to
12 V for a total of tPPH hours maximum. Stressing the flash device beyond these limits
might cause permanent damage.
11.3
Enhanced Factory Program (EFP)
EFP substantially improves flash device programming performance through a number
of enhancements to the conventional 12-Volt word program algorithm. The more
efficient WSM algorithm in EFP eliminates the traditional overhead delays of the
conventional word program mode in both the host programming system and the flash
device. Changes to the conventional word programming flowchart and internal WSM
routine were developed because of today's beat-rate-sensitive manufacturing
environments; a balance between programming speed and cycling performance was
attained.
The host programmer writes data to the flash device and checks the Status Register to
determine when the data has completed programming. This modification cuts write bus
cycles approximately in half.
• Following each internal program pulse, the WSM increments the flash device
address to the next physical location.
• Programming equipment can then sequentially stream program data throughout an
entire block without having to setup and present each new address.
In combination, these enhancements reduce much of the host programmer overhead,
enabling more of a data streaming approach to flash device programming.
EFP further speeds up programming by performing internal code verification. With this
feature, PROM programmers can rely on the flash device to verify that it has been
programmed properly. From the flash device side, EFP streamlines internal overhead by
eliminating the delays previously associated with switching voltages between
programming and verify levels at each memory-word location.
EFP consists of four phases: setup, program, verify, and exit. Refer to Figure 29,
“Enhanced Factory Program Flowchart” on page 64 for a detailed graphical
representation of how to implement EFP.
11.3.1
EFP Requirements and Considerations
Table 24: EFP Requirements and Considerations
EFP Requirements
EFP Considerations
Ambient temperature: TA = 25 °C ±5 °C
Block cycling below 100 erase cycles
VCC within specified operating range
RWW not supported2
VPP within specified VPPH range
EFP programs one block at a time
Target block unlocked
EFP cannot be suspended
1.
2.
1
Recommended for optimum performance. Some degradation in performance might occur if this limit is exceeded, but the
internal algorithm will continue to work properly.
Code or data cannot be read from another partition during EFP.
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Numonyx™ Wireless Flash Memory (W30)
11.3.2
Setup
After receiving the EFP Setup (30h) and EFP Confirm (D0h) command sequence, SR[7]
transitions from a 1 to a 0, indicating that the WSM is busy with EFP algorithm startup.
A delay before checking SR[7] is required to allow the WSM time to perform all of its
setups and checks (VPP level and block lock status). If an error is detected, status
register bits SR[4], SR[3], and/or SR[1] are set, and the EFP operation terminates.
Note:
After the EFP Setup and Confirm command sequence, reads from the flash device
automatically output status register data. Do not issue the Read Status Register
command, because this command is interpreted as data to program at WA0.
11.3.3
Program
After setup completion, the host programming system must check SR[0] to determine
the data-stream ready status (SR[0]=0). Each subsequent write after this check is a
program-data write to the flash memory array. Each cell within the memory word to be
programmed to 0 receives one WSM pulse; additional pulses, if required, occur in the
verify phase.
SR[0]=1 indicates that the WSM is busy applying the program pulse.
The host programmer must poll the flash device status register for the program done
state after each data-stream write.
SR[0]=0 indicates that the appropriate cell(s) within the accessed memory location
have received their single WSM program pulse, and that the flash device is ready
for the next word.
Although the host can check full status for errors at any time, this check is necessary
only on a block basis, after EFP exit.
Addresses must remain within the target block. Supplying an address outside of the
target block immediately terminates the program phase; the WSM then enters the EFP
verify phase.
The address can either remain constant or increment. The flash device compares the
incoming address to the address stored from the setup phase (WA0).
• If the addresses match, the WSM programs the new data word at the next
sequential memory location.
• If the addresses differ, the WSM jumps to the new address location.
The program phase concludes when the host programming system writes to a different
block address. The data supplied must be FFFFh. Upon program phase completion, the
flash device enters the EFP verify phase.
11.3.4
Verify
A high percentage of the flash memory bits program on the first WSM pulse. However,
EFP internal verification identifies cells that do not completely program on their first
attempt, and applies additional pulses as required.
The verify phase is identical in flow to the program phase, except that instead of
programming incoming data, the WSM compares the verify-stream data to the data
that was previously programmed into the block.
• If the data compares correctly, the host programmer proceeds to the next word.
• If the data does not match, the host waits while the WSM applies one or more
additional pulses.
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The host programmer must reset its initial verify-word address to the same starting
location supplied during the program phase. It then reissues each data word in the
same order as during the program phase. Like programming, the host can write each
subsequent data word to WA0 or it can increment through the block addresses.
The verification phase concludes when the interfacing programmer writes to a different
block address. The data supplied must be FFFFh. Upon completion of the verify phase,
the flash device enters the EFP exit phase.
11.3.5
Exit
SR[7]=1 indicates that the flash device has returned to normal operating conditions.
Perform a full status check at this time, to verify that the entire block programmed
successfully. After EFP exit, any valid CUI command can be issued.
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Numonyx™ Wireless Flash Memory (W30)
Figure 29: Enhanced Factory Program Flowchart
ENHANCED FACTORY PROGRAMMING PROCEDURE
EFP Setup
EFP Program
EFP Verify
EFP Exit
Start
Read
Status Register
Read
Status Register
Read
Status Register
SR[0]=1=N
Write 30h
Address = WA0
S R [0 ] = 1 = N
Write D0h
Address = WA0
Read
Status Register
EFP Setup
Done?
S R [7 ] = 0 = Y
EFP setup time
SR[0]=1=N Verify Stream
Ready?
Data Stream
Ready?
SR[7]=1=Y
Write Data
Address = WA0
Write Data
Address = WA0
Full Status Check
Procedure
Read
Status Register
Read
Status Register
Operation
Complete
Verify
Done?
SR[0]=0=Y
SR[0]=0=Y
N
Last
Data?
Last
Data?
Y
SR[7]=1=N
Check VPP & Lock
errors (SR[3,1])
EFP
Exited?
SR[0] =0=Y
Program
Done?
N
SR[7]=0=N
SR[0] =0=Y
S R [0 ] = 1 = N
VPP = 12V
Unlock Block
Y
Write FFFFh
Address ≠ BBA
Write FFFFh
Address ≠ BBA
Exit
EFP Setup
Bus
State
Comments
Write
Unlock
Block
VPP = 12V
Unlock block
Write
EFP
Setup
Data = 30h
Address = WA0
Write
EFP
Data = D0h
Confirm Address = WA0
Standby
EFP setup time
Read
Standby
EFP
Setup
Done?
Status Register
Check SR[7]
0 = EFP ready
1 = EFP not ready
If SR[7] = 1:
Error
Check SR[3,1]
Standby Condition
SR[3] = 1 = VPP error
Check
SR[1] = 1 = locked block
EFP Program
Bus
State
Comments
Read
Status Register
EFP Verify
Bus
State
Comments
Read
Status Register
Data
Check SR[0]
Standby Stream 0 = Ready for data
Ready? 1 = Not ready for data
Verify Check SR[0]
Standby Stream 0 = Ready for verify
Ready? 1 = Not ready for verify
Write
(note 1)
Write
(note 2)
Data = Data to program
Address = WA0
Read
Status Register
Check SR[0]
Program
Standby
0 = Program done
Done?
1 = Program not done
Standby
Write
Last
Data?
Device automatically
increments address.
Exit
Data = FFFFh
Program Address not within same
Phase BBA
Data = Word to verify
Address = WA0
Read
Status Register
Standby
(note 3)
Verify
Done?
Check SR[0]
0 = Verify done
1 = Verify not done
Standby
Last
Data?
Device automatically
increments address.
Write
Exit
Verify
Phase
Data = FFFFh
Address not within same
BBA
EFP Exit
1. WA0 = first Word Address to be programmed within the target block. The BBA (Block Base
Read
Status Register
Address) must remain constant throughout the program phase data stream; WA can be held
Check SR[7]
constant at the first address location, or it can be written to sequence up through the addresses
EFP
0 = Exit not finished
Standby
within the block. Writing to a BBA not equal to that of the block currently being written to
Exited?
1 = Exit completed
terminates the EFP program phase, and instructs the device to enter the EFP verify phase.
2. For proper verification to occur, the verify data stream must be presented to the device in the
Repeat for subsequent operations.
same sequence as that of the program phase data stream. Writing to a BBA not equal to
WA
After EFP exit, a Full Status Check can
terminates the EFP verify phase, and instructs the device to exit EFP
.
determine if any program error occurred.
3. Bits that did not fully program with the single WSM pulse of the EFP program phase receive
additional program-pulse attempts during the EFP verify phase. The device will report any
program failure by setting SR[4]=1; this check can be performed during the full status check afterSee the Full Status Check procedure in the
Word Program flowchart.
EFP has been exited for that block, and will indicate any error within the entire data stream.
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Numonyx™ Wireless Flash Memory (W30)
12.0
Program and Erase Operations
12.1
Program/Erase Suspend and Resume
The Program Suspend and Erase Suspend commands halt an in-progress program or
erase operation. The command can be issued at any flash device address. The partition
corresponding to the address of the command remains in its previous state. A suspend
command allows data to be accessed from memory locations other than the location
being programmed or the block being erased.
• A program operation can be suspended only to perform a read operation.
• An erase operation can be suspended to perform either a program or a read
operation within any block, except the block that is erase suspended.
• A program command nested within a suspended erase can subsequently be
suspended to read yet another location.
Once a program or erase process starts, the Suspend command requests that the WSM
suspends the program or erase sequence at predetermined points in the algorithm. The
partition that is actually suspended continues to output status register data after the
Suspend command is written. An operation is suspended when status bits SR[7] and
SR[6] and/or SR[2] are set.
To read data from blocks within the partition (other than an erase-suspended block),
write a Read Array command. Block erase cannot resume until the program operations
initiated during erase suspend are complete.
• Read Array, Read Status Register, Read Identifier (ID), Read Query, and Program
Resume are valid commands during Program or Erase Suspend.
• Additionally, Clear Status Register, Program, Program Suspend, Erase Resume,
Lock Block, Unlock Block, and Lock-Down Block are valid commands during erase
suspend.
To read data from a block in a partition that is not programming or erasing, the
operation does not need to be suspended.
• If the other partition is already in read array, ID, or Query mode, issuing a valid
address returns corresponding data.
• If the other partition is not in a read mode, one of the read commands must be
issued to the partition before data can be read.
During a suspend, CE# = VIH places the flash device in standby state, which reduces
active current. VPP must remain at its program level and WP# must remain unchanged
while in suspend mode.
A resume command instructs the WSM to continue programming or erasing, and clears
status register bits SR[2] (or SR[6]) and SR[7]. The Resume command can be written
to any partition. When read at the partition that is programming or erasing, the flash
device outputs data corresponding to the last mode for that partition. If the status
register error bits are set, the status register can be cleared before issuing the next
instruction. RST# must remain at VIH. See Figure 30, “Program Suspend / Resume
Flowchart” on page 66, and Figure 31, “Erase Suspend / Resume Flowchart” on
page 67.
If a suspended partition was placed in Read Array, Read Status Register, Read Identifier
(ID), or Read Query during the suspend, the flash device remains in that mode, and
outputs data corresponding to that mode after the program or erase operation
resumes.
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After resuming a suspended operation, issue the read command appropriate to the
read operation. To read status after resuming a suspended operation, issue a Read
Status Register command (70h) to return the suspended partition to status mode.
Figure 30: Program Suspend / Resume Flowchart
PROGRAM SUSPEND / RESUME PROCEDURE
Bus
Command
Operation
Start
Write
Write B0h
Any Address
Write
Write 70h
Same Partition
SR[7] =
Read
Status
0
Standby
Check SR[7]
1 = WSM ready
0 = WSM busy
Standby
Check SR[2]
1 = Program suspended
0 = Program completed
1
SR[2] =
0
Program
Completed
1
Write
Write FFh
Susp Partition
Read
Array
Done
Reading
Write
Data = FFh
Addr = Any device address (except word
being programmed)
Read array data from block other than
the one being programmed
Read
Read Array
Data
Data = 70h
Addr = Any address in same partition
Read SRD
Toggle CE# or OE# to update SRD
Addr = Any address in same partition
Read
Read Status
Register
Comments
Data = B0h
Program
Addr = Any address within programming
Suspend
partition
Program
Resume
Data = D0h
Addr = any device address
If the suspended partition was placed in Read Array mode:
No
Write
Yes
Write D0h
Any Address
Write FFh
Pgm'd Partition
Program
Resumed
Read Array
Data
Read
Status
Return partition to status mode:
Data = 70h
Addr = address within same partition
Write 70h
Same Partition
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Numonyx™ Wireless Flash Memory (W30)
Figure 31: Erase Suspend / Resume Flowchart
ERASE SUSPEND / RESUME PROCEDURE
Bus
Command
Operation
Start
Write B0h
Any Address
Write
Erase
Suspend
Write
Read
Status
Write 70h
Same Partition
Read Status
Register
SR[6] =
1
Read
Read Array
Data
Read or
Program?
No
Check SR[7]
1 = WSM ready
0 = WSM busy
Standby
Check SR[6]
1 = Erase suspended
0 = Erase completed
Write
Data = FFh or 40h
Read Array
Addr = Any device address (except
or Program
block being erased)
Erase
Completed
0
Read or
Write
Program
Program
Loop
Data = 70h
Addr = Any address in same partition
Standby
0
1
Data = B0h
Addr = Any address
Read SRD
Toggle CE# or OE# to update SRD
Addr = Any address in same partition
Read
SR[7] =
Comments
Write
Read array or program data from/to
block other than the one being erased
Erase
Resume
Data = D0h
Addr = Any address
If the suspended partition was placed in
Read Array mode or a Program Loop:
Done?
Yes
Write D0h
Any Address
Write FFh
Erased Partition
Erase Resumed
Read Array
Data
Write
Read
Status
Return partition to status mode:
Data = 70h
Addr = Address within same partition
Write 70h
Same Partition
12.2
Block Erase
The 2-cycle block erase command sequence, consisting of Erase Setup (20h) and Erase
Confirm (D0h), initiates one block erase at the addressed block. Only one partition can
be in an erase mode at a time; other partitions must be in a read mode. The Erase
Confirm command internally latches the address of the block to erase. Erase forces all
bits within the block to 1.
SR[7] is cleared while the erase executes.
After writing the Erase Confirm command, the selected partition is placed in read status
register mode. Reads performed to that partition return the current status data. The
address given during the Erase Confirm command does not need to be the same
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address used in the Erase Setup command. For example, if the Erase Confirm
command is given to partition B, then the selected block in partition B is erased, even if
the Erase Setup command was to partition A.
The 2-cycle erase sequence cannot be interrupted with a bus write operation. For
example, to execute properly, an Erase Setup command must be immediately followed
by the Erase Confirm command. If a different command is issued between the setup
and confirm commands, the following occurs:
• The partition is placed in read-status mode.
• The status register signals a command sequence error.
• All subsequent erase commands to that partition are ignored until the status
register is cleared.
To detect block erase completion, the CPU analyzes SR[7] of that partition. If an error bit
(SR[5,3,1]) was flagged, the status register can be cleared by issuing the Clear Status Register
command before attempting the next operation. The partition remains in read-status
mode until another command is written to its CUI. Any CUI instruction can follow after
erasing completes. The CUI can be set to read-array mode to prevent inadvertent
status register reads.
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Numonyx™ Wireless Flash Memory (W30)
Figure 32: Block Erase Flowchart
BLOCK ERASE PROCEDURE
Bus
Command
Comments
Operation
Block
Data = 20h
Erase
Write
Addr = Block to be erased (BA)
Setup
Start
Write 20h
Block Address
Write
Write D0h and
Block Address
Erase
Confirm
Read
Suspend
Erase
Loop
Read Status
Register
No
SR[7] =
0
Suspend
Erase
1
Standby
Data = D0h
Addr = Block to be erased (BA)
Read SRD
Toggle CE# or OE# to update SRD
Check SR[7]
1 = WSM ready
0 = WSM busy
Yes
Repeat for subsequent block erasures.
Full status register check can be done after each block erase
or after a sequence of block erasures.
Full Erase
Status Check
(if desired)
Block Erase
Complete
FULL ERASE STATUS CHECK PROCEDURE
Read Status
Register
SR[3] =
Bus
Command
Operation
1
VPP Range
Error
0
SR[5:4] =
1
Command
Sequence Error
1
Block Erase
Error
0
SR[5] =
0
SR[1] =
0
Block Erase
Successful
12.3
1
Erase of
Locked Block
Aborted
Comments
Standby
Check SR[3]
1 = VPP error
Standby
Check SR[5:4]
Both 1 = Command sequence error
Standby
Check SR[5]
1 = Block erase error
Check SR[1]
1 = Attempted erase of locked block
Erase aborted
SR[3,1] must be cleared before the WSM will allow further
erase attempts.
Standby
Only the Clear Status Register command clears SR[5:3,1].
If an error is detected, clear the Status register before
attempting an erase retry or other error recovery.
Read-While-Write and Read-While-Erase
The Product Name supports flexible multi-partition dual-operation architecture. By
dividing the flash memory into many separate partitions, the flash device can read from
one partition while programing (Read-While-Write) or erasing (Read-While-Eras) in
another partition. Both of these features greatly enhance data storage performance.
The W30 flash memory device does not support simultaneous program and erase
operations. Attempting to perform operations such as these results in a command
sequence error. Only one partition can be programming or erasing while another
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Numonyx™ Wireless Flash Memory (W30)
partition is reading. However, one partition can be in erase suspend mode while a
second partition is performing a program operation, and yet another partition is
executing a read command. Table 18, “Command Codes and Descriptions” on page 51
describes the command codes available for all functions.
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Numonyx™ Wireless Flash Memory (W30)
13.0
Security Modes
The W30 flash memory device offers both hardware and software security features to
protect the flash memory data.
• To use the software security feature, execute the Lock Block command.
• To use the hardware security feature, execute the Lock-Down Block command and
assert the WP# signal.
Refer to Figure 33, “Block Locking State Diagram” on page 72 for a state diagram of
the flash device security features. Also see Figure 34, “Locking Operations Flowchart”
on page 75.
13.1
Block Lock Operations
Individual instant block locking protects code and data by allowing any block to be
locked or unlocked with no latency. This locking scheme offers two levels of protection:
• Software-only control of block locking (useful for frequently changed data blocks).
• Hardware interaction before locking can be changed (protects infrequently changed
code blocks).
The following sections discuss the locking system operation. The term state [abc]
specifies locking states, such as state [001]. In this syntax:
• a = WP# value.
• b = block lock-down status bit D1.
• c = Block Lock status register bit D0.
Figure 33, “Block Locking State Diagram” on page 72 defines possible locking states.
The following summarizes the locking functionality.
• All blocks power-up in a locked state.
• Unlock commands can unlock these blocks, and lock commands can lock them
again.
• The Lock-Down command locks a block and prevents it from being unlocked when
WP# is asserted.
— Locked-down blocks can be unlocked or locked with commands as long as WP#
is deasserted.
— When WP# is asserted, previously locked-down blocks return to lock-down.
— The lock-down status bit clears only when the flash device is reset or powereddown.
Block lock registers are not affected by the VPP level. These registers can be modified
and read even if VPP < VPPLK.
The locking status of each block can be set to locked, unlocked, and lock-down, as
described in the following sections. See Figure 34, “Locking Operations Flowchart” on
page 75.
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Numonyx™ Wireless Flash Memory (W30)
Figure 33: Block Locking State Diagram
Power-Up/Reset
Locked
[X01]
Locked Down 4,5
[011]
Hardware
Locked 5
[011]
WP# Hardware Control
Unlocked
[X00]
Software
Locked
[111]
Unlocked
[110 ]
Software Block Lock (0x60/0x01) or Software Block Unlock (0x60/0xD0)
Software Block Lock-Down (0x60/0x2F)
WP# hardware control
Notes: 1. [a,b,c] represents [WP#, D1, D0]. X = Don’t Care.
2. D1 indicates block Lock -down status.
- D1 = 0, Lock -down has not been issued to this block .
- D1 = 1, Lock -down has been issued to this block .
3. D0 indicates block lock status.
- D0 = 0, block is unlocked.
- D0 = 1, block is locked.
4. Locked-down = Hardware + Software locked.
5. [011] states should be tracked by system software to determine difference between
Hardware Locked and Locked -Down states.
B5070
13.1.1
Lock
All blocks default to locked (state [x01]) after initial power-up or reset. Locked blocks
are fully protected from alteration. Attempted program or erase operations to a locked
block return an error in SR[1].
• To lock unlocked blocks, use the Lock Block command sequence.
• To change the status of a locked block to unlocked or lock-down, use the
appropriate software commands.
13.1.2
Unlock
Unlocked blocks (states [x00] and [110]) can be programmed or erased. All unlocked
blocks return to the locked state when the flash device is reset or powered-down.
• To change the status of an unlocked block to the locked or locked-down state, use
the appropriate software commands.
• To unlock a locked block, write the Unlock Block command sequence if the block is
not locked-down.
13.1.3
Lock-Down
Locked-down blocks (state [011]) offer an additional level of write protection beyond
the protection of a regular locked block. If a block is locked-down, the software cannot
change the state of the block if WP# is asserted.
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• To lock-down a locked or unlocked block, write the Lock-Down Block command
sequence.
• If a block was set to locked-down, then later changed to unlocked, issue the Lockdown command before asserting WP#, to put that block back in the locked-down
state.
• When WP# is deasserted, locked-down blocks change to the locked state, and can
then be unlocked using the Unlock Block command.
13.1.4
Block Lock Status
The lock status of every block can be read in read identifier mode.
Note:
To enter this mode, issue the Read Identifier command to the flash device.
Subsequent reads at BBA + 02h output the lock status of that block. For example, to
read the block lock status of block 10, the address sent to the flash device must be
50002h (for a top-parameter device).
The lowest two data bits of the read data, DQ1 and DQ0, represent the lock status.
• DQ0 indicates the block lock status. This bit is set using the Lock Block command
and cleared using the Block Unlock command. It is also set when entering the lockdown state.
• DQ1 indicates lock-down status and is set using the Lock-Down command.
The lock-down status bit cannot be cleared by software–only by a flash device reset or
power-down. See Table 25.
Table 25: Write Protection Truth Table
VPP
WP#
RST#
X
X
VIL
Device is inaccessible
VIL
X
VIH
Word program and block erase are prohibited
X
VIL
VIH
All lock-down blocks are locked
X
VIH
VIH
All lock-down blocks can be unlocked
13.1.5
Write Protection
Lock During Erase Suspend
Block lock configurations can be performed during an erase suspend operation, using
the standard locking command sequences to unlock, lock, or lock-down a block. This
feature is useful when another block requires immediate updating.
To change block locking during an erase operation:
1. Write the Erase Suspend command.
2. Check SR[6] to determine that the erase operation has suspended.
3. Write the desired lock command sequence to a block.
The lock status changes.
4. After completing lock, unlock, read, or program operations, resume the erase
operation with the Erase Resume command (D0h).
If a block is locked or locked-down during a suspended erase of the same block, the
locking status bits change immediately. When the erase operation resumes, it
completes normally.
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Locking operations cannot occur during program suspend. Appendix A, “Write State
Machine” on page 86 shows valid commands during erase suspend.
13.1.6
Status Register Error Checking
Using nested locking or program command sequences during erase suspend can
introduce ambiguity into status register results.
Because locking changes require 2-cycle command sequences—for example, 60h
followed by 01h to lock a block—following the Configuration Setup command (60h) with
an invalid command produces a command sequence error (SR[5:4]=11b).
If a Lock Block command error occurs during erase suspend, the flash device sets
SR[4] and SR[5] to 1 even after the erase resumes. When erase is complete, possible
errors during the erase cannot be detected from the status register, because of the
previous locking command error. A similar situation occurs if a program operation error
is nested within an erase suspend.
13.1.7
WP# Lock-Down Control
The Write Protect signal, WP#, adds an additional layer of block security. WP# affects
only blocks that previously had the Lock-Down command written to them.
• After the lock-down status bit is set for a block, asserting WP# forces that block
into the lock-down state [011] and prevents it from being unlocked.
• After WP# is deasserted, the state of the block reverts to locked [111]. Software
commands can then unlock the block (for erase or program operations) and
subsequently re-lock it.
Only flash device reset or power-down can clear the lock-down status bit and render
WP# ineffective.
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Numonyx™ Wireless Flash Memory (W30)
Figure 34: Locking Operations Flowchart
LOCKING OPERATIONS PROCEDURE
Start
Bus
Command
Operation
Write 60h
Block Address
Write
Write 01,D0,2Fh
Block Address
Write
Optional
Write 90h
BBA + 02h
Write
(Optional)
Read Block Lock
Status
Locking
Change?
Lock
Setup
Comments
Data = 60h
Addr = Block to lock/unlock/lock-down (BA)
Lock,
Data = 01h (Lock block)
Unlock, or
D0h (Unlock block)
Lockdown
2Fh (Lockdown block)
Confirm Addr = Block to lock/unlock/lock-down (BA)
Read ID
Plane
Data = 90h
Addr = BBA + 02h
Read
Block Lock Block Lock status data
(Optional)
Status Addr = BBA + 02h
No
Confirm locking change on DQ[1:0].
(See Block Locking State Transitions Table
for valid combinations.)
Standby
(Optional)
Yes
Write FFh
Partition Address
Write
Read
Array
Data = FFh
Addr = Any address in same partition
Lock Change
Complete
13.2
Protection Register
The W30 flash memory device includes a 128-bit Protection Register. This protection
register is used to increase system security and for identification purposes. The
protection register value can match the flash device to the system CPU or ASIC to
prevent flash device substitution.
• The lower 64 bits within the protection register are programmed by Numonyx with
a unique number in each flash device.
• The upper 64 OTP bits within the protection register are left for the customer to
program. Once programmed, the customer segment can be locked to prevent
further programming.
Note:
The individual bits of the user segment of the protection register are OTP, not the
register in total. The user can program each OTP bit individually, one at a time, if
desired. However, after the protection register is locked, the entire user segment is
locked and no more user bits can be programmed.
The protection register shares some of the same internal flash device resources as the
parameter partition. Therefore, RWW is allowed only between the protection register
and the main partitions. Table 26 describes the operations allowed in the protection
register, parameter partition, and main partition during RWW and RWE.
November 2007
Order Number: 290702-13
Datasheet
75
Numonyx™ Wireless Flash Memory (W30)
Table 26: Simultaneous Operations Allowed with the Protection Register
Protection
Register
Parameter
Partition
Array Data
Main
Partitions
Read
See
Description
Write/Erase
While programming or erasing in a main partition, the protection register can
be read from any other partition. Reading the parameter partition data is not
allowed if the protection register is being read from addresses within the
parameter partition.
See
Description
Read
Write/Erase
While programming or erasing in a main partition, read operations are allowed
in the parameter partition. Accessing the protection registers from parameter
partition addresses is not allowed.
Read
Read
Write/Erase
While programming or erasing in a main partition, read operations are allowed
in the parameter partition. Accessing the protection registers is allowed, but
only in a partition that is different from the partition being programmed or
erased, and also different from the parameter partition.
Write
No Access
Allowed
Read
While programming the protection register, reads are allowed only in the other
main partitions. Access to the parameter partition is not allowed, because
programming of the protection register can occur only in the parameter
partition, so that the parameter partition exists in status mode.
No Access
Allowed
Write/Erase
Read
While programming or erasing the parameter partition, reads of the protection
registers are not allowed in any partition. Reads in other main partitions are
supported.
13.2.1
Description
Reading the Protection Register
Writing the Read Identifier command allows the protection register data to be read 16
bits at a time from addresses shown in Table 20, “Flash Device Identification Codes” on
page 55. The protection register is read from the Read Identifier command, and can be
read in any partition.Writing the Read Array command returns the flash device to readarray mode.
13.2.2
Programing the Protection Register
Issue the Protection Program command only at the parameter partition followed by the
data to be programmed at the specified location. This command programs the upper 64
bits of the protection register 16 bits at a time. Table 20, “Flash Device Identification
Codes” on page 55 shows allowable addresses. See also Figure 35, “Protection Register
Programming Flowchart” on page 77. Issuing a Protection Program command outside
the address space of the register results in a status register error (SR[4]=1).
13.2.3
Locking the Protection Register
• PR-LK.0 is programmed to 0 by Numonyx to protect the unique flash device
number.
• PR-LK.1 can be programmed by the user to lock the user portion (upper 64 bits) of
the protection register (See Figure 36, “Protection Register Locking). This bit is set
using the Protection Program command to program a value of FFFDh into PR-LK.
After PR-LK register bits are programmed (locked), the stored values in the protection
register cannot be changed. Protection Program commands written to a locked section
result in a status register error (SR[4]=1, SR[5]=1).
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Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
.
Figure 35: Protection Register Programming Flowchart
PROTECTION REGISTER PROGRAMMINGPROCEDURE
Bus
Command
Comments
Operation
Protection
Data = C0h
Program
Write
Addr = Protection address
Setup
Start
Write C0h
Addr=Prot addr
Write
Write Protect.
Register
Address / Data
Read
Read Status
Register
Standby
SR[7] = 1?
No
Protection Data = Data to program
Program Addr = Protection address
Read SRD
Toggle CE# or OE# to update SRD
Check SR[7]
1 = WSM Ready
0 = WSM Busy
Protection Program operations addresses must be within the
protection register address space. Addresses outside this
space will return an error.
Yes
Repeat for subsequent programming operations.
Full Status
Check
(if desired)
Full status register check can be done after each program or
after a sequence of program operations.
Program
Complete
FULL STATUS CHECK PROCEDURE
Bus
Command
Operation
Read SRD
Standby
SR[4:3] =
1,1
VPP Range Error
Standby
SR[4,1] =
SR[4,1] =
Program
Successful
November 2007
Order Number: 290702-13
1,0
1,1
Programming Error
Locked-Register
Program Aborted
Standby
Comments
SR[1] SR[3] SR[4]
0
1
1 VPP Error
0
0
1
Protection register
program error
1
0
1
Register locked;
Operation aborted
SR[3] MUST be cleared before the WSM will allow further
program attempts.
Only the Clear Staus Register command clears SR[4:3,1].
If an error is detected, clear the status register before
attempting a program retry or other error recovery.
Datasheet
77
Numonyx™ Wireless Flash Memory (W30)
Figure 36: Protection Register Locking
0x88
User-Programmable
0x85
0x84
Intel Factory-Programmed
0x81
PR Lock Register 0
0x80
13.3
15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
VPP Protection
The Product Name provides in-system program and erase at VPPL. For factory
programming, the W30 flash memory device also includes a low-cost, backwardcompatible 12 V programming feature.(See “Factory Programming” on page 60.) The
EFP feature can also be used to greatly improve factory program performance, as
explained in Section 11.3, “Enhanced Factory Program (EFP)” on page 61.
In addition to flexible block locking, holding the VPP programming voltage low can
provide hardware write protection of all flash-device blocks. If VPP is below VPPLK,
program or erase operations result in an error displayed in SR[3]. (See Figure 37.)
Figure 37: Examples of VPP Power Supply Configurations
System supply
12 V supply
VCC
VPP
System supply
Prot# (logic signal)
VCC
VPP
≤ 10K Ω
• 12 V fast programming
• Absolute write protection with V PP ≤ VPPLK
System supply
(Note 1)
12 V supply
VCC
VPP
• Low voltage and 12 V fast programming
Note:
• Low-voltage programming
• Absolute write protection via logic signal
System supply
VCC
VPP
• Low-voltage programming
If the VCC supply can sink adequate current, you can use an appropriately valued resistor.
Datasheet
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November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
14.0
Set Read Configuration Register
The Set Read Configuration Register (RCR) command sets the burst order, frequency
configuration, burst length, and other parameters.
A two-bus cycle command sequence initiates this operation. The read configuration
register data is placed on the lower 16 bits of the address bus (A[15:0]) during both
bus cycles.
1. The Set Read Configuration Register command is written, along with the
configuration data (on the address bus).
2. A second write confirms the operation and again presents the read configuration
register data on the address bus.
3. The read configuration register data is latched on the rising edge of ADV#, CE#, or
WE# (whichever occurs first).
This command functions independently of the applied VPP voltage. After executing this
command, the flash device returns to read-array mode.
To examine the contents of the read configuration register, write the Read Identifier
command and then read location 05h. (See Table 27 and Table 28.)
Table 27: Read Configuration Register Definitions
Read
Mod
e
Res’d
First Access
Latency Count
WAIT
Polarit
y
Data
Outpu
t
Config
WAI
T
Confi
g
Burs
t Seq
Cloc
k
Confi
g
Res’
d
Res’
d
Burs
t
Wra
p
Burst Length
RM
R
LC2
LC1
LC0
WP
DOC
WC
BS
CC
R
R
BW
BL2
BL1
BL0
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Table 28: Read Configuration Register Descriptions (Sheet 1 of 2)
Description1
Bit
Name
15
RM
Read Mode
14
R
13-11
LC[2:0]
First Access Latency
Count
001 = Reserved
010 = Code 2
011 = Code 3
10
WP
WAIT Signal Polarity
0 = WAIT signal is asserted low
1 = WAIT signal is asserted high (Default)
3
9
DOC
Data Output Configuration
0 = Hold Data for One Clock
1 = Hold Data for Two Clock (Default)
6
8
WC
WAIT Configuration
0 = WAIT Asserted During Delay
1 = WAIT Asserted One Data Cycle before Delay (Default)
6
7
BS
Burst Sequence
6
CC
Clock
Configuration
5
R
Reserved
5
4
R
Reserved
5
November 2007
Order Number: 290702-13
0 = Synchronous Burst Reads Enabled
1 = Asynchronous Reads Enabled (Default)
Notes
2,6
5
Reserved
100 = Code 4
101 = Code 5
111 = Reserved (Default)
6
1 = Linear Burst Order (Default)
0 = Burst Starts and Data Output on Falling Clock Edge
1 = Burst Starts and Data Output on Rising Clock Edge (Default)
Datasheet
79
Numonyx™ Wireless Flash Memory (W30)
Table 28: Read Configuration Register Descriptions (Sheet 2 of 2)
Description1
Bit
Name
3
BW
Burst Wrap
2-0
BL[2:0]
Burst Length
Notes
0 = Wrap bursts within burst length set by CR[2:0]
1 = Don’t wrap accesses within burst length set by CR[2:0].(Default)
001
010
011
111
=
=
=
=
4-Word Burst
8-Word Burst
16-Word Burst (Available on the 130 nm lithography)
Continuous Burst (Default)
4
Notes:
1.
Undocumented combinations of bits are reserved by Numonyx for future implementations.
2.
Synchronous and page read mode configurations affect reads from main blocks and parameter blocks. Status Register
and configuration reads support single read cycles. RCR[15]=1 disables the configuration set by RCR[14:0].
3.
Data is not ready when WAIT is asserted.
4.
Set the synchronous burst length. In asynchronous page mode, the burst length equals four words.
5.
Set all reserved Read Configuration Register bits to zero.
6.
Setting the Read Configuration Register for synchronous burst-mode with a latency count of 2 (RCR[13:11] = 010),
data hold for 2 clocks (RCR[9] = 1), and WAIT asserted one data cycle before delay (RCR[8] =1) is not supported.
14.1
Read Mode (RCR[15])
All partitions support two high-performance read configurations and RCR[15] sets the
read configuration to one of these modes:
• synchronous burst mode
• asynchronous page mode (default)
Status register, query, and identifier modes support only asynchronous and singlesynchronous read operations.
14.2
First Access Latency Count (RCR[13:11])
The First Access Latency Count (RCR[13:11]) configuration tells the flash device how
many clocks must elapse from ADV# de-assertion (VIH) before driving the first data
word onto its data pins. The input clock frequency determines this value. See Table 27,
“Read Configuration Register Definitions” on page 79 for latency values.
Figure 38 shows data output latency from ADV# assertion for different latencies. Refer
to Section 14.2.1, “Latency Count Settings” on page 81 for Latency Code Settings.
Figure 38: First Access Latency Configuration
CLK [C]
Address [A]
Valid
Address
ADV# [V]
D[15:0] [Q]
D[15:0] [Q]
D[15:0] [Q]
D[15:0] [Q]
Note:
Code 2
Valid
Output
Code 3
Code 4
Code 5
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Valid
Output
Other First Access Latency Configuration settings are reserved.
)
Datasheet
80
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Figure 39: Word Boundary
Word 0 - 3
0
1
2
Word 4 - 7
3
4
5
6
Word 8 - B
7
8
9
A
Word C - F
B C D E
F
16 Word Boundary
4 Word Boundary
Note:
The 16-word boundary is the end of the flash device sense word-line.
14.2.1
Latency Count Settings
Table 29: Latency Count Settings
tAVQV/tCHQV (85ns/22ns)
tAVQV/tCHQV (70ns/20ns)
tAVQV/tCHQV (90ns/22ns)
Latency Count
Settings
2
3, 4, 5
2, 3, 4, 5
2
3, 4, 5
Frequency
< 31
< 33
< 40
< 29
< 33
Unit
MHz
Figure 40: Data Output with LC Setting at Code 3
tADD-DELAY
CLK (C)
0st
tDATA
2rd
1nd
3th
4th
CE# (E)
ADV# (V)
AMAX-0 (A)
Valid Address
Code 3
DQ15-0 (D/Q)
High Z
Valid
Output
Valid
Output
R103
14.3
WAIT Signal Polarity (RCR[10])
• If the WT bit is cleared (RCR[10]=0), then WAIT is configured to be asserted low. A
0 on the WAIT signal indicates that data is not ready and the data bus contains
invalid data.
• Conversely, if RCR[10] is set, then WAIT is asserted high.
November 2007
Order Number: 290702-13
Datasheet
81
Numonyx™ Wireless Flash Memory (W30)
In either case, if WAIT is deasserted, then data is ready and valid. WAIT is asserted
during asynchronous page mode reads.
14.4
WAIT Signal Function
The WAIT signal indicates data valid when the flash device is operating in synchronous
mode (RCR[15]=0), and when addressing a partition that is currently in read-array
mode. The WAIT signal is deasserted only when data is valid on the bus.
• When the flash device is operating in synchronous non-read-array mode, such as
read status, read ID, or read query, WAIT is set to an asserted state, as determined
by RCR[10]. See Figure 14, “WAIT Signal in Synchronous Non-Read Array
Operation Waveform” on page 37.
• When the flash device is operating in asynchronous page mode or asynchronous
single word read mode, WAIT is set to an asserted state, as determined by
RCR[10]. See Figure 10, “Page-Mode Read Operation Waveform” on page 33, and
Figure 8, “Asynchronous Read Operation Waveform” on page 31.
From a system perspective, the WAIT signal is in the asserted state (based on
RCR[10]) when the flash device is operating in synchronous non-read-array mode
(such as Read ID, Read Query, or Read Status), or if the flash device is operating in
asynchronous mode (RCR[15]=1). In these cases, the system software must ignore
(mask) the WAIT signal, because WAIT does not convey any useful information about
the validity of what is appearing on the data bus.
CONDITION
WAIT
CE# = VIH
CE# = VIL
Tri-State
Active
OE#
No-Effect
Synchronous Array Read
Active
Synchronous Non-Array Read
Asserted
All Asynchronous Read and all Write
Asserted
14.5
Data Hold (RCR[9])
The Data Output Configuration (DOC) bit (RCR[9]) determines whether a data word
remains valid on the data bus for one or two clock cycles. The minimum data set-up
time on the processor, and the flash memory clock-to-data output delay, determine
whether one or two clocks are needed.
• A DOC set at 1-clock data hold corresponds to a 1-clock data cycle.
• A DOC set at 2-clock data hold corresponds to a 2-clock data cycle.
The setting of this configuration bit depends on the system and CPU characteristics. For
clarification, see Figure 41. The following is a method for determining this configuration
setting.
To set the flash device at 1-clock data hold for subsequent reads, the following
condition must be satisfied:
tCHQV
(ns) + tDATA
(ns) < One CLK Period (ns)
As an example, use a clock frequency of 54 MHz and a clock period of 25 ns. Assume
the data output hold time is one clock. Apply this data to the formula above for the
subsequent reads:
Datasheet
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November 2007
Order Number: 290702-13
20 ns + 4 ns ≤ 25 ns
This equation is satisfied, and data output is available and valid at every clock period. If
tDATA is long, hold for two cycles. During page-mode reads, the initial access time can be
determined using the formula:
tADD-DELAY
(ns)tDATA
(ns) + tAVQV (ns)
Subsequent reads in page mode are defined by:
tAPA (ns) + tDATA (ns)
(minimum time)
Figure 41: Data Output Configuration with WAIT Signal Delay
CLK [C]
WAIT (CR.8 = 1)
Note 1
tCHQV
WAIT (CR.8 = 0)
1 CLK
Data Hold
Note 1
Valid
Output
DQ15-0 [Q]
WAIT (CR.8 = 0)
tCHTL/H
WAIT (CR.8 = 1)
2 CLK
Data Hold
Note:
14.6
DQ15-0 [Q]
Valid
Output
Valid
Output
Note 1
tCHQV
Note 1
Valid
Output
Valid
Output
WAIT shown asserted high (RCR[10]=1).
WAIT Delay (RCR[8])
The WAIT configuration bit (RCR[8]) controls WAIT signal delay behavior for all
synchronous read-array modes. This bit setting depends on the system and CPU
characteristics. The WAIT can be asserted either during, or one data cycle before, a
valid output.
In synchronous linear read array (no-wrap mode RCR[3]=1) of 4-word, 8-word, 16word, or continuous-word burst mode, an output delay might occur when a burst
sequence crosses its first flash device-row boundary (16-word boundary).
• If the burst start address is 4-word boundary aligned, the delay does not occur.
• If the start address is misaligned to a 4-word boundary, the delay occurs once per
burst-mode read sequence. The WAIT signal informs the system of this delay.
14.7
Burst Sequence (RCR[7])
The burst sequence specifies the synchronous-burst mode data order (see Table 30,
“Sequence and Burst Length” on page 84). When operating in a linear burst mode,
either 4-word, 8-word, or 16-word burst length with the burst wrap bit (RCR[3]) set, or
in continuous burst mode, the flash device might incur an output delay when the burst
sequence crosses the first 16-word boundary. (See Figure 39, “Word Boundary” on
page 81 for word boundary description.)
Numonyx™ Wireless Flash Memory (W30)
Whether this delay occurs depends on the starting address.
• If the starting address is aligned to a 4-word boundary, there is no delay.
• If the starting address is the end of a 4-word boundary, the output delay is one
clock cycle less than the First Access Latency Count; this is the worst-case delay.
The delay takes place only once, and only if the burst sequence crosses a 16-word
boundary. The WAIT pin informs the system of this delay. For timing diagrams of WAIT
functionality, see these figures:
• Figure 11, “Single Synchronous Read-Array Operation Waveform” on page 34
• Figure 12, “Synchronous 4-Word Burst Read Operation Waveform” on page 35
• Figure 13, “WAIT Functionality for EOWL (End-of-Word Line) Condition Waveform”
on page 36
Table 30: Sequence and Burst Length
Burst Addressing Sequence (Decimal)
4-Word Burst
CR[2:0]=001b
8-Word Burst
CR[2:0]=010b
16-Word Burst1
CR[2:0]=011b
Continuous Burst
CR[2:0]=111b
Linear
Linear
Linear
Linear
0
0-1-2-3
0-1-2-3-4-5-6-7
0-1-2...14-15
0-1-2-3-4-5-6-...
1
1-2-3-0
1-2-3-4-5-6-7-0
1-2-3...14-15-0
1-2-3-4-5-6-7-...
2
2-3-0-1
2-3-4-5-6-7-0-1
2-3-4...15-0-1
2-3-4-5-6-7-8-...
3
3-0-1-2
3-4-5-6-7-0-1-2
3-4-5...15-0-1-2
3-4-5-6-7-8-9-...
4
4-5-6-7-0-1-2-3
4-5-6...15-0-1-2-3
4-5-6-7-8-9-10...
5
5-6-7-0-1-2-3-4
5-6-7...15-0-1...4
5-6-7-8-9-10-11...
6
6-7-0-1-2-3-4-5
6-7-8...15-0-1...5
6-7-8-9-10-11-12-...
7
7-0-1-2-3-4-5-6
7-8-9...15-0-1...6
7-8-9-10-11-12-13...
14
14-15-0-1...13
14-15-16-17-18-19-20-...
15
15-0-1-2-3...14
15-16-17-18-19-...
0-1-2-3
0-1-2-3-4-5-6-7
0-1-2...14-15
0-1-2-3-4-5-6-...
1
1-2-3-4
1-2-3-4-5-6-7-8
1-2-3...15-16
1-2-3-4-5-6-7-...
2
2-3-4-5
2-3-4-5-6-7-8-9
2-3-4...16-17
2-3-4-5-6-7-8-...
3
3-4-5-6
3-4-5-6-7-8-9-10
3-4-5...17-18
3-4-5-6-7-8-9-...
4
4-5-6-7-8-9-10-11
4-5-6...18-19
4-5-6-7-8-9-10...
5
5-6-7-8-9-10-11-12
5-6-7...19-20
5-6-7-8-9-10-11...
6
6-7-8-9-10-11-12-13
6-7-8...20-21
6-7-8-9-10-11-12-...
7
7-8-9-10-11-12-13-14
7-8-9...21-22
7-8-9-10-11-12-13...
...
...
...
...
0
...
No-Wrap (CR[3]=1)
...
...
...
...
Note:
...
Wrap (CR[3]=0)
Start
Addr.
(Dec)
14
14-15...28-29
14-15-16-17-18-19-20-...
15
15-16...29-30
15-16-17-18-19-20-21-...
Available on the 130 nm lithography.
Datasheet
84
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
14.8
Clock Edge (RCR[6])
Configuring the valid clock edge enables a flexible memory interface to a wide range of
burst CPUs. Clock configuration sets the flash device to start a burst cycle, output data,
and assert WAIT on the rising or falling edge of the clock.
14.9
Burst Wrap (RCR[3])
The burst wrap bit determines whether 4-word, 8-word, or 16-word burst accesses
wrap within the burst-length boundary, or they cross word-length boundaries to
perform linear accesses.
No-wrap mode (RCR[3]=1) enables WAIT to hold off the system processor, as it does in
the continuous burst mode, until valid data is available.
In no-wrap mode (RCR[3]=0), the flash device operates similarly to continuous linear
burst mode, but consumes less power during 4-word, 8-word, or 16-word bursts.
For example, if RCR[3]=0 (wrap mode) and RCR[2:0] = 1h (4-word burst), possible
linear burst sequences are 0-1-2-3, 1-2-3-0, 2-3-0-1, 3-0-1-2.
If RCR[3]=1 (no-wrap mode) and RCR[2:0] = 1h (4-word burst length), then possible
linear burst sequences are 0-1-2-3, 1-2-3-4, 2-3-4-5, and 3-4-5-6. RCR[3]=1 not only
enables limited non-aligned sequential bursts, but also reduces power by minimizing
the number of internal read operations.
Setting RCR[2:0] bits for continuous linear burst mode (7h) also achieves the above 4word burst sequences. However, significantly more power might be consumed. The 12-3-4 sequence, for example, consumes power during the initial access, again during
the internal pipeline lookup as the processor reads word 2, and possibly again,
depending on system timing, near the end of the sequence as the flash device pipelines
the next 4-word sequence. RCR[3]=1 while in 4-word burst mode (no-wrap mode)
reduces this excess power consumption.
14.10
Burst Length (RCR[2:0])
The burst length is the number of words the flash device outputs in a synchronous read
access. 4-word, 8-word, 16-word, and continuous-word are supported.
In 4-word, 8-word, or 16-word burst configuration, the burst wrap bit (RCR[3])
determines whether burst accesses wrap within word-length boundaries, or they cross
word-length boundaries to perform a linear access.
After an address is specified, the flash device outputs data until it reaches the end of its
burstable address space. Continuous burst accesses are linear only (burst wrap bit
RCR[3] is ignored during continuous burst) and do not wrap within word-length
boundaries (see Table 30, “Sequence and Burst Length” on page 84).
November 2007
Order Number: 290702-13
Datasheet
85
Numonyx™ Wireless Flash Memory (W30)
Appendix A Write State Machine
Table 31 shows the command state transitions, based on incoming commands. Only
one partition can be actively programming or erasing at a time.
Table 31: Next State Table (Sheet 1 of 2)
W r ite S ta te M a c h in e (W S M ) N e x t S ta te T a b le
C h ip N e x t S ta te a ft e r C o m m a n d In p u t
C u r r e n t C h ip
S ta te
(8 )
R ead
A rr a y
(3 )
S e tu p
( 4 ,5 )
E ra s e
S e tu p
( 4 ,5 )
E nhanced
F a c to ry
Pgm
S e tu p
Ready
(4 )
(F F H )
(1 0 H /4 0 H )
(2 0 H )
(3 0 H )
R eady
P r o g ra m
S e tu p
E ra s e
S e tu p
EFP
S e tu p
L o c k /C R S e tu p
OTP
P r o g ra m
R e a d y ( L o c k E r ro r)
(B 0 H )
(7 0 H )
C le a r
S ta tu s
R e g is te r
R ead
ID /Q u e r y
(6)
(5 0 H )
(9 0 H , 9 8 H )
R eady
R e a d y (L o c k E rr o r )
B usy
P r o g ra m B u s y
B usy
P r o g ra m B u s y
P gm S usp
S uspend
P r o g ra m S u s p e n d
Pgm Busy
S e tu p
R e a d y ( E rr o r )
E ra s e B u s y
S uspend
E ra s e
S uspend
P g m in
E ra s e
S u s p S e tu p
R e a d y (E r ro r)
E ra s e S u s p
E ra s e S u s p e n d
S e tu p
P r o g ra m B u s y
P ro g r a m S u s p e n d
E ra s e B u s y
E ra s e
E ra s e B u s y
E ra s e B u s y
E ra s e S u s p e n d
P r o g ra m in E r a s e S u s p e n d B u s y
B usy
P g m S u s p in
E ra s e S u s p
P r o g ra m i n E r a s e S u s p e n d B u s y
S uspend
P ro g r a m in E ra s e S u s p e n d B u s y
P r o g ra m S u s p e n d in E r a s e S u s p e n d
P g m in E r a s e
S usp B usy
P ro g r a m S u s p e n d in E ra s e S u s p e n d
E r a s e S u s p e n d (L o c k E rr o r )
E ra s e S u s p
E ra s e S u s p e n d
(L o c k E rro r)
E F P B usy
R e a d y (E r ro r)
L o c k /C R S e tu p in E r a s e
S uspend
E nhanced
F a c to r y
P ro g r a m
(D 0 H )
Read
S ta tu s
O T P Busy
B usy
P ro g r a m in
E ra s e S u s p e n d
C o n fir m
(9 )
P r o g ra m /
E ra s e
S uspend
Ready
S e tu p
S e tu p
P ro g r a m
B E C o n firm ,
P /E R e s u m e ,
ULB
S e tu p
R e a d y ( E rr o r )
(7 )
EF P Busy
EF P Busy
E F P V e rify
V e r ify B u s y
(7 )
O u tp u t N e x t S ta te T a b le
(1)
O u tp u t N e x t S t a t e a f t e r C o m m a n d In p u t
P g m S e tu p ,
E ra s e S e tu p ,
O T P S e tu p ,
P g m in E ra s e S u s p S e tu p ,
E F P S e tu p ,
E FP B usy,
V e r ify B u s y
S ta tu s
L o c k /C R S e tu p ,
L o c k /C R S e tu p in E r a s e S u s p
S ta tu s
O T P Busy
Ready,
P gm B usy,
P gm S uspend,
E ra s e B u s y ,
E ra s e S u s p e n d ,
P g m In E ra s e S u s p B u s y ,
P g m S u s p In E r a s e S u s p
Datasheet
86
S ta tu s
A rr a y
(3 )
S ta tu s
O u tp u t d o e s n o t c h a n g e
S ta tu s
O u tp u t
does not
change
ID /Q u e r y
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 31: Next State Table (Sheet 2 of 2)
W r it e S t a t e M a c h i n e ( W S M ) N e x t S t a t e T a b l e
C h i p N e x t S t a t e a f t e r C o m m a n d In p u t
C u r r e n t C h ip
S ta te
(8 )
Lock,
U n lo c k ,
L o c k -d o w n ,
C R s e tu p
(5)
S e tu p
(5 )
(6 0 H )
(C 0 H )
Ready
L o c k /C R
S e tu p
O TP
S e tu p
L o c k /C R S e tu p
R e a d y (L o c k E rr o r )
C o n firm
(9)
(0 1 H )
W r it e C R
(9 )
C o n f ir m
C o n f ir m
(2 F H )
(9 )
(0 3 H )
E nhanced
Fact Pgm
E x it ( b lk a d d
<> W A 0)
(X X X X H )
I lle g a l
com m ands or
E F P d a ta
(2 )
W SM
O p e r a t io n
C o m p le t e s
(o th e r c o d e s )
R eady
R eady
R eady
S e tu p
OTP
R eady
N /A
R e a d y ( L o c k E r ro r)
O TP B usy
B usy
R eady
S e tu p
P ro g ra m B u s y
N /A
B usy
P ro g ra m B u s y
R eady
S uspend
P ro g ra m S u s p e n d
S e tu p
R e a d y ( E r ro r)
P ro g r a m
B usy
E ra s e
S uspend
E ra s e B u s y
E ra s e S u s p e n d
P r o g r a m in E r a s e S u s p e n d B u s y
B usy
P r o g r a m in E r a s e S u s p e n d B u s y
S uspend
P r o g r a m S u s p e n d in E r a s e S u s p e n d
L o c k / C R S e t u p in E r a s e
S uspend
N /A
E ra s e B u s y
L o c k /C R
S e t u p in
E ra s e S u s p
S e tu p
P r o g r a m in
E ra s e S u s p e n d
E nhanced
F a c to ry
P ro g r a m
LockD ow n
B lo c k
Lock
B lo c k
O TP
E ra s e S u s p e n d
(L o c k E r ro r )
E ra s e S u s p
S e tu p
E ra s e S u s p
E ra s e S u s p
R eady
N /A
E ra s e
S uspend
E r a s e S u s p e n d (L o c k E rr o r )
N /A
R e a d y ( E r ro r)
(7 )
EFP Busy
E FP B usy
E F P V e r if y
V e r if y B u s y
(7 )
E F P V e r if y
E F P B usy
(7 )
R eady
E F P V e r if y
(7)
R eady
O u t p u t N e x t S t a t e T a b le
(1)
O u t p u t N e x t S t a t e a f t e r C o m m a n d In p u t
P g m S e tu p ,
E ra s e S e tu p ,
O T P S e tu p ,
P g m in E r a s e S u s p S e t u p ,
E F P S e tu p ,
EFP Busy,
V e r if y B u s y
S ta tu s
L o c k /C R S e tu p ,
L o c k / C R S e t u p in E r a s e S u s p
S ta tu s
A r ra y
S ta tu s
O TP Busy
Ready,
P gm B usy,
P gm S uspend,
E ra s e B u s y ,
E ra s e S u s p e n d ,
P g m In E ra s e S u s p B u s y ,
P g m S u s p In E ra s e S u s p
S ta tu s
O u tp u t d o e s n o t c h a n g e
A rr a y
O u tp u t d o e s
not change
O u tp u t d o e s
not change
Notes:
1.
The output state shows the type of data that appears at the outputs if the partition address is the same as the command
address.
— A partition can be placed in Read Array, Read Status or Read ID/CFI, depending on the command issued.
— Each partition stays in its last output state (Array, ID/CFI or Status) until a new command changes it. The next WSM
state does not depend on the output state of the partition.
— For example, if the partition #1 output state is Read Array and the partition #4 output state is Read Status, every read
from partition #4 (without issuing a new command) outputs the Status register.
2.
Illegal commands are any commands not defined in the command set.
November 2007
Order Number: 290702-13
Datasheet
87
Numonyx™ Wireless Flash Memory (W30)
3.
4.
5.
6.
7.
8.
9.
10.
All partitions default to Read Array mode at power-up. A Read Array command issued to a busy partition results in
undetermined data when a partition address is read.
Both cycles of two-cycle commands must be issued to the same partition address. If the two cycles are issued to different
partitions, the address used for the second write cycle determines the active partition. Both partitions output status
information when read.
If the WSM is active, both cycles of a two-cycle command are ignored. This feature differs from previous Numonyx flash
memory devices.
The Clear Status command clears status register error bits, except when the WSM is running (Pgm Busy, Erase Busy, Pgm
Busy In Erase Suspend, OTP Busy, EFP modes) or suspended (Erase Suspend, Pgm Suspend, Pgm Suspend In Erase
Suspend).
EFP writes are allowed only when status register bit SR.0 = 0. EFP is busy if the Block Address = the address at the EFP
Confirm command. Any other commands are treated as data.
The current state is the state of the WSM, not the state of the partition.
Confirm commands (Lock Block, Unlock Block, Lock-down Block, Configuration Register) perform the operation and then
move to the Ready State.
In Erase suspend mode, the only valid two-cycle commands are Program Word, Lock/Unlock/Lockdown Block, and CR
Write. Both cycles of other two-cycle commands (Program OTP & confirm, EFP Setup & confirm, Erase setup & confirm) are
ignored. In Program suspend or Program suspend in Erase suspend, both cycles of all two-cycle commands are ignored.
Datasheet
88
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Appendix B Common Flash Interface
This appendix defines the data structure or database returned by the Common Flash
Interface (CFI) Query command. System software parses this structure to gain critical
information, such as block size, density, x8/x16, and electrical specifications.
Once this information has been obtained, the software can determine which command
sets to use to enable flash device writes, enable block erases, and otherwise control the
flash device. The Query is part of an overall specification for multiple command set and
control interface descriptions, which is called the Common Flash Interface, or CFI.
B.1
Query Structure Output
The Query database allows system software to obtain information for controlling the
flash device. This section describes the flash device CFI-compliant interface that allows
access to Query data.
Query data are presented on the lowest-order data outputs (DQ0-7) only. The
numerical offset value is the address relative to the maximum bus width that the flash
device supports. On the W30 family of flash memory devices, the Query table device
starting address is a 10h, which is a word address for x16 flash devices.
For a word-wide (x16) flash device, the first two Query-structure bytes, ASCII Q and R,
appear on the low byte at word addresses 10h and 11h.
• This CFI-compliant flash device outputs 00h data on upper bytes.
• The flash device outputs ASCII Q in the low byte (DQ0-7) and 00h in the high byte
(DQ8-15).
At Query addresses containing two or more bytes of information, the least significant
data byte is presented at the lower address, and the most significant data byte is
presented at the higher address.
In all of the following tables, addresses and data are represented in hexadecimal
notation, so the h suffix has been dropped. In addition, because the upper byte of
word-wide flash devices is always 00h, the leading 00 has been dropped from the table
notation, and only the lower byte value is shown. Any x16 flash device outputs can be
assumed to have 00h on the upper byte in this mode.
Table 32: Summary of Query Structure Output as a Function of the Flash Device and Mode
Device
Device Addresses
November 2007
Order Number: 290702-13
Hex
Offset
Hex
Code
ASCI
I
Value
00010:
00011:
00012:
51
52
59
Q
R
Y
Datasheet
89
Numonyx™ Wireless Flash Memory (W30)
Table 33: Example of Query Structure Output of x16- and x8 Flash Devices
Word Addressing:
Offset
Hex Code
AX—A0
Byte Addressing:
Value
D15—D0
Offset
Hex Code
AX—A0
Value
D7—D0
00010h
0051
“Q”
00010h
51
Q
00011h
0052
“R”
00011h
52
R
00012h
0059
“Y”
00012h
59
Y
00013h
P IDLO
PrVendor
00013h
P IDLO
PrVendor
00014h
P IDHI
ID #
00014h
P IDLO
ID #
00015h
PLO
PrVendor
00015h
P IDHI
ID #
...
...
00016h
PHI
TblAdr
00016h
00017h
A IDLO
AltVendor
00017h
00018h
A IDHI
ID #
00018h
...
...
...
...
B.2
Query Structure Overview
The Query command causes the flash device to display the Common Flash Interface
(CFI) Query structure or database. Table 34 summarizes the structure sub-sections and
address locations.
Table 34: Query Structure
Offset
00000h
00001h
(BA+2)h(2)
00004-Fh
00010h
0001Bh
00027h
P(3)
Sub-Section Name
(1)
Description
Manufacturer Code
Device Code
Block Status register
Block-specific information
Reserved
Reserved for vendor-specific information
CFI query identification string
Command set ID and vendor data offset
System interface information
Device timing & voltage information
Device geometry definition
Flash device layout
Vendor-defined additional information specific
Primary Intel-specific Extended Query Table
to the Primary Vendor Algorithm
Notes:
1.
Refer to the Section B.1, “Query Structure Output” on page 89 and offset 28h, for the detailed definition of
the offset address as a function of the flash device bus width and mode.
2.
BA = Block Address beginning location (for example, 08000h is the block 1’beginning location when the block size is 32Kword).
3.
Offset 15 defines P, which points to the Primary Numonyx-specific Extended Query Table.
B.3
Block Status Register
The Block Status Register indicates whether an erase operation completed successfully,
a given block is locked, or a given block can be accessed for flash memory program/
erase operations.
Block Erase Status (BSR.1) allows system software to determine the success of the last
block erase operation. Use BSR.1 just after power-up to verify that the VCC supply was
not accidentally removed during an erase operation.
Datasheet
90
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 35: Block Status Register
Offset
Length
Description
(BA+2)h(1)
1
Block Lock Status Register
BSR.0 Block lock status
0 = Unlocked
1 = Locked
BSR.1 Block lock-down status
0 = Not locked down
1 = Locked down
BSR 2–7: Reserved for future use
Add.
Value
BA+2 --00 or --01
BA+2 (bit 0): 0 or 1
BA+2 (bit 1): 0 or 1
BA+2
(bit 2–7): 0
Notes:
1.
BA = Block Address beginning location (for example, 08000h is the block 1 beginning location when the block size is 32Kword).
B.4
CFI Query Identification String
The Identification String verifies that the component supports the Common Flash
Interface specification. It also indicates the specification version and supported vendorspecified command set(s).
.
Table 36: CFI Identification
Add.
Hex
Code
Value
Query-unique ASCII string ”QRY”
10:
11:
12:
--51
--52
--59
Q
R
Y
2
Primary vendor command set and control interface ID code.
16-bit ID code for vendor-specified algorithms
13:
14:
--03
--00
15h
2
Extended Query Table primary algorithm address
15:
16:
--39
--00
17h
2
Alternate vendor command set and control interface ID code.
0000h means no second vendor-specified algorithm exists
17:
18:
--00
--00
19h
2
Secondary algorithm Extended Query Table address.
0000h means none exists
19:
1A:
--00
--00
Offset
Length
10h
3
13h
Description
November 2007
Order Number: 290702-13
Datasheet
91
Numonyx™ Wireless Flash Memory (W30)
Table 37: System Interface Information
Offset
Length
Description
1Bh
1
1Ch
1
1Dh
1
1Eh
1
1Fh
20h
21h
22h
23h
24h
25h
26h
1
1
1
1
1
1
1
1
VCC logic supply minimum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 BCD volts
VCC logic supply maximum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 BCD volts
VPP [programming] supply minimum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 HEX volts
VPP [programming] supply maximum program/erase voltage
bits 0–3 BCD 100 mV
bits 4–7 HEX volts
“n” such that typical single word program time-out = 2n μ-sec
“n” such that typical max. buffer write time-out = 2n μ-sec
“n” such that typical block erase time-out = 2n m-sec
“n” such that typical full chip erase time-out = 2n m-sec
“n” such that maximum word program time-out = 2n times typical
“n” such that maximum buffer write time-out = 2n times typical
“n” such that maximum block erase time-out = 2n times typical
“n” such that maximum chip erase time-out = 2n times typical
Datasheet
92
Hex
Add. Code Value
1B:
--17 1.7V
1C:
--19
1.9V
1D:
--B4
11.4V
1E:
--C6 12.6V
1F:
20:
21:
22:
23:
24:
25:
26:
--04 16μs
--00
NA
--0A
1s
--00
NA
--04 256μs
--00
NA
--03
8s
--00
NA
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
B.5
Flash Device Geometry Definition
Table 38: Flash Device Geometry Definition
Offset
27h
Length
Description
n
1
“n” such that device size = 2 in number of bytes
Flash device interface code assignment:
"n" such that n+1 specifies the bit field that represents the flash
device width capabilities as described in the table:
28h
2
2Ah
2
2Ch
1
2Dh
31h
35h
Address
27:
28:
29:
2A:
2B:
2C:
2D:
2E:
2F:
30:
31:
32:
33:
34:
35:
36:
37:
38:
November 2007
Order Number: 290702-13
4
4
4
7
6
5
4
3
2
1
0
—
—
—
—
x64
x32
x16
x8
15
14
13
12
11
10
9
8
—
—
—
—
—
—
—
—
“n” such that maximum number of bytes in write buffer = 2 n
Number of erase block regions (x) within device:
1. x = 0 means no erase blocking; the device erases in bulk
2. x specifies the number of device regions with one or
more contiguous same-size erase blocks.
3. Symmetrically blocked partitions have one blocking region
Erase Block Region 1 Information
bits 0–15 = y, y+1 = number of identical-size erase blocks
bits 16–31 = z, region erase block(s) size are z x 256 bytes
Erase Block Region 2 Information
bits 0–15 = y, y+1 = number of identical-size erase blocks
bits 16–31 = z, region erase block(s) size are z x 256 bytes
Reserved for future erase block region information
32 Mbit
–B
–T
--16
--16
--01
--01
--00
--00
--00
--00
--00
--00
--02
--02
--07
--3E
--00
--00
--20
--00
--00
--01
--07
--3E
--00
--00
--20
--00
--00
--01
--00
--00
--00
--00
--00
--00
--00
--00
64 Mbit
–B
–T
--17
--17
--01
--01
--00
--00
--00
--00
--00
--00
--02
--02
--07
--7E
--00
--00
--20
--00
--00
--01
--07
--7E
--00
--00
--20
--00
--00
--01
--00
--00
--00
--00
--00
--00
--00
--00
Code
27:
See table below
28:
--01
x16
29:
2A:
2B:
2C:
--00
--00
--00
0
See table below
2D:
2E:
2F:
30:
31:
32:
33:
34:
35:
36:
37:
38:
See table below
See table below
See table below
128 Mbit
–B
–T
--18
--18
--01
--01
--00
--00
--00
--00
--00
--00
--02
--02
--07
--FE
--00
--00
--20
--00
--00
--01
--07
--FE
--00
--00
--20
--00
--00
--01
--00
--00
--00
--00
--00
--00
--00
--00
Datasheet
93
Numonyx™ Wireless Flash Memory (W30)
B.6
Numonyx-Specific Extended Query Table
Table 39: Primary Vendor-Specific Extended Query
(1)
Datasheet
94
Offset
P = 39h
(P+0)h
(P+1)h
(P+2)h
(P+3)h
(P+4)h
(P+5)h
(P+6)h
(P+7)h
(P+8)h
Length
(P+9)h
1
(P+A)h
(P+B)h
2
3
1
1
4
(P+C)h
1
(P+D)h
1
Description
(Optional flash features and commands)
Primary extended query table
Unique ASCII string “PRI“
Major version number, ASCII
Minor version number, ASCII
Optional feature and command support (1=yes, 0=no)
bits 10–31 are reserved; undefined bits are “0.” If bit 31 is
“1” then another 31 bit field of Optional features follows at
the end of the bit–30 field.
bit 0 Chip erase supported
bit 1 Suspend erase supported
bit 2 Suspend program supported
bit 3 Legacy lock/unlock supported
bit 4 Queued erase supported
bit 5 Instant individual block locking supported
bit 6 Protection bits supported
bit 7 Pagemode read supported
bit 8 Synchronous read supported
bit 9 Simultaneous operations supported
Supported functions after suspend: read Array, Status, Query
Other supported operations are:
bits 1–7 reserved; undefined bits are “0”
bit 0 Program supported after erase suspend
Block status register mask
bits 2–15 are Reserved; undefined bits are “0”
bit 0 Block Lock-Bit Status register active
bit 1 Block Lock-Down Bit Status active
VCC logic supply highest performance program/erase voltage
bits 0–3 BCD value in 100 mV
bits 4–7 BCD value in volts
VPP optimum program/erase supply voltage
bits 0–3 BCD value in 100 mV
bits 4–7 HEX value in volts
Add.
39:
3A:
3B:
3C:
3D:
3E:
3F:
40:
41:
bit 0
bit 1
bit 2
bit 3
bit 4
bit 5
bit 6
bit 7
bit 8
bit 9
42:
Hex
Code Value
--50
"P"
--52
"R"
--49
"I"
--31
"1"
--33
"3"
--E6
--03
--00
--00
=0
No
=1
Yes
=1
Yes
=0
No
=0
No
=1
Yes
=1
Yes
=1
Yes
=1
Yes
=1
Yes
--01
bit 0
43:
44:
bit 0
bit 1
45:
=1
--03
--00
=1
=1
--18
Yes
46:
--C0 12.0V
Yes
Yes
1.8V
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 40: Protection Register Information
Offset(1)
P = 39h
Length
Description (Optional flash device features and commands)
Add.
Hex
Code
Value
(P+E)h
1
Number of Protection register fields in JEDEC ID space.
00h indicates that 256 protection fields are available
47:
--01
1
4
Protection Field 1: Protection Description
This field describes user-available One Time Programmable (OTP) Protection
register bytes.
• Some bytes are pre-programmed with flash device-unique serial
numbers.
• Other bytes are user programmable.
Bits 0-15 point to the Protection register Lock byte, the first byte in the
section. The following bytes are factory pre-programmed and userprogrammable.
• bits 0--7 = Lock/bytes Jedec-plane physical low address
• bits 8--15 = Lock/bytes Jedec-plane physical high address
• bits 16--23 = n such that 2n = factory pre-programmed bytes
• bits 24--31 =n such that 2n = user programmable bytes
48:
49:
4A:
4B:
--80
--00
--03
--03
80h
00h
8 byte
8 byte
(P+F)h
(P+10)h
(P+11)h
(P+12)h
Table 41: Burst Read Information for Non-Multiplexed Flash Device
(1)
Offset
P = 39h
(P+13)h
Length
(P+14)h
1
(P+15)h
1
(P+16)h
(P+17)h
(P+18)h
1
1
1
1
Description
(Optional flash features and commands)
Page Mode Read capability
bits 0–7 = “n” such that 2n HEX value represents the number of
read-page bytes. See offset 28h for device word width to
determine page-mode data output width. 00h indicates no
read page buffer.
Number of synchronous mode read configuration fields that
follow. 00h indicates no burst capability.
Synchronous mode read capability configuration 1
Bits 3–7 = Reserved
bits 0–2 “n” such that 2n+1 HEX value represents the
maximum number of continuous synchronous reads when
the device is configured for its maximum word width. A value
of 07h indicates that the device is capable of continuous
linear bursts that will output data until the internal burst
counter reaches the end of the device’s burstable address
space. This field’s 3-bit value can be written directly to the
Read Configuration Register bits 0–2 if the device is
configured for its maximum word width. See offset 28h for
word width to determine the burst data output width.
Synchronous mode read capability configuration 2
Synchronous mode read capability configuration 3
Synchronous mode read capability configuration 4
Hex
Add. Code Value
4C:
--03 8 byte
4D:
--04
4
4E:
--01
4
4F:
50:
51:
--02
--03
--07
8
16
Cont
Table 42: Partition and Erase-Block Region Information
(1)
Offset
P = 39h
Description
Bottom
(Optional flash features and commands)
Top
(P+19)h (P+19)h Number of device hardware-partition regions within the device.
x = 0: a single hardware partition device (no fields follow).
x specifies the number of device partition regions containing
one or more contiguous erase block regions.
November 2007
Order Number: 290702-13
See table below
Address
Bot
Top
Len
1
52:
52:
Datasheet
95
Numonyx™ Wireless Flash Memory (W30)
Table 43: Partition Region 1 Information
(1)
Offset
P = 39h
Description
Bottom
Top
(Optional flash features and commands)
(P+1A)h (P+1A)h Number of identical partitions within the partition region
(P+1B)h (P+1B)h
(P+1C)h (P+1C)h Number of program or erase operations allowed in a partition
bits 0–3 = number of simultaneous Program operations
bits 4–7 = number of simultaneous Erase operations
(P+1D)h (P+1D)h Simultaneous program or erase operations allowed in other
partitions while a partition in this region is in Program mode
bits 0–3 = number of simultaneous Program operations
bits 4–7 = number of simultaneous Erase operations
(P+1E)h (P+1E)h Simultaneous program or erase operations allowed in other
partitions while a partition in this region is in Erase mode
bits 0–3 = number of simultaneous Program operations
bits 4–7 = number of simultaneous Erase operations
(P+1F)h (P+1F)h Types of erase block regions in this Partition Region.
x = 0 = no erase blocking; the Partition Region erases in bulk
x = number of erase block regions w/ contiguous same-size
erase blocks. Symmetrically blocked partitions have one
blocking region. Partition size = (Type 1 blocks)x(Type 1
block sizes) + (Type 2 blocks)x(Type 2 block sizes) +…+
(Type n blocks)x(Type n block sizes)
(P+20)h (P+20)h Partition Region 1 Erase Block Type 1 Information
(P+21)h (P+21)h
bits 0–15 = y, y+1 = number of identical-size erase blocks
(P+22)h (P+22)h
bits 16–31 = z, region erase block(s) size are z x 256 bytes
(P+23)h (P+23)h
(P+24)h (P+24)h Partition 1 (Erase Block Type 1)
Minimum block erase cycles x 1000
(P+25)h (P+25)h
(P+26)h (P+26)h Partition 1 (erase block Type 1) bits per cell; internal ECC
bits 0–3 = bits per cell in erase region
bit 4 = reserved for “internal ECC used” (1=yes, 0=no)
bits 5–7 = reserve for future use
(P+27)h (P+27)h Partition 1 (erase block Type 1) page mode and synchronous
mode capabilities defined in Table 10.
bit 0 = page-mode host reads permitted (1=yes, 0=no)
bit 1 = synchronous host reads permitted (1=yes, 0=no)
bit 2 = synchronous host writes permitted (1=yes, 0=no)
bits 3–7 = reserved for future use
(P+28)h
Partition Region 1 Erase Block Type 2 Information
(P+29)h
bits 0–15 = y, y+1 = number of identical-size erase blocks
(P+2A)h
bits 16–31 = z, region erase block(s) size are z x 256 bytes
(P+2B)h
(bottom parameter device only)
(P+2C)h
Partition 1 (Erase block Type 2)
(P+2D)h
Minimum block erase cycles x 1000
(P+2E)h
Partition 1 (Erase block Type 2) bits per cell
bits 0–3 = bits per cell in erase region
bit 4 = reserved for “internal ECC used” (1=yes, 0=no)
bits 5–7 = reserve for future use
(P+2F)h
Partition 1 (Erase block Type 2) pagemode and synchronous
mode capabilities defined in Table 10
bit 0 = page-mode host reads permitted (1=yes, 0=no)
bit 1 = synchronous host reads permitted (1=yes, 0=no)
bit 2 = synchronous host writes permitted (1=yes, 0=no)
bits 3–7 = reserved for future use
Datasheet
96
See table below
Address
Bot
Top
Len
2
53:
53:
54:
54:
1
55:
55:
1
56:
56:
1
57:
57:
1
58:
58:
4
1
59:
5A:
5B:
5C:
5D:
5E:
5F:
59:
5A:
5B:
5C:
5D:
5E:
5F:
1
60:
60:
4
1
61:
62:
63:
64:
65:
66:
67:
1
68:
2
2
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 44: Partition Region 2 Information
Offset(1)
P = 39h
Description
Bottom
Top
(Optional flash features and commands)
(P+30)h (P+28)h Number of identical partitions within the partition region
(P+31)h (P+29)h
(P+32)h (P+2A)h Number of program or erase operations allowed in a partition
bits 0–3 = number of simultaneous Program operations
bits 4–7 = number of simultaneous Erase operations
(P+33)h
(P+34)h
(P+35)h
(P+36)h
(P+37)h
(P+38)h
(P+39)h
(P+3A)h
(P+3B)h
(P+3C)h
(P+3D)h
(P+3E)h
(P+3F)h
See table below
Address
Bot
Top
Len
2
69:
61:
6A:
62:
1
6B:
63:
(P+2B)h Simultaneous program or erase operations allowed in other
1
partitions while a partition in this region is in Program mode
bits 0–3 = number of simultaneous Program operations
bits 4–7 = number of simultaneous Erase operations
(P+2C)h Simultaneous program or erase operations allowed in other
1
partitions while a partition in this region is in Erase mode
bits 0–3 = number of simultaneous Program operations
bits 4–7 = number of simultaneous Erase operations
(P+2D)h Types of erase block regions in this Partition Region.
1
x = 0 = no erase blocking; the Partition Region erases in bulk
x = number of erase block regions w/ contiguous same-size
erase blocks. Symmetrically blocked partitions have one
blocking region. Partition size = (Type 1 blocks)x(Type 1
block sizes) + (Type 2 blocks)x(Type 2 block sizes) +…+
(Type n blocks)x(Type n block sizes)
(P+2E)h Partition Region 2 Erase Block Type 1 Information
4
(P+2F)h
bits 0–15 = y, y+1 = number of identical-size erase blocks
(P+30)h
bits 16–31 = z, region erase block(s) size are z x 256 bytes
(P+31)h
(P+32)h Partition 2 (Erase block Type 1)
2
(P+33)h
Minimum block erase cycles x 1000
(P+34)h Partition 2 (Erase block Type 1) bits per cell
1
bits 0–3 = bits per cell in erase region
bit 4 = reserved for “internal ECC used” (1=yes, 0=no)
bits 5–7 = reserve for future use
(P+35)h Partition 2 (erase block Type 1) pagemode and synchronous
1
mode capabilities as defined in Table 10.
bit 0 = page-mode host reads permitted (1=yes, 0=no)
bit 1 = synchronous host reads permitted (1=yes, 0=no)
bit 2 = synchronous host writes permitted (1=yes, 0=no)
bits 3–7 = reserved for future use
(P+36)h Partition Region 2 Erase Block Type 2 Information
4
(P+37)h
bits 0–15 = y, y+1 = number of identical-size erase blocks
(P+38)h
bits 16–31 = z, region erase block(s) size are z x 256 bytes
(P+39)h
(P+3A)h Partition 2 (Erase Block Type 2)
2
(P+3B)h
Minimum block erase cycles x 1000
(P+3C)h Partition 2 (Erase Block Type 2) bits per cell
1
bits 0–3 = bits per cell in erase region
bit 4 = reserved for “internal ECC used” (1=yes, 0=no)
bits 5–7 = reserved for future use
(P+3D)h Partition 2 (Erase block Type 2) pagemode and synchronous
1
mode capabilities as defined in Table 10.
bit 0 = page-mode host reads permitted (1=yes, 0=no)
bit 1 = synchronous host reads permitted (1=yes, 0=no)
bit 2 = synchronous host writes permitted (1=yes, 0=no)
bits 3–7 = reserved for future use
(P+3E)h Features Space definitions (Reserved for future use)
TBD
(P+3F)h Reserved for future use
Resv'd
November 2007
Order Number: 290702-13
6C:
64:
6D:
65:
6E:
66:
6F:
70:
71:
72:
73:
74:
75:
67:
68:
69:
6A:
6B:
6C:
6D:
76:
6E:
6F:
70:
71:
72:
73:
74:
75:
76:
77:
78:
77:
78:
Datasheet
97
Numonyx™ Wireless Flash Memory (W30)
Table 45: Partition and Erase-Block Region Information
Address
52:
53:
54:
55:
56:
57:
58:
59:
5A:
5B:
5C:
5D:
5E:
5F:
60:
61:
62:
63:
64:
65:
66:
67:
68:
69:
6A:
6B:
6C:
6D:
6E:
6F:
70:
71:
72:
73:
74:
75:
76:
64Mbit
32 Mbit
–B
--02
--01
--00
--11
--00
--00
--02
--07
--00
--20
--00
--64
--00
--01
--03
--06
--00
--00
--01
--64
--00
--01
--03
--07
--00
--11
--00
--00
--01
--07
--00
--00
--01
--64
--00
--01
--03
–T
--02
--07
--00
--11
--00
--00
--01
--07
--00
--00
--01
--64
--00
--01
--03
--01
--00
--11
--00
--00
--02
--06
--00
--00
--01
--64
--00
--01
--03
--07
--00
--20
--00
--64
--00
--01
--03
–B
--02
--01
--00
--11
--00
--00
--02
--07
--00
--20
--00
--64
--00
--01
--03
--06
--00
--00
--01
--64
--00
--01
--03
--0F
--00
--11
--00
--00
--01
--07
--00
--00
--01
--64
--00
--01
--03
–T
--02
--0F
--00
--11
--00
--00
--01
--07
--00
--00
--01
--64
--00
--01
--03
--01
--00
--11
--00
--00
--02
--06
--00
--00
--01
--64
--00
--01
--03
--07
--00
--20
--00
--64
--00
--01
--03
128Mbit
–B
–T
--02
--02
--01
--1F
--00
--00
--11
--11
--00
--00
--00
--00
--02
--01
--07
--07
--00
--00
--20
--00
--00
--01
--64
--64
--00
--00
--01
--01
--03
--03
--06
--01
--00
--00
--00
--11
--01
--00
--64
--00
--00
--02
--01
--06
--03
--00
--1F
--00
--00
--01
--11
--64
--00
--00
--00
--01
--01
--03
--07
--07
--00
--00
--00
--20
--01
--00
--64
--64
--00
--00
--01
--01
--03
--03
Notes:
1.
The P variable is a pointer which is defined at CFI offset 15h.
2.
TPD - Top parameter device.
BPD - Bottom parameter device.
3.
Partition: Each partition is 4 Mb in size. It can contain main blocks OR a combination of both main and parameter blocks.
4.
Partition Region: Symmetrical partitions form a partition region.
— Partition region A. contains all partitions that are made up of main blocks only.
— Partition region B. contains the partition that is made up of the parameter and the main blocks.
Datasheet
98
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Appendix C Ordering Information
To order samples, obtain datasheets or inquire about any stack combination, please
contact your local Numonyx representative.
Table 46: 38F Type Stacked Components
PF
Package
Designator
38F
Product Line
Designator
5070
Product Die/
Density
Configuration
M0
Y
0
NOR Flash
Product Family
Voltage/NOR
Flash CE#
Configuration
Parameter /
Mux
Configuration
First character
applies to Flash
die #1
V=
1.8 V Core
and I/O;
Separate Chip
Enable per
die
0=
No parameter
blocks; NonMux I/O
interface
Second character
applies to Flash
die #2
(See
(See
Char 1 = Flash
die #1
Char 2 = Flash
die #2
Char 3 =
RAM die #1
PF =
SCSP, RoHS
RD =
SCSP,
Leaded
Stacked
NOR Flash +
RAM
Char 4 =
RAM die #2
(See
Table 48,
“38F / 48F
Density
Decoder”
on
page 100
(See Table 49,
“NOR Flash
Family
Decoder” on
page 101 for
details)
Table 50,
“Voltage /
NOR Flash
CE#
Configurati
on
Decoder”
on
page 101
for details)
Table 51,
“Paramete
r / Mux
Configurati
on
Decoder”
on
page 101
B
Ballout
Identifier
0
Device
Details
B=
x16D
Ballout
(See
Table 5
2,
“Ballout
Decoder
” on
page 10
2 for
0=
Original
released
version of
this
product
details)
for details)
for details)
November 2007
Order Number: 290702-13
Datasheet
99
Numonyx™ Wireless Flash Memory (W30)
Table 47: 48F Type Stacked Components
PC
Package
Designator
48F
4400
Product Line
Designator
PC =
Easy BGA,
RoHS
TE =
TSOP,
Leaded
Product Die/
Density
Configuration
V
B
NOR Flash
Product Family
Voltage/NOR
Flash CE#
Configuration
Parameter /
Mux
Configuration
First character
applies to Flash
dies #1 and #2
V=
1.8 V Core
and 3 V I/O;
Virtual Chip
Enable
0
Ballout
Identifier
0
Device
Details
Char 1 = Flash
die #1
Char 2 = Flash
die #2
RC =
Easy BGA,
Leaded
JS =
TSOP, RoHS
P0
Char 3 = Flash
die #3
Stacked
NOR Flash
only
Second character
applies to Flash
dies #3 and #4
Char 4 = Flash
die #4
Table 49,
“NOR Flash
Family
Decoder” on
page 101 for
(See
(See
Table 48,
“38F / 48F
Density
Decoder”
on
page 100
PF =
SCSP, RoHS
RD =
SCSP,
Leaded
details)
(See
B=
Bottom
parameter;
Non-Mux I/O
interface
Table 50,
“Voltage /
NOR Flash
CE#
Configurati
on
Decoder”
on
page 101
for details)
(See
Table 51,
“Paramete
r / Mux
Configurati
on
Decoder”
on
page 101
0=
Discrete
Ballout
(See
Table 5
2,
“Ballout
Decoder
” on
page 10
2 for
0=
Original
released
version of
this
product
details)
for details)
for details)
Table 48: 38F / 48F Density Decoder
Code
Datasheet
100
Flash Density
RAM Density
0
No Die
No Die
1
32-Mbit
4-Mbit
2
64-Mbit
8-Mbit
3
128-Mbit
16-Mbit
4
256-Mbit
32-Mbit
5
512-Mbit
64-Mbit
6
1-Gbit
128-Mbit
7
2-Gbit
256-Mbit
8
4-Gbit
512-Mbit
9
8-Gbit
1-Gbit
A
16-Gbit
2-Gbit
B
32-Gbit
4-Gbit
C
64-Gbit
8-Gbit
D
128-Gbit
16-Gbit
E
256-Gbit
32-Gbit
F
512-Gbit
64-Gbit
November 2007
Order Number: 290702-13
Numonyx™ Wireless Flash Memory (W30)
Table 49: NOR Flash Family Decoder
Code
Family
Marketing Name
C
C3
Numonyx Advanced+ Boot Block Flash Memory
J
J3v.D
Numonyx Embedded Flash Memory
L
L18 / L30
Numonyx StrataFlash® Wireless Memory
M
M18
Numonyx StrataFlash® Cellular Memory
P
P30 / P33
Numonyx StrataFalsh® Embedded Memory
W
W18 / W30
Numonyx Wireless Flash Memory
0(zero)
-
No Die
Table 50: Voltage / NOR Flash CE# Configuration Decoder
I/O
Voltage
(Volt)
Code
Core Voltage (Volt)
CE# Configuration
Z
3.0
1.8
Seperate Chip Enable per die
Y
1.8
1.8
Seperate Chip Enable per die
X
3.0
3.0
Seperate Chip Enable per die
V
3.0
1.8
Virtual Chip Enable
U
1.8
1.8
Virtual Chip Enable
T
3.0
3.0
Virtual Chip Enable
R
3.0
1.8
Virtual Address
Q
1.8
1.8
Virtual Address
P
3.0
3.0
Virtual Address
Table 51: Parameter / Mux Configuration Decoder
Code, Mux
Identificati
on
0 = Non Mux
1 = AD Mux1
2= AAD Mux
3 =Full" AD
Mux2
Number of Flash
Die
Any
Bus Width
NA
1
B = Non Mux
C = AD Mux
F = "Full" Ad
Mux
2
3
Flash Die
2
Flash Die
3
Flash Die
4
Notation used for stacks that contain no parameter
blocks
Bottom
-
-
-
Bottom
Top
-
-
Bottom
Bottom
Top
-
4
Bottom
Top
Bottom
Top
2
Bottom
Bottom
-
-
Bottom
Bottom
Top
Top
4
November 2007
Order Number: 290702-13
X16
Flash Die
1
X32
Datasheet
101
Numonyx™ Wireless Flash Memory (W30)
Table 51: Parameter / Mux Configuration Decoder
Code, Mux
Identificati
on
T = Non Mux
U = AD Mux
W = "Full" Ad
Mux
Number of Flash
Die
Bus Width
Flash Die
1
Flash Die
2
Flash Die
3
Flash Die
4
1
Top
-
-
-
2
Top
Bottom
-
-
Top
Top
Bottom
-
Top
Bottom
Top
Bottom
Top
Top
-
-
Top
Top
Bottom
Bottom
3
X16
4
2
4
X32
1. Only Flash is Muxed and RAM is non-Muxed
2. Both Flash and RAM are AD-Muxed
Table 52: Ballout Decoder
Code
0 (Zero)
Datasheet
102
Ballout Definition
SDiscrete ballout (Easay BGA and TSOP)
B
x16D ballout, 105 ball (x16 NOR + NAND + DRAM Share Bus)
C
x16C ballout, 107 ball (x16 NOR + NAND + PSRAM Share Bus)
Q
QUAD/+ ballout, 88 ball (x16 NOR + PSRAM Share Bus)
U
x32SH ballout, 106 ball (x32 NOR only Share Bus)
V
x16SB ballout, 165 ball (x16 NOR / NAND + x16 DRAM Split Bus
W
x48D ballout, 165 ball (x16/x32 NOR + NAND + DRAM Split Bus
November 2007
Order Number: 290702-13