NSC DP8391AV

DP8391A/NS32491A SNI Serial Network Interface
General Description
The DP8391A Serial Network Interface (SNI) provides the
Manchester data encoding and decoding functions for
IEEE 802.3 Ethernet/Cheapernet type local area networks.
The SNI interfaces the DP8390 Network Interface Controller
(NIC) to the Ethernet transceiver cable. When transmitting,
the SNI converts non-return-to-zero (NRZ) data from the
controller and clock pulses into Manchester encoding and
sends the converted data differentially to the transceiver.
The opposite process occurs on the receive path, where a
digital phase-locked loop decodes 10 Mbit/s signals with as
much as g 18 ns of jitter.
The DP8391A SNI is a functionally complete Manchester
encoder/decoder including ECL like balanced driver and receivers, on board crystal oscillator, collision signal translator, and a diagnostic loopback circuit.
The SNI is part of a three chip set that implements the complete IEEE compatible network node electronics as shown
below. The other two chips are the DP8392 Coax Transceiver Interface (CTI) and the DP8390 Network Interface Controller (NIC).
Incorporated into the CTI are the transceiver, collision and
jabber functions. The Media Access Protocol and the buffer
management tasks are performed by the NIC. There is an
isolation requirement on signal and power lines between the
CTI and the SNI. This is usually accomplished by using a set
of miniature pulse transformers that come in a 16-pin plastic
DIP for signal lines. Power isolation, however, is done by
using a DC to DC converter.
Features
Y
Compatible with Ethernet II, IEEE 802.3; 10Base5,
10Base2, and 10Base-T
Y
Y
Y
Y
Y
Y
Y
Y
Y
10 Mb/s Manchester encoding/decoding with receive
clock recovery
Patented digital phase locked loop (DPLL) decoder requires no precision external components
Decodes Manchester data with up to g 18 ns of jitter
Loopback capability for diagnostics
Externally selectable half or full step modes of operation at transmit output
Squelch circuits at the receive and collision inputs reject noise
High voltage protection at transceiver interface (16V)
TTL/MOS compatible controller interface
Connects directly to the transceiver (AUI) cable
Table of Contents
1.0 System Diagram
2.0 Block Diagram
3.0 Functional Description
3.1
Oscillator
3.2
Encoder
3.3
Decoder
3.4
Collision Translator
3.5
Loopback
4.0 Connection Diagrams
5.0 Pin Descriptions
6.0 Absolute Maximum Ratings
7.0 Electrical Characteristics
8.0 Switching Characteristics
9.0 Timing and Load Diagrams
10.0 Physical Dimensions
1.0 System Diagram
IEEE 802.3 Compatible Ethernet/Cheapernet Local Area Network Chip Set
TL/F/9357 – 1
C1995 National Semiconductor Corporation
TL/F/9357
RRD-B30M105/Printed in U. S. A.
DP8391A/NS32491A SNI Serial Network Interface
July 1993
2.0 Block Diagram
TL/F/9357 – 2
FIGURE 1
3.0 Functional Description
the transmitted frequency to exceed its 0.01% tolerance.
The frequency marked on the crystal is usually measured
with a fixed shunt capacitance (CL) that is specified in the
crystal’s data sheet. This capacitance for 20 MHz crystals is
typically 20 pF. The capacitance between the X1 and X2
pins of the SNI, of the PC board traces and the plated
through holes plus any stray capacitance such as the socket capacitance, if one is used, should be estimated or measured. Once the total sum of these capacitances is determined, the value of additional external shunt capacitance
required can be calculated. This capacitor can be a fixed
5% tolerance component. The frequency accuracy should
be measured during the design phase at the transmit clock
pin (TXC) for a given pc layout. Figure 2 shows the crystal
connection.
The SNI consists of five main logical blocks:
a) the oscillatorÐgenerates the 10 MHz transmit clock signal for system timing.
b) the Manchester encoder and differential output driverÐ
accepts NRZ data from the controller, performs Manchester encoding, and transmits it differentially to the
transceiver.
c) the Manchester decoderÐreceives Manchester data
from the transceiver, converts it to NRZ data and clock
pulses, and sends them to the controller.
d) the collision translatorÐindicates to the controller the
presence of a valid 10 MHz signal at its input.
e) the loopback circuitryÐwhen asserted, switches encoded data instead of receive input signals to the digital
phase-locked loop.
3.1 OSCILLATOR
The oscillator is controlled by a 20 MHz parallel resonant
crystal connected between X1 and X2 or by an external
clock on X1. The 20 MHz output of the oscillator is divided
by 2 to generate the 10 MHz transmit clock for the controller. The oscillator also provides internal clock signals to the
encoding and decoding circuits.
TL/F/9357 – 3
CL e Load capacitance specified by the crystal’s manufacturer
CP e Total parasitic capacitance including:
a) SNI input capacitance between X1 and X2 (typically 5 pF)
b) PC board traces, plated through holes, socket capacitances
Crystal Specification
Resonant frequency
20 MHz
g 0.001% at 25§ C
Tolerance
Note 1: When using a Viking (San Jose) VXB49N5 crystal, the external capacitor is not required, as the CL of the crystal matches the input
capacitance of the DP8391A.
FIGURE 2. Crystal Connection
g 0.005% 0–70§ C
Stability
Type
AT-Cut
Circuit
Parallel Resonance
The 20 MHz crystal connection to the SNI requires special
care. The IEEE 802.3 standard requires a 0.01% absolute
accuracy on the transmitted signal frequency. Stray capacitance can shift the crystal’s frequency out of range, causing
3.2 MANCHESTER ENCODER AND DIFFERENTIAL
DRIVER
The encoder combines clock and data information for the
transceiver. Data encoding and transmission begins with the
transmit enable input (TXE) going high. As long as TXE re-
2
3.0 Functional Description (Continued)
carrier sense (CRS) is asserted. Receive data (RXD) and
receive clock (RXC) become available typically within 6 bit
times. At this point the digital phase-locked loop has locked
to the incoming signal. The DP8391A decodes a data frame
with up to g 18 ns of jitter correctly.
The decoder detects the end of a frame when the normal
mid-bit transition on the differential input ceases. Within one
and a half bit times after the last bit, carrier sense is de-asserted. Receive clock stays active for five more bit times
before it goes low and remains low until the next frame.
Figures 7, 8 and 9 illustrate the receive timing.
mains high, transmit data (TXD) is encoded out to the transmit-driver pair (TX g ). The transmit enable and transmit data
inputs must meet the setup and hold time requirements with
respect to the rising edge of transmit clock. Transmission
ends with the transmit enable input going low. The last transition is always positive at the transmit output pair. It will
occur at the center of the bit cell if the last bit is one, or at
the boundary of the bit cell if the last bit is zero.
The differential line driver provides ECL like signals to the
transceiver with typically 5 ns rise and fall times. It can drive
up to 50 meters of twisted pair AUI Ethernet transceiver
cable. These outputs are source followers which need external 270X pulldown resistors to ground. Two different
modes, full-step or half-step, can be selected with SEL input. With SEL low, transmit a is positive with respect to
transmit b in the idle state. With SEL high, transmit a and
transmit b are equal in the idle state, providing zero differential voltage to operate with transformer coupled loads.
Figures 4, 5 and 6 illustrate the transmit timing.
3.4 COLLISION TRANSLATOR
The Ethernet transceiver detects collisions on the coax cable and generates a 10 MHz signal on the transceiver cable.
The SNI’s collision translator asserts the collision detect
output (COL) to the DP8390 controller when a 10 MHz signal is present at the collision inputs. The controller uses this
signal to back off transmission and recycle itself. The collision detect output is de-asserted within 350 ns after the 10
MHz input signal disappears.
The collision differential inputs ( a and b) should be terminated in exactly the same way as the receive inputs. The
collision input also has a squelch circuit that rejects signals
with pulse widths less than 5 ns (negative going), or with
levels less than b175 mV. Figure 10 illustrates the collision
timing.
3.3 MANCHESTER DECODER
The decoder consists of a differential input circuitry and a
digital phase-locked loop to separate Manchester encoded
data stream into clock signals and NRZ data. The differential input should be externally terminated if the standard
78X transceiver drop cable is used. Two 39X resistors connected in series and one optional common mode bypass
capacitor would accomplish this. A squelch circuit at the
input rejects signals with pulse widths less than 5 ns (negative going), or with levels less than b175 mV. Signals more
negative than b300 mV and with a duration greater than
30 ns are always decoded. This prevents noise at the input
from falsely triggering the decoder in the absence of a valid
signal. Once the input exceeds the squelch requirements,
3.5 LOOPBACK FUNCTIONS
Logic high at loopback input (LBK) causes the SNI to route
serial data from the transmit data input, through its encoder,
returning it through the phase-locked-loop decoder to receive data output. In loopback mode, the transmit driver is in
idle state and the receive and collision input circuitries are
disabled.
4.0 Connection Diagram
Top View
*Refer to the Oscillator section
TL/F/9357 – 4
FIGURE 3a
Order Number DP8391AN
See NS Package Number N24C
3
PCC Connection Diagram
TL/F/9357 – 5
*Refer to the Oscillator section
FIGURE 3b
Order Number DP8391AV
NS Package Number V28A
4
5.0 Pin Descriptions
Pin No.
Name
I/O
Description
(DIP)
(PCC)
1
1
COL
O
Collision Detect Output. A TTL/MOS level active high output. A 10 MHz
( a 25% – 15%) signal at the collision input will produce a logic high at COL
output. When no signal is present at the collision input, COL output will go low.
2
2
RXD
O
Receive Data Output. A TTL/MOS level signal. This is the NRZ data output
from the digital phase-locked loop. This signal should be sampled by the
controller at the rising edge of receive clock.
3
3
CRS
O
Carrier Sense. A TTL/MOS level active high signal. It is asserted when valid
data from the transceiver is present at the receive input. It is de-asserted one
and a half bit times after the last bit at receive input.
4
4
RXC
O
Receive Clock. A TTL/MOS level recovered clock. When the phase-locked loop
locks to a valid incoming signal a 10 MHz clock signal is activated on this output.
This output remains low during idle (5 bit times after activity ceases at receive
input).
5
5
SEL
I
Mode Select. A TTL level input. When high, transmit a and transmit b outputs
are at the same voltage in idle state providing a ‘‘zero’’ differential. When low,
transmit a is positive with respect to transmit b in idle state.
6
6–9
GND
7
10
LBK
I
Loopback. A TTL level active high on this input enables the loopback mode.
8
11
X1
I
Crystal or External Frequency Source Input (TTL).
9
12
X2
O
Crystal Feedback Output. This output is used in the crystal connection only. It
must be left open when driving X1 with an external frequency source.
10
13
TXD
I
Transmit Data. A TTL level input. This signal is sampled by the SNI at the rising
edge of transmit clock when transmit enable input is high. The SNI combines
transmit data and transmit clock signals into a Manchester encoded bit stream
and sends it differentially to the transceiver.
11
14
TXC
O
Transmit Clock. A TTL/MOS level 10 MHz clock signal derived from the 20
MHz oscillator. This clock signal is always active.
12
15
TXE
I
Transmit Enable. A TTL level active high data encoder enable input. This signal
is also sampled by the SNI at the rising edge of transmit clock.
13
14
16
17
TXb
TX a
O
Transmit Output. Differential line driver which sends the encoded data to the
transceiver. These outputs are source followers and require 270X pulldown
resistors to GND.
15
16
18
NC
17
19
CAP
18
19
20–23
VCC
20
24
NC
21
22
25
26
RXb
RX a
I
Receive Input. Differential receive input pair from the transceiver.
23
24
27
28
CDb
CD a
I
Collision Input. Differential collision input pair from the transceiver.
Negative Supply Pins.
No Connection.
O
Bypass Capacitor. A ceramic capacitor (greater than 0.001 mF) must be
connected from this pin to GND.
Positive Supply Pins. A 0.1 mF ceramic decoupling capacitor must be
connected across VCC and GND as close to the device as possible.
No Connection.
5
6.0 Absolute Maximum Ratings
Supply Voltage (VCC)
Recommended Operating
Conditions
7V
Input Voltage (TTL)
0 to 5.5V
Supply Voltage (VCC)
5V g 5%
0§ to 70§ C
0§ to 55§ C
Note: Absolute maximum ratings are those values beyond
which the safety of the device cannot be guaranteed. They
are not meant to imply that the device should be operated at
these limits.
b 5.5 to a 16V
Input Voltage (differential)
Output Voltage (differential)
0 to 16V
b 40 mA
Output Current (differential)
b 65§ to 150§ C
Storage Temperature
Lead Temperature (soldering, 10 sec)
300§ C
2.95W*
Package Power Rating for DIP at 25§ C
(PC Board Mounted)
Derate Linearly at the rate of 23.8 mW/§ C
Package Power Rating for PCC at 25§ C
Derate Linearly at the rate of 15.4 mW/§ C
Ambient Temperature (DIP)
(PCC)
1.92W*
*For actual power dissipation of the device please refer to
Section 7.0.
ESD rating
2000V
7.0 Electrical Characteristics
VCC e 5V g 5%, TA e 0§ C to 70§ C for DIP and 0§ C to 55§ C for PCC (Notes 1 & 2)
Symbol
Parameter
Test Conditions
VIH
Input High Voltage (TTL)
VIHX1a
Input High Voltage (X1)
No Series Resistor
VIHX1b
Input High Voltage (X1)
1k Series Resistor
VIL
Input Low Voltage (TTL and X1)
IIH
Input High Current (TTL)
Input High Current (RX g CD g )
IIL
Min
Max
Units
2.0
VCCb1.5
V
2.0
VCC
V
2.0
V
0.8
V
VIN e VCC
VIN e VCC
50
500
mA
mA
Input Low Current (TTL)
Input Low Current (RX g CD g )
VIN e 0.5V
VIN e 0.5V
b 300
b 700
mA
mA
VCL
Input Clamp Voltage (TTL)
IIN e b12 mA
b 1.2
V
VOH
Ouptut High Voltage (TTL/MOS)
IOH e b100 mA
VOL
Output Low Voltage (TTL/MOS)
IOL e 8 mA
IOS
Output Short Circuit Current (TTL/MOS)
VOD
Differential Output Voltage (TX g )
78X termination, and
270X from each to GND
VOB
Diff. Output Voltage Imbalance (TX g )
same as above
VDS
Diff. Squelch Threshold (RX g CD g )
VCM
Diff. Input Common Mode Voltage (RX g CD g )
ICC
Power Supply Current
3.5
V
0.5
V
b 40
b 200
mA
g 550
g 1200
mV
g 40
mV
b 175
b 300
mV
b 5.25
5.25
V
270
mA
10Mbit/s
8.0 Switching Characteristics VCC e 5V g 5%, TA e 0§ C to 70§ C for DIP and 0§ C to 55§ C for PCC (Note 2)
Symbol
Parameter
Figure
Min
Typ
Max
Units
OSCILLATOR SPECIFICATION
tXTH
X1 to Transmit Clock High
12
8
20
ns
tXTL
X1 to Transmit Clock Low
12
8
20
ns
42
TRANSMIT SPECIFICATION
tTCd
Transmit Clock Duty Cycle at 50% (10 MHz)
12
tTCr
Transmit Clock Rise Time (20% to 80%)
12
tTCf
Transmit Clock Fall Time (80% to 20%)
tTDs
Transmit Data Setup Time to Transmit Clock Rising Edge
4 & 12
20
ns
tTDh
Transmit Data Hold Time from Transmit Clock Rising Edge
4 & 12
0
ns
tTEs
Transmit Enable Setup Time to Trans. Clock Rising Edge
4 & 12
20
ns
tTEh
Transmit Enable Hold Time from Trans. Clock Rising Edge
5 & 12
0
ns
12
50
58
%
8
ns
8
ns
Note 1: All currents into device pins are positive, all currents out of device pins are negative. All voltages are referenced to ground unless otherwise specified.
Note 2: All typicals are given for VCC e 5V and TA e 25§ C.
6
8.0 Switching Characteristics
VCC e 5V g 5%, TA e 0§ C to 70§ C for DIP and 0§ C to 55§ C for PCC (Note 2) (Continued)
Symbol
Parameter
Figure
Min
Typ
Max
Units
TRANSMIT SPECIFICATION (Continued)
tTOd
Transmit Output Delay from Transmit Clock Rising Edge
tTOr
Transmit Output Rise Time (20% to 80%)
4 & 12
50
ns
12
7
ns
tTOf
Transmit Output Fall Time (80% to 20%)
12
tTOj
Transmit Output Jitter
12
tTOh
Transmit Output High Before Idle in Half Step Mode
5 & 12
tTOi
Transmit Output Idle Time in Half Step Mode
5 & 12
7
g 0.25
ns
ns
200
ns
800
ns
RECEIVE SPECIFICATION
tRCd
Receive Clock Duty Cycle at 50% (10 MHz)
12
60
%
tRCr
Receive Clock Rise Time (20% to 80%)
12
8
ns
tRCf
Receive Clock Fall Time (80% to 20%)
12
8
ns
tRDr
Receive Data Rise Time (20% to 80%)
12
8
ns
tRDf
Receive Data Fall Time (80% to 20%)
12
8
tRDs
Receive Data Stable from Receive Clock Rising Edge
tCSon
Carrier Sense Turn On Delay
7 & 12
50
ns
tCSoff
Carrier Sense Turn Off Delay
8, 9 & 12
160
ns
tDAT
Decoder Acquisition Time
7
1.80
ms
tDrej
Differential Inputs Rejection Pulse Width (Squelch)
7
30
ns
tRd
Receive Throughput Delay
150
ns
7 & 12
40
50
g 40
0.6
5
8 & 12
ns
ns
COLLISION SPECIFICATION
tCOLon
Collision Turn On Delay
10 & 12
50
ns
tCOLoff
Collision Turn Off Delay
10 & 12
350
ns
LOOPBACK SPECIFICATION
tLBs
Loopback Setup Time
11
20
ns
tLBh
Loopback Hold Time
11
0
ns
Note 2: All typicals are given for VCC e 5V and TA e 25§ C.
9.0 Timing and Load Diagrams
TL/F/9357 – 6
FIGURE 4. Transmit Timing - Start of Transmission
7
9.0 Timing and Load Diagrams (Continued)
TL/F/9357 – 7
FIGURE 5. Transmit Timing - End of Transmission (last bit e 0)
TL/F/9357 – 8
FIGURE 6. Transmit Timing - End of Transmission (last bit e 1)
8
9.0 Timing and Load Diagrams (Continued)
TL/F/9357 – 9
FIGURE 7. Receive Timing - Start of Packet
TL/F/9357 – 10
FIGURE 8. Receive Timing - End of Packet (last bit e 0)
9
9.0 Timing and Load Diagrams (Continued)
TL/F/9357 – 11
FIGURE 9. Receive Timing - End of Packet (last bit e 1)
TL/F/9357 – 12
FIGURE 10. Collision Timing
TL/F/9357 – 13
FIGURE 11. Loopback Timing
TL/F/9357 – 14
*27 mH transformer is used for testing purposes, 100 mH transformers (Valor, LT1101, or Pulse Engineering 64103) are recommended for application use.
FIGURE 12. Test Loads
10
10.0 Physical Dimensions inches (millimeters)
Molded Dual in Line Pkg (N)
Order Number DP8391AN
NS Package Number N24C
11
DP8391A/NS32491A SNI Serial Network Interface
10.0 Physical Dimensions inches (millimeters) (Continued)
Lit. Ý103053
Plastic Chip Carrier (V)
Order Number DP8391AV
NS Package Number V28A
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