NSC LM4765T

LM4765 Overture™
Audio Power Amplifier Series Dual 30W Audio Power
Amplifier with Mute and Standby Modes
General Description
Key Specifications
The LM4765 is a stereo audio amplifier capable of delivering
typically 30W per channel of continuous average output
power into an 8Ω load with less than 0.1% (THD + N).
j
Each amplifier has an independent smooth transition fade-in/
out mute and a power conserving standby mode which can
be controlled by external logic.
The performance of the LM4765, utilizing its Self Peak Instantaneous Temperature (˚Ke) (SPiKe™) Protection Circuitry, places it in a class above discrete and hybrid amplifiers by providing an inherently, dynamically protected Safe
Operating Area (SOA). SPiKe Protection means that these
parts are safeguarded at the output against overvoltage, undervoltage, overloads, including thermal runaway and instantaneous temperature peaks.
THD+N at 1 kHz at 2 x 25W continuous average
output power into 8Ω:
j
j
0.1% (max)
THD+N at 1 kHz at continuous average
output power of 2 x 30W into 8Ω:
0.009% (typ)
Standby current:
6.5 mA (typ)
Features
n
n
n
n
n
SPiKe Protection
Minimal amount of external components necessary
Quiet fade-in/out mute mode
Standby-mode
Non-Isolated 15-lead TO-220 package
Applications
n High-end stereo TVs
n Component stereo
n Compact stereo
Typical Application
Connection Diagram
Plastic Package
DS100927-2
DS100927-1
Top View
Non-Isolated Package
Order Number LM4765T
See NS Package Number TA15A
FIGURE 1. Typical Audio Amplifier Application Circuit
Note: Numbers in parentheses represent pinout for amplifier B.
*Optional component dependent upon specific design requirements.
SPiKe™ Protection and Overture™ are trademarks of National Semiconductor Corporation.
© 1999 National Semiconductor Corporation
DS100927
www.national.com
LM4765 Overture™ Audio Power Amplifier Series
Dual 30W Audio Power Amplifier with Mute and Standby Modes
August 1998
Absolute Maximum Ratings (Notes 5, 4)
Junction Temperature (Note 8)
Thermal Resistance
Non-Isolated T-Package
θJC
Soldering Information
T Package (10 sec.)
Storage Temperature
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage |VCC| + |VEE|
(No Input)
Supply Voltage |VCC| + |VEE|
(with Input)
Common Mode Input Voltage
Differential Input Voltage
Output Current
Power Dissipation (Note 6)
ESD Susceptability (Note 7)
66V
64V
(VCC or VEE) and
|VCC| + |VEE| ≤ 60V
60V
Internally Limited
62.5W
2000V
150˚C
1˚C/W
260˚C
−40˚C to +150˚C
Operating Ratings (Notes 4, 5)
Temperature Range
TMIN ≤ TA ≤ TMAX
Supply Voltage |VCC| + |VEE|(Note 1)
−20˚C ≤ TA ≤ +85˚C
20V to 64V
Electrical Characteristics (Notes 4, 5)
The following specifications apply for VCC = +28V, VEE = −28V with RL = 8Ω unless otherwise specified. Limits apply for TA =
25˚C.
Symbol
Parameter
Conditions
GND − VEE ≥ 9V
|VCC| +
Power Supply Voltage
|VEE|
(Note 11)
PO
Output Power
(Note 3)
(Continuous Average)
THD + N = 0.1% (max),
f = 1 kHz
Total Harmonic Distortion
|VCC| = |VEE| = 28V, RL = 8Ω
|VCC| = |VEE| = 20V, RL = 4Ω
30 W/ch, RL = 8Ω
THD + N
LM4765
Limit
(Note 9)
(Note 10)
18
20
V (min)
64
V (max)
30
25
W/ch (min)
22
15
W/ch (min)
0.08
%
%
Plus Noise
15 W/ch, RL = 4Ω, |VCC| = |VEE| = 20V
20 Hz ≤ f ≤ 20 kHz, AV = 26 dB
0.1
Xtalk
Channel Separation
Slew Rate
f = 1 kHz, VO = 10.9 Vrms
VIN = 1.414 Vrms, trise = 2 ns
80
SR
(Note 3)
Itotal
Total Quiescent Power
(Note 2)
Supply Current
VOS
(Note 2)
Input Offset Voltage
IB
Input Bias Current
IOS
Input Offset Current
IO
Output Current Limit
VOD
Output Dropout Voltage
(Note 2)
(Note 12)
PSRR
Power Supply Rejection Ratio
CMRR
12
V/µs (min)
Standby: Off
50
80
mA (max)
Standby: On
VCM = 0V, IO = 0 mA
6.5
8
mA (max)
2.0
15
mV (max)
Both Amplifiers VCM = 0V,
VO = 0V, IO = 0 mA
VCM = 0V, IO = 0 mA
VCM = 0V, IO = 0 mA
|VCC| = |VEE| = 10V, tON = 10 ms,
VO = 0V
|VCC–VO|, VCC = 20V, IO = +100 mA
|VO–VEE|, VEE = −20V, IO = −100 mA
VCC = 30V to 10V, VEE = −30V,
0.2
0.5
µA (max)
0.002
0.2
µA (max)
3.5
2.9
Apk (min)
1.8
2.3
V (max)
2.5
3.2
V (max)
115
85
dB (min)
110
85
dB (min)
Common Mode Rejection Ratio
VCC = 35V to 10V, VEE = −10V to −35V,
VCM = 10V to −10V, IO = 0 mA
110
80
dB (min)
Open Loop Voltage Gain
RL = 2 kΩ, ∆ VO = 30V
110
90
dB (min)
(Note 2)
AVOL
(Note 2)
dB
18
VCM = 0V, IO = 0 mA
VCC = 30V, VEE = −30V to −10V
VCM = 0V, IO = 0 mA
(Note 2)
Units
(Limits)
Typical
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2
Electrical Characteristics (Notes 4, 5)
(Continued)
The following specifications apply for VCC = +28V, VEE = −28V with RL = 8Ω unless otherwise specified. Limits apply for TA =
25˚C.
Symbol
Parameter
Conditions
LM4765
Typical
Limit
Units
(Limits)
(Note 9)
(Note 10)
GBWP
Gain Bandwidth Product
fO = 100 kHz, VIN = 50 mVrms
7.5
5
MHz (min)
eIN
Input Noise
IHF — A Weighting Filter
RIN = 600Ω (Input Referred)
2.0
8
µV (max)
Signal-to-Noise Ratio
PO = 1W, A — Weighted,
Measured at 1 kHz, RS = 25Ω
PO = 25W, A — Weighted
98
dB
108
dB
(Note 3)
SNR
Measured at 1 kHz, RS = 25Ω
AM
Mute Attenuation
Pin 6,11 at 2.5V
115
VIL
Standby Low Input Voltage
Not in Standby Mode
VIH
Standby High Input Voltage
In Standby Mode
VIL
Mute Low Input Voltage
Outputs Not Muted
VIH
Mute High Input Voltage
Outputs Muted
80
dB (min)
0.8
V (max)
2.5
V (min)
0.8
V (max)
2.5
V (min)
Standby
Pin
2.0
Mute pin
2.0
Note 1: Operation is guaranteed up to 64V, however, distortion may be introduced from SPiKe Protection Circuitry if proper thermal considerations are not taken into
account. Refer to the Application Information section for a complete explanation.
Note 2: DC Electrical Test; Refer to Test Circuit #1.
Note 3: AC Electrical Test; Refer to Test Circuit #2.
Note 4: All voltages are measured with respect to the GND pins (5, 10), unless otherwise specified.
Note 5: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.
Note 6: For operating at case temperatures above 25˚C, the device must be derated based on a 150˚C maximum junction temperature and a thermal resistance of
θJC = 1˚C/W for the T package. Refer to the section Determining the Correct Heat Sink in the Application Information section.
Note 7: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 8: The operating junction temperature maximum is 150˚C, however, the instantaneous Safe Operating Area temperature is 250˚C.
Note 9: Typicals are measured at 25˚C and represent the parametric norm.
Note 10: Limits are guarantees that all parts are tested in production to meet the stated values.
Note 11: VEE must have at least −9V at its pin with reference to ground in order for the under-voltage protection circuitry to be disabled. In addition, the voltage differential between VCC and VEE must be greater than 14V.
Note 12: The output dropout voltage, VOD, is the supply voltage minus the clipping voltage. Refer to the Clipping Voltage vs. Supply Voltage graph in the Typical Performance Characteristics section.
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Test Circuit #1
(Note 2) (DC Electrical Test Circuit)
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Test Circuit #2
(Note 3) (AC Electrical Test Circuit)
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Bridged Amplifier Application Circuit
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FIGURE 2. Bridged Amplifier Application Circuit
Single Supply Application Circuit
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FIGURE 3. Single Supply Amplifier Application Circuit
Note: *Optional components dependent upon specific design requirements.
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Auxiliary Amplifier Application Circuit
DS100927-7
FIGURE 4. Special Audio Amplifier Application Circuit
Equivalent Schematic
(excluding active protection circuitry)
LM4765 (One Channel Only)
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External Components Description
Components
1
Functional Description
RB
Prevents currents from entering the amplifier’s non-inverting input which may be passed through to the
load upon power down of the system due to the low input impedance of the circuitry when the
undervoltage circuitry is off. This phenomenon occurs when the supply voltages are below 1.5V.
2
Ri
Inverting input resistance to provide AC gain in conjunction with Rf.
3
Rf
Feedback resistance to provide AC gain in conjunction with Ri.
4
Ci
(Note 13)
Feedback capacitor which ensures unity gain at DC. Also creates a highpass filter with Ri at fC =
1/(2πRiCi).
5
CS
Provides power supply filtering and bypassing. Refer to the Supply Bypassing application section for
proper placement and selection of bypass capacitors.
6
RV
(Note 13)
Acts as a volume control by setting the input voltage level.
7
RIN
(Note 13)
Sets the amplifier’s input terminals DC bias point when CIN is present in the circuit. Also works with CIN to
create a highpass filter at fC = 1/(2πRINCIN). Refer to Figure 4.
8
CIN
(Note 13)
Input capacitor which blocks the input signal’s DC offsets from being passed onto the amplifier’s inputs.
9
RSN
(Note 13)
Works with CSN to stabilize the output stage by creating a pole that reduces high frequency instabilities.
10
CSN
(Note 13)
Works with RSN to stabilize the output stage by creating a pole that reduces high frequency instabilities.
The pole is set at fC = 1/(2πRSNCSN). Refer to Figure 4.
11
L (Note 13)
12
R (Note 13)
Provides high impedance at high frequencies so that R may decouple a highly capacitive load and reduce
the Q of the series resonant circuit. Also provides a low impedance at low frequencies to short out R and
pass audio signals to the load. Refer to Figure 4.
13
RA
Provides DC voltage biasing for the transistor Q1 in single supply operation.
14
CA
Provides bias filtering for single supply operation.
15
RINP
(Note 13)
Limits the voltage difference between the amplifier’s inputs for single supply operation. Refer to the Clicks
and Pops application section for a more detailed explanation of the function of RINP.
16
RBI
Provides input bias current for single supply operation. Refer to the Clicks and Pops application section
for a more detailed explanation of the function of RBI.
17
RE
Establishes a fixed DC current for the transistor Q1 in single supply operation. This resistor stabilizes the
half-supply point along with CA.
Note 13: Optional components dependent upon specific design requirements.
Typical Performance Characteristics
THD + N vs Frequency
THD + N vs Frequency
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THD + N vs Frequency
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Typical Performance Characteristics
THD + N vs
Output Power
(Continued)
THD + N vs
Output Power
THD + N vs
Output Power
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Clipping Voltage vs
Supply Voltage
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Clipping Voltage vs
Supply Voltage
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Output Power vs
Load Resistance
Clipping Voltage vs
Supply Voltage
DS100927-23
Power Dissipation vs
Output Power
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Power Dissipation vs
Output Power
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Typical Performance Characteristics
Output Power vs
Supply Voltage
(Continued)
Output Mute vs
Mute Pin Voltage
Output Mute vs
Mute Pin Voltage
DS100927-28
Channel Separation vs
Frequency
DS100927-29
Pulse Response
Large Signal Response
DS100927-32
DS100927-31
Power Supply
Rejection Ratio
DS100927-30
Common-Mode
Rejection Ratio
DS100927-33
Open Loop
Frequency Response
DS100927-34
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Typical Performance Characteristics
Safe Area
(Continued)
SPiKe Protection
Response
DS100927-38
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Pulse Thermal
Resistance
Pulse Thermal
Resistance
Pulse Power Limit
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Supply Current vs
Output Voltage
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Pulse Power Limit
DS100927-43
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Supply Current vs
Supply Voltage
Supply Current vs
Case Temperature
DS100927-44
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Typical Performance Characteristics
Supply Current (ICC) vs
Standby Pin Voltage
(Continued)
Supply Current (IEE) vs
Standby Pin Voltage
Input Bias Current vs
Case Temperature
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Application Information
tween the thermal shutdown temperature limits of 165˚C and
155˚C. This greatly reduces the stress imposed on the IC by
thermal cycling, which in turn improves its reliability under
sustained fault conditions.
MUTE MODE
By placing a logic-high voltage on the mute pins, the signal
going into the amplifiers will be muted. If the mute pins are
left floating or connected to a logic-low voltage, the amplifiers will be in a non-muted state. There are two mute pins,
one for each amplifier, so that one channel can be muted
without muting the other if the application requires such a
configuration. Refer to the Typical Performance Characteristics section for curves concerning Mute Attenuation vs
Mute Pin Voltage.
Since the die temperature is directly dependent upon the
heat sink used, the heat sink should be chosen such that
thermal shutdown will not be reached during normal operation. Using the best heat sink possible within the cost and
space constraints of the system will improve the long-term
reliability of any power semiconductor device, as discussed
in the Determining the Correct Heat Sink Section.
STANDBY MODE
DETERMlNlNG MAXIMUM POWER DISSIPATION
The standby mode of the LM4765 allows the user to drastically reduce power consumption when the amplifiers are
idle. By placing a logic-high voltage on the standby pins, the
amplifiers will go into Standby Mode. In this mode, the current drawn from the VCC supply is typically less than 10 µA
total for both amplifiers. The current drawn from the VEE supply is typically 4.2 mA. Clearly, there is a significant reduction
in idle power consumption when using the standby mode.
There are two Standby pins, so that one channel can be put
in standby mode without putting the other amplifier in
standby if the application requires such flexibility. Refer to
the Typical Performance Characteristics section for
curves showing Supply Current vs. Standby Pin Voltage for
both supplies.
Power dissipation within the integrated circuit package is a
very important parameter requiring a thorough understanding if optimum power output is to be obtained. An incorrect
maximum power dissipation calculation may result in inadequate heat sinking causing thermal shutdown and thus limiting the output power.
Equation (1) exemplifies the theoretical maximum power dissipation point of each amplifier where VCC is the total supply
voltage.
PDMAX = VCC2/2π2RL
(1)
Thus by knowing the total supply voltage and rated output
load, the maximum power dissipation point can be calculated. The package dissipation is twice the number which results from Equation (1) since there are two amplifiers in each
LM4765. Refer to the graphs of Power Dissipation versus
Output Power in the Typical Performance Characteristics
section which show the actual full range of power dissipation
not just the maximum theoretical point that results from
Equation (1).
UNDER-VOLTAGE PROTECTION
Upon system power-up, the under-voltage protection circuitry allows the power supplies and their corresponding capacitors to come up close to their full values before turning
on the LM4765 such that no DC output spikes occur. Upon
turn-off, the output of the LM4765 is brought to ground before the power supplies such that no transients occur at
power-down.
DETERMINING THE CORRECT HEAT SINK
The choice of a heat sink for a high-power audio amplifier is
made entirely to keep the die temperature at a level such
that the thermal protection circuitry does not operate under
normal circumstances.
The thermal resistance from the die (junction) to the outside
air (ambient) is a combination of three thermal resistances,
θJC, θCS, and θSA. In addition, the thermal resistance, θJC
(junction to case), of the LM4765 is 1˚C/W. Using Thermalloy
Thermacote thermal compound, the thermal resistance, θCS
(case to sink), is about 0.2˚C/W. Since convection heat flow
(power dissipation) is analogous to current flow, thermal resistance is analogous to electrical resistance, and temperature drops are analogous to voltage drops, the power dissipation out of the LM4765 is equal to the following:
PDMAX = (TJMAX−TAMB)/θJA
(2)
where TJMAX = 150˚C, TAMB is the system ambient temperature and θJA = θJC + θCS + θSA.
OVER-VOLTAGE PROTECTION
The LM4765 contains over-voltage protection circuitry that
limits the output current to approximately 3.5 Apk while also
providing voltage clamping, though not through internal
clamping diodes. The clamping effect is quite the same,
however, the output transistors are designed to work alternately by sinking large current spikes.
SPiKe PROTECTION
The
LM4765
is
protected
from
instantaneous
peak-temperature stressing of the power transistor array.
The Safe Operating graph in the Typical Performance
Characteristics section shows the area of device operation
where SPiKe Protection Circuitry is not enabled. The waveform to the right of the SOA graph exemplifies how the dynamic protection will cause waveform distortion when enabled. Please refer to AN-898 for more detailed information.
THERMAL PROTECTION
The LM4765 has a sophisticated thermal protection scheme
to prevent long-term thermal stress of the device. When the
temperature on the die reaches 165˚C, the LM4765 shuts
down. It starts operating again when the die temperature
drops to about 155˚C, but if the temperature again begins to
rise, shutdown will occur again at 165˚C. Therefore, the device is allowed to heat up to a relatively high temperature if
the fault condition is temporary, but a sustained fault will
cause the device to cycle in a Schmitt Trigger fashion bewww.national.com
DS100927-52
Once the maximum package power dissipation has been
calculated using Equation (1), the maximum thermal resistance, θSA, (heat sink to ambient) in ˚C/W for a heat sink can
be calculated. This calculation is made using Equation (3)
which is derived by solving for θSA in Equation (2).
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Application Information
SINGLE-SUPPLY AMPLIFIER APPLICATION
The typical application of the LM4765 is a split supply amplifier. But as shown in Figure 3, the LM4765 can also be used
in a single power supply configuration. This involves using
some external components to create a half-supply bias
which is used as the reference for the inputs and outputs.
Thus, the signal will swing around half-supply much like it
swings around ground in a split-supply application. Along
with proper circuit biasing, a few other considerations must
be accounted for to take advantage of all of the LM4765
functions.
The LM4765 possesses a mute and standby function with internal logic gates that are half-supply referenced. Thus, to
enable either the Mute or Standby function, the voltage at
these pins must be a minimum of 2.5V above half-supply. In
single-supply systems, devices such as microprocessors
and simple logic circuits used to control the mute and
standby functions, are usually referenced to ground, not
half-supply. Thus, to use these devices to control the logic
circuitry of the LM4765, a “level shifter,” like the one shown in
Figure 5, must be employed. A level shifter is not needed in
a split-supply configuration since ground is also half-supply.
(Continued)
θSA = [(TJMAX−TAMB)−PDMAX(θJC +θCS)]/PDMAX (3)
Again it must be noted that the value of θSA is dependent
upon the system designer’s amplifier requirements. If the
ambient temperature that the audio amplifier is to be working
under is higher than 25˚C, then the thermal resistance for the
heat sink, given all other things are equal, will need to be
smaller.
SUPPLY BYPASSING
The LM4765 has excellent power supply rejection and does
not require a regulated supply. However, to improve system
performance as well as eliminate possible oscillations, the
LM4765 should have its supply leads bypassed with
low-inductance capacitors having short leads that are located close to the package terminals. Inadequate power
supply bypassing will manifest itself by a low frequency oscillation known as “motorboating” or by high frequency instabilities. These instabilities can be eliminated through multiple
bypassing utilizing a large tantalum or electrolytic capacitor
(10 µF or larger) which is used to absorb low frequency
variations and a small ceramic capacitor (0.1 µF) to prevent
any high frequency feedback through the power supply lines.
If adequate bypassing is not provided, the current in the supply leads which is a rectified component of the load current
may be fed back into internal circuitry. This signal causes
distortion at high frequencies requiring that the supplies be
bypassed at the package terminals with an electrolytic capacitor of 470 µF or more.
BRIDGED AMPLIFIER APPLICATION
The LM4765 has two operational amplifiers internally, allowing for a few different amplifier configurations. One of these
configurations is referred to as “bridged mode” and involves
driving the load differentially through the LM4765’s outputs.
This configuration is shown in Figure 2. Bridged mode operation is different from the classical single-ended amplifier
configuration where one side of its load is connected to
ground.
A bridge amplifier design has a distinct advantage over the
single-ended configuration, as it provides differential drive to
the load, thus doubling output swing for a specified supply
voltage. Consequently, theoretically four times the output
power is possible as compared to a single-ended amplifier
under the same conditions. This increase in attainable output
power assumes that the amplifier is not current limited or
clipped.
A direct consequence of the increased power delivered to
the load by a bridge amplifier is an increase in internal power
dissipation. For each operational amplifier in a bridge configuration, the internal power dissipation will increase by a
factor of two over the single ended dissipation. Thus, for an
audio power amplifier such as the LM4765, which has two
operational amplifiers in one package, the package dissipation will increase by a factor of four. To calculate the
LM4765’s maximum power dissipation point for a bridged
load, multiply Equation (1) by a factor of four.
This value of PDMAX can be used to calculate the correct size
heat sink for a bridged amplifier application. Since the internal dissipation for a given power supply and load is increased by using bridged-mode, the heatsink’s θSA will have
to decrease accordingly as shown by Equation (3). Refer to
the section, Determining the Correct Heat Sink, for a more
detailed discussion of proper heat sinking for a given application.
DS100927-12
FIGURE 5. Level Shift Circuit
When the voltage at the Logic Input node is 0V, the 2N3904
is “off” and thus resistor Rc pulls up mute or standby input to
the supply. This enables the mute or standby function. When
the Logic Input is 5V, the 2N3904 is “on” and consequently,
the voltage at the collector is essentially 0V. This will disable
the mute or standby function, and thus the amplifier will be in
its normal mode of operation. Rshift, along with Cshift, creates
an RC time constant that reduces transients when the mute
or standby functions are enabled or disabled. Additionally,
Rshift limits the current supplied by the internal logic gates of
the LM4765 which insures device reliability. Refer to the
Mute Mode and Standby Mode sections in the Application
Information section for a more detailed description of these
functions.
CLICKS AND POPS
In the typical application of the LM4765 as a split-supply audio power amplifier, the IC exhibits excellent “click” and “pop”
performance when utilizing the mute and standby modes. In
addition, the device employs Under-Voltage Protection,
which eliminates unwanted power-up and power-down transients. The basis for these functions are a stable and constant half-supply potential. In a split-supply application,
ground is the stable half-supply potential. But in a
single-supply application, the half-supply needs to charge up
just like the supply rail, VCC. This makes the task of attaining
a clickless and popless turn-on more challenging. Any uneven charging of the amplifier inputs will result in output
clicks and pops due to the differential input topology of the
LM4765.
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Application Information
loaded voltage which is usually about 15% higher. The supply voltage will also rise 10% during high line conditions.
Therefore the maximum supply voltage is obtained from the
following equation.
Max supplies ≈ ± (VOPEAK + VOD) (1 + regulation) (1.1)
(Continued)
To achieve a transient free power-up and power-down, the
voltage seen at the input terminals should be ideally the
same. Such a signal will be common-mode in nature, and
will be rejected by the LM4765. In Figure 3, the resistor RINP
serves to keep the inputs at the same potential by limiting the
voltage difference possible between the two nodes. This
should significantly reduce any type of turn-on pop, due to an
uneven charging of the amplifier inputs. This charging is
based on a specific application loading and thus, the system
designer may need to adjust these values for optimal performance.
As shown in Figure 3, the resistors labeled RBI help bias up
the LM4765 off the half-supply node at the emitter of the
2N3904. But due to the input and output coupling capacitors
in the circuit, along with the negative feedback, there are two
different values of RBI, namely 10 kΩ and 200 kΩ. These resistors bring up the inputs at the same rate resulting in a popless turn-on. Adjusting these resistors values slightly may reduce pops resulting from power supplies that ramp
extremely quick or exhibit overshoot during system turn-on.
For 15W of output power into an 8Ω load, the required
VOPEAK is 15.49V. A minimum supply rail of 20.5V results
from adding VOPEAK and VOD. With regulation, the maximum
supplies are ± 26V and the required IOPEAK is 1.94A from
Equation (5). It should be noted that for a dual 15W amplifier
into an 8Ω load the IOPEAK drawn from the supplies is twice
1.94 Apk or 3.88 Apk. At this point it is a good idea to check
the Power Output vs Supply Voltage to ensure that the required output power is obtainable from the device while
maintaining low THD+N. In addition, the designer should
verify that with the required power supply voltage and load
impedance, that the required heatsink value θSA is feasible
given system cost and size constraints. Once the heatsink
issues have been addressed, the required gain can be determined from Equation (6).
(6)
From Equation (6), the minimum AV is: AV ≥ 11.
By selecting a gain of 21, and with a feedback resistor, Rf =
20 kΩ, the value of Ri follows from Equation (7).
(7)
Ri = Rf (AV − 1)
Thus with Ri = 1 kΩ a non-inverting gain of 21 will result.
Since the desired input impedance was 47 kΩ, a value of
47 kΩ was selected for RIN. The final design step is to address the bandwidth requirements which must be stated as a
pair of −3 dB frequency points. Five times away from a −3 dB
point is 0.17 dB down from passband response which is better than the required ± 0.25 dB specified. This fact results in
a low and high frequency pole of 4 Hz and 100 kHz respectively. As stated in the External Components section, Ri in
conjunction with Ci create a high-pass filter.
use 39 µF.
Ci ≥ 1/(2π * 1 kΩ * 4 Hz) = 39.8 µF;
The high frequency pole is determined by the product of the
desired high frequency pole, fH, and the gain, AV. With a
AV = 21 and fH = 100 kHz, the resulting GBWP is 2.1 MHz,
which is less than the guaranteed minimum GBWP of the
LM4765 of 5 MHz. This will ensure that the high frequency
response of the amplifier will be no worse than 0.17 dB down
at 20 kHz which is well within the bandwidth requirements of
the design.
AUDIO POWER AMPLlFIER DESIGN
Design a 15W/8Ω Audio Amplifier
Given:
Power Output
Load Impedance
Input Level
Input Impedance
15 Wrms
8Ω
1 Vrms(max)
47 kΩ
Bandwidth
20 Hz−20 kHz
± 0.25 dB
A designer must first determine the power supply requirements in terms of both voltage and current needed to obtain
the specified output power. VOPEAK can be determined from
Equation (4) and IOPEAK from Equation (5).
(4)
(5)
To determine the maximum supply voltage the following conditions must be considered. Add the dropout voltage to the
peak output swing VOPEAK, to get the supply rail at a current
of IOPEAK. The regulation of the supply determines the un-
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14
LM4765 Overture™ Audio Power Amplifier Series
Dual 30W Audio Power Amplifier with Mute and Standby Modes
Physical Dimensions
inches (millimeters) unless otherwise noted
Non-Isolated TO-220 15-Lead Package
Order Number LM4765T
NS Package Number TA15A
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