Double Sided (Silver / Copper) Polymer Through Hole Board 䂓Features Significant cost reduction is possible by replacing copper plating through-hole PWB with polymer through-hole PWB. High density circuit design is widely available. Double sided surface mount PWB is available by using polymer through-hole PWB. Highly reliable PWB is realized by using polymer through-holes on paper phenolic board. 䂓Construction 㽲 㽴 㽳 㽷 No. 㽲 㽳 㽴 Name Base Copper Foil Through-hole No. 㽵 㽶 㽷 䂓Design Requirement B C E Copper Foil F Name Solder Resist Covercoat & Marking Through-hole Pitch Through-hole Pitch:A 1.00 1.25 1.50 1.75 2.00 2.50 A D Through-hole 㽶 㽵 (mm) C 0.80 1.00 1.20 1.40 1.50 2.00 D 0.20 0.25 0.30 0.35 0.50 0.50 E 0.25 0.25 0.30 0.40 0.50 0.50 F 0.20 0.20 0.20 0.20 0.20 0.20 G 0.20 0.20 0.20 0.20 0.20 0.20 G 䂓Specification Item Material of Base Through-hole Ambient Temperature Through-hole Resistance Rated Current Max. Operation Voltage Specification AgTh Condition CuTh FR-1, CEM-3 Conductive Resin Copper paste through-hole pitch: Silver Paste Copper Paste -30 ~ +100㷄 100m㱅/hole 300mA/hole 100m㱅/hole 300mA/hole 50V *(20V) 100V Min. 1.25mm Less than 1.25mm pitch:250mA/hole Different electric potential Voltage (*Applied less than 1.25mm pitch) Load Life 200m㱅/hole 200m㱅/hole Humidity Load Life 200m㱅/hole 200m㱅/hole 40㷄 90~ 95%RH 1000Hr High Temperature 200m㱅/hole 200m㱅/hole 100㷄 1000Hr 70㷄 1000Hr Humidity 200m㱅/hole 200m㱅/hole 40㷄 90~ 95%RH 1000Hr Solder Dipping 200m㱅/hole 200m㱅/hole 260㷄 5sec. Reflow 200m㱅/hole 200m㱅/hole 240㷄 3sec. Migration 200m㱅/hole 200m㱅/hole 40㷄 90 ~ 95%RH 1000Hr Oil Dipping 200m㱅/hole 200m㱅/hole 260㷄 10sec 100 Cycle Heat Cycle 200m㱅/hole 200m㱅/hole -40㷄 100㷄 30min. 100 cycle HOKURIKU Specifications are subject to change without notice. 1 Double Sided (Silver / Copper) Polymer Through Hole Board Characteristic (Reference Data) Ag Th : Ag Paste (1.5mm pitch , FR-1 , t=1.6mm) Cu Th : Copper Paste (1.5mm pitch , FR-1 , t=1.6mm ) Humidity Test (60㷄 90䌾95%Rh) High Temp. Test (100㷄) 250 250 Through-hole Resistance (m㱅/2hole) Through-hole Resistance (m㱅/2hole) Ag Th 200 Cu Th 150 100 50 Ag Th Cu Th 200 150 100 50 0 0 0 250 500 750 1000 0 250 Time (Hr) 500 750 Humidity Load Life (40㷄 90䌾95%Rh 300mA) Load Life (70㷄 300mA) 250 250 200 Ag Th Through-hole Resistance (m㱅/2hole) Through-hole Resistance (m㱅/2hole) Ag Th Cu Th 150 100 50 Cu Th 200 150 100 50 0 0 0 250 500 750 1000 0 250 Time (Hr) 500 750 1000 Time (Hr) Migration (60㷄 90䌾95%Rh DC100V) Migration (40㷄 90䌾95%Rh DC50V)䇭 1.E+13 1.E+13 Ag Th Ag Th InsulationResistance (㱅) InsulationResistance (㱅) 1000 Time (Hr) 1.E+12 1.E+11 1.E+10 1.E+09 1.E+12 Cu Th 1.E+11 1.E+10 1.E+09 1.E+08 1.E+08 1.E+07 1.E+07 0 500 1000 1500 0 2000 500 1000 1500 2000 Time (Hr) Time (Hr) Solder Dipping (260㷄 5sec 5Cycle) Reflow Dipping (230㷄 3sec 5Cycle) 250 250 Ag Th Cu Th 150 100 0 Initial 150 100 50 1 3 5 Ag Th Cu Th 200 Through-hole Resistance (m㱅/2hole) 150 Ag Th Cu Th 200 Through-hole Resistance (m㱅/2hole) Through-hole Resistance (m㱅/2hole) 200 250 Ag Th Through-hole Resistance (m㱅/2hole) 250 Heat Cycle (100Cycle) (-40㷄 30min 100㷄 30min) Oil Dipping (260㷄 10sec 100Cycle) 100 50 50 0 0 Initial 1 3 5 Initial HOKURIKU 20 50 100 Cu Th 200 150 100 50 0 Initial 100 Specifications are subject to change without notice. 300 2