IXYS CPC3701C

CPC3701
60V, Depletion-Mode, N-Channel
Vertical DMOS FET
INTEGRATED CIRCUITS DIVISION
V(BR)DSX /
V(BR)DGX
RDS(on)
(max)
IDSS (min)
Package
60V
1
600mA
SOT-89
Features
• Depletion Mode Device Offers Low RDS(on)
at Cold Temperatures
• Low On-Resistance: 1 max. at 25ºC
• High Input Impedance
• Low VGS(off) Voltage: -0.8 to -2.9V
• Small Package Size SOT-89
Ignition Modules
Normally-On Switches
Solid State Relays
Converters
Security
Power Supplies
Ordering Information
Part #
CPC3701C
CPC3701CTR
Package Pinout (SOT-89)
D
G
The CPC3701 is an N-channel, depletion mode, field
effect transistor (FET) that utilizes IXYS Integrated
Circuits Division’s proprietary third-generation vertical
DMOS process. The third-generation process realizes
world class, high voltage MOSFET performance
in an economical silicon gate process. Our vertical
DMOS process yields a robust device, with high input
impedance, for use in high-power applications. The
CPC3701 is a highly reliable FET device that has
been used extensively in our Solid State Relays for
industrial and security applications.
The CPC3701 has a minimum breakdown voltage of
60V, and is available in the SOT-89 package. As with
all MOS devices, the FET structure prevents thermal
runaway and thermal-induced secondary breakdown.
Applications
•
•
•
•
•
•
Description
Description
N-Channel Depletion Mode FET, SOT-89 Pkg.
Cut-Tape, Available in Quantities of 200, 300,
400, 500, and 600
N-Channel Depletion Mode FET, SOT-89 Pkg.
Tape and Reel (1000/Reel)
Circuit Symbol
D
D
S
G
S
Pb
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INTEGRATED CIRCUITS DIVISION
CPC3701
Absolute Maximum Ratings @ 25ºC
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Pulsed Drain Current
Total Package Dissipation 1
Operational Temperature
Storage Temperature
1
Ratings
60
±15
1
1.1
-55 to +125
-55 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
VP
A
W
ºC
ºC
Mounted on 1"x1" FR4 board.
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Parameter
Drain-to-Source Breakdown Voltage
Gate-to-Source Off Voltage
Change in VGS(off) with Temperature
Gate Body Leakage Current
Symbol
V(BR)DSX
Conditions
VGS= -5V, ID=100µA
Min
60
VGS(off)
VDS= 5V, ID=1A
dVGS(off) /dT
VDS= 5V, ID=1A
IGSS
Drain-to-Source Leakage Current
ID(off)
Saturated Drain-to-Source Current
IDSS
Static Drain-to-Source On-State Resistance
Change in RDS(on) with Temperature
RDS(on)
Max
-
-0.8
-
-2.9
V
-
-
4.5
mV/ºC
VGS=±15V, VDS=0V
-
-
100
nA
VGS= -5V, VDS=60V
-
-
1
µA
VGS= -5V, VDS=40V, TA=125ºC
-
-
1
mA
VGS= 0V, VDS=15V
600
-
-
-
-
1
mA

-
-
1.1
%/ºC
VGS= 0V, ID=300mA
dRDS(on) /dT
Turn-On Delay Time
Typ
-
Units
V
td(on)
VDS= 25V
-
70
tr
ID= 300mA
-
40
td(off)
VGS= 0V to -10V
-
50
tf
Rgen= 50
-
150
Source-Drain Diode Voltage Drop
VSD
VGS= -5V, ISD=300mA
-
0.6
1.8
V
Thermal Resistance (Junction to Ambient)
RJA
-
-
90
-
ºC/W
Rise Time
Turn-Off Delay Time
Fall Time
-
ns
Switching Waveform & Test Circuit
VDD
RL
0V
90%
PULSE
GENERATOR
INPUT
-10V
10%
Rgen
t on
t d(on)
VDS
OUTPUT
t off
tf
t d(off)
tr
90%
D.U.T.
90%
INPUT
OUTPUT
0V
2
10%
10%
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R03
INTEGRATED CIRCUITS DIVISION
CPC3701
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC3701C
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC3701C
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
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INTEGRATED CIRCUITS DIVISION
CPC3701
MECHANICAL DIMENSIONS
CPC3701C
1.626 / 1.829
(0.064 / 0.072)
1.397 / 1.600
(0.055 / 0.063)
R 0.254
(R 0.010)
PCB Land Pattern
1.90
(0.075)
3.937 / 4.242
(0.155 / 0.167)
2.286 / 2.591
(0.090 / 0.102)
45º
2.45
(0.096)
1.40
(0.055)
Pin 1
0.356 / 0.483
(0.014 / 0.019)
0.432 / 0.559
(0.017 / 0.022)
0.889 / 1.194
(0.035 / 0.047)
5.00
(0.197)
50º
1.90
(0.074)
0.356 / 0.432
(0.014 / 0.017)
0.60
(0.024)
TYP 3
4.394 / 4.597
(0.173 / 0.181)
1.422 / 1.575
(0.056 / 0.062)
2.921 / 3.073
(0.115 / 0.121)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
CPC3701CTR Tape & Reel
177.8 Dia
(7.00 Dia)
5.50 ± 0.05
(0.217 ± 0.002)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
1.75 ± 0.1
(0.069 ± 0.004)
W=12.00 ± 0.3
(0.472 ± 0.012)
B0=4.60 ± 0.1
(0.181 ± 0.004)
K0=1.80 ± 0.1
(0.071 ± 0.004)
Embossed
Carrier
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
A0=4.80 ± 0.1
(0.189 ± 0.004)
P=8.00 ± 0.1
(0.315 ± 0.004)
Embossment
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC3701-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/18/2012