IXYS LDA110S

LDA110
Optocoupler, Bidirectional Input
Darlington-Transistor Output
INTEGRATED CIRCUITS DIVISION
Parameter
Breakdown Voltage - BVCEO
Current Transfer Ratio
CTR (Typical)
Saturation Voltage - VCE (sat)
Input Control Current - IF
Rating
30
8500
Units
VP
%
1
1
V
mA
Description
LDA110 is a bidirectional-input optocoupler with
a Darlington-transistor output. The LDA110 has a
minimum current transfer ratio (CTR) of 300% with a
maximum value of 30,000%.
Approvals
Features
•
•
•
•
•
•
100mA Continuous Load Rating
3750Vrms Input/Output Isolation
Bidirectional Input
Small 6-Pin Package, Thru-Hole or Surface Mount
Machine Insertable, Wave Solderable
Surface Mount Tape & Reel Packaging Available
Applications
•
•
•
•
•
•
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Loop Detect
Ringing Detect
Current Sensing
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Ordering Information
Part Number
LDA110
LDA110S
LDA110STR
Description
6-Pin DIP (50/tube)
6-Pin Surface Mount (50/tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
A/K
A/K
Pb
DS-LDA110-R06
1
6
2
5
3
4
B
C
E
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1
INTEGRATED CIRCUITS DIVISION
LDA110
Absolute Maximum Ratings @ 25ºC
Parameter
Breakdown Voltage
Input Control Current
Peak (10ms)
Power Dissipation
Input Power Dissipation 1
Phototransistor 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33mW / ºC
2
Derate linearly 2mW / ºC
Ratings
30
100
1
Units
VP
mA
A
150
150
3750
-40 to +85
-40 to +125
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Phototransistor Breakdown Voltage
Phototransistor Dark Current
Saturation Voltage
Current Transfer Ratio
Output Capacitance
Input Characteristics
Input Control Current
Input Voltage Drop
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
IC = 100µA
VCEO = 5V, IF = 0mA
IC = 3mA, IF = 1mA
IF = 1mA, VCE = 2V
25V, f =1MHz
BVCEO
ICEO
VCE(sat)
CTR
COUT
30
300
-
85
50
8500
3
500
1
30000
-
V
nA
V
%
pF
IC = 3mA, VCE = 2V
IF = 5mA
IF
VF
0.9
0.07
1.2
1
1.4
mA
V
-
CI/O
-
3
-
pF
Switching Characteristics @ 25ºC
Characteristic
Turn-On Time
Turn-Off Time
Symbol
ton
toff
Test Condition
Typ
8
345
VCC=5V, IF=1mA, RL=500
Switching Time Test Circuit
Units
s
VCC
RL
Pulse Width=5ms
Duty Cycle=1%
IF
VCE
IF
VCE
90%
10%
t on
2
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t off
R06
INTEGRATED CIRCUITS DIVISION
LDA110
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Voltage vs. Current (Log)
LED Voltage vs. Current
30
20
10
0
10
1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
1.0
25ºC
10000
85ºC
5000
0
2
4
6
8
LED Forward Current (mA)
10
200
150
100
IF=2mA
IF=1mA
IF=0.5mA
50
0
1
2
3
4
Collector Voltage VCE (V)
IF=5mA
IF=2mA
IF=1mA
-20
0
20
40
60
Temperature (ºC)
5
100
ICE Current vs. Temperature
(VCE=5V)
IF=10mA
IF=5mA
IF=2mA
IF=1mA
150
100
50
6
80
IF=0.2mA
IF=0.1mA
0
-40
-20
IF=0.5mA
0
20
40
60
Temperature (ºC)
80
100
Leakage Current vs. Temperature
1200
Leakage (nA)
VCE(sat) (V)
1.1
1400
0.90
0.85
0.80
0.75
1000
VCC=10V
VCC=5V
VCC=3V
800
600
400
200
0.70
-40
-20
0
20
40
60
Temperature (ºC)
80
0
-40
100
Turn-On Time vs. Load Resistance
(IF=1mA, VCC=5V)
8.0
7.9
7.8
7.7
7.6
7.5
7.4
7.3
7.2
7.1
7.0
6.9
6.8
1x102
15000
Turn-Off Time (Ps)
Turn-On Time (Ps)
1.2
200
VCE(sat) vs. Temperature
(IF=1mA, IC=3mA)
0.95
1.3
250
IF=20mA
IF=10mA
IF=5mA
0
0
1.6
250
Collector Current IC (mA)
15000
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.4
Typical Collector Current
vs. Collector Voltage
Typical CTR vs. LED Forward Current
(VCE=5V)
-40ºC
1.1
ICE Current (mA)
1.1
IF=50mA
IF=20mA
IF=10mA
1.5
1.0
-40
0.1
1.0
CTR (%)
LED Forward Voltage (V)
40
20000
LED Forward Voltage vs. Temperature
1.6
100
LED Forward Current (mA)
LED Forward Current (mA)
50
1x103
1x104
Load Resistance (:)
1x105
-20
0
20
40
60
Temperature (ºC)
80
100
Turn-Off Time vs. Load Resistance
(IF=1mA, VCC=5V)
10000
5000
0
1x102
1x103
1x104
Load Resistance (:)
1x105
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R06
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3
INTEGRATED CIRCUITS DIVISION
LDA110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LDA110 / LDA110S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
LDA110 / LDA110S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
4
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R06
INTEGRATED CIRCUITS DIVISION
LDA110
Mechanical Dimensions
LDA110
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
7.620 ± 0.254
(0.300 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
LDA110S
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
R06
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5
INTEGRATED CIRCUITS DIVISION
LDA110
LDA110STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-LDA110-R06
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012