LOC210 Dual Linear Optocouplers INTEGRATED CIRCUITS DIVISION Parameter LED Operating Range K3, Transfer Gain Isolation, Input to Output Rating 2-10 0.773-1.072 3750 Description Units mA - The LOC210 Dual Linear Optocoupler features an infrared LED optically coupled with two photodiodes. A feedback (input) photodiode is used to generate a control signal that provides a servomechanism to the LED drive current, thus compensating for the LED's nonlinear time and temperature characteristics. The other (output) photodiode provides an output signal that is linear with respect to the servo LED current. The product features wide bandwidth, high input to output isolation and excellent servo linearity. Vrms Features • • • • • • • • • • • 0.01% Servo Linearity THD -87dB Typical Wide Bandwidth (>200kHz) Couples Analog and Digital Signals High Gain Stability Low Input/Output Capacitance Low Power Consumption 16-Pin SOIC Package (PCMCIA Compatible) Machine Insertable, Wave Solderable Surface Mount Tape & Reel Version Available VDE Compatible Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • Certified to: IEC 60950-1: 2005 EN 60950-1: 2006 TUV Certificate B 09 07 49410 006 Ordering Information Applications Part # LOC210P LOC210PTR • Modem Transformer Replacement With No Insertion Loss • Digital Telephone Isolation • Power Supply Feedback Voltage/Current • Medical Sensor Isolation • Audio Signal Interfacing • Isolation of Process Control Transducers Description 16-Pin SOIC (50/tube) 16-Pin SOIC (1000/Reel) K3 Sorted Bins Bin K3 Range Bin 1 0.773 - 0.886 Bin 2 0.887 - 1.072 Bin Matrix Top Pole Optocoupler* Pin Configuration – LED Suffix 1 16 2 15 3 14 4 13 5 12 + LED C1 Optocoupler #1 Optocoupler #2 A1 NC NC 6 11 7 10 8 9 C2 DS-LOC210-R05 NC NC Bin 1 1 L 1 2 M 2 1 N 2 2 *Top Optocoupler: Pins 1,2,3,4,13, and 14 **Bottom Optocouplers: Pins 7 through 12 C2 A2 – LED + LED C1 A1 A2 Pb K Bottom Pole Optocoupler** Part Number Information The LOC210 is shipped in anti-static tubes (50 pieces each) or tape/reel (1,000 pieces each). Each container has only 1 bin combination which will be branded on each part with the appropriate bin letter K, L, M, or N in the lower right hand corner. Suffix representation is described in the “Bin Matrix”. e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LOC210 Absolute Maximum Ratings @ 25ºC Parameter Reverse LED Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Power Dissipation Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Ratings 5 100 1 150 Units V mA A mW 800 mW 3750 -40 to +85 -40 to +125 Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameter Conditions Symbol Min Typ Max Units IF=2 - 10mA VR=5V VF IR 0.9 - 1.2 - 1.4 10 V A IF=0mA, VC1-A1=VC2-A2=15V ID K1 K2 K3 K3 K3/T CMRR THD f-3dB 0.004 0.004 0.773 -96 - 1 0.005 130 -87 200 40 25 0.030 0.030 1.072 1 -80 - nA % %/°C dB dB kHz kHz CI/O - 3 - pF Input Characteristics LED Voltage Drop Reverse LED Current Coupler/Detector Characteristics Dark Current K1, Servo Gain (IC1/IF) K2, Forward Gain (IC2/IF) K3, Transfer Gain (K2/K1=IC2/IC1) K3, Transfer Gain Linearity (non-servoed) K3 Temperature Coefficient Common Mode Rejection Ratio Total Harmonic Distortion Frequency Response 2 IF=2 - 10mA, VC1-A1=VC2-A2=15V IF=2 - 10mA IF=2 - 10mA, VC1-A1=VC2-A2= 5V V=20VP-P , RL=2K, f=100Hz f0=350Hz, 0dBm Photoconductive Configuration Photovoltaic Configuration Common Characteristics Input/Output Capacitance 1 2 - All parameters above are for each optocoupler. Refer to Application Note, AN-107, for LOC210 configurations. 2 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LOC210 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Forward Current vs. LED Forward Voltage LED Current (mA) 50 40 30 20 LED Forward Voltage Drop (V) 100 60 LED Current (mA) Typical LED Forward Voltage Drop vs. Temperature LED Forward Current vs. LED Forward Voltage 10 1 0.1 10 1.0 1.1 1.2 1.3 1.4 0.01 1.5 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) Servo Gain vs. LED Current & Temperature Servo-Photocurrent vs. LED Current & Temperature 0.016 Servo-Photocurrent (PA) 0ºC 25ºC 50ºC 70ºC 85ºC 0.008 0.004 0.000 0ºC 25ºC 120 50ºC 70ºC 85ºC 100 80 60 40 20 0 0 2 4 6 8 LED Current (mA) 10 12 0 2 4 6 8 LED Current (mA) 10 IF=50mA IF=20mA IF=10mA 1.5 1.4 1.3 1.2 IF=5mA IF=2mA IF=1mA 1.1 1.0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Normalized Servo-Photocurrent vs. LED Current & Temperature 140 0.012 Servo Gain 1.0 LED Forward Voltage (V) Normalized Servo-Photocurrent 0 1.6 12 4.0 0ºC 25ºC 50ºC 70ºC 85ºC 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 LED Current (mA) 10 12 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LOC210 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LOC210P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LOC210P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb 4 e3 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LOC210 Mechanical Dimensions LOC210P 10.160±0.381 (0.400±0.015) PCB Land Pattern 0.254 ±0.0127 (0.010±0.0005) PIN 16 10.363±0.127 (0.408±0.005) 7.493±0.127 (0.295±0.005) 0.635 X 45° (0.025 X 45°) 1.016 TYP (0.040 TYP) 9.30 (0.366) 1.90 (0.075) PIN 1 1.270 TYP (0.050 TYP) 0.406 TYP (0.016 TYP) 8.890 TYP (0.350 TYP) 0.508±0.1016 (0.020±0.004) 1.27 (0.050) 2.108 MAX (0.083 MAX) See Note 3 0.60 (0.024) Lead to Package Standoff: MIN: 0.0254 (0.001) MAX: 0.102 (0.004) DIMENSIONS mm (inches) NOTES: 1. Coplanarity = 0.1016 (0.004) max. 2. Leadframe thickness does not include solder plating (1000 microinch maximum). 3. Sum of package height, standoff, and coplanarity does not exceed 2.108 (0.083). LOC210PTR Tape & Reel 330.2 DIA. (13.00 DIA.) W=16 (0.630) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) B0=10.70 (0.421) K0=3.20 (0.126) A0=10.90 (0.429) P=12.00 (0.472) K1=2.70 (0.106) Embossed Carrier Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: DS-LOC210-R05 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012