DATA SHEET MOS INTEGRATED CIRCUIT µPD4711B RS-232 LINE DRIVER/RECEIVER The µPD4711B is a high-voltage silicon gate CMOS line driver/reciever conforming to the EIA/TIA-232-E standard. It can operate with a single +5 V power source because it is provided with a DC-DC converter. In addition, this line driver/receiver has many ancillary functions, including output control, threshold select, and standby functions. Because the µPD4711B is provided with two output driver circuits and two receiver circuits, it can constitute an RS232 interface circuit with a single chip. FEATURES • Conforms to EIA/TIA-232-E (RS-232C) standard • +5 V single power source • Threshold select pin selecting two types of threshold voltages • Standby mode can be set by making standby pin high to reduce circuit current. • Three-state output configuration. Both driver and receiver outputs go into high-impedance state in standby mode. ORDERING INFORMATION Part Number Package µPD4711BCX 20-pin plastic DIP (300 mil) µPD4711BGS 20-pin plastic SOP (300 mil) The information in this document is subject to change without notice. Document No. S10315EJ3V1DS00 (3rd edition) Date Published April 1997 N Printed in Japan © 1995 µPD4711B BLOCK DIAGRAM/PIN CONFIGURATION (Top View) +10 V + C3 1 VDD + C4 DC - DC 20 + C4 converter 2 C + 1 GND 19 + C1 +5 V By pass Capacitor + Standby STBY 3 VCC 4 C1 – C4 – VSS 17 –10 V 16 DCON 15 DOUT1 7 14 DOUT2 ROUT1 8 13 RIN1 12 RIN2 11 RCON 5 C2 18 Output contrtol 300 Ω TTL/CMOS INPUT DIN1 300 Ω DIN2 TTL/CMOS OUTPUT 6 5.5 kΩ ROUT2 9 RS-232 OUTPUT RS-232 INPUT 5.5 kΩ 10 GND Threshold control * VDD and Vss are output pins of voltages internally boosted. Connecting a load directly to these pins is not recommended. ** The standby pin is internally pulled down. *** Use capacitors with a working voltage of 16 V or higher as C1 through C4. Insert a bypass capasitor about 0.1 to 1 µF between VCC pin to GND pin. 2 µPD4711B TRUTH TABLE Drivers STBY DCON DIN DOUT Remark H X X Z Standby mode (DC-DC converter stops) L L X L Mark level output L H L H Space level output L H H L Mark level output STBY RIN ROUT H X Z Stanby mode (DC-DC converter stops) L L H Mark level input L H L Space level input Receivers Remark Receiver input threshold voltage RCON RIN1 to RIN2 L A mode H B mode H: high level, L: low level, Z: high impedance, X: H or L 3 µPD4711B ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C) Parameter Symbol Ratings Unit Supply voltage VCC –0.5 to +6.0 V Driver input voltage DIN –0.5 to VCC +0.5 V Receiver input voltage RIN –30.0 to +30.0 V Driver output voltage DOUT –25.0 to +25.0Note 1 V Receiver output voltage ROUT –0.5 to VCC + 0.5 V Receiver input current IIN ±60.0 mA Operating temperature range TA –40 to +85 ˚C Storage temperature range Tstg –55 to +150 ˚C Power dissipation PT 0.5 W Note 1. Pulse width: 1 ms, duty factor: 10 % MAX. RECOMMENDED OPERATING RANGE Symbol MIN. Supply voltage Parameter VCC 4.5 Receiver input voltage RIN –30 +30 V Operating temperature range TA –20 80 ˚C External capacitance Note 2 1.0 47 µF Note 2. TYP. MAX. Unit 5.0 5.5 V 22 The capacitance of an electrolytic capacitor decreases at a low temperature (0 ˚C or lower). Determine the capacitance of the capacitor to be used taking this into consideration when the µPD4711B is used at a low temperature. Keep the wiring length between the capacitor and IC as short as possible. ELECTRICAL CHARACTERISTICS (OVERALL) (Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF) Parameter Symbol Conditions MIN. TYP. MAX. Unit 4.5 9.0 mA 15.0 25.0 mA 50 120 µA 0.8 V VCC = +5 V, no load, RIN pin open Circuit current ICC1 Circuit current (Standby pin open) VCC = +5 V, RL = 3 kΩ (DOUT), DIN = GND, ICC2 RIN and ROUT pins open (Standby pin open) Standby circuit current ICC (Standby) Standby low-level input voltage Standby high-level input voltage Input capacitance VIL VCC = +5 V, no load, RIN pin open (Standby pin high) Note 3 (Standby) VIH 2.0 (Standby) CIN V Driver input and receiver input VCC = +5 V, vs. GND, f = 1 MHz 10 pF * TYP.: Typical (reference) value at TA = 25 ˚C. Note 3. 4 Because the standby pin is internally pulled down, if the standby pin is left open, operating mode is in effect. µPD4711B ELECTRICAL CHARACTERISTICS (DRIVER) (Unless otherwise specified, VCC = +5 V ±10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF) Parameter Symbol Conditions MIN. TYP. MAX. Unit 0.8 V Low-level input voltage VIL High-level input voltage VIH 2.0 Low-level input current IIL 0 –1.0 µA High-level input current IIH 0 1.0 µA VCC = +5.0 V, RL = ∞, TA = 25 ˚C Output voltage VDO Output short current ISC SR Propagation delay timeNote 4 ±9.7 VCC = +5.0 V, RL = 3 kΩ ±5.5 VCC = +4.5 V, RL = 3 kΩ ±5.0 V V V ±40 ±15 VCC = +5.0 V, vs. GND Slew rate V mA CL = 10 pF, RL = 3 to 7 kΩ 1.5 11 30 V/µs CL = 2500 pF, RL = 3 to 7 kΩ 1.5 6 30 V/µs tPHL RL = 3.5 kΩ, CL = 2500 pF tPLH Output resistance µs 0.8 VCC = VDD = VSS = 0 V Standby output transition time Standby output transition time Ω RO VOUT = ±2 V tDAZ Note 5 4 10 µs Note 5 25 50 ms tDZA 300 * TYP.: Typical (reference) value at TA = 25 ˚C. Note 4. Test point If the output control pin is made low, the driver output goes low regardless of the driver input state. 6 ns 6 ns 5 90 % 90 % Driver input 1.5 V 1.5 V 10 % 10 % 0 tPHL VOH Driver output tPLH 3V –3 V VOL 10 % SR 90 % 3V –3 V SR 5 µPD4711B Note 5. Test Point 5V Standby input 1.5 V 1.5 V 0V +5 V VOH +5 V High impedance Driver output –5 V –5 V VOL tDZA tDAZ Do not perform communication within the standby output transition time tDZA on power application or on releasing the standby mode. ELECTRICAL CHARACTERISTICS (RECEIVER) (Unless otherwise specified, VCC = +5 V ± 10 %, TA = –20 ˚C to +80 ˚C, C1 to C4 = 22 µF) Parameter Low-level output voltage High-level output voltage Symbol VOL VOH Conditions MIN. TYP. IOUT = 4 mA IOUT = –4 mA MAX. Unit 0.4 V VCC V –0.8 VIL RCON pin High-level input voltage VIH RCON pin Propagation delay timeNote 6 tPHL Low-level input voltage tPLH 2.0 RL = 1 kΩ, CL = 150 pF Input current IIN VIN = ±5 V Input resistance RI VIN = ±3 to ±25 Input pin release voltage VIO Input threshold A mode only Input threshold A mode VIH V V µs 0.13 1 mA 3 5 7 kΩ 0.5 V VCC = +5 V 1.6 2.2 2.6 V VIL VCC = +5 V 0.6 1 1.6 V VH VCC = +5 V (hysteresis width) 0.5 1.2 1.8 V VIH VCC = +5 V 1.6 2.2 2.6 V VIL VCC = +5 V –0.4 –1.8 –3.0 V VH VCC = +5 V (hysteresis width) 2.6 4.0 5.4 V Standby output transition time tDAZ Note 7 0.4 1 µs Standby output transition time tDZA Note 7 0.03 10 ms (RCON pin low) Input threshold B mode (RCON pin high) * TYP.: Typical (reference) value at TA = 25 ˚C. 6 0.8 µPD4711B Note 6. Test Point 10 ns 10 ns 5 90 % 90 % Receiver input 1.5 V 1.5 V 10 % 10 % –5 tPHL tPLH VOH Receiver output 1.5 V 1.5 V VOL Note 7. Test Point 5V Standby input 1.5 V 1.5 V 0V VOH 90 % High impedance Receiver output 10 % VOL tDAZ tDZA The receiver output is undefined during the standby output transition time t DZA. Do not perform communication in the standby output transition time t DZA on power application or on releasing the standby mode. 7 µPD4711B TEST CIRCUIT Driver output voltage/Output current (+ side) +10 V + C3 1 VDD + C4 DC - DC 20 + C4 converter 2 C + 1 GND 19 + C1 + 3 VCC 4 C1 – 4 C – VSS 17 +5 V 5 C2 18 +5 V –10 V 16 STBY 300 Ω 6 15 300 Ω 14 7 13 8 IDO 5.5 kΩ V V DO 12 9 5.5 kΩ 11 10 GND Driver output voltage/Output current (– side) +10 V + C3 1 VDD + C4 DC - DC 20 2 C + C4 converter + 1 GND 19 + C1 + 3 VCC 4 C1 – 4 C – VSS 17 +5 V 5 C2 18 –10 V +5 V 16 STBY 300 Ω 6 15 300 Ω 7 14 8 13 5.5 kΩ 9 IDO 12 5.5 kΩ 10 GND 8 11 V V DO µPD4711B PACKAGE DRAWINGS 20PIN PLASTIC DIP (300 mil) 20 11 1 10 A K L P I J H C F D N R M B G M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS INCHES A B 25.40 MAX. 1.27 MAX. 1.000 MAX. 0.050 MAX. C 2.54 (T.P.) 0.100 (T.P.) D 0.50±0.10 0.020 +0.004 –0.005 F 1.1 MIN. 0.043 MIN. G H 3.5±0.3 0.51 MIN. 0.138±0.012 0.020 MIN. I J 4.31 MAX. 5.08 MAX. 0.170 MAX. 0.200 MAX. K 7.62 (T.P.) 0.300 (T.P.) L 6.4 0.252 M 0.25 +0.10 –0.05 0.010 +0.004 –0.003 N 0.25 P 0.9 MIN. R 0~15 ° 0.01 0.035 MIN. 0~15° P20C-100-300A,C-1 9 µPD4711B 20 PIN PLASTIC SOP (300 mil) 20 11 P detail of lead end 1 10 A H J E K F G I C N D M L B M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 13.00 MAX. 0.512 MAX. B 0.78 MAX. 0.031 MAX. C 1.27 (T.P.) 0.050 (T.P.) D 0.40 +0.10 –0.05 0.016 +0.004 –0.003 E 0.1±0.1 0.004±0.004 F 1.8 MAX. 0.071 MAX. G 1.55 0.061 H 7.7±0.3 0.303±0.012 I 5.6 0.220 J 1.1 0.043 K 0.20 +0.10 –0.05 0.008 +0.004 –0.002 L 0.6±0.2 M 0.12 0.005 N 0.10 0.004 P 3 ° +7° –3° 3° +7° –3° 0.024 +0.008 –0.009 P20GM-50-300B, C-4 10 µPD4711B RECOMMENDED SOLDERING CONDITIONS Soldering the µPD4711B under the conditions listed in the table below is recommended. For soldering methods and conditions other than those recommended, consult NEC. Surface mount type For the details of the recommended soldering conditions of the surface mount type, refer to Information document “Semiconductor Device Mounting Technology Manual” C10535EJ7V0IF00. µ PD4711BGS Soldering Method Infrared reflow Soldering Condition Package peak temperature: 235 ˚C, Time: 30 seconds MAX. Recommended Condition Symbol IR35-00-2 (210 ˚C MIN.), Number of times: 2, Number of days: not limited* VPS Package peak temperature: 215 ˚C, Time: 40 seconds MAX. VP15-00-2 (200 ˚C MIN.), Number of times: 2, Number of days: not limited* Wave soldering Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds WS60-00-1 MAX., Number of times: 1, Number of days: not limited* Pin partial heating Pin temperature: 300 ˚C MAX (lead temperature), Time: 3 seconds MAX. (per lead pin), Number of days: not limited* * The number of days the device can be stored at 25 ˚C, 65 % RH MAX. after the dry pack has been opened. Caution Do not use two or more soldering methods in combination (except the pin partial heating method). Throught-hole type µ PD4711BCX Soldering Method Wave soldering Soldering Conditions Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX. Reference documents “NEC Semiconductor Device Reliability/Quality Control System” (IEI-1212) “Quality Grade on NEC Semiconductor Devices” (IEI-1209) “Semiconductor Device Mounting Technology Manual” C10535EJ7V0IF00 11 µPD4711B [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 12