ALLEGRO A1104

A1101, A1102, A1103, A1104, and A1106
Continuous-Time Switch Family
Features and Benefits
Description
▪ Continuous-time operation
▫ Fast power-on time
▫ Low noise
▪ Stable operation over full operating temperature range
▪ Reverse battery protection
▪ Solid-state reliability
▪ Factory-programmed at end-of-line for optimum
performance
▪ Robust EMC performance
▪ High ESD rating
▪ Regulator stability without a bypass capacitor
The Allegro® A1101-A1104 and A1106 Hall-effect switches
are next generation replacements for the popular Allegro
312x and 314x lines of unipolar switches. The A110x family,
produced with BiCMOS technology, consists of devices that
feature fast power-on time and low-noise operation. Device
programming is performed after packaging, to ensure increased
switchpoint accuracy by eliminating offsets that can be induced
by package stress. Unique Hall element geometries and lowoffset amplifiers help to minimize noise and to reduce the
residual offset voltage normally caused by device overmolding,
temperature excursions, and thermal stress.
The A1101-A1104 and A1106 Hall-effect switches include
the following on a single silicon chip: voltage regulator,
Hall-voltage generator, small-signal amplifier, Schmitt
trigger, and NMOS output transistor. The integrated voltage
regulator permits operation from 3.8 to 24 V. The extensive
on-board protection circuitry makes possible a ±30 V absolute
maximum voltage rating for superior protection in automotive
and industrial motor commutation applications, without adding
Packages: 3-pin SOT23W (suffix LH), and
3-pin SIP (suffix UA)
LH: A1101, A1102, A1103,
A1104, and A1106
Not to scale
UA: A1101, A1102,
A1103, and A1104
Continued on the next page…
UA: A1106
Functional Block Diagram
VCC
To all subcircuits
Regulator
VOUT
Amp
Gain
Offset
Trim
Control
GND
A1101-DS, Rev. 14
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Description (continued)
external components. All devices in the family are identical except
for magnetic switchpoint levels.
The small geometries of the BiCMOS process allow these devices
to be provided in ultrasmall packages. The package styles available
provide magnetically optimized solutions for most applications.
Package LH is an SOT23W, a miniature low-profile surface-mount
package, while package UA is a three-lead ultramini SIP for throughhole mounting. Each package is lead (Pb) free, with 100% matte
tin plated leadframes.
Selection Guide
Packing*
Part Number
Mounting
Ambient, TA
A1101ELHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1101EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1101LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1101LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1102ELHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1102EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1102LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1102LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1103ELHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1103LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1103LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1104EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1104LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1104LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1106EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1106LLHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1106LUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
BRP (Min)
BOP (Max)
10
175
60
245
150
355
25
450
160
430
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
*Contact Allegro for additional packing options.
Absolute Maximum Ratings
Characteristic
Symbol
Notes
Rating
Units
Supply Voltage
VCC
30
V
Reverse Supply Voltage
VRCC
–30
V
V
Output Off Voltage
VOUT
30
Reverse Output Voltage
VROUT
–0.5
V
IOUTSINK
25
mA
Output Current
Magnetic Flux Density
B
Unlimited
G
Range E
–40 to 85
ºC
Range L
Operating Ambient Temperature
TA
–40 to 150
ºC
Maximum Junction Temperature
TJ(max)
165
ºC
Tstg
–65 to 170
ºC
Storage Temperature
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Operating, TJ < 165°C
3.8
–
24
V
VOUT = 24 V, B < BRP
–
–
10
μA
IOUT = 20 mA, B > BOP
–
215
400
mV
Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP + 5 G or
B < BRP – 5 G
–
–
4
μs
tr
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF
–
–
400
ns
tf
Voltage1
VCC
Output Leakage Current
IOUTOFF
VOUT(SAT)
Supply
Output On Voltage
Power-On Time2
tPO
Output Rise Time3
Output Fall
Time3
Supply Current
Reverse Battery Current
Units
VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF
–
–
400
ns
ICCON
B > BOP
–
4.1
7.5
mA
ICCOFF
B < BRP
–
3.8
7.5
mA
VRCC = –30 V
–
–
–10
mA
IRCC
Supply Zener Clamp Voltage
VZ
ICC = 10.5 mA; TA = 25°C
32
–
–
V
Supply Zener Current4
IZ
VZ = 32 V; TA = 25°C
–
–
10.5
mA
1
Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
2 For V
CC slew rates greater than 250 V/μs, and TA = 150°C, the Power-On Time can reach its maximum value.
3 C =oscilloscope probe capacitance.
S
4 Maximum current limit is equal to the maximum I
CC(max) + 3 mA.
DEVICE QUALIFICATION PROGRAM
Contact Allegro for information.
EMC (Electromagnetic Compatibility) REQUIREMENTS
Contact Allegro for information.
Package LH
GND
Package UA, 3-pin SIP
2
3
VOUT
VOUT
1
GND
2
VCC
1
VCC
3
Terminal List
Name
VCC
VOUT
GND
Description
Connects power supply to chip
Output from circuit
Ground
Number
Package LH Package UA
1
1
2
3
3
2
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
MAGNETIC OPERATING CHARACTERISTICS1 over full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max. Units
A1101
A1102
Operate Point
BOP
A1103
A1104
A1106
A1101
A1102
Release Point
BRP
A1103
A1104
A1106
A1101
A1102
Hysteresis
BHYS
A1103
A1104
A1106
TA = 25°C
50
100
160
G
Operating Temperature Range
30
100
175
G
TA = 25°C
130
180
230
G
Operating Temperature Range
115
180
245
G
TA = 25°C
220
280
340
G
Operating Temperature Range
205
280
355
G
TA = 25°C
70
–
350
G
Operating Temperature Range
35
–
450
G
TA = 25°C
280
340
400
G
Operating Temperature Range
260
340
430
G
TA = 25°C
10
45
130
G
Operating Temperature Range
10
45
145
G
TA = 25°C
75
125
175
G
Operating Temperature Range
60
125
190
G
TA = 25°C
165
225
285
G
Operating Temperature Range
150
225
300
G
TA = 25°C
50
–
330
G
Operating Temperature Range
25
–
430
G
TA = 25°C
180
240
300
G
Operating Temperature Range
160
240
330
G
TA = 25°C
20
55
80
G
Operating Temperature Range
20
55
80
G
TA = 25°C
30
55
80
G
Operating Temperature Range
30
55
80
G
TA = 25°C
30
55
80
G
Operating Temperature Range
30
55
80
G
TA = 25°C
20
55
–
G
Operating Temperature Range
20
55
–
G
TA = 25°C
70
105
140
G
Operating Temperature Range
70
105
140
G
1
Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields.
This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated
by the absolute value of B, and the sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but
opposite polarity).
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Characteristic
Symbol
Test Conditions
RθJA
Maximum Allowable VCC (V)
Package Thermal Resistance
Value Units
Package LH, 1-layer PCB with copper limited to solder pads
228
ºC/W
Package LH, 2-layer PCB with 0.463 in.2 of copper area each
side connected by thermal vias
110
ºC/W
Package UA, 1-layer PCB with copper limited to solder pads
165
ºC/W
Power Derating Curve
TJ(max) = 165ºC; ICC = ICC(max)
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
VCC(max)
Package LH, 2-layer PCB
(RQJA = 110 ºC/W)
Package UA, 1-layer PCB
(RQJA = 165 ºC/W)
Package LH, 1-layer PCB
(RQJA = 228 ºC/W)
VCC(min)
20
40
60
80
100
120
140
160
180
Power Dissipation, PD (mW)
Power Dissipation versus Ambient Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
Pa
(R cka
ge
QJ
A =
L
11 H, 2
0 º -la
Pac
C/ ye
W
(R kage
) r PC
UA
QJA =
B
,
165 1-la
ºC/ yer
W)
PC
B
Pac
k
(R age LH
,
QJA =
228 1-laye
ºC/W r PC
B
)
20
40
60
80
100
120
Temperature (°C)
140
160
180
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Characteristic Data
Supply Current (On) versus Ambient Temperature
Supply Current (On) versus Supply Voltage
(A1101/02/03/04/06)
(A1101/02/03/04/06)
8.0
7.0
7.0
ICCON (mA)
6.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCON (mA)
8.0
6.0
TA (°C)
5.0
–40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
0
0
–50
0
50
TA (°C)
100
150
0
5
20
25
Supply Current (Off) versus Supply Voltage
(A1101/02/03/04/06)
(A1101/02/03/04/06)
8.0
7.0
7.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCOFF (mA)
8.0
6.0
ICCOFF (mA)
15
VCC (V)
Supply Current (Off) versus Ambient Temperature
6.0
TA (°C)
5.0
–40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
0
0
–50
0
50
TA (°C)
100
0
150
10
15
20
25
Output Voltage (On) versus Supply Voltage
(A1101/02/03/04/06)
400
5
VCC (V)
Output Voltage (On) versus Ambient Temperature
(A1101/02/03/04/06)
400
350
350
300
300
250
VCC (V)
200
24
3.8
150
100
50
VOUT(SAT) (mV)
VOUT(SAT) (mV)
10
TA (°C)
250
–40
25
150
200
150
100
50
0
0
–50
0
50
TA (°C)
100
150
0
5
10
15
20
25
VCC (V)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Functional Description
OPERATION
The output of these devices switches low (turns on) when a
magnetic field (south polarity) perpendicular to the Hall element exceeds the operate point threshold, BOP. After turn-on,
the output is capable of sinking 25 mA and the output voltage is
VOUT(SAT). When the magnetic field is reduced below the release
point, BRP , the device output goes high (turns off). The difference in the magnetic operate and release points is the hysteresis,
Bhys, of the device. This built-in hysteresis allows clean switching of the output, even in the presence of external mechanical
vibration and electrical noise.
Powering-on the device in the hysteresis region, less than BOP and
higher than BRP, allows an indeterminate output state. The correct
state is attained after the first excursion beyond BOP or BRP.
CONTINUOUS-TIME BENEFITS
packaging to tighten magnetic parameter distributions. In contrast, chopper-stabilized switches employ an offset cancellation
technique on the chip that eliminates these offsets without the
need for after-packaging programming. The tradeoff is a longer
settling time and reduced frequency response as a result of the
chopper-stabilization offset cancellation algorithm.
The choice between continuous-time and chopper-stabilized
designs is solely determined by the application. Battery management is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 2). The duty cycle
is controlled by the power-on time, tPO, of the device. Because
continuous-time devices have the shorter power-on time, they
are the clear choice for such applications.
Continuous-time devices, such as the A110x family, offer the
fastest available power-on settling time and frequency response.
Due to offsets generated during the IC packaging process,
continuous-time devices typically require programming after
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall
Sensing Using Dynamic Quadrature Offset Cancellation and
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a
Track-and-Hold Signal Demodulator.
(A)
(B)
VS
V+
VOUT
VCC
Switch to Low
Switch to High
VCC
A110x
VOUT(SAT)
0
BRP
BOP
B– 0
RL
VOUT
Output
GND
B+
BHYS
Figure 1. Switching Behavior of Unipolar Switches. On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field
strength, and the B– direction indicates decreasing south polarity field strength (including the case of increasing north polarity). This behavior can
be exhibited when using a circuit such as that shown in Panel B.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
ADDITIONAL APPLICATIONS INFORMATION
Extensive applications information for Hall-effect devices is
available in:
• Hall-Effect IC Applications Guide, Application Note 27701
• Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead
Welding and Lead Forming, Application Note 27703.1
• Soldering Methods for Allegro’s Products – SMT and ThroughHole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702,
and the Allegro Web site, www.allegromicro.com.
1
2
3
4
5
VCC
t
VOUT
t
tPO(max)
Output Sampled
Figure 2. Continuous-Time Application, B < BRP.. This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power.
Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max).
The case shown is where the correct output state is HIGH . Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is
valid, a control unit reads the output. Position 5, power is removed from the device.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Power Derating
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RJC, is
relatively small component of RJA. Ambient air temperature,
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × IIN

(1)
T = PD × RJA (2)
TJ = TA + ΔT
Example: Reliability for VCC at TA = 150°C, package UA, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RJA = 165°C/W, TJ(max) = 165°C, VCC(max) = 24 V, and
ICC(max) = 7.5 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = Tmax ÷ RJA = 15°C ÷ 165 °C/W = 91 mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max) = 91 mW ÷ 7.5 mA = 12.1 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced
RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
(3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 4 mA, and RJA = 140 °C/W, then:
PD = VCC × ICC = 12 V × 4 mA = 48 mW

T = PD × RJA = 48 mW × 140 °C/W = 7°C
TJ = TA + T = 25°C + 7°C = 32°C
A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RJA and TA.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Package LH, 3-Pin (SOT-23W)
+0.12
2.98 –0.08
1.49 D
4°±4°
3
A
+0.020
0.180–0.053
0.96 D
+0.10
2.90 –0.20
+0.19
1.91 –0.06
2.40
0.70
D
0.25 MIN
1.00
2
1
0.55 REF
0.25 BSC
0.95
Seating Plane
Gauge Plane
8X 10° REF
B
PCB Layout Reference View
Branded Face
1.00 ±0.13
C
Standard Branding Reference View
+0.10
0.05 –0.05
0.95 BSC
A
Active Area Depth, 0.28 mm REF
B
Reference land pattern layout
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
Branding scale and appearance at supplier discretion
D
Hall element, not to scale
A1101, A1102,
A1103, A1104,
and A1106
0.40 ±0.10
For Reference Only; not for tooling use (reference dwg. 802840)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
C
NNT
1
N = Last two digits of device part number
T = Temperature code (letter)
NNN
A1101, A1102,
A1103, and
A1104 only
1
N = Last three digits of device part number
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Package UA, 3-Pin SIP
(A1101, A1102, A1103. and A1104)
+0.08
4.09 –0.05
45°
B
C
E
2.04
1.52 ±0.05
1.44 E
Mold Ejector
Pin Indent
+0.08
3.02 –0.05
E
Branded
Face
NNT
45°
1
D Standard Branding Reference View
2.16
MAX
= Supplier emblem
N = Last two digits of device part number
T = Temperature code
0.79 REF
A
0.51
REF
1
2
3
+0.03
0.41 –0.06
15.75 ±0.51
For Reference Only; not for tooling use (reference DWG-9049)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A
Dambar removal protrusion (6X)
B Gate burr area
C Active Area Depth, 0.50 mm REF
+0.05
0.43 –0.07
D
Branding scale and appearance at supplier discretion
E
Hall element, not to scale
1.27 NOM
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Package UA, 3-Pin SIP
(A1106)
+0.08
4.09 –0.05
45°
B
C
E
2.04
1.52 ±0.05
1.44 E
10°
Mold Ejector
Pin Indent
+0.08
3.02 –0.05
E
Branded
Face
NNT
45°
1
D Standard Branding Reference View
0.79 REF
= Supplier emblem
N = Last two digits of device part number
T = Temperature code
A
1.02
MAX
1
2
3
For Reference Only; not for tooling use (reference DWG-9065)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.03
0.41 –0.06
14.99 ±0.25
+0.05
0.43 –0.07
A
Dambar removal protrusion (6X)
B
Gate and tie bar burr area
C
Active Area Depth, 0.50 mm REF
D
Branding scale and appearance at supplier discretion
E
Hall element (not to scale)
1.27 NOM
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
A1101, A1102, A1103,
A1104, and A1106
Continuous-Time Switch Family
Revision History
Revision
Revision Date
Rev. 14
May 29, 2012
Description of Revision
Add A1106 UA package drawing
Copyright ©2006-2012, Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;
nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
13