TI TXB0304RSVR

TXB0304
www.ti.com
SCES831C – SEPTEMBER 2011 – REVISED MAY 2012
4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION
SENSING
Check for Samples: TXB0304
FEATURES
1
•
•
•
•
•
•
•
Fully Symmetric Supply Voltages. 0.9 V to 3.6
V on A Port and 0.9 V to 3.6 V
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
OE Input Circuit Referenced to VCCA
Low Power Consumption, 5-μA Max (ICCA or
ICCB)
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 8000-V Human-Body Model (A114-B)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
This 4-bit non-inverting translator uses two separate
configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply
voltage from 0.9 V to 3.6 V. The B port is designed to
track VCCB. VCCB accepts any supply voltage from 0.9
V to 3.6 V. This allows for low-voltage bidirectional
translation between 1-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V
and 3.3-V voltage nodes. For the TXB0304, when the
output-enable (OE) input is low, all outputs are placed
in the high-impedance state. To ensure the highimpedance state during power up or power down, OE
should be tied to GND through a pulldown resistor;
the minimum value of the resistor is determined by
the current-sourcing capability of the driver. The
TXB0304 is designed so that the OE input circuit is
supplied by VCCA. This device is fully specified for
partial-power-down applications using Ioff. The Ioff
circuitry disables the outputs, preventing damaging
current backflow through the device when it is
powered down.
RSV PACKAGE
(TOP VIEW)
TXB0304
NC
NC
V CCB
15
14
13
12
11
10
B3
4
9
9
A4
B2
3
10
A3
B1
2
11
4
B4
A2
TXB0304
1
12
3
B3
16
13
B2
A1
V CCA
V CCB
15
14
B1
2
A4
TXBN0304
1
A3
NC
16
A2
NC
V CCA
A1
RUT PACKAGE
(TOP VIEW)
B4
TXBN0304
8
GND
/OE
NC
GND
5
OE
6
8
GND
GND
7
6
NC
7
5
A.
Pull up resistors are not required on both sides for Logic I/O.
B.
If pull up or pull down resistors are needed, the resistor value must be over 20 kΩ.
C.
20 kΩ is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down
resistor is allowed, the draft estimation is Vol = Vccout × 1.5k/(1.5k + Rpu) and Voh = Vccout × Rdw/(1.5k + Rdw).
D.
If pull up resistors are needed, please refer to the TXS0104 or contact TI.
E.
For detailed information, please refer to application note SCEA043.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated
TXB0304
SCES831C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
TA
–40 to 85°C
(1)
(2)
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
RUT – MicroQFN
TXB0304RUTR
73R
RSV – QFN
TXB0304RSVR
ZTJ
RUT – MicroQFN
TXBN0304RUTR
74R
RSV – QFN
TXBN0304RSVR
ZTK
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com.
DEVICE INFORMATION
Table 1. SIGNAL DESCRIPTIONS
PIN NO.
2
NAME
TXB0304
FUNCTION
RSV
RUT
TXBN0304
16
1
VCCA
1
2
A1
Input/output 1
2
3
A2
Input/output 2
3
4
A3
Input/output 3
4
5
A4
Input/output 4
5
–
NC
No connection; not internally connected
6,7
6
GND
8
12
OE
A-port supply voltage 0.9V ≤ VCCA ≤ 3.6V
Referenced to VCCA
Ground
OE
3-state output-mode enable. Pull OE (TXB0304) low to place all outputs in 3-state mode.
3-state output-mode enable. Pull OE (TXBN0304) high to place all outputs in 3-state
mode.
Referenced to VCCA.
9
7
B4
Input/output 1
10
8
B3
Input/output 2
11
9
B2
Input/output 3
12
10
B1
Input/output 4
13
11
VCCB
14
–
NC
No connection; not internally connected
15
–
NC
No connection; not internally connected
Referenced to VCCB
B-port supply voltage 0.9V ≤ VCCB ≤ 3.6V
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXB0304
TXB0304
www.ti.com
SCES831C – SEPTEMBER 2011 – REVISED MAY 2012
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
MIN
MAX
–0.5
4.6
–0.5
4.6
A port
Supply voltage range
UNIT
V
VI
Input voltage range
–0.5
4.6
B port
–0.5
4.6
VO
Voltage range applied to any output in the A port
high-impedance or power-off state
B port
–0.5
4.6
-0.5
4.6
VO
Voltage range applied to any output in the A port
high or low state (2)
B port
–0.5
VCCA + 0.5
–0.5
VCCB + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCCA, VCCB, or GND
±100
mA
150
°C
Tstg
(1)
(2)
Storage temperature range
–65
V
V
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
THERMAL IMPEDANCE RATINGS
over operating free-air temperature range (unless otherwise noted)
UNIT
θJA
(1)
(2)
Package thermal impedance
RUT package (1)
87
RSV package (2)
184
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7
The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS (1) (2)
VCCA
VCCA
VCCB
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VO
Voltage range applied to any output in
the high-impedance or power-off state
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
(2)
VCCB
MIN
MAX
0.9
3.6
0.9
3.6
Data inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
VCCI × 0.65
VCCI
OE
0.9 V to 3.6 V
0.9 V to 3.6 V
VCCA × 0.65
3.6
Data inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
0
VCCI × 0.35
OE
0.9 V to 3.6 V
0.9 V to 3.6 V
0 VCCA × 0.35
A-port
0.9 V to 3.6 V
0.9 V to 3.6 V
0
3.6
B-port
0.9 V to 3.6 V
0.9 V to 3.6 V
0
3.6
A-port inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
40
B-port inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
40
–40
85
UNIT
V
V
V
V
ns/V
°C
The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
VCCI is the supply voltage associated with the input port.
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Product Folder Link(s): TXB0304
3
TXB0304
SCES831C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
VCCA
VOHA
IOH = –20 μA
0.9 V to 3.6 V
VOLA
IOL = 20 μA
0.9 V to 3.6 V
IOH = –20 μA
VOHB
II
Ioff
OE
VI = VCCI or GND
A port
B port
A or B port
MIN
TYP
–40°C to 85°C
MAX
MIN
MAX
0.9 x
VCCA
0.2
0.9 V to 3.6 V
UNIT
V
V
0.9 x
VCCB
0.9 V to 3.6 V
IOL = 20 μA
VOLB
TA = 25°C
VCCB
V
0.2
V
0.9 V to 3.6 V
0.9 V to 3.6 V
±1
±2
VI or VO = 0 to 3.6 V
0V
0 V to 3.6 V
±1
±2
VI or VO = 0 to 3.6 V
0.9 V to 3.6 V
0V
±1
±2
±1
μA
μA
OE = GND
0.9 V to 3.6 V
0.9 V to 3.6 V
±2
μA
ICCA
VI = VCCI or GND, IO = 0
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
ICCB
VI = VCCI or GND, IO = 0
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
ICCA + ICCB
VI = VCCI or GND, IO = 0
0.9 V to 3.6 V
0.9 V to 3.6 V
10
μA
ICCZA
VI = VCCI or GND,
IO = 0, OE = GND
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
ICCZB
VI = VCCI or GND,
IO = 0, OE = GND
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
0.9 V to 3.6 V
0.9 V to 3.6 V
IOZ
Ci
Cio
OE
A port
0.9 V to 3.6 V
B port
3
pF
6.7
0.9 V to 3.6 V
pF
6.7
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted)
Data rate
4
VCCA
VCCB
MIN MAX
UNIT
CL = 15 pF
0.9 to 3.6 V
0.9 to 3.6 V
50
Mbps
CL = 15 pF
1.2 to 3.6 V
1.2 to 3.6 V
100
Mbps
CL = 15 pF
1.8 to 3.6 V
1.8 to 3.6 V
140
Mbps
CL = 30 pF
0.9 to 3.6 V
0.9 to 3.6 V
40
Mbps
CL = 30 pF
1.2 to 3.6 V
1.2 to 3.6 V
90
Mbps
CL = 30 pF
1.8 to 3.6 V
1.8 to 3.6 V
130
Mbps
CL = 50 pF
1.2 to 3.6 V
1.2 to 3.6 V
80
Mbps
CL = 50 pF
1.8 to 3.6 V
1.8 to 3.6 V
120
Mbps
CL = 100 pF
1.2 to 3.6 V
1.2 to 3.6 V
70
Mbps
CL = 100 pF
1.8 to 3.6 V
1.8 to 3.6 V
100
Mbps
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXB0304
TXB0304
www.ti.com
SCES831C – SEPTEMBER 2011 – REVISED MAY 2012
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TYP
TA =
25°C
MAX
0.9-3.6
18.9
30
1.2-3.6
1.2-3.6
7.5
11.5
1.8-3.6
1.8-3.6
3.7
4.8
CL = 30
0.9-3.6
0.9-3.6
19.5
34
B
CL = 30
1.2-3.6
1.2-3.6
7.8
11.9
B
CL = 30
1.8-3.6
1.8-3.6
3.8
5.2
A
B
CL = 50
1.2-3.6
1.2-3.6
8
12.3
A
B
CL = 50
1.8-3.6
1.8-3.6
4
5.4
A
B
CL = 100
1.2-3.6
1.2-3.6
8.6
13.5
A
B
CL = 100
1.8-3.6
1.8-3.6
4.5
6
B
A
CL = 15
0.9-3.6
0.9-3.6
18.9
30
B
A
CL = 15
1.2-3.6
1.2-3.6
7.5
11.5
B
A
CL = 15
1.8-3.6
1.8-3.6
3.7
5
B
A
CL = 30
0.9-3.6
0.9-3.6
19.5
34
B
A
CL = 30
1.2-3.6
1.2-3.6
7.8
11.9
B
A
CL = 30
1.8-3.6
1.8-3.6
3.8
5.2
B
A
CL = 50
1.2-3.6
1.2-3.6
8
12.3
B
A
CL = 50
1.8-3.6
1.8-3.6
4
5.4
B
A
CL = 100
1.2-3.6
1.2-3.6
8.6
13.5
B
A
CL = 100
1.8-3.6
1.8-3.6
4.5
A
CL = 15
0.9-3.6
0.9-3.6
173
B
CL = 15
0.9-3.6
0.9-3.6
213
A
CL = 15
0.9-3.6
0.9-3.6
172
ns
B
CL = 15
0.9-3.6
0.9-3.6
169
ns
FROM
(INPUT)
TO
(OUTPUT)
A
B
A
A
tpd
VCCA
VCCB
CL = 15
0.9-3.6
B
CL = 15
B
CL = 15
A
B
A
A
ten
OE
tdis
OE
MIN
UNIT
ns
ns
6
ns
trB, tfB
B-port rise and fall times
CL = 15
0.9-3.6
0.9-3.6
2.95
ns
t s, t s
A-port rise and fall times
CL = 15
0.9-3.6
0.9-3.6
3.1
ns
tSK(O)
Channel-to-channel
skew
CL = 15
0.9-3.6
0.9-3.6
0.15
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
VCCA, VCCB
0.9 V to 3.6 V
TEST CONDITIONS
UNIT
TYP
CpdA
CpdB
CpdA
CpdB
A-port input, B-port output
34
B-port input, A-port output
34
A-port input, B-port output
CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled)
34
B-port input, A-port output
34
A-port input, B-port output
0.01
B-port input, A-port output
0.01
A-port input, B-port output
CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled)
B-port input, A-port output
0.01
0.01
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXB0304
pF
pF
pF
pF
5
TXB0304
SCES831C – SEPTEMBER 2011 – REVISED MAY 2012
www.ti.com
REVISION HISTORY
Changes from Revision B (September 2011) to Revision C
•
6
Page
Added package pin out diagram notes. ................................................................................................................................ 1
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXB0304
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
TXB0304RSVR
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TXB0304RUTR
ACTIVE
UQFN
RUT
12
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TXBN0304RSVR
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TXBN0304RUTR
ACTIVE
UQFN
RUT
12
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TXB0304RSVR
UQFN
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
RSV
16
3000
177.8
B0
(mm)
K0
(mm)
P1
(mm)
12.4
2.0
2.8
0.7
4.0
W
Pin1
(mm) Quadrant
12.0
Q1
TXB0304RUTR
UQFN
RUT
12
3000
180.0
9.5
1.9
2.3
0.75
4.0
8.0
Q1
TXBN0304RSVR
UQFN
RSV
16
3000
177.8
12.4
2.0
2.8
0.7
4.0
12.0
Q1
TXBN0304RSVR
UQFN
RSV
16
3000
330.0
12.4
2.1
2.9
0.75
4.0
12.0
Q1
TXBN0304RUTR
UQFN
RUT
12
3000
180.0
8.4
1.95
2.3
0.75
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXB0304RSVR
UQFN
RSV
16
3000
202.0
201.0
28.0
TXB0304RUTR
UQFN
RUT
12
3000
180.0
180.0
30.0
TXBN0304RSVR
UQFN
RSV
16
3000
202.0
201.0
28.0
TXBN0304RSVR
UQFN
RSV
16
3000
180.0
180.0
30.0
TXBN0304RUTR
UQFN
RUT
12
3000
202.0
201.0
28.0
Pack Materials-Page 2
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TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
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DLP® Products
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RFID
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