TI TXB0106RGYR

TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008
6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION
FEATURES
1
•
A2
A3
A4
A5
A6
OE
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
B1
VCCB
B2
B3
B4
B5
B6
GND
RGY PACKAGE
(TOP VIEW)
VCCA
2
B1
•
A1
VCCA
1
16
15
VCCB
14
B2
13
B3
12
B4
A2
3
A3
4
A4
5
A5
6
11
B5
A6
7
10
B6
Exposed
Center Pad
8
9
GND
•
•
•
PW PACKAGE
(TOP VIEW)
A1
•
1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on
B Port (VCCA≤ VCCB)
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
OE Input Circuit Referenced to VCCA
Low Power Consumption, 4-µA Max ICC
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 150-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– ±15-kV Human-Body Model (A114-B)
– 150-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
OE
•
The exposed center pad, if used, must be
connected as a secondary ground or left
electrically open.
DESCRIPTION/ORDERING INFORMATION
This 6-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
The TXB0106 is designed so that the OE input circuit is supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TXB0106
SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN – RGY
Reel of 1000
TXB0106RGYR
YE06
TSSOP – PW
Reel of 2000
TXB0106PWR
YE06
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PIN DESCRIPTION
NO.
NAME
1
A1
FUNCTION
2
VCCA
3
A2
Input/output 2. Referenced to VCCA.
4
A3
Input/output 3. Referenced to VCCA.
5
A4
Input/output 4. Referenced to VCCA.
6
A5
Input/output 5. Referenced to VCCA.
7
A6
Input/output 6. Referenced to VCCA.
8
OE
Output enable. Pull OE low to place all outputs in 3-state mode.
Referenced to VCCA.
Input/output 1. Referenced to VCCA.
A-port supply voltage. 1.2 V ≤ VCCA≤ 3.6 V, VCCA≤ VCCB.
9
GND
10
B6
Ground
Input/output 6. Referenced to VCCB.
11
B5
Input/output 5. Referenced to VCCB.
12
B4
Input/output 4. Referenced to VCCB.
13
B3
Input/output 3. Referenced to VCCB.
14
B2
Input/output 2. Referenced to VCCB.
15
VCCB
16
B1
B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V.
Input/output 1. Referenced to VCCB.
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
VCCA
VCCB
OE
TXB0106
2
1.8 -V
System
Controller
A1
A2
B1
B2
3.3-V
System
Data
A3
A4
A5
A6
B3
B4
B5
B6
Data
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
Supply voltage range
–0.5
6.5
V
(2)
–0.5
6.5
V
–0.5
6.5
V
VI
Input voltage range
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
A inputs
–0.5 VCCA + 0.5
B inputs
–0.5 VCCB + 0.5
UNIT
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCCA, VCCB, or GND
JA
Package thermal impedance
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
PW package (4)
83
RGY package (5)
37
–65
V
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS (1) (2)
VCCA
VCCA
VCCB
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
Δt/Δv
Input transition
rise or fall rate
TA
Operating free-air temperature
(1)
(2)
(3)
VCCB
Data inputs
OE
1.2 V to 3.6 V
Data inputs
1.2 V to 5.5 V
OE
1.2 V to 3.6 V
A-port inputs
1.2 V to 3.6 V
B-port inputs
1.2 V to 3.6 V
1.65 V to 5.5 V
1.65 V to 5.5 V
MIN
MAX
1.2
3.6
1.65
5.5
VCCI× 0.65 (3)
VCCI
VCCA× 0.65
5.5
0
VCCI× 0.35 (3)
0
VCCA× 0.35
1.65 V to 5.5 V
40
1.65 V to 3.6 V
40
4.5 V to 5.5 V
UNIT
V
V
V
ns/V
30
–40
85
°C
The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
VCCI is the supply voltage associated with the input port.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
3
TXB0106
SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS (1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
VCCA
TA = 25°C
VCCB
MIN
1.2 V
IOH = –20 µA
VOLA
IOL = 20 µA
VOHB
IOH = –20 µA
1.65 V to 5.5 V
VOLB
IOL = 20 µA
1.65 V to 5.5 V
IOZ
1.4 V to 3.6 V
0.4
VCCB– 0.4
V
V
µA
±2
A port
0V
0 V to 5.5 V
±1
±2
B port
0 V to 3.6 V
0V
±1
±2
1.2 V to 3.6 V
1.65 V to 5.5 V
±1
±2
OE = GND
VI = VCCI or GND,
IO = 0
1.4 V to 3.6 V
0V
5.5 V
2
ICCA + ICCB
VI = VCCI or GND,
IO = 0
1.2 V
ICCZA
VI = VCCI or GND,
IO = 0,
OE = GND
ICCZB
VI = VCCI or GND,
IO = 0,
OE = GND
0V
0V
5.5 V
1.4 V to 3.6 V
1.4 V to 3.6 V
µA
µA
2
3.5
1.65 V to 5.5 V
10
0.05
1.65 V to 5.5 V
5
1.2 V
1.2 V to 3.6 V
B port
5
–2
1.2 V
1.4 V to 3.6 V
µA
3.4
1.65 V to 5.5 V
3.6 V
1.2 V to 3.6 V
A port
5
2
ICCB
OE
1.65 V to 5.5 V
0V
1.2 V
µA
0.06
3.6 V
1.4 V to 3.6 V
V
0.4
±1
VI = VCCI or GND,
IO = 0
(1)
(2)
0.9
1.65 V to 5.5 V
A or B port
UNIT
V
1.2 V to 3.6 V
ICCA
Cio
MAX
VCCA– 0.4
1.2 V
1.2 V
CI
MIN
1.4 V to 3.6 V
OE
Ioff
–40°C to 85°C
MAX
1.1
VOHA
II
TYP
3.3
1.65 V to 5.5 V
5
1.65 V to 5.5 V
1.65 V to 5.5 V
5
5.5
5
6.5
8
10
µA
µA
µA
pF
pF
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
TIMING REQUIREMENTS
TA = 25°C, VCCA = 1.2 V
Data rate
tw
Pulse duration
Data inputs
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
TYP
TYP
TYP
TYP
20
20
20
20
Mbps
50
50
50
50
ns
UNIT
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
Data rate
tw
4
Pulse duration
MAX
VCCB = 2.5 V
± 0.2 V
MIN
50
Data inputs
20
Submit Documentation Feedback
VCCB = 3.3 V
± 0.3 V
MAX
MIN
50
20
MAX
VCCB = 5 V
± 0.5 V
MIN
50
20
50
20
UNIT
MAX
Mbps
ns
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
MAX
Data rate
tw
VCCB = 2.5 V
± 0.2 V
MIN
MAX
52
Pulse duration
Data inputs
VCCB = 3.3 V
± 0.3 V
MIN
MAX
60
19
VCCB = 5 V
± 0.5 V
MIN
60
17
60
17
UNIT
MAX
17
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
MAX
Data rate
tw
VCCB = 3.3 V
± 0.3 V
MIN
MAX
70
Pulse duration
Data inputs
VCCB = 5 V
± 0.5 V
MIN
100
14
100
10
UNIT
MAX
10
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
MIN
Data rate
tw
VCCB = 5 V
± 0.5 V
MAX
MIN
100
Pulse duration
Data inputs
10
UNIT
MAX
100
10
Mbps
ns
SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
TYP
TYP
TYP
TYP
A
B
9.5
7.9
7.6
8.5
B
A
9.2
8.8
8.4
8
A
1
1
1
1
B
1
1
1
1
A
20
17
17
18
B
20
16
15
15
A-port rise and fall times
4.1
4.4
4.1
3.9
ns
ns
ten
OE
tdis
OE
trA, tfA
UNIT
ns
µs
ns
trB, tfB
B-port rise and fall times
5
5
5.1
5.1
tSK(O)
Channel-to-channel skew
2.4
1.7
1.9
7
ns
20
20
20
20
Mbps
Max data rate
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
5
TXB0106
SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
MIN
MAX
MIN
MAX
MIN
B
1.4
12.9
1.2
10.1
A
0.9
14.2
0.7
12
VCCB = 5 V
± 0.5 V
UNIT
MAX
MIN
MAX
1.1
10
0.8
9.9
0.4
11.7
0.3
13.7
A
1
1
1
1
B
1
1
1
1
ns
µs
A
6.6
33
6.4
25.3
6.1
23.1
5.9
24.6
B
6.6
35.6
5.8
25.6
5.5
22.1
5.6
20.6
A-port rise and fall times
0.8
6.5
0.8
6.3
0.8
6.3
0.8
6.3
ns
trB, tfB
B-port rise and fall times
1
7.3
0.7
4.9
0.7
4.6
0.6
4.6
ns
tSK(O)
Channel-to-channel skew
trA, tfA
Max data rate
2.6
1.9
50
50
1.6
50
1.3
50
ns
ns
Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.6
11
1.4
7.7
1.3
6.8
1.2
6.5
A
1.5
12
1.2
8.4
0.8
7.6
0.5
7.1
A
1
1
1
1
B
1
1
1
1
ns
µs
A
5.9
26.7
5.6
21.6
5.4
18.9
4.8
18.7
B
6.1
33.9
5.2
23.7
5
19.9
5
17.6
A-port rise and fall times
0.7
5.1
0.7
5
1
5
0.7
5
ns
trB, tfB
B-port rise and fall times
1
7.3
0.7
5
0.7
3.9
0.6
3.8
ns
tSK(O)
Channel-to-channel skew
trA, tfA
Max data rate
6
VCCB = 1.8 V
± 0.15 V
0.8
52
Submit Documentation Feedback
0.7
60
0.6
60
0.6
60
ns
ns
Mbps
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
MIN
MAX
B
1.1
A
1
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
6.4
1
5.3
0.9
4.7
7
0.6
5.6
0.3
4.4
A
1
1
1
B
1
1
1
ns
µs
A
5
16.9
4.9
15
4.5
13.8
B
4.8
21.8
4.5
17.9
4.4
15.2
A-port rise and fall times
0.8
3.6
0.6
3.6
0.5
3.5
ns
trB, tfB
B-port rise and fall times
0.6
4.9
0.7
3.9
0.6
3.2
ns
tSK(O)
Channel-to-channel skew
trA, tfA
0.4
Max data rate
0.3
70
0.3
100
100
ns
ns
Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
B
0.9
4.9
0.8
4
A
0.5
5.4
0.2
4
A
1
1
B
1
1
ns
µs
A
4.5
13.9
4.1
12.4
B
4.1
17.3
4
14.4
A-port rise and fall times
0.5
3
0.5
3
ns
trB, tfB
B-port rise and fall times
0.7
3.9
0.6
3.2
ns
tSK(O)
Channel-to-channel skew
trA, tfA
Max data rate
0.4
100
0.3
100
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
ns
ns
Mbps
7
TXB0106
SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
OPERATING CHARACTERISTICS
TA = 25°C
VCCA
1.2 V
1.2 V
1.5 V
1.8 V
2.5 V
2.5 V
3.3 V
2.5 V
5V
3.3 V
to
5V
VCCB
PARAMETER
TEST CONDITIONS
5V
CpdA
CpdB
CpdA
CpdB
8
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = VCCA
(outputs enabled)
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = GND
(outputs disabled)
1.8 V
1.8 V
1.8 V
UNIT
TYP
TYP
TYP
TYP
TYP
TYP
9
8
7
7
7
7
TYP
8
12
11
11
11
11
11
11
35
26
27
27
27
27
28
26
19
18
18
18
20
21
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.03
0.01
0.01
0.01
0.01
0.01
0.01
0.03
Submit Documentation Feedback
pF
pF
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008
PRINCIPLES OF OPERATION
Applications
The TXB0106 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0106 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0106 can maintain a high or low,
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts
flowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up
the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V,
50 Ω at VCCO = 1.8 V to 3.3 V and 40 Ω at VCCO = 3.3 V to 5 V.
VCCA
VCCB
One
Shot
T1
4k
One
Shot
T2
A
B
One
Shot
T3
4k
T4
One
Shot
Figure 1. Architecture of TXB0106 I/O Cell
Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0106 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0106 must have drive strength of at least ±2 mA.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
9
TXB0106
SCES709 – SEPTEMBER 2008 ......................................................................................................................................................................................... www.ti.com
IIN
VT/4 k
VIN
–(VD – VT)/4 k
A.
VT is the input threshold voltage of the TXB0106 (typically VCCI/ 2).
B.
VD is the supply voltage of the external driver.
Figure 2. Typical IIN vs VIN Curve
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0106 has circuitry that disables all
output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0106 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
The TXB0106 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0106 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0106.
For the same reason, the TXB0106 should not be used in applications such as I2C or 1-Wire where an
open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI
TXS01xx series of level translators.
10
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
TXB0106
www.ti.com ......................................................................................................................................................................................... SCES709 – SEPTEMBER 2008
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
From Output
Under Test
15 pF
1 MW
Open
50 kW
15 pF
TEST
tPZL/tPLZ
tPHZ/tPZH
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
S1
50 kW
From Output
Under Test
S1
2 × VCCO
Open
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
tPHL
tw
Output
VCCO/2
0.9 y VCCO
0.1 y VCCO
VOH
tf
tr
VCCI
VCCO/2
VOL
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A.
B.
C.
D.
E.
F.
G.
VCCI/2
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuits and Voltage Waveforms
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0106
11
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TXB0106PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXB0106PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXB0106RGYR
ACTIVE
VQFN
RGY
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TXB0106RGYRG4
ACTIVE
VQFN
RGY
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TXB0106 :
• Automotive: TXB0106-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TXB0106PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TXB0106RGYR
VQFN
RGY
16
3000
330.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXB0106PWR
TXB0106RGYR
TSSOP
PW
16
2000
346.0
346.0
29.0
VQFN
RGY
16
3000
346.0
346.0
29.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated