TI TCA9406DCUR

TCA9406
www.ti.com
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
2-BIT BIDIRECTIONAL 1MHz, I2C BUS AND SMBUS VOLTAGE-LEVEL TRANSLATOR WITH
8kV HBM ESD
Check for Samples: TCA9406
FEATURES
1
•
•
•
•
•
•
•
•
•
2-Bit Bidirectional Translator for SDA and SCL
Lines in Mixed-Mode I2C Applications
5.5-V Tolerant OE Input
Level Translation Range
– 1.8 V to 2.5 V/3.3 V/5 V
– 2.5 V to 2.5 V/3.3 V/5 V
– 3.3 V to 3.3 V/5 V
Internal10-kΩ Pullup Resistor on Each Port
and Option to Add External Pullup Resistor if
Required
Provides Bidirectional Voltage Translation
With No Direction Pin
Ioff Support Partial Power Down (VCC= 0 V)
With 2 mA
High-Impedance Output SCL1, SDA1, SCL2,
and SDA2 Pins When OE = Low or VCC= 0 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 8-kV Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
TYPICAL LEVEL-SHIFTER
APPLICATIONS
•
•
•
I2C/SMBus
UART
GPIO
DCU PACKAGE
(TOP VIEW)
SDA_B
1
8
SCL_B
GND
2
7
VCCB
VCCA
3
6
OE
SDA_A
4
5
SCL_A
YZP PACKAGE
(BOTTOM VIEW)
SDA_A
D1
4 5
D2
VCCA
C1
3 6
C2
SCL_A
OE
GND
B1
2 7
B2
VCCB
SDA_B
A1
1 8
A2
SCL_B
DQM PACKAGE
(TOP VIEW)
SDA_A
1
8
SCL_A
VCCA
2
7
OE
GND
3
6
VCCB
SDA_B
4
5
SCL_B
DESCRIPTION
The TCA9406 is a dual bidirectional I2C-Bus and SMBus Voltage-Level translator with enable (OE) Input. It is
operational from 1.65 V to 3.6 V on A-Port and 2.3 V to 5.5 V on B-port. The Output Enable (OE) input is
referenced to VCCA, but is 5.5V tolerant
The device can also be used as a general purpose level-translator, supporting push-pull driving of the A and
B ports. When driven with push-pull devices on both sides the TCA9406 can support up to 24Mps.
Under normal I2C and SMBus operation or other open drain configurations, the device can support up to
2Mbps. It is compatible with a standard I2C bus 100 kHz, 400 kHz and 1 MHz at both sides of A-Port and BPort.
The TCA9406 features internal 10kOHM pullup resistors. Additional external pullup resistors can be added to
the bus to reduce total pullup resistance.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
TCA9406
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
www.ti.com
The TCA9406 is not a bus buffer like the PCA9515B and PCA9517. The OE feature can be utilized to isolate
one side of the bus from the other by placing both sides into a high impedence state.
The Enable (OE) should be tied to GND through a pulldown resistor to ensure the high-impedance state
during power up or power down. The minimum value of the resistor is determined by the current-sourcing
capability of the driver.
ORDERING INFORMATION
For package and ordering information, see the Package Option Addendum at the end of this document.
PIN DESCRIPTION
NO.
NAME
TYPE
FUNCTION
DQM,
DCU
YZP
1
A1
SDA_B
I/O
2
B1
GND
GND
Ground
3
C1
VCCA
PWR
A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB. Configuration for
SDA_A, SCL_A, and OE
4
D1
SDA_A
I/O
Input/output A. Referenced to VCCA. Allows I2C_SDA configured to 1.8V, 2.5V, 3.3V
5
D2
SCL_A
I/O
Input/output A. Referenced to VCCA. Allows I2C_SCL configured to 1.8V, 2.5V, 3.3V
6
C2
OE
Input
Output enable (active High). Referenced to VCCA. Pull OE to LOW to place all outputs
in tri-state mode.
7
B2
VCCB
PWR
B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V for SDA_B, SCL_B
8
A2
SCL_B
I/O
Input/output B. Referenced to VCCB. Allow I2C_SDA configured to 2.5V/3.3V/5V
Input/output B. Referenced to VCCB. Allow I2C_SCL configured to 2.5V/3.3V/5V
TYPICAL OPERATING CIRCUIT
Optional Resistors
1.8V
3.3V
0.1!F
Master
I2C
Bus
VCCA
VCCB
SDA_A
SDA_B
SCL_A
SCL_B
I2C
Bus
Devices
OE
Design Notes:
OE can be tied directly to 1.8V (VCCA) to always be in ENABLE mode.
2
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
TCA9406
www.ti.com
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
ABSOLUTE MAXIMUM RATINGS (1)
over recommended operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
Supply voltage range
–0.5
6.5
V
A port
–0.5
4.6
B port
–0.5
6.5
OE input
–0.5
6.5
A port
–0.5
4.6
B port
–0.5
6.5
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
Input voltage range (2)
VI
V
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
VO
Voltage range applied to any output in the high or low state (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
(3)
Continuous current through VCCA, VCCB, or GND
Package thermal impedance (4)
θJA
Tstg
(1)
(2)
(3)
(4)
DQM package
220
DCU package
227
YZP package
102
Storage temperature range
–65
Supply voltage (3)
VCCB
Supply voltage
VIH
High-level
input voltage
A-port I/Os
B-port I/Os
OE input
1.65 V to 1.95 V
2.3 V to 3.6 V
1.65 V to 3.6 V
VCCB
2.3 V to 5.5 V
2.3 V to 5.5 V
A-port I/Os
(4)
Low-level
input voltage
B-port I/Os
1.65 V to 3.6 V
2.3 V to 5.5 V
OE input
Δt/Δv
(1)
(2)
(3)
(4)
°C/W
150
°C
(2)
VCCA
VCCA
TA
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VIL
V
A-port I/Os, push-pull driving
Input transition
B-port I/Os, push-pull driving
rise or fall rate
Control input
MIN
MAX
1.65
3.6
V
2.3
5.5
V
VCCI – 0.2
VCCI
VCCI – 0.4
VCCI
VCCI – 0.4
VCCI
VCCA × 0.65
5.5
0
0.15
0
0.15
0
VCCA × 0.35
UNIT
V
V
10
1.65 V to 3.6 V
2.3 V to 5.5 V
10
ns/V
10
Operating free-air temperature
–40
85
°C
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
The maximum VIL value is provided to ensure that a valid VOL is maintained. The VOL value is VIL plus the voltage drop across the passgate transistor.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
3
TCA9406
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
www.ti.com
ELECTRICAL CHARACTERISTICS (1)
(2) (3)
over recommended operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
VCCA
VCCB
VOHA
IOH = –20 μA,
VIB ≥ VCCB – 0.4 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLA
IOL = 1 mA,
VIB ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOHB
IOH = –20 μA,
VIA ≥ VCCA – 0.2 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLB
IOL = 1 mA,
VIA ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
1.65 V to 3.6 V
2.3 V to 5.5 V
0V
0 to 5.5 V
PARAMETER
II
Ioff
IOZ
OE
A port
VCCA × 0.67
UNIT
V
0.4
VCCB × 0.67
V
V
0.4
V
±1
±2
μA
±1
±2
μA
0V
±1
±2
μA
±1
±2
μA
1.65 V to VCCB
2.3 V to 5.5 V
2.4
3.6 V
0V
2.2
0V
5.5 V
–1
1.65 V to VCCB
2.3 V to 5.5 V
12
3.6 V
0V
–1
0V
5.5 V
1
1.65 V to VCCB
2.3 V to 5.5 V
OE
3.3 V
3.3 V
2.5
A or B port
3.3 V
3.3 V
10
VI = VO = open,
IO = 0
ICCA + ICCB
VI = VCCI or GND,
IO = 0
4
MIN MAX
2.3 V to 5.5 V
VI = VO = open,
IO = 0
(1)
(2)
(3)
TYP MAX
0 to 3.6 V
A or B port
ICCB
Cio
MIN
–40°C to 85°C
1.65 V to 3.6 V
B port
ICCA
CI
TA = 25°C
A port
5
6
B port
6
7.5
μA
μA
14.4
μA
3.5
pF
pF
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
TCA9406
www.ti.com
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
Data rate
tw
Pulse
duration
MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 3.3 V
± 0.3 V
MIN
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
21
22
24
2
2
2
47
45
41
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
Data rate
tw
Pulse
duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 3.3 V
± 0.3 V
MAX
MIN
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
20
22
24
2
2
2
50
45
41
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCC = 3.3 V
± 0.3 V
MIN
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
23
24
2
2
43
41
500
500
Mbps
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
ns
5
TCA9406
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
A
ten
OE
A or B
tdis
OE
A or B
tPLH
Open-drain driving
45
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
8.8
260
1.9
5.3
175
MIN
9.6
36
208
4.4
27
36
140
1.2
198
4
0.5
27
200
50
40
200
ns
35
ns
3.2
9.5
2.3
9.3
2
7.6
Open-drain driving
38
165
30
132
22
95
Open-drain driving
Push-pull driving
4
10.8
2.7
9.1
2.7
7.6
34
145
23
106
10
58
2
5.9
1.9
6
1.7
13.3
Open-drain driving
4.4
6.9
4.3
6.4
4.2
6.1
Push-pull driving
2.9
13.8
2.8
16.2
2.8
16.2
Open-drain driving
6.9
13.8
7.5
16.2
7
16.2
0.7
Push-pull driving
Open-drain driving
Submit Documentation Feedback
0.7
0.7
21
22
24
2
2
2
ns
102
Push-pull driving
Push-pull driving
ns
4.7
4.5
200
10
7.5
4.5
1.1
UNIT
MAX
6.8
2.6
7.1
5.3
45
MAX
VCCB = 5 V
± 0.5 V
5.4
2.4
4.4
Push-pull driving
Open-drain driving
MIN
6.8
Push-pull driving
B
MAX
VCCB = 3.3 V
± 0.3 V
5.3
2.3
Push-pull driving
Open-drain driving
tPHL
6
TEST CONDITIONS
ns
ns
ns
ns
Mbps
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
TCA9406
www.ti.com
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
B
A
ten
OE
A or B
tdis
OE
A or B
tPLH
Open-drain driving
43
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
250
1.8
4.7
170
MIN
6
36
206
4.2
27
37
140
1.2
190
4
1
27
200
50
40
200
ns
35
ns
2.8
7.4
2.6
6.6
1.8
5.6
Open-drain driving
34
149
28
121
24
89
Push-pull driving
3.2
8.3
2.9
7.2
2.4
6.1
Open-drain driving
35
151
24
112
12
64
Push-pull driving
1.9
5.7
1.9
5.5
1.8
5.3
Open-drain driving
4.4
6.9
4.3
6.2
4.2
5.8
Push-pull driving
2.2
7.8
2.4
6.7
2.6
6.6
Open-drain driving
5.1
8.8
5.4
9.4
5.4
10.4
Push-pull driving
Open-drain driving
0.7
0.7
20
22
24
2
2
2
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
ns
103
Push-pull driving
0.7
ns
4.3
1.6
200
5.8
4.4
3.6
2.6
UNIT
MAX
3.8
2.1
4.1
2.5
44
MAX
VCCB = 5 V
± 0.5 V
3.7
2
3
Push-pull driving
Open-drain driving
6.3
3.5
Push-pull driving
tPHL
MIN
3.2
1.7
Push-pull driving
Open-drain driving
MAX
VCCB = 3.3 V
± 0.3 V
ns
ns
ns
ns
ns
Mbps
7
TCA9406
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 3.3 V
± 0.3 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
A
ten
OE
A or B
tdis
OE
A or B
tPLH
Open-drain driving
36
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
4.2
204
1
124
139
4.6
4.4
28
1
165
97
2.6
3
200
40
200
ns
35
ns
2.3
5.6
1.9
4.8
Open-drain driving
25
116
19
85
Push-pull driving
2.5
6.4
2.1
7.4
Open-drain driving
26
116
14
72
2
5.4
1.9
5
Open-drain driving
4.3
6.1
4.2
5.7
Push-pull driving
2.3
7.4
2.4
7.6
5
7.6
4.8
8.3
Open-drain driving
0.7
Push-pull driving
Open-drain driving
Submit Documentation Feedback
0.7
23
24
2
2
ns
105
Push-pull driving
Push-pull driving
ns
3.3
2.5
3
UNIT
MAX
3.1
1.4
2.5
Push-pull driving
Open-drain driving
MIN
4.2
Push-pull driving
B
MAX
VCCB = 5 V
± 0.5 V
2.4
1.3
Push-pull driving
Open-drain driving
tPHL
8
TEST CONDITIONS
ns
ns
ns
ns
ns
Mbps
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
TCA9406
www.ti.com
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
PRINCIPLES OF OPERATION
Application Notes
Figure 1. Typical Design Example
The TCA9406 has a VCC isolation feature known as Ioff partial power down and backdrive protection. If a cable is
connected, and the connected external system is still powered own, the system can be put into standby mode by
shutting down the power rail. In this state, the TCA9406 has a leakage current of approximately 2 µA caused by
current flow from powered-on system.
Power Up, Power Down
One advantage of the TCA9406 translator is that either power supply can be ramped up first. Another advantage
is that either power supply can be set to 0 V, and the outputs are in high-impedance state.
The recommended power up sequence is:
1. Apply power to the first VCC and apply the second VCC
2. Drive the OE input high to enable the device
The recommended power down sequence is:
1. Drive OE input low to disable the device
2. Switch Off the power from either VCC and remove power from other VCC.
Enable/Disable
The TCA9406 has an OE input that is used to disable the device by setting OE low, which place all I/Os in the
high-impedance state. The control OE is referenced to the VCCA supply. A pulldown resistor tying OE to ground
should be used to ensure that bus contention, excessive currents, or oscillations do not occur during power up
and power down. The value of resistor is based upon the current sinking capability of the device.
Integrated Pullup Resistors on the I/Os (A-Ports/B-Ports)
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors). Adding lower value pull-up resistors may effect VOL
levels. The internal pullups of the TCA9406 are disabled when the OE pin is low.
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
9
TCA9406
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
VCCI
VCCO
DUT
IN
DUT
IN
OUT
OUT
1 MW
15 pF
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × VCCO
50 kW
From Output
Under Test
15 pF
S1
Open
50 kW
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
0V
tPLZ
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
0.9 y VCCO
VCCO/2
0.1 y VCCO
VOH
VCCO/2
VOL
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VCCA/2
VCCO
VCCO/2
0.1 y VCCO
VOL
tPHZ
tPZH
VOH
0.9 y VCCO
VCCO/2
0V
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
10
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
TCA9406
www.ti.com
SCPS221B – OCTOBER 2010 – REVISED JUNE 2013
Changes from Revision A (Febuary 2013) to Revision B
•
Page
Removed ordering information table, information now located in POA. ............................................................................... 2
Submit Documentation Feedback
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: TCA9406
11
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
HPA02270YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
7W
TCA9406DCTR
ACTIVE
SM8
DCT
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
NF9
Z
TCA9406DCUR
ACTIVE
US8
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
NF9R
TCA9406YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
7W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TCA9406DCTR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SM8
DCT
8
3000
180.0
13.0
3.35
4.5
1.55
4.0
12.0
Q3
TCA9406DCUR
US8
DCU
8
3000
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
TCA9406YZPR
DSBGA
YZP
8
3000
180.0
8.4
1.11
2.1
0.56
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jun-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TCA9406DCTR
SM8
DCT
8
3000
182.0
182.0
20.0
TCA9406DCUR
US8
DCU
8
3000
202.0
201.0
28.0
TCA9406YZPR
DSBGA
YZP
8
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
D: Max = 1.918 mm, Min =1.858 mm
E: Max = 0.918 mm, Min =0.858 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated