ETC XCCACEM64SERIES

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DS087 (v1.0) September 25, 2001
System ACE MPM Solution
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Advance Product Specification
Summary of Features
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System level, high capacity, pre-configured solution for
Virtex and Spartan FPGAs
Industry standard Flash memory die combined with
Xilinx controller technology in a single package
Effortless density migration:
- XCCACEM16-BG388I (16 Megabit (Mb))
- XCCACEM32-BG388I (32 Mb)
- XCCACEM64-BG388I (64 Mb)
All densities are available in the 388-pin Ball Grid Array
package
VCC I/O: 1.8V, 2.5V, and 3.3V
Configuration rates up to 152 Mb per second (Mb/s)
Flexible configuration solution:
- SelectMAP (control up to four FPGAs)
- Slave-Serial
- Concurrent Slave-Serial (up to eight separate
chains)
Patented compression technology (up to
2x compression)
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JTAG interface allows:
- Access to the standard Flash memory
- Boundary Scan testing
Native interface to the standard Flash memory is
provided for:
- External parallel programming
- Processor access to unused Flash memory
locations
Supports up to eight separate design sets (selectable
by mode pins or via JTAG), enabling systems to
reconfigure FPGAs for different functions
Compatible with IEEE Standard 1532
User-friendly software to format and program the
bitstreams into the standard Flash via the patented
Flash programming engine
Internet Reconfigurable Logic (IRL) upgradable system
Description
The System ACE™ Multi-Package Module (MPM) solution
addresses the need for a space-efficient, pre-engineered,
high-density configuration solution in multiple FPGA systems. The System ACE technology is a ground-breaking
in-system programmable configuration solution that provides substantial savings in development effort and cost per
bit over traditional PROM and embedded solutions for high
capacity FPGA systems. As shown in Figure 1, the System
ACE MPM solution is a multi-package module that includes
the System ACE MPM controller, a configuration PROM,
and an AMD Flash Memory.
The native Flash memory interface provides direct read and
write access to the Flash memory unit. The target FPGA
interface provides the signals to configure target FPGAs via
the Slave-Serial, concurrent Slave-Serial, or SelectMAP
configuration modes.
Separate power pins provide voltage compatibility control
for the target FPGA configuration interface and for the system control/status interface.
See Figure 3 for a complete view of the components and
schematic of the signals in the System ACE MPM.
The System ACE MPM has four major interfaces. (See
Figure 2.) The boundary scan JTAG interface is provided for
boundary scan test and boundary-scan-based Flash memory programming. The system control interface provides an
input for the system clock, design set selection pins, system
configuration control signals, and system configuration status signals.
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
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System ACE MPM Solution
16/32/64 Mbit AMD Flash Memory
Metal Lid
Package: 48 pin TSOP
Dimensions: 20 x 12 x 1.2 mm
PROM XC18V01
Package: VQ44
Dimensions: 12 x 12 x 1.2 mm
Virtex XCV50E Configuration Controller
Package: CS144
MPM BGA Module
Dimensions: 12 x 12 x 1.2 mm
System ACE MPM BG388
Complete Assembly
Dimensions: 35 x 35 x 2.7 mm
DS087_01_081501
Figure 1: System ACE MPM Assembly
System ACE MPM
Boundary
Scan
Interface
System
Control
Interface
Native
Flash
Memory
PROM
XCV50E
Configuration
Controller
Slave-Serial
or SelectMAP
Target
FPGA
Interface
AMD
Flash
Memory
ds087_02_091001
Figure 2: System ACE MPM Interfaces
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System ACE MPM Solution
System ACE MPM
TDI
TCK
TMS
TDO
3.3v
XCV50E
RESET * 6
4.7k
4.7k
XC18V01
3.3v
TCK
AMD Flash
GND
300
TDO
RESET
FLASH_IO_LEVEL* 2
VIO /BYTE * 2 A0-A21 * 1
ACC * 4
TDI
TDO
CCLK
CLK
TDI
RESET
A0-A21 * 1
DQ0-DQ15
DIN
D0
OE
OE
INIT
OE/Reset
CE
CE
DONE
CE
WE
WE
PROGRAM
CF
DQ0-DQ15
ACC * 4
TCK
TMS
TMS
ACC/WP * 5
RY/BY * 3
WP * 5
RY/BY * 3
DEVRDY
FCMRESET
FCM_ENABLE
SYSRESET
SYSRESET
A0-A21 *1
SYSCLK
DQ0-DQ15
BITSTRSEL[0-2]
OE
STATUS[0-3]
CE
CFG_MODE[0-2]
WE
CFG_CLK
WP * 5
CFG_BUSY
RY/BY * 3
CFG_INIT
FCM_ENABLE
CFG_DONE
CFG_DONE
FLASH_VCCO
VCCO 2,3,4,5 CFG_PROG
CFG_PROG
SYSCLK
BITSTRSEL[0-2]
STATUS[0-3]
CFG_MODE[0-2]
CFG_CLK
CFG_BUSY
CFG_INIT
CFG_VCCO
VCCO 6,7
CFG_WRITE
CFG_WRITE
CTRL_VCCO
VCCO 0,1
CFG_CS[0-3]
CFG_CS[0-3]
CFG_DATA[0-7]
CFG_DATA[0-7]
*1 A21 for XCCACEM64 only; A20 for XCCACEM32 and XCCACEM64 only.
*2 V for XCCACEM64; BYTE for XCCACEM16 and XCCACE32.
IO
*3 XCCACEM16 and XCCACEM32 only.
*4 XCCACEM64 only.
*5 WP on XCCACEM64; ACC/WP on XCCACEM32. Do not apply VHH to ACC/WP.
*6 Do not apply V to RESET.
ID
DS087_03_091701
Figure 3: System ACE MPM schematic
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System ACE MPM Solution
Pin Descriptions
This section provides native Flash interface, Boundary
Scan, and target FPGA configuration pinout information.
Native Flash Interface Pins
All of the native Flash memory pins are routed to pins on the
System ACE MPM ball-grid-array. Thus, the Flash memory
is available to the system for direct read and write access
with a few restrictions. See Note 1 and Table 1 for descriptions of the restrictions.
Notes:
1. All of the native Flash memory interface pins are connected to
the System ACE MPM controller (except where explicitly
noted in the pin description). The FCM_ENABLE pin must be
held Low to externally access the Flash memory without
contention with the System ACE MPM controller.
Table 1: Native Flash Memory Interface Pins
Pin Name
Pin Type
Description
A0-A21
I/O
Flash memory address bus. A21 exists on the XCCACEM64 only. A20 exists
on the XCCACEM32 and XCCACEM64 only.
DQ0-DQ15
I/O
Flash memory data bus. DQ15 becomes the A-1 pin in the XCCACEM16 and
XCCACEM32 when the BYTE mode is active.
RESET
I/O
Flash memory hardware reset. When asserted, all Flash operations are
immediately terminated and Flash is reset to read mode. When RESET and CE
are held High, the Flash memory is put into standby mode. Do not apply VID to
the RESET pin. The RESET is connected to the System ACE MPM controller
that has a maximum tolerance of 3.6V.
CE
I/O
Flash memory chip enable. When RESET and CE are held High, the Flash
memory is put into standby mode.
OE
I/O
Flash memory output enable.
WE
I/O
Flash memory write enable.
RY/BY
Output
Flash memory ready/busy signal. Open-drain output. When Low, the RD/BY
signal indicates that the Flash is actively erasing, programming, or resetting.
XCCACEM16 and XCCACEM32 only.
WP
I/O
ACC
Input
Flash memory accelerated mode pin. Do not apply VHH to the XCCACEM32
WP/ACC pin. The XCCACEM32 WP/ACC pin is connected to the System ACE
MPM controller that has a maximum tolerance of 3.6V. The XCCACEM64 ACC
pin is independent of the rest of the System ACE MPM and may be used to put
the Flash memory into accelerated program operation.
Flash memory hardware write protect.
FLASH_IO_LEVEL
Input
Flash memory VIO pin on the XCCACEM64 only. This pin must be connected
to 3.3V for compatibility with the System ACE MPM controller.
BYTE
Input
Flash memory byte-wide data bus mode. XCCACEM16 and XCCACEM32
only. This pin must be connected to 3.3V for compatibility with the System ACE
MPM controller and thus only the 16-bit, word mode is available for accessing
the Flash memory in the system.
Boundary Scan Pins
The System ACE MPM controller (Virtex-E XCV50E) and
the System ACE MPM controller PROM (XC18V01) are
both IEEE Standard 1149.1 compatible devices. The System ACE MPM connects these devices into an internal scan
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chain comprised of the XC18V01 device followed by the
XCV50E device. The internal scan chain is accessible
through the boundary scan test access port (TAP) on the
BG388 package. See Table 2.
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System ACE MPM Solution
Table 2: IEEE 1149.1 Boundary Scan Pins
Pin Name
Pin Type
Description
TCK
Input
IEEE 1149.1 test clock pin. The System ACE MPM TCK pin is connected to the
XCV50E and XC18V01 TCK pins. By default, the XCV50E has an internal
pull-up resistor on its TCK pin.
TMS
Input
IEEE 1149.1 test mode select pin. The System ACE MPM TMS pin is
connected to the XCV50E and XC18V01 TMS pins which have internal pull-up
resistors.
TDI
Input
IEEE 1149.1 test data input pin. The System ACE MPM TDI is connected to
the XC18V01 TDI pin which has an internal pull-up resistor.
TDO
Output
IEEE 1149.1 test data output pin. The System ACE MPM TDO pin is connected
to the XCV50E TDO pin which by default has an internal pull-up resistor.
Target FPGA Configuration Pins
Table 3 provides target FPGA configuration pins.
Table 3: Target FPGA Configuration Pins
Pin Name
Pin Type
Description
CFG_DATA[0]
Output
For Slave-Serial configuration mode, CFG_DATA[0] is the serial data signal for
Serial-Slave Chain 0 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 0. For Slave-SelectMAP configuration mode, CFG_DATA[0]
is the data bit 0 on the SelectMAP bus and is connected to D0 on all target
FPGAs.
CFG_DATA[1]
Output
For Slave-Serial configuration mode, CFG_DATA[1] is the serial data signal for
Serial-Slave Chain 1 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 1. For Slave-SelectMAP configuration mode, CFG_DATA[1]
is the data bit 1 on the SelectMAP bus and is connected to D1 on all target
FPGAs.
CFG_DATA[2]
Output
For Slave-Serial configuration mode, CFG_DATA[2] is the serial data signal for
Serial-Slave Chain 2 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 2. For Slave-SelectMAP configuration mode, CFG_DATA[2]
is the data bit 2 on the SelectMAP bus and is connected to D2 on all target
FPGAs.
CFG_DATA[3]
Output
For Slave-Serial configuration mode, CFG_DATA[3] is the serial data signal for
Serial-Slave Chain 3 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 3. For Slave-SelectMAP configuration mode, CFG_DATA[3]
is the data bit 3 on the SelectMAP bus and is connected to D3 on all target
FPGAs.
CFG_DATA[4]
Output
For Slave-Serial configuration mode, CFG_DATA[4] is the serial data signal for
Serial-Slave Chain 4 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 4. For Slave-SelectMAP configuration mode, CFG_DATA[4]
is the data bit 4 on the SelectMAP bus and is connected to D4 on all target
FPGAs.
CFG_DATA[5]
Output
For Slave-Serial configuration mode, CFG_DATA[5] is the serial data signal for
Serial-Slave Chain 5 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 5. For Slave-SelectMAP configuration mode, CFG_DATA[5]
is the data bit 5 on the SelectMAP bus and is connected to D5 on all target
FPGAs.
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System ACE MPM Solution
Table 3: Target FPGA Configuration Pins (Continued)
Pin Name
6
Pin Type
Description
CFG_DATA[6]
Output
For Slave-Serial configuration mode, CFG_DATA[6] is the serial data signal for
Serial-Slave Chain 6 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 6. For Slave-SelectMAP configuration mode, CFG_DATA[6]
is the data bit 6 on the SelectMAP bus and is connected to D6 on all target
FPGAs.
CFG_DATA[7]
Output
For Slave-Serial configuration mode, CFG_DATA[7] is the serial data signal for
Serial-Slave Chain 7 and is connected to DIN of the first FPGA in the
Slave-Serial Chain 7. For Slave-SelectMAP configuration mode, CFG_DATA[7]
is the data bit 7 on the SelectMAP bus and is connected to D7 on all target
FPGAs.
CFG_MODE[0]
Output
The CFG_MODE pins set the configuration mode on the target FPGAs.
Connect CFG_MODE[0] to the M0 pin on all target FPGAs.
CFG_MODE[1]
Output
The CFG_MODE pins set the configuration mode on the target FPGAs.
Connect CFG_MODE[1] to the M1 pin on all target FPGAs.
CFG_MODE[2]
Output
The CFG_MODE pins set the configuration mode on the target FPGAs.
Connect CFG_MODE[2] to the M2 pin on all target FPGAs.
CFG_CCLK
Output
CFG_CCLK is the configuration clock source for the target FPGAs. The
CFG_CCLK is derived from the SYSCLK. The CFG_CCLK frequency is half
the SYSCLK frequency. Connect CFG_CCLK to the CCLK pin on all target
FPGAs.
CFG_PROG
Output
CFG_PROG is pulsed Low at the beginning of the configuration download to
reset the configuration state of the target FPGAs. CFG_PROG is connected to
the PROG_B pin on all target FPGAs.
CFG_INIT
Input
Target FPGA INIT monitor pin. At the start of the configuration process, the
System ACE MPM controller waits for INIT to go High before initiating delivery
of configuration data through the CFG_DATA pins. CFG_INIT is connected to
the INIT pin on all target FPGAs.
CFG_BUSY
Input
When CFG_BUSY is High, the CFG_DATA outputs are held. If the target FPGA
configuration mode is Slave-SelectMAP and if the CFG_CCLK is greater than
50 MHz, connect the CFG_BUSY pin to the BUSY pin on all target FPGAs.
Otherwise, pull-down the CFG_BUSY pin to GND.
CFG_DONE
Input
CFG_DONE monitors the DONE status on all target FPGAs. Connect the
CFG_DONE to the DONE pin on all target FPGAs. DONE must be pulled High
with an external 330-8 pull-up resistor. The BitGen option DriveDONE should
be left in the default “NO” setting when generating bitstreams for Xilinx FPGAs.
CFG_WRITE
Output
Slave-SelectMAP write-enable pin. Connect the CFG_WRITE pin to the
RDWR_B pin on all target FPGAs.
CFG_CS[0]
Output
Slave-SelectMAP chip-enable for target FPGA 0. Connect the CFG_CS[0] pin
to the CS_B pin on target FPGA 0.
CFG_CS[1]
Output
Slave-SelectMAP chip-enable for target FPGA 1. Connect the CFG_CS[1] pin
to the CS_B pin on target FPGA 1.
CFG_CS[2]
Output
Slave-SelectMAP chip-enable for target FPGA 2. Connect the CFG_CS[2] pin
to the CS_B pin on target FPGA 2.
CFG_CS[3]
Output
Slave-SelectMAP chip-enable for target FPGA 3. Connect the CFG_CS[3] pin
to the CS_B pin on target FPGA 3.
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System ACE MPM Solution
System Control and Status Pins
Table 4 provides system control and status pins.
Table 4: System Control and Status Pins
Pin Name
Pin Type
Description
FCM_ENABLE
Input
System ACE MPM controller enable. When this pin is held Low, all of the
System ACE MPM controller (XCV50E) pins tied to the Flash memory are
3-stated allowing external peripherals access to Flash memory without
contention.
FCMRESET
Input
System ACE MPM FPGA reset pin. The FCMRESET pin is connected to the
XCV50E PROGRAM pin. Applying a Low pulse to the FCMRESET resets the
XCV50E and forces the XCV50E to reconfigure itself from the XC18V01
PROM. (The XCV50E automatically configures itself from the XC18V01 PROM
at power-up.)
DEVRDY
Output
System ACE MPM FPGA DONE pin. The DEVRDY pin is connected to the
XCV50E DONE pin. When DEVRDY is High, the XCV50E is configured and
ready for operation.
SYSCLK
Input
SYSCLK is the system clock input for the System ACE MPM control logic.
SYSRESET
Input
Hold SYSRESET High for at least 10 SYSCLK cycles to reset the System ACE
MPM control logic. Upon release from the reset condition, the System ACE
MPM initiates the download procedure to the target FPGAs.
BITSTRSEL[2-0]
Input
The BITSTRSEL pins determine which of the eight configuration data streams
to download to the target FPGA.
STATUS[3-0]
Output
The STATUS pins indicate the status of the System ACE MPM control logic.
Power and Ground Pins
The System ACE MPM requires at least two power supplies: 1.8V supplies power to the System ACE MPM configuration controller (an XCV50E) core; and 3.3V supplies
power to the Flash memory and configuration controller
PROM (an XC18V01). Additional power supplies may be
required for the output voltage compatibility pins:
FLASH_VCCO, CFG_VCCO, and CTRL_VCCO. See
Figure 4 and Table 5 for a description of the System ACE
MPM power pins.
System ACE
MPM
VCCint1
VCCint2
FLASH_VCCO
CTRL_VCCO
Control
Circuits
XILINX
Virtex-II
CFG_VCCO
Compatible with
Compatible with
Control Circuits
Target
CTRL_VCCO
BITSTRSEL[0-2]
SYSCLK
SYSRESET
1.8v
3.3v
System Signals
Control
Signals
FPGAs
CFG_VCCO
Configuration
Signals
Slave-Serial
or
Slave-SelectMAP
XILINX
XILINX
Spartan-II
Virtex-II
DS087_04_090601
Figure 4: Power Pins
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System ACE MPM Solution
Table 5: Power and Ground Pins
Pin Name
Pin Type
Description
VCCINT1
Power
1.8V power supply pins for the Virtex-E XCV50E configuration controller core.
The 1.8V power supply should rise prior to or simultaneously to the
FLASH_VCCO, CTRL_VCCO, and CFG_VCCO power supplies.Otherwise,
the XCV50E device might draw excessive current.
VCCINT2
Power
3.3V power supply pins for the AMD Flash memory and the XC18V01 PROM.
FLASH_VCCO
Power
3.3V power supply for the I/O banks connecting the Virtex-E XCV50E controller
to the AMD Flash memory.
CFG_VCCO
Power
Configurable power supply for the I/O banks on the target FPGA configuration
interface. Connect this power pin to a voltage that is compatible with the target
FPGA configuration pins.
CTRL_VCCO
Power
Configurable power supply for the I/O banks on the system interface. Connect
this power pin to a voltage that is compatible with the system control and status
monitor signals.
GND
Ground
Ground.
Pinout
Table 6 provides System ACE MPM pinout. Unlisted BGA sites are no connects.
Table 6: System ACE MPM Pinout
Pin Name
8
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
A0
AF8
AF8
AF8
A1
AF4
AF4
AF4
A2
AF3
AF3
AF3
A3
AF2
AF2
AF2
A4
AE4
AE4
AE4
A5
AE3
AE3
AE3
A6
AE1
AE1
AE1
A7
AD2
AD2
AD2
A8
W1
W1
W1
A9
W2
W2
W2
A10
V1
V1
V1
A11
V2
V2
V2
A12
U1
U1
U1
A13
U2
U2
U2
A14
T1
T1
T1
A15
T2
T2
T2
A16
R25
R25
R25
A17
AD1
AD1
AD1
A18
AC2
AC2
AC2
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Table 6: System ACE MPM Pinout (Continued)
Pin Name
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
A19
Y1
Y1
AC1
A20
n/a
Y2
Y2
A21
n/a
n/a
Y1
DQ0
AD26
AD26
AD26
DQ1
AC25
AC25
AC25
DQ2
AB26
AB26
AB26
DQ3
AA26
AA26
AA26
DQ4
Y26
Y26
Y26
DQ5
W26
W26
W26
DQ6
U26
U26
U26
DQ7
T26
T26
T26
DQ8
AD25
AD25
AD25
DQ9
AC26
AC26
AC26
DQ10
AB25
AB25
AB25
DQ11
AA25
AA25
AA25
DQ12
Y25
Y25
Y25
DQ13
W25
W25
W25
DQ14
U25
U25
U25
DQ15
T25
T25
T25
RESET
AA2
AA2
AA2
CE
AE23
AE23
AE23
OE
AE26
AE26
AE26
WE
AA1
AA1
AA1
RY/BY
AC1
AC1
n/a
WP
n/a
AB2
AB2
ACC
n/a
n/a
AB1
FLASH_IO_LEVEL
R26
R26
R26
FCM_ENABLE
B7
B7
B7
FCMRESET
K26
K26
K26
DEVRDY
N26
N26
N26
TCK
G26
G26
G26
TMS
A3
A3
A3
TDI
F26
F26
F26
TDO
A15
A15
A15
SYSCLK
A9
A9
A9
SYSRESET
B8
B8
B8
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Table 6: System ACE MPM Pinout (Continued)
Pin Name
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
BITSTRSEL[0]
A6
A6
A6
BITSTRSEL[1]
B5
B5
B5
BITSTRSEL[2]
A5
A5
A5
STATUS[0]
A10
A10
A10
STATUS[1]
B9
B9
B9
STATUS[2]
B6
B6
B6
STATUS[3]
A7
A7
A7
CFG_DATA[0]
J2
J2
J2
CFG_DATA[1]
J1
J1
J1
CFG_DATA[2]
H3
H3
H3
CFG_DATA[3]
G2
G2
G2
CFG_DATA[4]
H2
H2
H2
CFG_DATA[5]
H1
H1
H1
CFG_DATA[6]
J3
J3
J3
CFG_DATA[7]
G3
G3
G3
CFG_MODE[0]
H26
H26
H26
CFG_MODE[1]
E1
E1
E1
CFG_MODE[2]
F2
F2
F2
CFG_CCLK
K1
K1
K1
CFG_BUSY
G1
G1
G1
CFG_INIT
K3
K3
K3
CFG_PROG
K2
K2
K2
CFG_DONE
B3
B3
B3
CFG_WRITE
L1
L1
L1
CFG_CS[0]
B1
B1
B1
CFG_CS[1]
D1
D1
D1
CFG_CS[2]
C1
C1
C1
CFG_CS[3]
A1
A1
A1
CTRL_VCCO
A4, A16, A11
A4, A16, A11
A4, A16, A11
CFG_VCCO
M1, B4, F1
M1, B4, F1
M1, B4, F1
FLASH_VCCO
B14, J26, L26, AF13, N1,
AF9
B14, J26, L26, AF13, N1,
AF9
B14, J26, L26, AF13, N1,
AF9
VCCint1
C3, C7, C8, C9, C10, D6,
D7, D8,
C3, C7, C8, C9, C10, D6,
D7, D8,
C3, C7, C8, C9, C10, D6,
D7, D8,
D13, D14, E4, F4, K4, L2,
M2, M3
D13, D14, E4, F4, K4, L2,
M2, M3
D13, D14, E4, F4, K4, L2,
M2, M3
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System ACE MPM Solution
Table 6: System ACE MPM Pinout (Continued)
XCCACEM16-BG388I
XCCACEM32-BG388I
XCCACEM64-BG388I
VCCint2
Pin Name
AA23, AB4, AB23, AC4,
AC11, AC12, AC13, AC18,
AC19, AC20, D17, D18,
D21, D22, D23, E23, H23,
J23, N23, P23, R4, T4, U4,
V26, Y23
AA23, AB4, AB23, AC4,
AC11, AC12, AC13, AC18,
AC19, AC20, D17, D18,
D21, D22, D23, E23, H23,
J23, N23, P23, R4, T4, U4,
V26, Y23
AA23, AB4, AB23, AC4,
AC11, AC12, AC13, AC18,
AC19, AC20, D17, D18,
D21, D22, D23, E23, H23,
J23, N23, P23, R4, T4, U4,
V26, Y23
GND
A2, A8, A26, AA3, AB24,
AD16, AD22, AE2, AE11,
AE12, AE18, AE22, AE25,
AF1, AF26, B15, B19, B22,
B25, D4, D9, D10, D11,
F23, G4, H25, J4, K23, L4,
L11, L12, L13, L14, L15,
L16, M4, M11, M12, M13,
M14, M15, M16, M23, N11,
N12, N13, N14, N15, N16,
P2, P11, P12, P13, P14,
P15, P16, R1, R11, R12,
R13, R14, R15, R16, R23,
T11, T12, T13, T14, T15,
T16, T23, V25
A2, A8, A26, AA3, AB24,
AD16, AD22, AE2, AE11,
AE12, AE18, AE22, AE25,
AF1, AF26, B15, B19, B22,
B25, D4, D9, D10, D11,
F23, G4, H25, J4, K23, L4,
L11, L12, L13, L14, L15,
L16, M4, M11, M12, M13,
M14, M15, M16, M23, N11,
N12, N13, N14, N15, N16,
P2, P11, P12, P13, P14,
P15, P16, R1, R11, R12,
R13, R14, R15, R16, R23,
T11, T12, T13, T14, T15,
T16, T23, V25
A2, A8, A26, AA3, AB24,
AD16, AD22, AE2, AE11,
AE12, AE18, AE22, AE25,
AF1, AF26, B15, B19, B22,
B25, D4, D9, D10, D11,
F23, G4, H25, J4, K23, L4,
L11, L12, L13, L14, L15,
L16, M4, M11, M12, M13,
M14, M15, M16, M23, N11,
N12, N13, N14, N15, N16,
P2, P11, P12, P13, P14,
P15, P16, R1, R11, R12,
R13, R14, R15, R16, R23,
T11, T12, T13, T14, T15,
T16, T23, V25
Configuration Overview
Configuration Modes
The System ACE MPM is engineered for high-speed configuration of high-density FPGAs. Multiple configuration
modes are supported to target FPGAs including Concurrent
Slave-Serial mode, Slave-SelectMAP mode, and Slave-Parallel mode. The System ACE MPM handles storage of up to
eight separate configuration data sets. Each data set can be
optionally compressed to reduce the overall storage
requirements. One default data set is automatically downloaded to the target FPGAs at system power-up. Any one of
the eight data sets can be selected to reconfigure the target
FPGAs at any time during system operation.
The System ACE MPM supports high-speed FPGA configuration via the Slave-Serial or Slave-SelectMAP configuration modes.
DS087 (v1.0) September 25, 2001
Advance Product Specification
The System ACE MPM solution is a pre-engineered storage
and delivery system with direct support for the high-density
and high-speed configuration needs of the Virtex-II family.
For example, the System ACE MPM can configure a Virtex-II XC2V6000, which requires 19,759,968 configuration
bits, via Slave-Serial mode in 300 milliseconds and via
Slave-SelectMAP mode in 130 milliseconds. In fact, the
System ACE MPM can configure two XC2V6000 devices
concurrently via Slave-Serial mode in 300 milliseconds.See
Table 7 for maximum configuration bit rates. See Table 8 for
FPGA configuration compatibility and cross-reference.
SeeTable 9 for System ACE MPM and FPGA configuration
signal cross-reference.
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Table 7: Maximum Configuration Bit Rates
Configuration
Mode
Maximum System
Clock Rate
(SYSCLK)
Maximum
Configuration Clock
(CFG_CCLK) Rate
(at Max SYSCLK
Rate)
Average
Configuration Clock
Rate (at Max
SYSCLK Rate)
Maximum Average
Combined Configuration
Bit Rate
Slave-SelectMAP
133 MHz
44 MHz
19 MHz‘
152 Mb/s
Slave-Serial
133 MHz
66 MHz
66 MHz
66 Mb/s
2 Concurrent
Slave-Serial
Chains
133 MHz
66 MHz
66 MHz
133 Mb/s
(66 Mb/s per chain)
3 - 4 Concurrent
Slave-Serial
Chains
133 MHz
66 MHz
38 MHz
152 Mb/s
(38 Mb/s per chain)
5 - 8 Concurrent
Slave-Serial
Chains
133 MHz
66 MHz
19 MHz
152 Mb/s
(19 Mb/s per chain)
Table 8: FPGA Configuration Compatibility and Cross-Reference
General
Description
Clock Source
Data
Path
Delivery Method
Virtex-II
Virtex
Virtex-E
Spartan-II
Serial
Configuration
Mode
External
1-bit
Cascade through
FPGAs in daisy-chain
style
Slave-Serial
Slave-Serial
Slave-Serial
Parallel
Configuration
Mode
External
8-bits
Chip-selected device
on configuration data
bus
SlaveSelectMAP
SelectMAP
Slave-Parallel
Table 9: System ACE MPM and FPGA Configuration Signal Cross-Reference
FPGA Configuration
Signal
System ACE MPM
Virtex-II
Virtex/
Virtex-E
Spartan-II
Configuration Mode
CFG_MODE[2:0]
M2, M1, M0
M2, M1, M0
M2, M1, M0
Configuration Clock
CFG_CLK
CCLK
CCLK
CCLK
Configuration Data
CFG_DATA[7:0]
D7, D6, D5,
D4, D3, D2,
D1, DIN/D0
D7, D6, D5,
D4, D3, D2,
D1, DIN/D0
D7, D6, D5,
D4, D3, D2,
D1, DIN/D0
Configuration Reset
CFG_PROG
PROG_B
PROGRAM
PROGRAM
CFG_INIT
INIT_B
INIT
INIT
CFG_BUSY
BUSY
BUSY
BUSY
Configuration
Configuration Busy
12
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Table 9: System ACE MPM and FPGA Configuration Signal Cross-Reference
FPGA Configuration
Signal
System ACE MPM
Virtex-II
Virtex/
Virtex-E
Spartan-II
Configuration Done
CFG_DONE
DONE
DONE
DONE
SelectMAP/SlaveParallel Bus Read/Write
Signal
CFG_WRITE
RDWR_B
WRITE
WRITE
SelectMAP/SlaveParallel Bus Chip Select
Signal
CFG_CS[3:0]
CS_B
CS
CS
Slave-Serial
Similar to the Xilinx PROM solution, the System ACE MPM
is a single package solution that supports the configuration
of a single, cascaded chain of Slave-Serial FPGAs. With the
maximum configuration clock rate of 66 MHz, the System
ACE MPM is twice as fast as the nearest Xilinx PROM configuration solution in the Slave-Serial mode.
The System ACE MPM has additional support for concurrently configuring multiple chains of Slave-Serial FPGAs.
Multiple data output pins on the System ACE MPM can concurrently supply bitstreams for two to eight Slave-Serial
FPGA chains. Although each Slave-Serial chain has a maximum configuration clock rate of 66 MHz, the maximum bit
delivery rate of 66 Mb/s is maintained across all concurrent
Slave-Serial FPGA chains up to the cumulative maximum of
152 Mb/s. (152 Mb/s is the maximum read rate from the
AMD Flash memory in the System ACE MPM.)
In the Concurrent Slave-Serial configuration mode, the bitstreams for the individual Slave-Serial chains are interleaved and optimized for concurrent configuration of two,
four, or eight Slave-Serial FPGA chains. Configuration time
and storage requirements are optimal when the data stream
sizes are equivalent across all concurrent Slave-Serial
FPGA chains.
DS087 (v1.0) September 25, 2001
Advance Product Specification
The connectivity between the System ACE MPM and
Slave-Serial FPGA chain is similar to the connectivity
between a Xilinx PROM and a Slave-Serial FPGA chain. All
configuration signals between Concurrent Slave-Serial
FPGA chains are common except that data for the first
chain originates from the System ACE MPM CFG_DATA[0]
pin, the data for the second chain originates from the
System ACE MPM CFG_DATA[1] pin, etc. See Figure 5 for
a schematic of the Slave-Serial configuration signal connections, and see Table 10 for a list of the Slave-Serial configuration signals. The voltage compatibility for the System ACE
MPM configuration interface is configurable via the
CFG_VCCO pin. CFG_VCCO should be connected to a
voltage level that is compatible with the target FPGAs. Typically, CFG_VCCO is connected to either 3.3V or 2.5V. Consult the target FPGA data sheet for an appropriate
configuration signal voltage level.
Identical configuration of multiple target FPGAs from one
bitstream can be achieved through the appropriate configuration signal connections. Figure 7 shows an example of
two FPGAs that are identically configured from a single bitstream. Table 10 provides the Slave-Serial configuration
signals.
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System ACE MPM Solution
Configuration Modes
Chip Selects for up to 4 Devices
SelectMAP
AMD
System ACE
Configuration
Controller
152 Mb/s
Flash
Memory
CS0
CS1
CS2
CS3
FPGA
FPGA
FPGA
FPGA
SelectMAP bus
Slave-Serial
AMD
66 Mb/s
System ACE
Serial data stream
Configuration
Controller
Flash
Memory
FPGA
FPGA
FPGA
FPGA
FPGA
FPGA
FPGA
FPGA
FPGA
Concurrent Slave-Serial
AMD
System ACE
Configuration
Controller
Flash
Memory
Up to 152 Mb/s
Serial data stream
.
. 2 to 8 chains
.
66Mb/s per chain
Serial data stream
ds087_05_091701
Figure 5: System ACE MPM Configuration Modes
CFG_VCCO *1
4.7k
330
FPGA
FPGA
(Chain 0, Device 0)
(Chain 0, Device 1)
D0
M2
D0
CFG_MODE[2]
CFG_MODE[1]
M1
M1
CFG_MODE[0]
M0
M0
3.3v
FLASH_IO_LEVEL
WP * 2
ACC * 2
4.7 k
CFG_VCCO
CFG_DATA[0-7] * 3
4.7k
DOUT
CCLK
CCLK
INIT_B
INIT_B
BITSTRSEL[0-2]
CFG_DONE
DONE
DONE
STATUS[0-3]
CFG_PROG
PROG_B
PROG_B
SYSCLK
CFG_CCLK
SYSRESET
DOUT
M2
CFG_INIT
FCM_ENABLE
CLK Source
BITSTRSEL[0-2]
CFG_DATA[0]
System ACE MPM
BUSY
To Chain0
Cascaded
4.7 k
FPGAs
CFG_DATA[1-7] *3
To Concurrent Slave-Serial
FPGA Chains (1-7)
* 1 Supply voltage to CFG_VCCO that is compatible with the FPGA configuration pins.
* 2 Only /WP on XCCACEM16; Combined ACC/WP on XCCACEM32; Separate /WP and ACC on XCCACEM64.
* 3 Use CFG_DATA[0] for systems with one slave-serial chain; Use CFG_DATA[0-1] for systems with two concurrent slave-serial
chains; Use CFG_DATA[0-3] for systems with four concurrent slave-serial chains; Use CFG_DATA[0-7] for systems with eight
concurrent slave-serial chains.
DS087_05_091201
Figure 6: Slave-Serial Configuration Mode
14
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System ACE MPM Solution
CFG_VCCO *1
System ACE MPM
4.7 k
330
3.3 V
FLASH_IO_LEVEL
CFG_DATA[0]
CFG_DATA[0]
D0
D0
ACC * 2
CFG_MODE[2]
M2
M2
CFG_MODE[1]
M1
M1
CFG_MODE[0]
M0
M0
CCLK
CCLK
CFG_INIT
INIT_B
INIT_B
CFG_DONE
DONE
DONE
CFG_PROG
PROG_B
PROG_B
FCM_ENABLE
SYSCLK
BITSTRSEL[0-2]
STATUS[0-3]
BITSTRSEL[0-2]
FPGA
FPGA
CFG_DATA[0]
4.7 k
WP * 2
4.7 k
CLK Source
CFG_VCCO
SYSRESET
CFG_CCLK
BUSY
To
Identical
FPGAs
4.7 k
* 1 Supply voltage to CFG_VCCO that is compatible with the FPGA configuration pins.
* 2 Combined ACC/WP on XCCACEM32; Separate WP and ACC on XCCACEM64.
DS087_07_091701
Figure 7: Example Slave-Serial Configuration for Identically Configured Xilinx FPGAs
Table 10: Slave-Serial FPGA Configuration Signals
System ACE MPM
Single
Slave-Serial Chain
Two
Slave-Serial Chains
Four
Slave-Serial Chains
Eight
Slave-Serial Chains
CFG_MODE[0]
M0 on all FPGAs
M0 on all FPGAs
M0 on all FPGAs
M0 on all FPGAs
CFG_MODE[1]
M1 on all FPGAs
M1 on all FPGAs
M1 on all FPGAs
M1 on all FPGAs
CFG_MODE[2]
M2 on all FPGAs
M2 on all FPGAs
M2 on all FPGAs
M2 on all FPGAs
CFG_CCLK
CCLK on all FPGAs
CCLK on all FPGAs
CCLK on all FPGAs
CCLK on all FPGAs
CFG_PROG
PROG_B on all
FPGAs
PROG_B on all
FPGAs
PROG_B on all
FPGAs
PROG_B on all
FPGAs
CFG_INIT
INIT_B on all FPGAs
INIT_B on all FPGAs
INIT_B on all FPGAs
INIT_B on all FPGAs
CFG_DONE
DONE on all FPGAs
DONE on all FPGAs
DONE on all FPGAs
DONE on all FPGAs
CFG_DATA[0]
DIN on first FPGA of
Chain 0
DIN on first FPGA of
Chain 0
DIN on first FPGA of
Chain 0
DIN on first FPGA of
Chain 0
DIN on first FPGA of
Chain 1
DIN on first FPGA of
Chain 1
DIN on first FPGA of
Chain 1
CFG_DATA[2]
DIN on first FPGA of
Chain 2
DIN on first FPGA of
Chain 2
CFG_DATA[3]
DIN on first FPGA of
Chain 3
DIN on first FPGA of
Chain 3
CFG_DATA[1]
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System ACE MPM Solution
Table 10: Slave-Serial FPGA Configuration Signals (Continued)
System ACE MPM
Single
Slave-Serial Chain
Two
Slave-Serial Chains
Four
Slave-Serial Chains
Eight
Slave-Serial Chains
CFG_DATA[4]
DIN on first FPGA of
Chain 4
CFG_DATA[5]
DIN on first FPGA of
Chain 5
CFG_DATA[6]
DIN on first FPGA of
Chain 6
CFG_DATA[7]
DIN on first FPGA of
Chain 7
Although Table 10 lists configuration signals for only one,
two, four, or eight Slave-Serial chain systems, any number
of Slave-Serial chains from one to eight are supported in the
System ACE software. The System ACE software assigns
the data streams for each Slave-Serial chain starting from
CFG_DATA[0] up to CFG_DATA[N-1] where N is the number
of Slave-Serial chains in the system.
Slave-SelectMAP/Slave-Parallel
The System ACE MPM conveniently supports high-speed,
sequential configuration of up to four Xilinx FPGAs via the
8-bit-wide SelectMAP configuration bus or four Spartan-II
devices via the 8-bit-wide Slave-Parallel bus. The System
ACE MPM generates a maximum configuration clock rate of
19 MHz. The maximum bit delivery rate is 152 Mb/s. (152
Mb/s is the maximum read rate from the AMD Flash memory in the System ACE MPM.)
16
The connectivity between the System ACE MPM and the
FPGAs on the SelectMAP bus is similar to the connectivity
between a Xilinx PROM and a Slave-SelectMAP FPGA with
the addition of the CFG_WRITE and separate CFG_CS
(chip select) signals. All configuration signals from the System ACE MPM are common to all of the target FPGAs on
the SelectMAP bus, except that the CS_B signal of the first
FPGA must be connected to the System ACE MPM
CFG_CS[0] pin, and the CS_B signal of the second FPGA
must be connected to the System ACE MPM CFG_CS[1]
pin, etc. See Figure 8 for a schematic diagram of the
Slave-SelectMAP configuration connections, and Table 11
for a list of the Slave-SelectMAP connections for up to four
target FPGAs.
The Spartan-II Slave-Parallel mode has the same structure
and protocol as the Slave-SelectMAP mode. Therefore, the
Slave-SelectMAP figure and table apply to the Spartan-II
Slave-Parallel mode with the appropriate signal name translations noted in Table 11
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System ACE MPM Solution
.
CFG_VCCO *1
4.7 k
System ACE MPM
330
FPGA
FPGA
(CFG_CS[0])
(CFG_CS[1])
4.7 k
3.3 V
CFG_CS[0]
FLASH_IO_LEVEL
CS_B
CS_B
CFG_DATA[7:0]
D[7:0]
D[7:0]
CFG_MODE[2:0]
M[2:0]
M[2:0]
CFG_CCLK
CCLK
CCLK
CFG_INIT
INIT_B
INIT_B
FCM_ENABLE
CFG_DONE
DONE
DONE
SYSCLK
CFG_PROG
PROG_B
PROG_B
BITSTRSEL[0-2]
CFG_WRITE
RDWR_B
RDWR_B
BUSY
BUSY
4.7 k
CLK Source
BITSTRSEL[0-2]
CFG_CS[1]
CFG_VCCO
WP * 2
ACC * 2
STATUS[0-3]
BUSY
CFG_CS[0-3] *3
SYSRESET
4.7 k
To
SelectMAP
FPGAs (2-3)
* 1 Supply voltage to CFG_VCCO that is compatible with the FPGA configuration pins.
* 2 Combined ACC/WP on XCCACEM32; Separate /WP and ACC on XCCACEM64.
* 3 Use CFG_CS[0] for systems with one slave-SelectMAP FPGA ; Use CFG_CS[0-1] for systems with two slaveSelectMAP FPGAs; Use CFG_CS[0-2] for systems with three slave-SelectMAP FPGAs; Use CFG_CS[0-3] for
systems with four slave-SelectMAP FPGAs.
ds087_08_91001
Figure 8: Slave-SelectMAP Configuration Mode
Table 11: Slave-SelectMAP FPGA Configuration Signals
System ACE MPM
FPGA 0
FPGA 1
FPGA 2
FPGA 3
CFG_MODE[0]
M0
M0
M0
M0
CFG_MODE[1]
M1
M1
M1
M1
CFG_MODE[2]
M2
M2
M2
M2
CFG_CCLK
CCLK
CCLK
CCLK
CCLK
CFG_PROG
PROG_B
PROG_B
PROG_B
PROG_B
CFG_INIT
INIT_B
INIT_B
INIT_B
INIT_B
CFG_BUSY
BUSY
BUSY
BUSY
BUSY
CFG_DONE
DONE
DONE
DONE
DONE
CFG_DATA[0-7]
D[0-7]
D[0-7]
D[0-7]
D[0-7]
CFG_WRITE
RDWR_B
RDWR_B
RDWR_B
RDWR_B
CFG_CS[0]
CS_B
CFG_CS[1]
CS_B
CFG_CS[2]
CS_B
CFG_CS[3]
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System ACE MPM Solution
Identical configuration of multiple target FPGAs from a single bitstream can be achieved through the appropriate connections. See Figure 9 for an example of two FPGAs that
are simultaneously configured from a single bitstream.
The System ACE software assigns bitstreams for the target
FPGAs in order, starting from the CFG_CS[0] pin through
CFG_CS[N-1] pin where N is the number of Slave-SelectMAP devices in the system. N may be up to four devices.
CFG_VCCO * 1
FPGA
System ACE MPM
FPGA
4.7 k
330
3.3 V
FLASH_IO_LEVEL
/WP * 2
ACC * 2
CFG_VCCO
BITSTRSEL[0-2]
CS_B
CFG_CS[0]
CS_B
CFG_DATA[7:0]
D[7:0]
D[7:0]
CFG_MODE[2:0]
M[2:0]
M[2:0]
CFG_CCLK
CCLK
CCLK
CFG_INIT
INIT_B
INIT_B
FCM_ENABLE
CFG_DONE
DONE
DONE
SYSCLK
CFG_PROG
PROG_B
PROG_B
BITSTRSEL [0-2]
CFG_WRITE
RDWR_B
RDWR_B
BUSY
BUSY
4.7 k
CLK Source
CFG_CS[0]
4.7 k
STATUS[0-3]
SYSRESET
BUSY
CFG_CS[0]
4.7 k
To
Identical
SelectMAP
FPGAs
* 1 Supply voltage to CFG_VCCO that is compatible with the FPGA configuration pins.
* 2 Combined ACC/WP on XCCACEM32; Separate /WP and ACC on XCCACEM64.
DS087_09_091001
Figure 9: Example Slave-SelectMAP Configuration for Identically Configured FPGAs
Configuration Data
The configuration data sets for the target FPGAs are stored
in a standard, high-density Flash memory unit in the System
ACE MPM.
The System ACE MPM product family offers data storage
capacity up to 64 Mb. See the Flash memory vendor’s data
sheets for additional information about the Flash memory
unit in the System ACE MPM. See Table 13 for Flash memory data sheet references.
Data Storage
The System ACE MPM integrates a standard Flash memory
unit for storage of the configuration data sets. See Table 12.
Table 12: Flash Memory Storage
Flash Device
Flash
Density
Flash Speed
Grade
XCCACEM16-BG388I
AMD Am29LV160DT
16 Mb
90 ns
1 M x 16-bit
(or 2 M x 8-bit)
XCCACEM32-BG388I
AMD Am29LV320DT
32 Mb
90 ns
2 M x 16-bit
(or 4 M x 8-bit)
XCCACEM64-BG388I
AMD Am29LV641DH
64 Mb
90 ns
4 M x 16-bit
System ACE MPM
18
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Flash Organization
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Table 13: Flash Memory Data Sheet References
System ACE MPM
Flash Device
Flash Data Sheet
XCCACEM16-BG388I
AMD
Am29LV160DT
http://www.amd.com/products/nvd/techdocs/22358.pdf
XCCACEM32-BG388I
AMD
Am29LV320DT
http://www.amd.com/products/nvd/techdocs/23579.pdf
XCCACEM64-BG388I
AMD
Am29LV641DH
http://www.amd.com/products/nvd/techdocs/22366.pdf
Data Set Organization
Configuration Data Compression
The Flash memory data array begins with a data set directory. There are eight directory entries that correspond to the
binary value of the BITSTRSEL[2-0] setting. Each directory
entry is 16 bytes long. The main elements in a directory
entry are: the configuration processing options for the data
set, the starting address of the actual data set location, and
the length of the data set in bytes. See Figure 10 for details
of the System ACE MPM directory structure.
The System ACE software gives the option to compress the
data streams up to 50 percent. The System ACE data
stream is stored in the compressed format within the
System ACE MPM. The System ACE MPM decompresses
the data streams in real time delivery to the target FPGAs.
The System ACE software composes the entire Flash memory image and automatically calculates the directory information from the given data streams and user selected
options.
Configuration Data Security
The compression performance is data-dependent.
Encrypted Virtex-II bitstreams are not compressible.
Data security is available for Virtex-II bitstreams through the
standard Virtex-II encryption technology.
Flash Memory Array
Data Set
Directory
DIR ENTRY 0
15(MSB)
0(LSB)
DIR ENTRY 1
BITSTRSEL[2:0] = "011"
DIR ENTRY 2
DIR ENTRY 3
DIR ENTRY 4
DIR ENTRY 5
DIR ENTRY 6
PROCESSING OPTIONS (16 bits)
START ADDR (lower 16 bits)
START ADDR (upper 16 bits)
Data Set BYTE SIZE (lower 16 bits)
Data Set BYTE SIZE (upper 16 bits)
Reserved 16-bit word
DIR ENTRY 7
Reserved 16-bit word
Reserved 16-bit word
0388h
Start of Data Set 3
DS087_09_081501
Figure 10: Flash Memory Organization
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System ACE MPM Solution
Configuration Sequence
The System ACE MPM configuration sequence is automatically initiated at power-up for the initial system configuration
and can be triggered later during system operation using
the SYSRESET signal to reconfigure the system. The configuration sequence is as follows:
4. Find the data set from the data set directory structure in
the Flash memory.
5. Deliver the data set to the target FPGAs according to
the configuration and processing options specified in
the directory.
1. Sample BITSTRSEL[2:0] pins to determine the data set
to download.
6. Check for DONE to go High indicating a successful
configuration.
2. Pulse the CFG_PROGRAM pin to clear the target
FPGAs and prepare them for configuration.
3. Wait for the CFG_INIT pin to go High which indicates
the target FPGAs are ready to receive data.
Configuration Control Timing
Table 14 shows the configuration control timing details.
Table 14: Control Configuration Timing
Symbol
Description
Min
Max
Units
TSYSRESET
SYSRESET min pulse
10
SYSCLK cycles
TSSEL
BITSTRSEL[2:0]
setup time to SYSCLK
1.1
ns
THSEL
BITSTRSEL[2:0] hold
time from SYSCLK
0
ns
20
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Configuration Data Set Selection
The System ACE MPM provides the opportunity to store up
to eight separate configuration data sets for the target
FPGAs in the system. The System ACE MPM BITSTRSEL[0-2] pins determine which of the eight possible data
sets to download. A data set is downloaded to configure the
target FPGAs automatically at system power-up, or a data
set is downloaded to reconfigure the target FPGAs upon
activation of the System ACE MPM SYSRESET pin. See
Table 15.
At the beginning of a configuration sequence (initiated at
power-up or via the SYSRESET pin), the System ACE MPM
samples the BITSTRSEL[2-0] pins to determine the data
set to download. Then, the System ACE MPM downloads
the data set to all target FPGAs.
Configuration Status
The System ACE MPM reports status through four status
pins (STATUS[3-0]). The status of the System ACE MPM is
available at all times. See Table 16 for definitions of the status signals.
Table 16: Status Definitions
STATUS
[2]
STATUS
[1]
STATUS
[0]
0
0
0
0
Reset OK;
system ready
0
0
0
1
Successful
Slave-Serial or
SlaveSelectMAP
configuration
0
0
1
0
Configuration
error
(CFG_DONE
did not go
High)
0
0
1
1
Decompression error
0
1
0
0
Invalid
controller state
(internal error)
0
1
0
1
Invalid
configuration
data or blank
flash memory
0
1
1
x
Reserved
1
x
x
x
MPM in wait
state;. JTAG
Flash
commands
(erase,
blank-check,
program,
verify) can be
issued.
Table 15: Configuration Data Set Selection for
BITSTRSEL[2:0] Settings
BITSTRSEL[2:0]
[2]
[1]
[0]
Selected Data
Set
0
0
0
Data Set 0
0
0
1
Data Set 1
0
1
0
Data Set 2
0
1
1
Data Set 3
1
0
0
Data Set 4
1
0
1
Data Set 5
1
1
0
Data Set 6
1
1
1
Data Set 7
The System ACE MPM can be hardwired for power-up configuration. Or, as shown in the example in Figure 11, the
System ACE MPM can be actively controlled and monitored
by the microcontroller.
Microprocessor
Peripheral
Interface
CTRL_SYSRESET
CTRL_ BITSTRSEL[0-2]
CTRL_ STATUS[0-3]
Status
Definition
STATUS
[3]
System ACE
MPM
SYSRESET
BITSTRSEL[0-2]
STATUS[0-3]
Table 17 provides the corrective action for status errors.
DS087_12_091001
Figure 11: Example Microprocessor-Based Data Set
Selection, Configuration Control, and Configuration
Status Monitor
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Table 17: Corrective Action for Status Errors
Status Error
Corrective Action
Configuration Error (CFG_DONE did not go High)
Check that all target FPGA DONE pins are connected
to CFG_DONE with external 330-8 pull-up resistor.
Decompression Error
Perform SYSRESET sequence to re-initialize the
System ACE MPM controller and restart configuration.
Invalid Controller State
Perform SYSRESET sequence to re-initialize the
System ACE MPM controller and restart configuration
Invalid Configuration Data or Blank Flash Memory
Erase and reprogram the Flash memory. Perform
SYSRESET sequence to re-initialize the System ACE
MPM controller and restart configuration.
Programming the Flash Memory
The System ACE MPM provides two interfaces for accessing the internal Flash memory unit: the native Flash memory interface and the Boundary Scan port. The native Flash
memory interface provides direct access to the Flash memory pins for reading and writing. The Boundary Scan port
provides indirect access to the Flash memory pins via the
Boundary Scan logic in the System ACE MPM controller
(XCV50E), whose Boundary Scannable pins are connected
to the Flash memory pins. See Table 18. Drive
FCM_ENABLE Low before using the native Flash memory
interface.
Table 18: Typical Flash Memory Programming
Methods (Continued)
Programming
Method/Tool
Interface
Unit
Location
Phase(s)
Third-party
programmers
Native
Flash
Interface
Off-board
Preproduction
Microprocessor
Boundary
Scan or
Native
Flash
Interface
In-system
Remote
Upgrade
System ACE Software
The System ACE software provides direct programming
support via the Xilinx Parallel Cable III to the System ACE
MPM Boundary Scan port. The System ACE software takes
advantage of a Flash memory programming engine that is
integrated into the System ACE MPM controller’s Boundary
Scan logic.
Table 18: Typical Flash Memory Programming
Methods
Programming
Method/Tool
Interface
System ACE
software
Boundary
Scan
In-system
Prototype
development
debug
Boundary Scan
tools
Boundary
Scan
In-system
Development
test
production
Automatic Test
Equipment
Native
Flash
Interface
In-system
22
Unit
Location
Phase(s)
Test
production
Boundary Scan Tools
The System ACE software can generate serial vector format
(SVF) files for System ACE MPM operations. These SVF
files can be executed through a Boundary Scan test tool.
Automatic Test Equipment
Automatic test equipment (ATE) vendors support in-system
Flash memory programming. The System ACE MPM’s
native Flash interface provides virtual access to every pin of
the Flash memory for the ATE. During the programming
operation, the ATE must hold the FCM_ENABLE signal on
the System ACE MPM Low to ensure that there will no contention between the ATE and the System ACE MPM controller on the native Flash interface signals. Test access points
are required for all of the native Flash memory interface signals and for the System ACE MPM FCM_ENABLE signal.
Third-Party Programmers
Third-party programmer vendors support stand-alone programming of the System ACE MPM through the native
Flash memory interface. The System ACE MPM programming times should be equivalent to the programming times
for the stand-alone AMD Flash memory units.
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Embedded Microprocessor
Software Support
An embedded microprocessor can be used to remotely
upgrade the System ACE MPM data sets. The embedded
microprocessor can program the Flash memory in the System ACE MPM using the native Flash memory interface to
directly control the Flash memory or the four-wire Boundary
Scan port.
The standard Xilinx design flow is followed for the development of the FPGA design sets. The Xilinx design software
packages are used to develop the design from which .bit
configuration file(s) are generated for each target FPGA.
The Xilinx PROM File Formatter tool is then used to compile
the .bit file(s) into a single image for downloading to a
Slave-Serial chain of FPGAs or to a single SelectMAP
FPGA. The output from the Xilinx PROM File Formatter is
an .MCS PROM image. The set of .MCS PROM images that
configure all of the target FPGA(s) connected to the System
ACE MPM is a called a design set.
The native Flash memory interface provides direct read
access, as well as write access, to the Flash memory. See
the AMD Flash memory data sheet for the proper Flash
memory programming protocol.
The FCM_ENABLE signal on the System ACE MPM must
be held Low during external access to the Flash memory.
Otherwise, contention between the microprocessor and
System ACE MPM configuration controller can occur.
The System ACE software can generate an SVF file for programming a System ACE MPM Flash memory through the
System ACE MPM Boundary Scan interface. The Xilinx
application note (XAPP058) at:
(http://www.xilinx.com/xapp/xapp058.pdf)
provides reference C code and solutions for programming a
device through Boundary Scan from an SVF file.
FOUNDATION
FOUNDATION
ALLIANCE
Xilinx Design Software/Tools
The System ACE MPM can store up to eight data sets. The
System ACE software is used to compile multiple data sets
into a single Flash memory image. The Flash memory
image is stored as an .MPM file. The .MPM file is a standard
Intel Hex (.MCS) file. The assignment of each data set to a
target FPGA chain or SelectMAP device is defined within
the System ACE software.
The System ACE software can also program the final Flash
memory image into the System ACE MPM through a Xilinx
Parallel Cable III, or it can generate an SVF file for programming the System ACE MPM using an alternate, Boundary
Scan-based programming method. Details of the System
ACE software are described in the System ACE CF Technology Software User Guide. Figure 12 shows the System
ACE MPM software flow.
Multiple HDL Designs
BIT file(s)
ISE
PROM File Formatter
MCS file(s)
MPM File
System ACE
Software
System ACE
MPM
Flash
Memory
DS087_13_091701
Figure 12: System ACE MPM Software Flow
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System ACE MPM Solution
IEEE 1149.1 Boundary Scan
Boundary Scan Test Requirements
The Xilinx Virtex-E XCV50E and XC18V01 PROMs in the
System ACE MPM support IEEE 1149.1 Boundary Scan.
Although the AMD Flash memory does not support Boundary Scan, all signal pins on the AMD Flash memory and the
MPM BG388 package are connected to boundary scannable pins on the XCV50E device (with the exception of the
XCCACEM64’s ACC pin). Thus, the System ACE MPM supports Boundary Scan for all significant signals on the System ACE MPM via the XCV50E’s Boundary Scan register.
Although the XC18V01 supports a Boundary Scan register,
most of its signals are solely internal to the System ACE
MPM. Signals from the XC18V01 device that reach the
external BG388 sites are redundantly tied to the XCV50E
device. Thus, Boundary Scan can be effectively performed
solely with the XCV50E Boundary Scan functions. See
Figure 13.
The System ACE MPM FCMRESET signal drives the
XCV50E /PROGRAM pin. The active-Low PROGRAM pin
on the XCV50E device resets the XCV50E’s Boundary
Scan test access port (TAP) controller. The FCM_ENABLE
signal must not be driven Low during Boundary Scan test.
Boundary Scan test functionality is undefined during the
System ACE MPM initialization phase. Therefore, boundary
scan testing must wait until after the initialization phase is
complete.
A special System ACE MPM Boundary Scan description
language (BSDL) file is required for proper Boundary Scan
test operation with the Virtex-E XCV50E device. The
XCCACEM16_BG388.BSD,
XCCACEM32_BG388.BSD,
and XCCACEM64.BSD files are available from the Xilinx
BSDL website under the software support pages at:
http://www.support.xilinx.com
System ACE MPM
TDI
TCK
TMS
TDO
XCV50E
AMD Flash
ACC*2
RESET
A0-A21*1
DQ0-DQ15
OE
CE
WE
ACC/WP *2
RY/BY *3
TCK
TMS
TDO
RESET
A0-A21*1
DQ0-DQ15
OE
CE
WE
WP
RY/BY *3
Boundary Scan
Register* *4
XC18V01
TDI
TCK
TMS
TDO
TDI
Most XC18V01 signals remain inside
the MPM except a few status signals
shared with the XCV50E
XCV50E boundary scan can scan
most MPM signal pins for board test
*1 A21 for XCCACEM64 only; A20 for XCCACEM32 and XCCACEM64 only.
*2 ACC/WP on XCCACEM32; XCCACEM64 has separate WP and ACC pins.
*3 RY/BY for XCCACEM16 and XCCACE32 only.
*4 Boundary scan register is only conceptually depicted.
See the System ACE MPM BSDL file for accurate boundary-scan register information.
ds087_14_091701
Figure 13: System ACE MPM Boundary Scan Mode
24
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TAP Timing
See Figure 14 for Boundary Scan TAP timing requirements.
TCKMIN
TCK
TMSS
TMSH
TMS
TDIS
TDIH
TDI
TDOV
TDO
DS087_15_091001
Figure 14: Boundary Scan TAP Timing Diagram
TAP AC Parameters
Table 19 provides Boundary Scan TAP AC characteristics.
Table 19: Boundary Scan TAP AC Characteristics
Parameter
Min
Max
Units
TCKMIN1
Symbol
TCK minimum clock period
100
-
ns
TCKMIN2
TCK minimum clock period, Bypass Mode
50
-
ns
TMSS
TMS setup time
10
-
ns
TMSH
TMS hold time
25
-
ns
TDIS
TDI setup time
10
-
ns
TDIH
TDI hold time
25
-
ns
TDOV
TDO valid delay
-
11
ns
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Absolute Maximum Ratings
Table 20 provides absolute maximum ratings.
Table 20: Absolute Maximum Ratings
Symbol
Description
Min
Max
Units
VCCint1
1.8V supply voltage relative to
GND
-0.5
2.0
V
VCCint2
3.3V supply voltage relative to
GND
-0.5
4.0
V
FLASH_VCCO
Flash interface power supply
-0.5
4.0
V
CFG_VCCO
Configuration interface power
supply
-0.5
4.0
V
CTRL_VCCO
System interface power supply
-0.5
4.0
V
VIN
Input voltage with respect to
GND
-0.5
4.0
V
-0.5
4.0
V
50
ms
125
°C
VTS
Voltage applied to 3-state output.
VCCint1_r
Longest 1.8V supply voltage rise
time 0 V – 1.71V
TSTG
Storage temperature (ambient)
-40
Recommended Operating Conditions
Table 21 provides the recommended operating conditions.
Table 21: Recommended Operating Conditions
Min
Max
Unit
VCCint1
Symbol
1.8V supply voltage relative to GND
1.8 - 5%
1.8 +5%
V
VCCint2
3.3V supply voltage relative to GND
3.0
3.6
V
26
Description
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Quality and Reliability Characteristics
DC Characteristics Over Operating Conditions
Table 22 provides DC characteristics over operating conditions.
Table 22: DC Characteristics Over Operating Conditions
Symbol
Description
Min
VDRINT1
Data retention VCCINT1 voltage
Max
Unit
1.5
V
ICCINT1Q
Quiescent VCCINT1 supply current
200
mA
ICCINT2Q
Quiescent VCCINT2 supply current
40
mA
IL
Input leakage current
+11
NA
CIN
Input capacitance
10
pF
COUT
Output capacitance
10
pF
-11
DC Input and Output Levels Over Operating Conditions
Three of the primary interfaces (the Boundary Scan interface, the system control interface, and the target FPGA
interface) to the System ACE MPM have I/O level compatibility control pins. See Figure 2 and Figure 4.
FLASH_VCCO controls the internal Flash memory interface
and the Boundary Scan interface. FLASH_VCCO must be
connected to a 3.3V power supply. The Boundary Scan
ports (TCK, TMS, TDI, and TDO) and the internal Flash
memory interface pins follow the 3.3V input and output level
specification. CTRL_VCCO controls the system control
interface, and CFG_VCCO controls the target FPGA interface. The input and output level specifications for the system control and target FPGA interface pins depend on the
voltage connection to the CTRL_VCCO and CFG_VCCO
pins. See Table 23 for the input and output level specifications for each VCCO voltage level.
Table 23: DC Input and Output Levels Over Operating Conditions
VCCO
Voltage
Level
VIL, Min
VIL, Max
3.3V
-0.5V
2.5V
-0.5V
1.8V
-0.5V
VIH, Min
VIH, Max
VOL, Max
VOH, Min
IOL, Max
IOH, Min
0.8V
2.0V
3.6V
0.4V
2.4V
24 mA
-24 mA
0.7V
1.7V
2.7V
0.4V
1.9V
12 mA
-12 mA
35%
VCCO
65%
VCCO
1.95V
0.4V
VCCO 0.4V
8 mA
-8 mA
AC Characteristics Over Operating Conditions
Table 24 provides the AC characteristics over operating conditions.
Table 24: AC Characteristics Over Operating Conditions
Timing Parameter
Description
Min
Max
Unit
133
MHz
FSYS
Maximum SYSCLK frequency
TSCL
SYSCLK Low time
3.75
ns
TSCH
SYSCLK High time
3.75
ns
TSYSRESET
Minimum SYSRESET pulse time
10
SYSCLK cycles
TCYC
CFG_CCLK period
TLC
CFG_CCLK Low time
7.5
ns
THC
CFG_CCLK High time
7.5
ns
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Quality and Reliability Characteristics
Table 25 provides quality and reliability characteristics.
Table 25: Quality and Reliability Characteristics
Symbol
Description
TDR
Data retention
NPE
Program/erase cycles
VESD
Electrostatic
discharge (HBM)
Min
Max
Unit
20 (Note 1)
Years
1 million (Note 1)
Cycles
1500
Volts
Notes:
1. See AMD Flash memory data sheet.
System ACE MPM Power-On Power Supply Requirements
The System ACE MPM requires two supply voltages: 1.8v
and 3.3V. The 1.8V supplies power to the embedded
XCV50E configuration controller core. The 3.3v supplies
power to remaining XCV50E power pins and to all other
devices. The 3.3V supply must be applied after or simultaneous to the 1.8V supply. The embedded XCV50E and
XC18V01 require monotonic power supply ramps. The
XCV50E requires the 1.8V supply to ramp to nominal voltage in less than 50 milliseconds. See Figure 15.
Before any programming operations can be performed, the
programmer must wait for the XCV50E’s initialization phase
to complete. The programmer may wait for either the maximum initialization time or for the System ACE MPM
DEVRDY signal to go High which indicates the end of the
initialization phase. After the initialization phase is complete, the device is ready for operation. See Table 26 for
power-on power supply requirements.
T V1
1.8 V
VCCint1=1.8v
0.0 V
T V1V2
3.3 V
VCCint2=3.3v
0.0 V
T RDY
T RDY
DEVRDY
T RST
FCMRESET
DS087_16_092001
Figure 15: Power-On Power Supply Requirements
Table 26: Power-On Power Supply Requirements
Parameter
Description
Minimum
Maximum
50 ms
TV1
1.8V power supply ramp 0-1.8V
2 ms
TV1V2
1.8V to 3.3V power sequence delay
0 ms
TRDY
Initialization time after 3.3V or FCMRESET
TRST
System ACE MPM controller reset
I1.8V
1.8V supply current
28
250 ms
300 ns
2A
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Ordering Information
XCCACEM16 BG388
I
Device Number
Operating Range/Processing
Package Type
XCCACEM16
XCCACEM32
XCCACEM64
I = Industrial (TA = -40˚ to +85˚ C)
BG388 = 388-site Ball Grid Array
DS087_17_091001
Valid Ordering Combinations
Valid Ordering Combinations
Description
XCCACEM16BG388I
16 Mb System ACE MPM
XCCACEM32BG388I
32 Mb System ACE MPM
XCCACEM64BG388I
64 Mb System ACE MPM
Revision History
The following table shows the revision history for this document.
Date
Version
09/25/01
1.0
DS087 (v1.0) September 25, 2001
Advance Product Specification
Revision
Initial Xilinx release.
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