ETC DS1330WP-150

DS1330W
3.3V 256k Nonvolatile SRAM
with Battery Monitor
www.maxim-ic.com
FEATURES
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10 years minimum data retention in the
absence of external power
Data is automatically protected during power
loss
Power supply monitor resets processor when
VCC power loss occurs and holds processor in
reset during VCC ramp-up
Battery monitor checks remaining capacity
daily
Read and write access times as fast as 100 ns
Unlimited write cycle endurance
Typical standby current 50 µA
Upgrade for 32k x 8 SRAM, EEPROM or
Flash
Lithium battery is electrically disconnected to
retain freshness until power is applied for the
first time
Optional industrial temperature range of
-40°C to +85°C, designated IND
PowerCap Module (PCM) package
- Directly surface-mountable module
- Replaceable snap-on PowerCap provides
lithium backup battery
- Standardized pinout for all nonvolatile
SRAM products
- Detachment feature on PowerCap allows
easy removal using a regular screwdriver
PIN ASSIGNMENT
BW
NC
NC
RST
VCC
WE
OE
CE
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
GND VBAT
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
NC
NC
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
34-Pin PowerCap Module (PCM)
(Uses DS9034PC PowerCap)
PIN DESCRIPTION
A0-A14
DQ0-DQ7
CE
WE
OE
RST
BW
VCC
GND
NC
- Address Inputs
- Data In/Data Out
- Chip Enable
- Write Enable
- Output Enable
- Reset Output
- Battery Warning Output
- Power (+3.3V)
- Ground
- No Connect
DESCRIPTION
The DS1330W 3.3V 256k Nonvolatile SRAM is a 262,144-bit, fully static, nonvolatile SRAM organized
as 32,768 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control
circuitry which constantly monitors VCC for an out-of-tolerance condition. When such a condition occurs,
the lithium energy source is automatically switched on and write protection is unconditionally enabled to
prevent data corruption. Additionally, the DS1330W has dedicated circuitry for monitoring the status of
VCC and the status of the internal lithium battery. DS1330W devices in the PowerCap Module package
are directly surface mountable and are normally paired with a DS9034PC PowerCap to form a complete
Nonvolatile SRAM module. The devices can be used in place of 32k x 8 SRAM, EEPROM or Flash
components.
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0717011
DS1330W
READ MODE
The DS1330W executes a read cycle whenever WE (Write Enable) is inactive (high) and CE (Chip
Enable) and OE (Output Enable) are active (low). The unique address specified by the 15 address inputs
(A0 - A14) defines which of the 32,768 bytes of data is to be accessed. Valid data will be available to the
eight data output drivers within tACC (Access Time) after the last address input signal is stable, providing
that CE and OE (Output Enable) access times are also satisfied. If OE and CE access times are not
satisfied, then data access must be measured from the later-occurring signal ( CE or OE ) and the limiting
parameter is either tCO for CE or tOE for OE rather than address access.
WRITE MODE
The DS1330W executes a write cycle whenever the WE and CE signals are in the active (low) state after
address inputs are stable. The later-occurring falling edge of CE or WE will determine the start of the
write cycle. The write cycle is terminated by the earlier rising edge of CE or WE . All address inputs must
be kept valid throughout the write cycle. WE must return to the high state for a minimum recovery time
(tWR) before another cycle can be initiated. The OE control signal should be kept inactive (high) during
write cycles to avoid bus contention. However, if the output drivers are enabled ( CE and OE active) then
WE will disable the outputs in tODW from its falling edge.
DATA RETENTION MODE
The DS1330W provides full-functional capability for VCC greater than 3.0 volts and write protects by 2.8
volts. Data is maintained in the absence of VCC without any additional support circuitry. The nonvolatile
static RAMs constantly monitor VCC. Should the supply voltage decay, the NV SRAMs automatically
write protect themselves, all inputs become “don’t care,” and all outputs become high impedance. As VCC
falls below approximately 2.5 volts, the power switching circuit connects the lithium energy source to
RAM to retain data. During power-up, when VCC rises above approximately 2.5 volts, the power
switching circuit connects external VCC to the RAM and disconnects the lithium energy source. Normal
RAM operation can resume after VCC exceeds 3.0 volts.
SYSTEM POWER MONITORING
The DS1330W has the ability to monitor the external VCC power supply. When an out-of-tolerance power
supply condition is detected, the NV SRAM warns a processor-based system of impending power failure
by asserting RST . On power-up, RST is held active for 200ms nominally to prevent system operation
during power-on transients and to allow tREC to elapse. RST has an open-drain output driver.
BATTERY MONITORING
The DS1330W automatically performs periodic battery voltage monitoring on a 24-hour time interval.
Such monitoring begins within tREC after VCC rises above VTP and is suspended when power failure
occurs.
After each 24-hour period has elapsed, the battery is connected to an internal 1MΩ test resistor for 1
second. During this 1 second, if battery voltage falls below the battery voltage trip point (2.6V), the
battery warning output BW is asserted. Once asserted, BW remains active until the module is replaced.
The battery is still re-tested after each VCC power-up, however, even if BW is active. If the battery
voltage is found to be higher than 2.6V during such testing, BW is de-asserted and regular 24-hour testing
resumes. BW has an open-drain output driver.
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DS1330W
FRESHNESS SEAL
Each DS1330W is shipped from Dallas Semiconductor with its lithium energy source disconnected,
guaranteeing full energy capacity. When VCC is first applied at a level greater than VTP, the lithium
energy source is enabled for battery backup operation.
PACKAGES
The 34-pin PowerCap Module integrates SRAM memory and nonvolatile control into a module base
along with contacts for connection to the lithium battery in the DS9034PC PowerCap. The PowerCap
Module package design allows a DS1330W device to be surface mounted without subjecting its lithium
backup battery to destructive high-temperature reflow soldering. After a DS1330W module base is reflow
soldered, a DS9034PC is snapped on top of the base to form a complete Nonvolatile SRAM module. The
DS9034PC is keyed to prevent improper attachment. DS1330W module bases and DS9034PC
PowerCaps are ordered separately and shipped in separate containers. See the DS9034PC data sheet for
further information.
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DS1330W
ABSOLUTE MAXIMUM RATINGS*
Voltage On Any Pin Relative To Ground
Operating Temperature
Storage Temperature
Soldering Temperature
-0.3V to +4.6V
0°C to 70°C, -40°C to +85°C for IND parts
-40°C to +70°C, -40°C to +85°C for IND parts
260°C For 10 seconds
* This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER
Power Supply Voltage
Logic 1
Logic 0
SYMBOL
VCC
VIH
VIL
MIN
3.0
2.2
0.0
DC ELECTRICAL CHARACTERISTICS
PARAMETER
Input Leakage Current
I/O Leakage Current CE ³
VIH £ VCC
Output Current @ 2.2V
Output Current @ 0.4V
Standby Current CE = 2.2V
Standby Current CE = VCC 0.2V
Operating Current
Write Protection Voltage
TYP
3.3
(TA: See Note 10)
MAX
3.6
VCC
0.4
UNITS
V
V
V
(TA: See Note 10) (VCC=3.3V ±0.3V)
SYMBOL
MIN
MAX
UNITS
IIL
-1.0
+1.0
µA
IIO
-1.0
+1.0
µA
IOH
IOL
ICCS1
-1.0
2.0
50
250
mA
mA
µA
30
150
µA
2.9
50
3.0
mA
V
ICCS2
ICCO1
VTP
2.8
TYP
CAPACITANCE
PARAMETER
Input Capacitance
Input/Output Capacitance
NOTES
NOTES
14
14
(TA= 25°C)
SYMBOL
MIN
CIN
CI/O
4 of 12
TYP
MAX
UNITS
5
5
10
10
pF
pF
NOTES
DS1330W
AC ELECTRICAL CHARACTERISTICS
PARAMETER
Read Cycle Time
Access Time
OE to Output Valid
CE to Output Valid
OE or CE to Output Active
Output High Z from
Deselection
Output Hold from Address
Change
Write Cycle Time
Write Pulse Width
Address Setup Time
Write Recovery Time
Output High Z from WE
Output Active from WE
Data Setup Time
Data Hold Time
SYMBOL
tRC
tACC
tOE
tCO
tCOE
(TA: See Note 10) (VCC =3.3V ±0.3V)
DS1330W-100
MIN
MAX
100
DS1330W-150
MIN
MAX
150
100
50
100
5
150
70
150
5
tOD
35
35
UNITS
NOTES
ns
ns
ns
ns
ns
5
ns
5
tOH
5
5
ns
tWC
tWP
tAW
tWR1
tWR2
tODW
tOEW
tDS
tDH1
tDH2
100
75
0
5
20
150
100
0
5
20
ns
ns
ns
35
5
40
0
20
35
5
60
0
20
READ CYCLE
5 of 12
ns
ns
ns
ns
ns
3
12
13
5
5
4
12
13
DS1330W
WRITE CYCLE 1
WRITE CYCLE 2
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DS1330W
POWER-DOWN/POWER-UP CONDITION
BATTERY WARNING DETECTION
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DS1330W
POWER-DOWN/POWER-UP TIMING
PARAMETER
VCC Fail Detect to CE and
WE Inactive
VCC slew from VTP to 0V
VCC Fail Detect to
RST Active
VCC slew from 0V to VTP
VCC Valid to CE and
WE Inactive
VCC Valid to End of
Write Protection
VCC Valid to RST Inactive
VCC Valid to BW Valid
SYMBOL
(TA: See Note 10)
MIN
TYP
tPD
tF
UNITS
NOTES
1.5
µs
11
150
µs
tRPD
tR
MAX
15
150
tPU
2
ms
tREC
125
ms
350
1
ms
s
tRPU
tBPU
150
Battery Test Cycle
Battery Test Pulse Width
Battery Test to BW Active
SYMBOL
14
µs
200
BATTERY WARNING TIMING
PARAMETER
µs
14
14
(TA: See Note 10)
MIN
tBTC
tBTPW
tBW
TYP
MAX
UNITS
1
1
hr
s
s
24
NOTES
(TA= 25°C)
PARAMETER
SYMBOL
MIN
Expected Data
Retention Time
tDR
10
TYP
MAX
UNITS
NOTES
years
9
WARNING:
Under no circumstance are negative undershoots, of any amplitude, allowed when device is in battery
backup mode.
NOTES:
1. WE is high for a Read Cycle.
2. OE = VIH or VIL . If OE = VIH during write cycle, the output buffers remain in a high impedance state.
3. tWP is specified as the logical AND of CE and WE . tWP is measured from the latter of CE or WE
going low to the earlier of CE or WE going high.
4. tDS is measured from the earlier of CE or WE going high.
5. These parameters are sampled with a 5 pF load and are not 100% tested.
6. If the CE low transition occurs simultaneously with or latter than the WE low transition, the output
buffers remain in a high impedance state during this period.
7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output
buffers remain in high-impedance state during this period.
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition,
the output buffers remain in a high-impedance state during this period.
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DS1330W
9. Each DS1330W has a built-in switch that disconnects the lithium source until VCC is first applied by
the user. The expected tDR is defined as accumulative time in the absence of VCC starting from the
time power is first applied by the user.
10. All AC and DC electrical characteristics are valid over the full operating temperature range. For
commercial products, this range is 0°C to 70°C. For industrial products (IND), this range is -40°C to
+85°C.
11. In a power-down condition the voltage on any pin may not exceed the voltage on VCC.
12. tWR1 and tDH1 are measured from WE going high.
13. tWR2 and tDH2 are measured from CE going high.
14. RST and BW are open drains and cannot source current. External pullup resistors should be
connected to these pins for proper operation. Both pins will sink 10mA.
15. DS1330 PowerCap modules are pending U.L. review. Contact the factory for status.
DC TEST CONDITIONS
Outputs Open
Cycle = 200 ns for operating current
All voltages are referenced to ground
AC TEST CONDITIONS
Output Load: 100 pF + 1TTL Gate
Input Pulse Levels: 0 to 2.7V
Timing Measurement Reference Levels
Input: 1.5V
Output: 1.5V
Input pulse Rise and Fall Times: 5ns
ORDERING INFORMATION
DS1330 W P - SSS - III
Operating Temperature Range
blank: 0° to 70°
IND: -40° to +85°C
Access Speed
100: 100ns
150: 150ns
P: 34-pin PowerCap Module
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DS1330W
DS1330W NONVOLATILE SRAM, 34-PIN POWERCAP MODULE
PKG
DIM
A
B
C
D
E
F
G
10 of 12
MIN
0.920
0.980
0.052
0.048
0.015
0.020
INCHES
NOM
0.925
0.985
0.055
0.050
0.020
0.025
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
DS1330W
DS1330W NONVOLATILE SRAM, 34-PIN POWERCAP MODULE WITH
POWERCAP
PKG
DIM
A
B
C
D
E
F
G
MIN
0.920
0.955
0.240
0.052
0.048
0.015
0.020
INCHES
NOM
0.925
0.960
0.245
0.055
0.050
0.020
0.025
MAX
0.930
0.965
0.250
0.058
0.052
0.025
0.030
ASSEMBLY AND USE
Reflow soldering
Dallas Semiconductor recommends that
PowerCap Module bases experience one pass
through solder reflow oriented label-side up
(live bug).
Hand soldering and touch-up
Do not touch soldering iron to leads for more
than 3 seconds. To solder, apply flux to the
pad, heat the lead frame pad and apply
solder. To remove part, apply flux, heat pad
until solder reflows, and use a solder wick.
LPM replacement in a socket
To replace a Low Profile Module in a 68-pin
PLCC socket, attach a DS9034PC PowerCap
to a module base then insert the complete
module into the socket one row of leads at a
time, pushing only on the corners of the cap.
Never apply force to the center of the device.
To remove from a socket, use a PLCC
extraction tool and ensure that it does not hit
or damage any of the module IC
components. Do not use any other tool for
extraction.
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DS1330W
RECOMMENDED POWERCAP MODULE LAND PATTERN
PKG
DIM
A
B
C
D
E
MIN
-
INCHES
NOM
MAX
1.050
0.826
0.050
0.030
0.112
-
RECOMMENDED POWERCAP MODULE SOLDER STENCIL
PKG
DIM
A
B
C
D
E
12 of 12
MIN
-
INCHES
NOM
MAX
1.050
0.890
0.050
0.030
0.080
-