ETC UPD16874GS

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD16874
QUAD Pch HIGH-SIDE SWITCH FOR USB
DESCRIPTION
The µPD16874 is a power switch IC with an overcurrent limiter that is used for the power bus of a Universal Serial
Bus (USB). This product has Pch power MOSFET circuits, each of which has a low-on resistance (100 mΩ TYP.), in
its switching block.
In addition, the IC is also equipped with an overcurrent detector that is essential for a host/hub controller
conforming to the USB Standard, so that the IC can report an overcurrent to the controller. Moreover, a thermal
shutdown circuit and an undervoltage lockout circuit are also provided as the protection circuits of the IC.
This product has four channels of power switches, control input pins, and flag output pins to simultaneously
control four USB ports with a single IC.
FEATURES
•
Four P-ch power MOSFET circuits
•
Overcurrent detector that outputs active-low control signal from detection report pin
•
Overcurrent limiter to prevent system voltage drop
•
Thermal shutdown circuit
•
Undervoltage lockout circuit
•
Each of four circuits can be turned on and off independently of the others by a control pin. (CTL input: active
low)
•
16-pin SOP package
ORDERING INFORMATION
Part Number
Package
µPD16874GS
16-pin SOP (7.62 mm (300))
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. S13894EJ1V0DS00 (1st edition)
Date Published February 2001 N CP(K)
Printed in Japan
©
2001
µPD16874
BLOCK DIAGRAM
IN (Input)
1
OUT1 2
(Output 1)
15 OUT2
(Output 2)
Reference
voltage
Reference
voltage
Overcurrent
detection
Gate
control
Gate
control
Overcurrent
detection
To VDDC pin
To VDDC pin
FLG1 3
(Flag output 1)
14 FLG2
(Flag output 2)
CTL1 4
(Control input 1)
13 CTL2
(Control input 2)
Undervoltage
lockout circuit
Thermal
shutdown circuit
CTL3 5
(Control input 3)
To VDDC pin
To VDDC pin
11 FLG4
(Flag output 4)
FLG3 6
(Flag output 3)
Overcurrent
detection
Gate
control
Gate
control
Overcurrent
detection
Reference
voltage
Reference
voltage
OUT3
(Output 3)
12 CTL4
(Control input 4)
10
7
9
16
8
VDDC
(USB controller power supply)
IN (Input)
OUT4
(Output 4)
GND
NOTES ON CORRECT USE
• No internal resistor is connected to input pins CTL1 (pin 4), CTL2 (pin 13), CTL3 (pin 5), and CTL4 (pin 12).
When using the µPD16874, therefore, be sure to set the voltage level of these input pins to “H” or “L”.
• Keep the IN pins (pins 1 and 8) at the same potential.
• Supply a voltage lower than that supplied to the IN pins (pins 1and 8) to VDDC (pin 9).
• FLG1 (pin 3), FLG2 (pin 14), FLG3 (pin 6), and FLG4 (pin 11) are internally pulled up to VDDC (USB controller
supply voltage) (resistance: approx. 400 kΩ). Therefore, no external pull-up resistor has to be connected to
these pins.
2
Data Sheet S13894EJ1V0DS
µPD16874
PIN CONFIGURATION (Top View)
IN
1
16
GND
OUT1
2
15
OUT2
FLG1
3
14
FLG2
CTL1
4
13
CTL2
CTL3
5
12
CTL4
FLG3
6
11
FLG4
OUT3
7
10
OUT4
IN
8
9
VDDC
16-pin SOP
PIN DESCRIPTION
Pin No.
Pin Name
Pin Function
4/5/12/13
CTL1/CTL2/CTL3/CTL4
Control input (See the truth table below). TTL input
3/6/11/14
FLG1/FLG2/FLG3/FLG4
Detection flag (output): Active-low, Nch open-drain
16
GND
1/8
IN
Power input: Source of MOSFET for output. Power supply to
internal circuitry of IC
9
VDDC
USB controller power supply. Each FLG output is connected
via internal resistor.
2/7/10/15
OUT1/OUT2/OUT3/OUT4
Ground
Switch output: Drain of MOSFET for output. Usually,
connected to load.
TRUTH TABLE (H: High level, L: Low level, ON: Output on, OFF: Output off, X: H or L)
CTLn (In)
FLGn (Out)
OUTn (Out)
Operation mode
L
H
ON
OUTn ON
H
H
OFF
OUTn OFF
H (all)
H (all)
OFF (all)
L
L
ON
X
L (all)
OFF (all)
Thermal shutdown circuit operation
X
L (all)
OFF (all)
Undervoltage lockout circuit operation
Standby mode
OUTn overcurrent detection
Data Sheet S13894EJ1V0DS
3
µPD16874
ABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, TA = 25°°C)
Parameter
Symbol
Conditions
Ratings
Unit
Input voltage
VIN
−0.3 to +6
V
Flag voltage
VFLG
−0.3 to +6
V
Flag current
IFLG
50
mA
Output voltage
VOUT
VIN+0.3
V
Output current
IOUT
+0.5 (VIN = VCTL = 5 V)
A
DC
−0.1 (VIN = 0 V, VOUT = 5 V)
Pulse width ≤ Single 100 µs pulse
Control input
+3
VCTL
Note 1
−0.3 to +6
V
Total power dissipation
PD
900
mW
Operating temperature range
TA
−40 to +85
°C
+150
°C
−55 to +150
°C
Note 2
Junction temperature
TCH MAX
Storage temperature
Tstg
1. When mounted on a glass epoxy board measuring 90 mm × 90 mm × 1.6 mm thick
Notes
2. This product has an internal thermal shutdown circuit (operating temperature: 150°C or higher TYP.)
RECOMMENDED OPERATING RANGE (Unless otherwise specified, TA = 25°°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Input voltage
VIN
+4
+5.5
V
Operating temperature range
TA
0
+70
°C
ELECTRICAL SPECIFICATIONS
DC Characteristics (Unless otherwise specified, VIN = +5 V, TA = +25°°C)
Parameter
Current consumption
Symbol
IDD
Conditions
MIN.
TYP.
MAX.
Unit
1
5
µA
VCTL = 0 V, OUT: open
150
µA
1.0
V
VCTL = VIN (all CTL pins),
OUT: Open
Input voltage, low
VIL
CTL pin
Input voltage, high
VIH
CTL pin
Control input current
ICTL
VCTL = 0 V
0.01
1
µA
VCTL = VIN
0.01
1
µA
TA = 0 to +70°C,
IOUT = 500 mA
100
140
mΩ
10
µA
0.9
1.25
A
2.0
V
Output MOSFET on-resistance
RON
Output leakage current
IO LEAK
Overcurrent detector threshold
ITH
TA = 0 to +70°C
Flag output resistance
RON F
IL = 10 mA
10
25
Ω
Flag leakage current
IO LEAK F
VFLAG = 5 V
0.01
1
µA
Undervoltage lockout circuit operating
voltage
VUVLO
VIN: When rising
2.2
2.5
2.8
V
VIN: When falling
2.0
2.3
2.6
V
Hysteresis width
0.05
0.25
V
4
Data Sheet S13894EJ1V0DS
0.6
µPD16874
ELECTRICAL SPECIFICATIONS
AC Characteristics (Unless otherwise specified, VIN = +5 V, TA = +25°°C)
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
2.5
5
8
ms
10
µs
Output transition rise time (ON)
tRISE
RL = 10 Ω per output
Output transition fall time (OFF)
tFALL
RL = 10 Ω per output
Overcurrent detection delay time
tOVER
Overcurrent detection output
rise time
tSRISE
RL = 10 Ω per output
2.5
Minimum CTL high time
tCTL
CTL : L→H→L
20
µs
20
5
8
ms
µs
POINTS OF MEASUREMENT
Output Transition Rise Time (ON)/Output Transition Fall Time (OFF)
CTL pin: H→L/L→H
5 V/3.3 V
90%
CTL
0V
tRISE
tFALL
5V
90%
90%
VOUT
10%
0V
Overcurrent Detection Delay Time/Minimum CTL High Time
ITH
IOUT
VOUT
tOVER
tSRISE
(Internal time)
FLG
90%
tCTL
CTL
10%
10%
Data Sheet S13894EJ1V0DS
5
µPD16874
DESCRIPTION OF FUNCTIONS
1. Overcurrent Detection
This IC detects an overcurrent in a range of 0.6 to 1.25 A (0.9 A TYP.) (the USB Standard defines that an
overcurrent is 0.5 A MAX.). When the IC detects an overcurrent, the FLG pin goes low (active) and reports the result
of detection to the control IC. At this time, the switch is kept ON and the current limiter is activated. In this way, an
overcurrent status that lasts for a long time can be prevented.
By deasserted the CTL pin inactive by the control IC, the switch is turned OFF and the FLG pin goes back high.
Therefore, the CTL signal must be deasserted inactive as soon as the controller IC has detected that the FLG pin has
gone low, to avoid overheating this IC. Once the switch has been turned OFF, it turns back ON again only when the
CTL signal is asserted active while the FLG pin is high.
To prevent an inrush current being detected by mistake, a deadband time (overcurrent detection delay time) is set
to elapse before the overcurrent detector is activated. The duration of this deadband time is 20 µs TYP.
While the overcurrent limiter is activated, the power consumption of the device may abruptly increase. As a result,
the junction temperature may also rise. Make sure that the CTL signal is deasserted inactive and that the switch is
turned OFF before the absolute maximum rating is exceeded.
2. Undervoltage Lockout Circuit (UVLO)
This circuit prevents malfunctioning of the switch due to fluctuation in supply voltage.
When power is turned on (2.5 V or less TYP.) or off (2.3 V or less TYP.), the OUT and FLG pins have the following
status:
OUT: OFF
FLG: “L” (= 0 V)
5V
Output voltage
2.3 V
2.5 V
5V
Input voltage
The above figure does not show the actual waveform. For the related characteristic waveform, refer to Major
Characteristic Curves.
6
Data Sheet S13894EJ1V0DS
µPD16874
3. Behavior When Power is Turned ON/OFF
This IC performs a soft-start operation on power application. This is to prevent an overcurrent from flowing
through the IC on power application while the high-capacity capacitor connected to the output pin is charged.
Power ON:
Soft start (2.5 to 8 ms)
Power OFF:
No control (10 µs MAX.)
5V
Vin
0V
2.5 ms MIN.
8 ms MAX.
10 µ s MAX.
5V
Vout
0V
The above figure does not show the actual waveform. For the related characteristic waveform, refer to Major
Characteristic Curves.
Data Sheet S13894EJ1V0DS
7
µPD16874
OPERATION SEQUENCE
Power ON/OFF
5V
IN (Input)
GND
5V
OUT
(Output)
GND
5V
Flg
(Output)
GND
5V
5V
CTL
(Input)
GND
Overcurrent detection threshold
Iout
Note If the CTL signal is asserted active after power has been turned ON, OUT executes the soft-start operation
(output transition time: 8 ms MAX.). In addition, FLG output is fixed to “L” if the supply voltage is lower than
the operating voltage of the undervoltage lockout circuit (UVLO) on power application.
If all the CTL pins are inactive when power is supplied, the IC enters the standby status (IDD = 5 µA MAX.).
When Control Signals Are Input
5V
IN (Input)
GND
5V
OUT
(Output)
FLG
(Output)
CTL
(Input)
8
GND
5V
GND
5V
GND
Data Sheet S13894EJ1V0DS
µPD16874
On Detection of Overcurrent
5V
IN (Input)
5V
Flg
(Output)
GND
5V
CTL
(Input)
GND
5V
OUT
(Output)
IOUT
GND
Overcurrent
detection threshold
When overcurrent
(inrush current)
is detected
Slow
start
period
When overcurrent is detected
(output is short-circuited)
If an overcurrent is detected after the overcurrent detection delay time of 20 µs, the IC executes a slow-start
operation again.
If an overcurrent is detected while the IC is executing the slow-start operation again, it is assumed that the output
is short-circuited and the FLG pin goes low. When the CTL signal is deasserted inactive, OUT is turned OFF and
FLG goes high. If the CTL signal is asserted active, OUT is turned back ON unless the undervoltage lockout circuit
or thermal shutdown circuit is activated.
Data Sheet S13894EJ1V0DS
9
µPD16874
When Thermal Shutdown Circuit Operates
5V
IN (Input)
Standby status
Non-standby
status
GND
5V
OUT
(Output)
FLG
(Output)
GND
5V
GND
5V
CTL
(Input)
Tch
GND
Thermal shutdown circuit
operating temperature (falling)
Thermal shutdown circuit
operating temperature (rising)
While the thermal shutdown circuit is activated, the output pins are in the OFF status. However, the IC does not
enter the standby status even if all the CLT pins are deasserted inactive at the same time.
The thermal shutdown circuit is not activated even if the junction temperature exceeds 150°C TYP. while the IC is
in the standby mode (when all the CTL pins are inactive).
TEST CIRCUIT
+5 V
10 Ω
10 Ω
10
1
IN
2
OUT1
OUT2 15
3
FLG1
FLG2 14
4
CTL1
CTL2 13
5
CTL3
CTL4 12
6
FLG3
FLG4 11
7
OUT3
OUT4 10
8
IN
GND 16
VDDC
Data Sheet S13894EJ1V0DS
9
10 Ω
10 Ω
µPD16874
MAJOR CHARACTERISTIC CURVES (Unless otherwise specified, TA = +25°°C, VIN = +5 V)
Total Power Dissipation PT vs. Ambient Temperature TA
Total consumption PT (mW)
1200
900
600
300
0
−40
0
40
80
120
160
200
Ambient temperature TA (˚C)
Output On-Resistance RON vs. Supply Voltage VIN
120
100
80
60
40
20
0
−20
0
20
40
60
80
Output on-resistance RON (mΩ)
Output on-resistance RON (mΩ)
Output On-Resistance RON vs. Ambient Temperature TA
140
140
120
100
80
60
40
20
0
3.5
4.0
4.5
Ambient temperature TA (˚C)
160
140
120
100
80
20
0
20
40
60
100
80
20
4.0
0.06
0.04
0.02
60
Ambient temperature TA (˚C)
80
Current consumption in standby mode ( µ A)
Current consumption in standby mode ( µ A)
0.08
40
4.5
5.0
5.5
6.0
6.5
Supply voltage (V)
Current Consumption (Standby) IDD vs. Ambient Temperature TA
20
6.5
120
0
3.5
80
0.10
0
6.0
140
Ambient temperature TA (˚C)
0.00
−20
5.5
Current Consumption IDD vs. Supply Voltage VIN
Current consumption ( µ A)
Current consumption ( µ A)
Current Consumption IDD vs. Ambient Temperature TA
180
0
−20
5.0
Supply voltage (V)
Current Consumption (Standby) IDD vs. Supply Voltage VIN
0.10
0.08
0.06
0.04
0.02
0.00
3.5
Data Sheet S13894EJ1V0DS
4.0
4.5
5.0
5.5
6.0
6.5
Supply voltage (V)
11
µPD16874
MAJOR CHARACTERISTIC CURVES (Unless otherwise specified, TA = +25°°C, VIN = +5 V)
Input Voltage VI vs. Ambient Temperature TA
Input Voltage VI vs. Supply Voltage VIN
1.70
1.70
Input voltage, low VIL (V)
Input voltage, high VIH (V)
Input voltage, low VIL (V)
Input voltage, high VIH (V)
1.80
VIH
1.60
VIL
1.50
1.40
1.30
−20
0
20
40
60
1.65
1.60
1.55
1.50
3.5
80
VIH
VIL
4.0
4.5
Ambient temperature TA (˚C)
1.2
1.0
0.8
0.6
0.4
0.2
0
20
40
60
80
1.0
0.8
0.6
0.4
0.2
0.0
3.5
4.0
4.5
Undervoltage lockout circuit operating voltage VUVLO (V)
12
Voltage (V)
Voltage (V)
Output voltage
4
2
1
0
2
3
4
0
Undervoltage Lockout Circuit Operating Voltage Characteristics
50
40
UVLO (L H)
30
20
UVLO (H L)
20
40
0.4
Time ( µ s)
Time ( µ s)
0
Output voltage
3
0
00
−20
6.5
5
1
10
6.0
6
3
1
5.5
Output Fall Delay Time Characteristics
4
0
5.0
Supply voltage (V)
Input voltage
2
6.5
1.2
Output Rise Delay Time Characteristics
5
6.0
1.4
Ambient temperature TA (˚C)
6
5.5
Overcurrent Threshold ITH vs. Supply Voltage VIN
Overcurrent detection value (A)
Overcurrent detection value (A)
Overcurrent Threshold ITH vs. Ambient Temperature TA
1.4
0.0
−20
5.0
Supply voltage (V)
60
80
Ambient temperature TA (˚C)
Data Sheet S13894EJ1V0DS
0.8
1.2
µPD16874
APPLICATION CIRCUIT
3.3 V
5V
VBUS
D+
D+
D-
D−
IN
USB controller
VDDC
Enable
GND
GND
1µ F
150 µ F
CTL1
VBUS
CTL2 OUT1
D+
CTL3
D−
CTL4 OUT2
FLG1
Over
current
150µ F
GND
FLG2 OUT3
FLG3
FLG4 OUT4
VBUS
150 µ F
µ PD16874
D+
D−
GND
VBUS
150 µ F
D+
D−
GND
USB
connector
Data Sheet S13894EJ1V0DS
13
µPD16874
PACKAGE DRAWING
16-PIN PLASTIC SOP (7.62 mm (300))
16
9
detail of lead end
P
1
8
A
H
F
I
G
J
S
B
N
S
L
K
C
D
M
M
E
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
ITEM
A
MILLIMETERS
10.2±0.2
B
0.78 MAX.
C
1.27 (T.P.)
D
0.42 +0.08
−0.07
E
0.1±0.1
F
1.65±0.15
G
1.55
H
7.7±0.3
I
5.6±0.2
J
1.1±0.2
K
0.22 +0.08
−0.07
L
0.6±0.2
M
0.12
N
0.10
P
3° +7°
−3°
P16GM-50-300B-6
14
Data Sheet S13894EJ1V0DS
µPD16874
RECOMMENDED SOLDERING CONDITIONS
The µPD16874 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended, contact your NEC sales representative.
Surface Mount Type
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
µPD16874GS
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),
Note
Count: two times, Exposure limit: Not limited
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),
Note
Count: two times, Exposure limit: Not limited
VP15-00-2
Wave soldering
Solder bath temperature: 260°C Max., Time: 10 sec. Max., Count: once,
Note
Exposure limit: not limited
WS60-00-1
Partial heating
Pin temperature: 300°C Max., Time: 3 sec. Max., Exposure limit: not limited
Note

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Cautions Do not use different soldering methods together (except for partial heating).
REFERENCE
Quality Grades on NEC semiconductor Devices
C11531E
Semiconductor Device Mounting Technology Manual
C10535E
NEC Semiconductor Device Reliability/Quality Control System
C10983E
Semiconductor Selection Guide
X10679X
Data Sheet S13894EJ1V0DS
15
µPD16874
[MEMO]
16
Data Sheet S13894EJ1V0DS
µPD16874
[MEMO]
Data Sheet S13894EJ1V0DS
17
µPD16874
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
18
Data Sheet S13894EJ1V0DS
µPD16874
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
NEC Electronics (Germany) GmbH
NEC Electronics Hong Kong Ltd.
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
NEC Electronics Singapore Pte. Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
Madrid Office
Madrid, Spain
Tel: 91-504-2787
Fax: 91-504-2860
United Square, Singapore
Tel: 65-253-8311
Fax: 65-250-3583
NEC Electronics Italiana s.r.l.
NEC Electronics (Germany) GmbH
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
NEC Electronics (France) S.A.
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-2719-2377
Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division
Guarulhos-SP Brasil
Tel: 55-11-6462-6810
Fax: 55-11-6462-6829
J00.7
Data Sheet S13894EJ1V0DS
19
µPD16874
• The information in this document is current as of December, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4