SURFACE MOUNT FUSES THIN-FILM SURFACE MOUNT 1206 SMF Very Fast-Acting Thin-Film Type 429 Series ® • The 1206 SMF is an extremely small, low profile design (1206 chip size) utilizing thin-film technology to achieve precise control of electrical characteristics. • New one-piece element/termination design assures extra reliability by eliminating the need for soldering, welding or other joining operations in the manufacture of the fuse. • Semi-rigid substrate eliminates the potential for thermal shock fractures and decreases the risk of mechanical damage during pick and place operations. ELECTRICAL CHARACTERISTICS: AGENCY APPROVALS: Recognized under the Components Program of Underwriters Laboratories and Certified by CSA. AGENCY FILE NUMBERS: UL E10480, CSA LR 29862. INTERRUPTING RATINGS: 0.125 – 3A 50 amperes at rated voltage, VAC/VDC 4 – 7A 35 amperes at rated voltage, VAC/VDC ENVIRONMENTAL SPECIFICATIONS: Operating Temperature: – 55°C to 125°C. Vibration: Withstands 10– 55 Hz per MIL-STD-202F, Method 201A and 10-2000 Hz at 20 G’s per MIL-STD-202F, Method 204D, Condition D. Insulation Resistance (After Opening): Greater than 10 KOhm. Resistance to Soldering Heat: Withstands 60 seconds above 200°C up to 260°C, maximum. Thermal Shock: Withstands 5 cycles of – 55° to 125°C. PHYSICAL SPECIFICATIONS: Materials: Body: Epoxy Substrate Terminations: Copper/Nickel/Tin-Lead (95/5) Cover Coat: Conformal Coating Soldering Parameters: Wave Solder — 260°C, 10 seconds maximum Reflow Solder — 260°C, 30 seconds maximum PACKAGING SPECIFICATIONS: 8mm Tape and Reel per EIA-RS481-2 (IEC 286, part 3); 3,000 per reel, add packaging suffix, WR. PATENTED ORDERING INFORMATION: Nominal Nominal Nominal Catalog Ampere Marking Voltage Resistance Voltage Drop Melting I 2t Number Rating Code Rating Cold Ohms1 (V) 2 (A2 Sec.)3 429.125 1/8 FB 125 2.30000 0.200 0.00020 429.200 2/10 FC 125 0.93800 0.175 0.00055 429.250 1/4 FD 125 0.62500 0.160 0.00100 429.375 3/8 FE 125 0.37500 0.138 0.00280 429.500 1/2 FF 63 0.24050 0.130 0.0060 429.750 3/4 FG 63 0.13700 0.120 0.0170 429 001 1 FH 63 0.09950 0.115 0.035 FJ 63 0.07475 0.108 0.065 429 1.25 11/4 1 FK 63 0.06250 0.101 0.125 429 01.5 1 /2 FL 63 0.05000 0.096 0.150 429 1.75 13/4 429 002 2 FN 63 0.03975 0.093 0.230 1 FO 32 0.03065 0.087 0.50 429 02.5 2 /2 429 003 3 FP 32 0.02625 0.080 0.70 429 004 4 FS 24 0.01926 0.070 1.5 429 005 5 FT 24 0.01375 0.065 2.7 429 007 7 FU 24 0.00925 0.060 3.6 1 Measured at 10% of rated current, 25°C. 2 Measured at 100% of rated current, 25°C. 3 Measured at rated voltage. 30 RECOMMENDED PAD LAYOUTS ±.005 .125" 0.150" 0.060" ±.005 0.060" 0.045" 0.080" REFLOW SOLDER ±.010 .098" ±.010 .044" 0.065" .000 ± .006 0.045" 0.060" 0.190" .025" ±.010 .025" ±.010 0.080" WAVE SOLDER Average Time Current Curves .125A .2A .25A .375A .5A .75A 1A 1.5A 1.75A 2A 2.5A 3A 4A 5A Opening Time at 25°C 4 hours, Minimum 5 seconds, Maximum 0.2 seconds, Maximum 1 TIME IN SECONDS % of Ampere Rating 100% 200% 300% 0.1 0.01 0.001 0.1 1 10 CURRENT IN AMPERES 100 ®