ETC B3FS-1000

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Mechanical Key Switch (SMD)
B3FS
Surface-mounting Switches Ideal for
High-density Mounting
Tape packing style also available.
Allows reflow soldering.
Incorporates a snap-action contact mechanism
that ensures sharp switching operations.
Ordering Information
Model Number Legend
B3FS-jjjjj
1
2
3
4
1.
Appearance
1: 6 mm x 6 mm
2.
Ground Terminal
0: None
3.
5
Height
0: 3.1 mm
4.
Operating Force (OF)
0: 100 gf
2: 150 gf
5.
Shipment Package
---: Bag
P: Embossed tape
List of Models
Model
6 x 6 mm
B3FS-1000 Series
Note:
Plunger type
Flat type
Operating force (OF)
Bag (see note 1)
Embossed tape (see note 2)
Standard model
0.98 N {100 gf}
B3FS-1000
B3FS-1000P
High-force
1.47 N {150 gf}
B3FS-1002
B3FS-1002P
1. Orders must be made in units of 100 pieces.
2. Orders must be made in units of 3,000 pieces. For the packing style, refer to Key Switch Packing on page 4.
1
B3FS
B3FS
Specifications
Ratings/Characteristics
Switching capacity
50 mA, 24 VDC (resistive load)
Insulation voltage
30 VDC
Contact configuration
SPST-NO
Contact material
Silver plating
Contact resistance
100 mΩ max. (initial value) (rated: 1 mA, 5 VDC)
Insulation resistance
100 MΩ min. (at 100 VDC)
Dielectric strength
250 VAC, 50/60 Hz for 1 min
Bounce time
5 ms max.
Vibration resistance
Malfunction: 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance
Destruction: 1,000 m/s2 min. {approx. 100G min.}
Malfunction: 100 m/s2 min. {approx. 10G min.}
Life expectancy
Standard models: 1,000,000 operations min.
High-force models: 300,000 operations min.
Ambient temperature
Operating: –40°C to 85°C (with no icing)
Ambient humidity
Operating: 35% to 85%
Weight
Approx. 0.2 g
Engineering Data
Operating Force vs. Stroke Characteristics
Operating force (gf)
High-force model
Standard model
Stroke S (mm)
2
B3FS
B3FS
Dimensions
Note:
All units are in millimeters unless otherwise indicated. Unless otherwise specified, a tolerance of ±0.4 mm applies to all dimensions.
B3FS-1000
B3FS-1002
B3FS-1000P
B3FS-1002P
3 dia. (3)
(4)
6.3 4.5±0.2
(1)
(2)
3.1 2.6
8
0.7
0.7
Terminal Arrangement/
Internal Connection
(Top View)
PCB Pad
(Top View)
(One-side PCB t= 1.6)
3.1
(4)
(3)
(2)
(1)
5.9
6.4
9.6
Operating Characteristics
B3FS-1000 Series
Item
e
Standard model
High-force
model
Operating force (OF)
0.98±0.29 N
{100±30 gf}
1.47±0.49 N
{150±50 gf}
Releasing force (RF)
0.2 N min.
{20 gf}
0.49 N min.
{50 gf}
Pretravel (PT)
+0.2
0.25 –0.1 mm
Precautions
Operation
Do not repeatedly operate the Switch with high force, apply additional force to the plunger once it has stopped moving, or operate
the Switch with excessive force, otherwise the disc spring of the
Switch may deform and the Switch may malfunction.
Be sure to set the Switch so that the plunger will be pressed straight.
A decrease in the life of the Switch may result if the plunger is
pressed off-center or from an acute angle.
The Switch is not of enclosed construction. Be sure to protect the
Switch with an appropriate sheet when using the Switch in locations
with excessive dust.
Key Top
Protection sheet
Switch
3
B3FS
B3FS
Soldering
Key Switch Packing
Do not apply flow soldering, otherwise fragments of solder and flux
may have a bad influence on the operation of the pushbutton.
Apply reflow soldering according to the optimum heating curve
shown below. Reflow soldering equipment may have a high peak
value. Be sure to conduct a test before use.
Soldering may be repeated only once at a minimum interval of five
minutes if the Switch is not soldered properly.
No flux can be wiped or cleaned after soldering the Switch because
the cleaning solvent will penetrate into the interior of the Switch together with the flux and dust on the PCB. As a result, the Switch may
malfunction.
Key Switches are packed on tape as shown below.
Label
(18)
Tape drawing direction
13 dia.
3802 dia.
Reel
Temperature (_C)
1.5 +0.1
dia.
0
Preheating
Tape drawing direction
Room temperature
Standard
Conform to EIAJ standards
Package
3,000 Switches
Heat resistance
50°C for 24 hours (not be deformed)
Time (s)
Note:
The above curve is given on condition that the thickness of
the PCB is 1.6 mm.
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Cat. No. A113-E1-1
In the interest of product improvement, specifications are subject to change without notice.
OMRON Corporation
C&C Components Division H.Q.
Mechanical-Components Division
28th Fl., Crystal Tower Bldg.,
1-2-27, Shiromi, Chuo-ku,
Osaka 540-6028 Japan
Phone: (81)6-949-6017 Fax: (81)6-949-6134
4
Printed in Japan
1098-1M (1098) a