ETC DSP56009DS

MOTOROLA Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
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DSP56009/D, Rev. 1
DSP56009
Freescale Semiconductor, Inc...
SYMPHONY AUDIO DSP FAMILY
24-BIT DIGITAL SIGNAL PROCESSORS
Motorola designed the Symphony™ family of high-performance, programmable Digital Signal
Processors (DSPs) to support a variety of digital audio applications, including Dolby ProLogic,
Dolby AC-3 Surround, MPEG1 Layer 2, and Digital Theater Sound (DTS) processing. Software
for these applications is licensed by Motorola for integration into products like audio/video
receivers, televisions, DVD applications, and automotive sound systems with such userdeveloped features as digital equalization and sound field processing. The DSP56009 is an MPUstyle general purpose DSP, composed of an efficient 24-bit Digital Signal Processor core,
program and data memories, various peripherals optimized for audio, and support circuitry. As
illustrated in Figure 1, the DSP56000 core family compatible DSP is fed by program memory,
two independent data RAMs and two data ROMs, a Serial Audio Interface (SAI), Serial Host
Interface (SHI), External Memory Interface (EMI), dedicated I/O lines, on-chip Phase Lock Loop
(PLL), and On-Chip Emulation (OnCE) port. The DSP56009 has more on-chip memory than
the DSP56004 or DSP56007.
ˇ
4
General
Purpose
Input/
Output
9
5
Serial
Audio
Interface
(SAI)
Serial
Host
Interface
(SHI)
DSP56000
Core
Y Data
Memory*
PDB
XDB
YDB
OnCETM Port
Interrupt
Control
Clock
Gen.
3
X Data
Memory*
Program
Memory*
GDB
Internal
Data
Bus
Switch
PLL
External
Memory
Interface
(EMI)
PAB
XAB
YAB
Address
Generation
Unit
24-Bit
16-Bit Bus
24-Bit Bus
29
4
Program
Program
Address
Decode
Generator
Controller
Program Control Unit
4
Data ALU
24 × 24 + 56 → 56-Bit MAC
Two 56-Bit Accumulators
* Refer to Table 1 for memory configurations.
IRQA, IRQB, NMI, RESET
Figure 1 DSP56009 Block Diagram
©1996, 1997 MOTOROLA, INC.
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TABLE OF CONTENTS
SECTION 1
SIGNAL/CONNECTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . 1-1
SECTION 2
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
SECTION 3
PACKAGING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
SECTION 4
DESIGN CONSIDERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
SECTION 5
ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
FOR TECHNICAL ASSISTANCE:
Telephone:
1-800-521-6274
Email:
[email protected]
Internet:
http://www.motorola-dsp.com
Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
Used to indicate a signal that is active when pulled low (For example, the RESET pin is
active when low.)
“asserted”
Means that a high true (active high) signal is high or that a low true (active low) signal
is low
“deasserted”
Means that a high true (active high) signal is low or that a low true (active low) signal
is high
Examples:
Note:
ii
Signal/Symbol
Logic State
Signal State
Voltage
PIN
True
Asserted
VIL/VOL
PIN
False
Deasserted
VIH/VOH
PIN
True
Asserted
VIH/VOH
PIN
False
Deasserted
VIL/VOL
Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
DSP56009/D, Rev. 1
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DSP56009
Features
FEATURES
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Digital Signal Processing Core
•
Efficient, object code compatible with the 24-bit DSP56000 core family engine
•
81 MHz device can use a 27 MHz clock, eliminating the need for an externally
generated clock signal, for instance in a DVD application
•
Up to 44 Million Instructions Per Second (MIPS)—22.7 ns instruction cycle at
88 MHz
•
Highly parallel instruction set with unique DSP addressing modes
•
Two 56-bit accumulators including extension byte
•
Parallel 24 × 24-bit multiply-accumulate in 1 instruction cycle (2 clock cycles)
•
Double precision 48 × 48-bit multiply with 96-bit result in 6 instruction cycles
•
56-bit addition/subtraction in 1 instruction cycle
•
Fractional and integer arithmetic with support for multiprecision arithmetic
•
Hardware support for block floating-point Fast Fourier Transforms (FFTs)
•
Hardware nested DO loops
•
Zero-overhead fast interrupts (2 instruction cycles)
•
Four 24-bit internal data buses and three 16-bit internal address buses for
simultaneous accesses to one program and two data memories
•
Fabricated in high-density CMOS
•
On-chip modified Harvard architecture, which permits simultaneous accesses
to program and two data memories
•
Bootstrap loading from Serial Host Interface or External Memory Interface
Memory
Table 1 Memory Configuration (Word width is 24 bits)
Mode
MOTOROLA
Program
X Data
Y Data
PEA
PEB
ROM
RAM
ROM
RAM
ROM
RAM
0
0
1
1
0
1
0
1
10.0 K
10.0 K
10.0 K
10.0 K
0.5 K
1.25 K
2.0 K
2.75 K
3.0 K
3.0 K
3.0 K
3.0 K
4.5 K
3.75 K
3.75 K
3.0 K
1.75 K
1.75 K
1.75 K
1.75 K
4.25 K
4.25 K
3.5 K
3.5 K
DSP56009/D, Rev. 1
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Bootstrap
ROM
64
iii
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DSP56009
Features
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Peripheral and Support Circuits
iv
•
Serial Audio Interface (SAI) includes two receivers and three transmitters,
master or slave capability, implementation of I2S, Sony, and Matsushita audio
protocols; and two sets of SAI interrupt vectors
•
Serial Host Interface (SHI) features single master capability, 10-word receive
FIFO, and support for 8-, 16-, and 24-bit words
•
External Memory Interface (EMI), implemented as a peripheral supporting:
–
Page-mode DRAMs (one or two chips): 64 K × 4, 256 K × 4,
and 4 M × 4 bits
–
SRAMs (one to four): 256 K × 8 bits
–
Data bus may be 4 or 8 bits wide
–
Data words may be 8, 12, 16, 20, or 24 bits wide
•
Four dedicated, independent, programmable General Purpose I/O (GPIO)
lines
•
On-chip peripheral registers memory mapped in data memory space
•
Three external interrupt request pins
•
On-Chip Emulation (OnCE) port for unobtrusive, processor speedindependent debugging
•
Software-programmable, Phase Lock Loop-based (PLL) frequency synthesizer
for the core clock
•
Power-saving Wait and Stop modes
•
Fully static, HCMOS design for operating frequencies down to DC
•
80-pin plastic Quad Flat Pack surface-mount package; 14 × 14 × 2.20 mm
(2.15–2.45 mm range); 0.65 mm lead pitch
•
Complete pinout compatibility between DSP56009, DSP56004,
DSP56004ROM, and DSP56007 for easy upgrades
•
5 V power supply
DSP56009/D, Rev. 1
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DSP56009
Product Documentation
PRODUCT DOCUMENTATION
Table 2 lists the documents that provide a complete description of the DSP56009 and
are required to design properly with the part. Documentation is available from a local
Motorola distributor, a Motorola semiconductor sales office, a Motorola Literature
Distribution Center, or through the Motorola DSP home page on the Internet (the
source for the latest information).
Table 2 DSP56009 Documentation
Freescale Semiconductor, Inc...
Document Name
Description of Content
Order Number
DSP56000 Family
Manual
DSP56000 core family architecture and the 24-bit
core processor and instruction set
DSP56KFAMUM/AD
DSP56009 User’s
Manual
Memory, peripherals, and interfaces
DSP56009UM/AD
DSP56009 Technical
Data
Electrical and timing specifications,
and pin and package descriptions
DSP56009/D
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DSP56009
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Product Documentation
vi
DSP56009/D, Rev. 1
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SECTION
1
SIGNAL/CONNECTION DESCRIPTIONS
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SIGNAL GROUPINGS
The DSP56009 input and output signals are organized into the nine functional
groups, as shown in Table 1-1. The individual signals are illustrated in Figure 1-1.
Table 1-1 DSP56009 Functional Group Signal Allocations
Functional Group
Number of Signals
Detailed Description
Power (VCC)
9
Table 1-2
Ground (GND)
13
Table 1-3
Phase Lock Loop (PLL)
3
Table 1-4
External Memory Interface (EMI)
29
Table 1-5 and
Table 1-6
Interrupt and Mode Control
4
Table 1-7
Serial Host Interface (SHI)
5
Table 1-8
Serial Audio Interface (SAI)
9
Table 1-9 and
Table 1-10
General Purpose Input/Output (GPIO)
4
Table 1-11
On-Chip Emulation (OnCE) port
4
Table 1-12
Total
MOTOROLA
80
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Signal/Connection Descriptions
Signal Groupings
Power Inputs
VCCP
3
VCCQ
2
VCCA
VCCD
2
VCCS
Ground
GNDP
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GNDQ
GNDA
GNDD
GNDS
DSP56009
SCK/SCL
MISO/SDA
Port B
Serial Host
Interface
MOSI/HA0
SS/HA2
HREQ
3
4
2
3
Port C
Serial Audio
Interface
Rec0
Rec1
PCAP
PINIT
SDI0
SDI1
SCKR
WSR
PLL
EXTAL
MA0–MA14
MD0–MD7
15
Tran0
SDO0
Tran1
SDO1
Tran2
SDO2
8
SCKT
WST
MA15/MCS3
MA16/MCS2/MCAS
MA17/MCS1/MRAS
MCS0
Port A
External Memory
Interface
GPIO
MWR
4
GPIO0–GPIO3
MRD
DSI/OS0
MODA/IRQA
MODB/IRQB
MODC/NMI
RESET
Mode/Interrupt
Control
DSCK/OS1
OnCE™
Port
Reset
DSO
DR
80 signals
AA0249G
Figure 1-1 DSP56009 SIgnals
1-2
DSP56009/D, Rev. 1
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Signal/Connection Descriptions
Power
POWER
Table 1-2 Power Inputs
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Power Name
Description
VCCP
PLL Power—VCCP provides isolated power for the Phase Lock Loop (PLL). The
voltage should be well-regulated and the input should be provided with an
extremely low impedance path to the VCC power rail.
VCCQ
Quiet Power—VCCQ provides isolated power for the internal processing logic. This
input must be tied externally to all other chip power inputs. The user must provide
adequate external decoupling capacitors.
VCCA
Address Bus Power—VCCA provides isolated power for sections of the address bus
I/O drivers. This input must be tied externally to all other chip power inputs. The
user must provide adequate external decoupling capacitors.
VCCD
Data Bus Power—VCCD provides isolated power for sections of the data bus I/O
drivers. This input must be tied externally to all other chip power inputs. The user
must provide adequate external decoupling capacitors.
VCCS
Serial Interface Power—VCCS provides isolated power for the SHI and SAI. This
input must be tied externally to all other chip power inputs. The user must provide
adequate external decoupling capacitors.
GROUND
Table 1-3 Grounds
Ground Name
Description
GNDP
PLL Ground—GNDP is ground dedicated for PLL use. The connection should be
provided with an extremely low-impedance path to ground. VCCP should be
bypassed to GNDP by a 0.47 µF capacitor located as close as possible to the chip
package.
GNDQ
Quiet Ground—GNDQ provides isolated ground for the internal processing logic.
This connection must be tied externally to all other chip ground connections. The
user must provide adequate external decoupling capacitors.
GNDA
Address Bus Ground—GNDA provides isolated ground for sections of the address
bus I/O drivers. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
GNDD
Data Bus Ground—GNDD provides isolated ground for sections of the data bus I/O
drivers. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
GNDS
Serial Interface Ground—GNDS provides isolated ground for the SHI and SAI. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
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Signal/Connection Descriptions
Clock and PLL signals
CLOCK AND PLL SIGNALS
Note: While the PLL on this DSP is identical to the PLL described in the DSP56000
Family Manual, two of the signals have not been implemented externally.
Specifically, there is no PLOCK signal or CKOUT signal available. Therefore,
the internal clock is not directly accessible and there is no external indication
that the PLL is locked. These signals were omitted to reduce the number of
pins and allow this DSP to be put in a smaller, less expensive package.
Freescale Semiconductor, Inc...
Table 1-4 Clock and PLL Signals
Signal
Type
State
during
Reset
EXTAL
Input
Input
External Clock/Crystal—This input should be connected to an
external clock source. If the PLL is enabled, this signal is
internally connected to the on-chip PLL. The PLL can multiply
the frequency on the EXTAL pin to generate the internal DSP
clock. The PLL output is divided by two to produce a four-phase
instruction cycle clock, with the minimum instruction time being
two PLL output clock periods. If the PLL is disabled, EXTAL is
divided by two to produce the four-phase instruction cycle clock.
PCAP
Input
Input
PLL Filter Capacitor—This input is used to connect a highquality (high “Q” factor) external capacitor needed for the PLL
filter. The capacitor should be as close as possible to the DSP with
heavy, short traces connecting one terminal of the capacitor to
PCAP and the other terminal to VCCP. The required capacitor
value is specified in Table 2-6 on page 2-6.
Signal
Name
Signal Description
Note:
When short lock time is critical, low dielectric absorption
capacitors such as polystyrene, polypropylene, or teflon are
recommended.
If the PLL is not used (i.e., it remains disabled at all times), there is
no need to connect a capacitor to the PCAP pin. It may remain
unconnected, or be tied to either Vcc or GND.
PINIT
1-4
Input
Input
PLL Initialization (PINIT)—During the assertion of hardware
reset, the value on the PINIT line is written into the PEN bit of the
PCTL register. When set, the PEN bit enables the PLL by causing
it to derive the internal clocks from the PLL voltage controlled
oscillator output. When the bit is cleared, the PLL is disabled and
the DSP’s internal clocks are derived from the clock connected to
the EXTAL signal. After hardware RESET is deasserted, the
PINIT signal is ignored.
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Signal/Connection Descriptions
External Memory Interface (EMI)
EXTERNAL MEMORY INTERFACE (EMI)
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Table 1-5 External Memory Interface (EMI) Signals
Signal Name
Signal
Type
State during
Reset
MA0–MA14
Output
Table 1-6
Memory Address Lines 0–14—The MA0–MA10 lines provide
the multiplexed row/column addresses for DRAM accesses.
Lines MA0–MA14 provide the non-multiplexed address lines
0–14 for SRAM accesses.
MA15
Output
Table 1-6
Memory Address Line 15 (MA15)—This line functions as the
non-multiplexed address line 15.
Memory Chip Select 3 (MCS3)—For SRAM accesses, this line
functions as memory chip select 3.
MCS3
MA16
Signal Description
Output
Table 1-6
Memory Address Line 16 (MA16)—This line functions as the
non-multiplexed address line 16 or as memory chip select 2 for
SRAM accesses.
MCS2
Memory Chip Select 2 (MCS2)—For SRAM access, this line
functions as memory chip select 2.
MCAS
Memory Column Address Strobe (MCAS)—This line
functions as the Memory Column Address Strobe (MCAS)
during DRAM accesses.
MA17
Output
Table 1-6
Memory Address Line 17 (MA17)—This line functions as the
non-multiplexed address line 17.
MCS1
Memory Chip Select 1 (MCS1)—This line functions as chip
select 1 for SRAM accesses.
MRAS
Memory Row Address Strobe (MRAS)—This line also
functions as the Memory Row Address Strobe during DRAM
accesses.
MCS0
Output
Table 1-6
Memory Chip Select 0—This line functions as memory chip
select 0 for SRAM accesses.
MWR
Output
Table 1-6
Memory Write Strobe—This line is asserted when writing to
external memory.
MRD
Output
Table 1-6
Memory Read Strobe—This line is asserted when reading
external memory.
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Signal/Connection Descriptions
External Memory Interface (EMI)
Table 1-5 External Memory Interface (EMI) Signals (Continued)
Signal Name
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MD0–MD7
Signal
Type
State during
Reset
Bidirectional
Tri-stated
Signal Description
Data Bus—These signals provide the bidirectional data bus for
EMI accesses. They are inputs during reads from external
memory, outputs during writes to external memory, and tristated if no external access is taking place. If the data bus width
is defined as four bits wide, only signals MD0–MD3 are active,
while signals MD4–MD7 remain tri-stated. While tri-stated,
MD0–MD7 are disconnected from the pins and do not require
external pull-ups.
.
Table 1-6 EMI States during Reset and Stop States
Operating Mode
Signal
Hardware Reset
Software Reset Individual Reset
Stop Mode
MA0–MA14
Driven High
Previous State
Previous State
Previous State
MA15
Driven High
Driven High
Previous State
Previous State
MCS3
Driven High
Driven High
Driven High
Driven High
MA16
Driven High
Driven High
Previous State
Previous State
MCS2
Driven High
Driven High
Driven High
Driven High
MCAS:
DRAM refresh disabled
DRAM refresh enabled
Driven High
Driven High
Driven High
Driven High
Driven High
Driven Low
Driven High
Driven High
MA17
Driven High
Driven High
Previous State
Previous State
MCS1
Driven High
Driven High
Driven High
Driven High
DRAM refresh enabled
Driven High
Driven High
Driven High
Driven High
Driven High
Driven Low
Driven High
Driven High
MCS0
Driven High
Driven High
Driven High
Driven High
MWR
Driven High
Driven High
Driven High
Driven High
MRD
Driven High
Driven High
Driven High
Driven High
MRAS:
DRAM refresh disabled
1-6
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Signal/Connection Descriptions
Interrupt and Mode Control
INTERRUPT AND MODE CONTROL
The interrupt and mode control signals select the DSP’s operating mode as it comes
out of hardware reset and receives interrupt requests from external sources after
reset.
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Table 1-7 Interrupt and Mode Control Signals
Signal Name
Signal
Type
MODA
Input
State during
Reset
Signal Description
Input (MODA) Mode Select A—This input signal has three functions:
•
•
•
to work with the MODB and MODC signals to select
the DSP’s initial operating mode,
to allow an external device to request a DSP
interrupt after internal synchronization, and
to turn on the internal clock generator when the DSP
is in the Stop processing state, causing the DSP to
resume processing.
MODA is read and internally latched in the DSP when the
processor exits the Reset state. The logic state present on the
MODA, MODB, and MODC pins selects the initial DSP
operating mode. Several clock cycles after leaving the Reset
state, the MODA signal changes to the external interrupt
request IRQA. The DSP operating mode can be changed by
software after reset.
IRQA
External Interrupt Request A (IRQA)—The IRQA input is a
synchronized external interrupt request. It may be
programmed to be level-sensitive or negative-edgetriggered. When the signal is edge-triggered, triggering
occurs at a voltage level and is not directly related to the fall
time of the interrupt signal. However, as the fall time of the
interrupt signal increases, the probability that noise on IRQA
will generate multiple interrupts also increases.
While the DSP is in the Stop mode, asserting IRQA gates on
the oscillator and, after a clock stabilization delay, enables
clocks to the processor and peripherals. Hardware reset
causes this input to function as MODA.
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Signal/Connection Descriptions
Interrupt and Mode Control
Table 1-7 Interrupt and Mode Control Signals (Continued)
Signal Name
Signal
Type
MODB
Input
State during
Reset
Signal Description
Input (MODB) Mode Select B—This input signal has two functions:
•
Freescale Semiconductor, Inc...
•
to work with the MODA and MODC signals to select
the DSP’s initial operating mode, and
to allow an external device to request a DSP
interrupt after internal synchronization.
MODB is read and internally latched in the DSP when the
processor exits the Reset state. The logic state present on the
MODA, MODB, and MODC pins selects the initial DSP
operating mode. Several clock cycles after leaving the Reset
state, the MODB signal changes to the external interrupt
request IRQB. The DSP operating mode can be changed by
software after reset.
IRQB
1-8
External Interrupt Request B (IRQB)—The IRQB input is a
synchronized external interrupt request. It may be
programmed to be level-sensitive or negative-edgetriggered. When the signal is edge-triggered, triggering
occurs at a voltage level and is not directly related to the fall
time of the interrupt signal. However, as the fall time of the
interrupt signal increases, the probability that noise on IRQB
will generate multiple interrupts also increases. Hardware
reset causes this input to function as MODB.
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Signal/Connection Descriptions
Interrupt and Mode Control
Table 1-7 Interrupt and Mode Control Signals (Continued)
Signal Name
MODC
Signal
Type
Input,
edgetriggered
State during
Reset
Signal Description
Input (MODC) Mode Select C—This input signal has two functions:
•
Freescale Semiconductor, Inc...
•
to work with the MODA and MODB signals to select
the DSP’s initial operating mode, and
to allow an external device to request a DSP
interrupt after internal synchronization.
MODC is read and internally latched in the DSP when the
processor exits the Reset state. The logic state present on the
MODA, MODB, and MODC pins selects the initial DSP
operating mode. Several clock cycles after leaving the Reset
state, the MODC signal changes to the Non-Maskable
Interrupt request, NMI. The DSP operating mode can be
changed by software after reset.
Non-Maskable Interrupt Request—The NMI input is a
negative-edge-triggered external interrupt request. This is a
level 3 interrupt that can not be masked out. Triggering
occurs at a voltage level and is not directly related to the fall
time of the interrupt signal. However, as the fall time of the
interrupt signal increases, the probability that noise on NMI
will generate multiple interrupts also increases. Hardware
reset causes this input to function as MODC.
NMI
RESET
input
active
RESET—This input causes a direct hardware reset of the
processor. When RESET is asserted, the DSP is initialized and
placed in the Reset state. A Schmitt-trigger input is used for
noise immunity. When the reset signal is deasserted, the initial
DSP operating mode is latched from the MODA, MODB, and
MODC signals. The DSP also samples the PINIT signal and
writes its status into the PEN bit of the PLL Control Register.
When the DSP comes out of the Reset state, deassertion
occurs at a voltage level and is not directly related to the rise
time of the RESET signal. However, the probability that
noise on RESET will generate multiple resets increases with
increasing rise time of the RESET signal.
For proper hardware reset to occur, the clock must be active,
since a number of clock ticks are required for proper
propagation of the hardware Reset state.
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Signal/Connection Descriptions
Serial Host Interface (SHI)
SERIAL HOST INTERFACE (SHI)
The Serial Host Interface (SHI) has five I/O signals, which may be configured to
operate in either SPI or I2C mode. Table 1-8 lists the SHI signals.
Table 1-8 Serial Host Interface (SHI) signals
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Signal Name
Signal
Type
SCK
Input or
Output
SCL
Input or
Output
1-10
State
during
Reset
Tri-stated
Signal Description
SPI Serial Clock (SCK)—The SCK signal is an output
when the SPI is configured as a master, and a Schmitttrigger input when the SPI is configured as a slave. When
the SPI is configured as a master, the SCK signal is
derived from the internal SHI clock generator. When the
SPI is configured as a slave, the SCK signal is an input,
and the clock signal from the external master
synchronizes the data transfer. The SCK signal is ignored
by the SPI if it is defined as a slave and the Slave Select
(SS) signal is not asserted. In both the master and slave
SPI devices, data is shifted on one edge of the SCK signal
and is sampled on the opposite edge where data is stable.
Edge polarity is determined by the SPI transfer protocol.
I2C Serial Clock (SCL)—SCL carries the clock for bus
transactions in the I2C mode. SCL is a Schmitt-trigger
input when configured as a slave, and an open-drain
output when configured as a master. SCL should be
connected to VCC through a pull-up resistor. The
maximum allowed internally generated bit clock
frequency is Fosc/4 for the SPI mode and Fosc/6 for the
I2C mode where Fosc is the clock on EXTAL. The
maximum allowed externally generated bit clock
frequency is Fosc/3 for the SPI mode and Fosc/5 for the
I2C mode. This signal is tri-stated during hardware reset,
software reset, or individual reset (no need for external
pull-up in this state).
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Signal/Connection Descriptions
Serial Host Interface (SHI)
Table 1-8 Serial Host Interface (SHI) signals (Continued)
Freescale Semiconductor, Inc...
Signal Name
Signal
Type
MISO
Input or
Output
SDA
Input or
Output
State
during
Reset
Tri-stated
Signal Description
SPI Master-In-Slave-Out (MISO)—When the SPI is
configured as a master, MISO is the master data input
line. The MISO signal is used in conjunction with the
MOSI signal for transmitting and receiving serial data.
This signal is a Schmitt-trigger input when configured
for the SPI Master mode, an output when configured for
the SPI Slave mode, and tri-stated if configured for the
SPI Slave mode when SS is deasserted.
I2C Serial Data and Acknowledge (SDA)—In I2C mode,
SDA is a Schmitt-trigger input when receiving and an
open-drain output when transmitting. SDA should be
connected to VCC through a pull-up resistor. SDA carries
the data for I2C transactions. The data in SDA must be
stable during the high period of SCL. The data in SDA is
only allowed to change when SCL is low. When the bus
is free, SDA is high. The SDA line is only allowed to
change during the time SCL is high in the case of Start
and Stop events. A high-to-low transition of the SDA line
while SCL is high is an unique situation, and is defined
as the Start event. A low-to-high transition of SDA while
SCL is high is an unique situation, and is defined as the
Stop event.
Note:
MOSI
Input or
Output
HA0
Input
Tri-stated
SPI Master-Out-Slave-In (MOSI)—When the SPI is
configured as a master, MOSI is the master data output
line. The MOSI signal is used in conjunction with the
MISO signal for transmitting and receiving serial data.
MOSI is the slave data input line when the SPI is
configured as a slave. This signal is a Schmitt-trigger
input when configured for the SPI Slave mode.
I2C Slave Address 0 (HA0)—This signal uses a Schmitttrigger input when configured for the I2C mode. When
configured for I2C Slave mode, the HA0 signal is used to
form the slave device address. HA0 is ignored when the
SHI is configured for the I2C Master mode.
Note:
MOTOROLA
This line is tri-stated during hardware reset, software
reset, or individual reset (no need for external pull-up
in this state).
This signal is tri-stated during hardware reset,
software reset, or individual reset (no need for
external pull-up in this state).
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Signal/Connection Descriptions
Serial Host Interface (SHI)
Table 1-8 Serial Host Interface (SHI) signals (Continued)
Signal
Type
State
during
Reset
SS
Input
Tri-stated
HA2
Input
Freescale Semiconductor, Inc...
Signal Name
Signal Description
SPI Slave Select (SS)—This signal is an active low
Schmitt-trigger input when configured for the SPI
mode. When configured for the SPI Slave mode, this
signal is used to enable the SPI slave for transfer.
When configured for the SPI Master mode, this
signal should be kept deasserted. If it is asserted
while configured as SPI master, a bus error
condition will be flagged.
I2C Slave Address 2 (HA2)—This signal uses a
Schmitt-trigger input when configured for the I2C
mode. When configured for the I2C Slave mode, the
HA2 signal is used to form the slave device address.
HA2 is ignored in the I2C Master mode. If SS is
deasserted, the SHI ignores SCK clocks and keeps
the MISO output signal in the high-impedance
state.
Note:
HREQ
Input or
Output
Tri-stated
Host Request—This signal is an active low Schmitttrigger input when configured for the Master mode, but
an active low output when configured for the Slave
mode. When configured for the Slave mode, HREQ is
asserted to indicate that the SHI is ready for the next data
word transfer and deasserted at the first clock pulse of
the new data word transfer. When configured for the
Master mode, HREQ is an input and when asserted by
the external slave device, it will trigger the start of the
data word transfer by the master. After finishing the data
word transfer, the master will await the next assertion of
HREQ to proceed to the next transfer.
Note:
1-12
This signal is tri-stated during hardware reset,
software reset, or individual reset (no need for
external pull-up in this state).
This signal is tri-stated during hardware, software,
individual reset, or when the HREQ[1:0] bits (in the
HCSR) are cleared (no need for external pull-up in this
state).
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Signal/Connection Descriptions
Serial Audio Interface (SAI)
SERIAL AUDIO INTERFACE (SAI)
The SAI is composed of separate receiver and transmitter sections.
SAI Receiver Section
Freescale Semiconductor, Inc...
Table 1-9 Serial Audio Interface (SAI) Receiver signals
Signal
Name
SDI0
Signal
Type
State during
Reset
Input
Tri-stated
Signal Description
Serial Data Input 0—While in the high impedance
state, the internal input buffer is disconnected from
the pin and no external pull-up is necessary. SDI0 is
the serial data input for receiver 0.
Note:
SDI1
Input
Tri-stated
Serial Data Input 1—While in the high impedance
state, the internal input buffer is disconnected from
the pin and no external pull-up is necessary. SDI1 is
the serial data input for receiver 1.
Note:
SCKR
Input or
Output
Tri-stated
This signal is high impedance during hardware or
software reset, while receiver 1 is disabled
(R1EN = 0), or while the DSP is in the Stop state.
Receive Serial Clock—SCKR is an output if the
receiver section is programmed as a master, and a
Schmitt-trigger input if programmed as a slave. While
in the high impedance state, the internal input buffer
is disconnected from the pin and no external pull-up is
necessary.
Note:
MOTOROLA
This signal is high impedance during hardware or
software reset, while receiver 0 is disabled
(R0EN = 0), or while the DSP is in the Stop state.
SCKR is high impedance if all receivers are
disabled (individual reset) and during hardware or
software reset, or while the DSP is in the Stop state.
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Signal/Connection Descriptions
Serial Audio Interface (SAI)
Table 1-9 Serial Audio Interface (SAI) Receiver signals (Continued)
Signal
Name
WSR
Signal
Type
State during
Reset
Input or
Output
Tri-stated
Signal Description
Word Select Receive (WSR)—WSR is an output if the
receiver section is configured as a master, and a
Schmitt-trigger input if configured as a slave. WSR is
used to synchronize the data word and to select the
left/right portion of the data sample.
Freescale Semiconductor, Inc...
Note:
1-14
WSR is high impedance if all receivers are disabled
(individual reset), during hardware reset, during
software reset, or while the DSP is in the Stop state.
While in the high impedance state, the internal
input buffer is disconnected from the signal and no
external pull-up is necessary.
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Signal/Connection Descriptions
Serial Audio Interface (SAI)
SAI Transmitter Section
Table 1-10 Serial Audio Interface (SAI) Transmitter signals
Freescale Semiconductor, Inc...
Signal
Name
Signal
Type
State
during
Reset
Signal Description
SDO0
Output
Driven
High
Serial Data Output 0 (SDO0)—SDO0 is the serial output for
transmitter 0. SDO0 is driven high if transmitter 0 is disabled,
during individual reset, hardware reset, and software reset,
or when the DSP is in the Stop state.
SDO1
Output
Driven
High
Serial Data Output 1 (SDO1)—SDO1 is the serial output for
transmitter 1. SDO1 is driven high if transmitter 1 is disabled,
during individual reset, hardware reset and software reset, or
when the DSP is in the Stop state.
SDO2
Output
Driven
High
Serial Data Output 2 (SDO2)—SDO2 is the serial output for
transmitter 2. SDO2 is driven high if transmitter 2 is disabled,
during individual reset, hardware reset and software reset, or
when the DSP is in the Stop state.
SCKT
Input or
Output
Tri-stated
Serial Clock Transmit (SCKT)—This signal provides the
clock for the SAI. SCKT can be an output if the transmit
section is configured as a master, or a Schmitt-trigger input if
the transmit section is configured as a slave. When the SCKT
is an output, it provides an internally generated SAI transmit
clock to external circuitry. When the SCKT is an input, it
allows external circuitry to clock data out of the SAI.
Note:
WST
Input or
Output
Tri-stated
Word Select Transmit (WST)—WST is an output if the
transmit section is programmed as a master, and a Schmitttrigger input if it is programmed as a slave. WST is used to
synchronize the data word and select the left/right portion of
the data sample.
Note:
MOTOROLA
SCKT is high impedance if all transmitters are disabled
(individual reset), during hardware reset, software reset, or
while the DSP is in the Stop state. While in the high
impedance state, the internal input buffer is disconnected
from the pin and no external pull-up is necessary.
WST is high impedance if all transmitters are disabled
(individual reset), during hardware or software reset, or
while the DSP is in the Stop state. While in the high
impedance state, the internal input buffer is disconnected
from the pin and no external pull-up is necessary.
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Signal/Connection Descriptions
General Purpose I/O
GENERAL PURPOSE I/O
Table 1-11 General Purpose I/O (GPIO) Signals
Signal
Name
Freescale Semiconductor, Inc...
GPIO0–
GPIO3
Signal
Type
State during
Reset
Standard
Output,
Open-drain
Output, or
Input
Disconnected
Signal Description
GPIO lines can be used for control and handshake
functions between the DSP and external circuitry.
Each GPIO line can be configured individually as
disconnected, open-drain output, standard output,
or an input.
Note:
Hardware reset or software reset configures all
the GPIO lines as disconnected (external
circuitry connected to these pins may need pullups until the pins are configured for operation).
ON-CHIP EMULATION (OnCETM) PORT
There are four signals associated with the OnCE port controller and its serial
interface.
Table 1-12 On-Chip Emulation Port Signals
Signal
Name
Signal
Type
State during
Reset
DSI
Input
Output,
Driven Low
OS0
Output
Signal Description
Debug Serial Input (DSI)—The DSI signal is the signal
through which serial data or commands are provided to the
OnCE port controller. The data received on the DSI signal
will be recognized only when the DSP has entered the
Debug mode of operation. Data must have valid TTL logic
levels before the serial clock falling edge. Data is always
shifted into the OnCE port Most Significant Bit (MSB) first.
Operating Status 0 (OS0)—When the DSP is not in the Debug
mode, the OS0 signal provides information about the DSP
status if it is an output and used in conjunction with the OS1
signal. When switching from output to input, the signal is
tri-stated.
Note:
1-16
If the OnCE port is in use, an external pull-down resistor
should be attached to the DSI/OS0 signal. If the OnCE
port is not in use, the resistor is not required.
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Signal/Connection Descriptions
On-Chip Emulation (OnCETM) Port
Table 1-12 On-Chip Emulation Port Signals (Continued)
Signal
Name
Freescale Semiconductor, Inc...
DSCK
OS1
Signal
Type
State during
Reset
Input
Output,
Driven Low
Output
Signal Description
Debug Serial Clock (DSCK)—The DSCK/OS1 signal,
when an input, is the signal through which the serial clock
is supplied to the OnCE port. The serial clock provides
pulses required to shift data into and out of the OnCE port.
Data is clocked into the OnCE port on the falling edge and
is clocked out of the OnCE port on the rising edge.
Operating Status 1 (OS1)—If the OS1 signal is an output
and used in conjunction with the OS0 signal, it provides
information about the DSP status when the DSP is not in the
Debug mode. The debug serial clock frequency must be no
greater than 1/8 of the processor clock frequency. The
signal is tri-stated when it is changing from input to output.
Note:
DSO
Output
Driven High
If the OnCE port is in use, an external pull-down resistor
should be attached to the DSCK/OS1 pin. If the OnCE
port is not in use, the resistor is not required.
Debug Serial Output (DSO)—The DSO line provides the
data contained in one of the OnCE port controller registers
as specified by the last command received from the
command controller. The Most Significant Bit (MSB) of the
data word is always shifted out of the OnCE port first. Data
is clocked out of the OnCE port on the rising edge of DSCK.
The DSO line also provides acknowledge pulses to the
external command controller. When the DSP enters the
Debug mode, the DSO line will be pulsed low to indicate
that the OnCE port is waiting for commands. After
receiving a read command, the DSO line will be pulsed low
to indicate that the requested data is available and the
OnCE port is ready to receive clock pulses in order to
deliver the data. After receiving a write command, the DSO
line will be pulsed low to indicate that the OnCE port is
ready to receive the data to be written; after the data is
written, another acknowledge pulse will be provided.
Note:
MOTOROLA
During hardware reset and when idle, the DSO line is
held high.
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Signal/Connection Descriptions
On-Chip Emulation (OnCETM) Port
Table 1-12 On-Chip Emulation Port Signals (Continued)
Signal
Name
Freescale Semiconductor, Inc...
DR
Signal
Type
State during
Reset
Input
Input
Signal Description
Debug Request (DR)—The debug request input provides a
means of entering the Debug mode of operation. This signal,
when asserted (pulled low), will cause the DSP to finish the
current instruction being executed, to save the instruction
pipeline information, to enter the Debug mode, and to wait
for commands to be entered from the debug serial input line.
While the DSP is in the Debug mode, the user can reset the
OnCE port controller by asserting DR, waiting for an
acknowledge pulse on DSO, and then deasserting DR. It
may be necessary to reset the OnCE port controller in cases
where synchronization between the OnCE port controller
and external circuitry is lost. Asserting DR when the DSP is
in the Wait or the Stop mode, and keeping it asserted until
an acknowledge pulse in the DSP is produced, puts the DSP
into the Debug mode. After receiving the acknowledge
pulse, DR must be deasserted before sending the first OnCE
port command. For more information, see Methods Of
Entering The Debug Mode in the DSP56000 Family
Manual.
Note:
1-18
If the OnCE port is not in use, an external pull-up resistor
should be attached to the DR line.
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SECTION
2
SPECIFICATIONS
Freescale Semiconductor, Inc...
INTRODUCTION
The DSP56009 is fabricated in high density CMOS with Transistor-Transistor Logic
(TTL) compatible inputs and outputs.
MAXIMUM RATINGS
CAUTION
This device contains circuitry protecting
against damage due to high static voltage or
electrical fields; however, normal precautions
should be taken to avoid exceeding maximum
voltage ratings. Reliability is enhanced if
unused inputs are tied to an appropriate logic
voltage level (e.g., either GND or VCC).
Note: In the calculation of timing requirements, adding a maximum value of one
specification to a minimum value of another specification does not yield a
reasonable sum. A maximum specification is calculated using a worst case
variation of process parameter values in one direction. The minimum
specification is calculated using the worst case for the same parameters in the
opposite direction. Therefore, a “maximum” value for a specification will
never occur in the same device that has a “minimum” value for another
specification; adding a maximum to a minimum represents a condition that
can never exist.
MOTOROLA
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Specifications
Thermal characteristics
Table 2-1 Maximum Ratings (GND = 0 Vdc)
Rating
Symbol
Value
Unit
Supply Voltage
VCC
–0.3 to +7.0
V
All Input Voltages
VIN
(GND – 0.25) to (VCC + 0.25)
V
Current Drain per Pin excluding VCC and GND
I
10
mA
Operating Temperature Range:
• 81 MHz
• 88 MHz
TJ
–40 to +120
–40 to +110
°C
°C
–55 to +125
°C
Freescale Semiconductor, Inc...
Storage Temperature
TSTG
THERMAL CHARACTERISTICS
Table 2-2 Thermal Characteristics
Characteristic
Symbol
QFP Value3
QFP Value4
Unit
Junction-to-ambient thermal resistance1
RθJA or θJA
47.5
36.3
˚C/W
Junction-to-case thermal resistance2
RθJC or θJC
7.3
—
˚C/W
Thermal characterization parameter
ΨJT
1.1
—
˚C/W
Notes:
1.
2.
3.
4.
2-2
Junction-to-ambient thermal resistance is based on measurements on a horizontal-single-sided
Printed Circuit Board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment
and Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111)
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G3088, with the exception that the cold plate temperature is used for the case temperature.
These are measured values. See note 1 for test board conditions.
These are measured values; testing is not complete. Values were measured on a non-standard
four-layer thermal test board (two internal planes) at one watt in a horizontal configuration.
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Specifications
DC Electrical Characteristics
DC ELECTRICAL CHARACTERISTICS
Table 2-3 DC Electrical Characteristics
81 MHz
Characteristics
Supply voltage
Freescale Semiconductor, Inc...
88 MHz
Symbol
Input high voltage
• EXTAL
• RESET
• MODA, MODB,
MODC
• SHI inputs1
• All other inputs
Input low voltage
• EXTAL
• MODA, MODB,
MODC
• SHI inputs1
• All other inputs
Unit
Min
Typ
Max
Min
Typ
Max
VCC
4.75
5.0
5.25
4.75
5.0
5.25
V
VIHC
VIHR
VIHM
4.0
2.5
3.5
—
—
—
VCC
VCC
VCC
4.0
2.5
3.5
—
—
—
VCC
VCC
VCC
V
V
V
VIHS
VIH
0.7 × VCC
2.0
—
—
VCC
VCC
0.7 × VCC
2.0
—
—
VCC
VCC
V
V
VILC
VILM
–0.5
–0.5
—
—
0.4
2.0
–0.5
–0.5
—
—
0.4
2.0
V
V
VILS
VIL
–0.5
–0.5
—
—
0.3 × VCC
0.8
–0.5
–0.5
—
—
0.3 × VCC
0.8
V
V
–1
—
1
–1
—
1
µA
–10
—
10
–10
—
10
µA
Input leakage current
• EXTAL, RESET,
MODA, MODB,
MODC, DR
• Other Input Pins
(@ 2.4 V/0.4 V)
IIN
High impedance (off-state)
input current (@ 2.4 V / 0.4 V)
ITSI
–10
—
10
–10
—
10
µA
Output high voltage
(IOH = –0.4 mA)
VOH
2.4
—
—
2.4
—
—
V
Output low voltage
(IOL = 3.2 mA)
SCK/SCL IOL = 6.7 mA
MISO/SDA IOL = 6.7 mA
HREQ IOL = 6.7 mA
VOL
—
—
0.4
—
—
0.4
V
ICCI
ICCW
ICCS
—
—
—
145
25
5
1554
36
110
—
—
—
155
27
5
1754
45
110
mA
mA
µA
—
1.2
2.0
—
1.3
2.2
mA
—
10
—
—
10
—
pF
Internal Supply Current
• Normal mode
• Wait mode
• Stop mode2
PLL supply current
Input
Notes:
capacitance3
1.
2.
3.
4.
CIN
The SHI inputs are: MOSI/HA0, SS/HA2, MISO/SDA, SCK/SCL, and HREQ.
In order to obtain these results, all inputs must be terminated (i.e., not allowed to float). PLL signals are
disabled during Stop state.
Periodically sampled and not 100% tested
Maximum values are derived using the methodology described in Section 4. Actual maximums are
application dependent and may vary widely from these numbers.
MOTOROLA
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Specifications
AC Electrical Characteristics
AC ELECTRICAL CHARACTERISTICS
Freescale Semiconductor, Inc...
The timing waveforms in the AC Electrical Characteristics are tested with a VIL
maximum of 0.5 V and a VIH minimum of 2.4 V for all pins, except EXTAL, RESET,
MODA, MODB, MODC, and SHI pins (MOSI/HA0, SS/HA2, MISO/SDA, SCK/
SCL, HREQ). These pins are tested using the input levels set forth in the DC Electrical
Characteristics. AC timing specifications that are referenced to a device input signal
are measured in production with respect to the 50% point of the respective input
signal’s transition. DSP56009 output levels are measured with the production test
machine VOL and VOH reference levels set at 0.8 V and 2.0 V, respectively.
All output delays are given for a 50 pF load unless otherwise specified.
For load capacitance greater than 50 pF, the drive capability of the output pins
typically decreases linearly:
1. At 1.5 ns per 10 pF of additional capacitance at all output pins except
MOSI/HA0, MISO/SDA, SCK/SCL, HREQ
2. At 1.0 ns per 10 pF of additional capacitance at output pins MOSI/HA0,
MISO/SDA, SCK/SCL, HREQ (in SPI mode only)
INTERNAL CLOCKS
For each occurrence of TH, TL, TC, or Icyc, substitute with the numbers in Table 2-4.
Table 2-4 Internal Clocks
Characteristics
Symbol
Internal Operation Frequency
f
Internal Clock High Period
• with PLL disabled
• with PLL enabled and MF ≤ 4
TH
• with PLL enabled and MF > 4
Internal Clock Low Period
• with PLL disabled
• with PLL enabled and MF ≤ 4
TL
• with PLL enabled and MF > 4
Internal Clock Cycle Time
Instruction Cycle Time
2-4
Expression
ETH
(Min) 0.48 × TC
(Max) 0.52 × TC
(Min) 0.467 × TC
(Max) 0.533 × TC
ETL
(Min) 0.48 × TC
(Max) 0.52 × TC
(Min) 0.467 × TC
(Max) 0.533 × TC
TC
(DF /MF) × ETC
ICYC
2 × TC
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Specifications
External Clock (EXTAL Pin)
EXTERNAL CLOCK (EXTAL PIN)
The DSP56009 system clock is externally supplied via the EXTAL pin. Timings shown
in this document are valid for clock rise and fall times of 3 ns maximum. The 81 MHz
speed allows the DSP56009 to take advantage of the 27 MHz system clock in DVD
applications.
Table 2-5 External Clock (EXTAL Pin)
81 MHz
Freescale Semiconductor, Inc...
No.
Characteristics
—
Frequency of External Clock (EXTAL Pin)
1
External Clock Input High—EXTAL
• with PLL disabled
(46.7%–53.3% duty cycle)
• with PLL enabled
(42.5%–57.5% duty cycle)
2
3
4
Note:
Pin1
Unit
Min
Max
Min
Max
0
81
0
88
MHz
5.8
∞
5.3
∞
ns
5.2
235500
4.8
235500
ns
5.8
∞
5.4
∞
ns
5.2
235500
4.8
235500
ns
12.3
12.3
∞
409600
11.4
11.4
∞
409600
ns
ns
24.7
24.7
∞
819200
22.7
22.7
∞
819200
ns
ns
Ef
ETH
External Clock Input Low—EXTAL Pin1
• with PLL disabled
(46.7%–53.3% duty cycle)
• with PLL enabled
(42.5%–57.5% duty cycle)
ETL
External Clock Cycle Time1
• with PLL disabled
• with PLL enabled
ETC
Instruction Cycle Time = Icyc = 2 × TC1
• with PLL disabled
• with PLL enabled
Icyc
1.
88 MHz
Sym.
External Clock Input High and External Clock Input Low are measured at 50% of the input transition.
EXTAL
1
ETH
2
3
ETL
ETC
4
AA0250
Figure 2-1 External Clock Timing
MOTOROLA
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
Phase Lock Loop (PLL) Characteristics
PHASE LOCK LOOP (PLL) CHARACTERISTICS
Table 2-6 Phase Lock Loop (PLL) Characteristics
Characteristics
Expression
MF × CPCAP1
@ MF ≤ 4
@ MF > 4
PLL external capacitor
(PCAP pin to VCCP)
Freescale Semiconductor, Inc...
1.
Max
Unit
10
f1
MHz
MF × 340
MF × 380
MF × 480
MF × 970
pF
pF
MF × Ef
VCO frequency when PLL enabled
Note:
Min
Cpcap is the value of the PLL capacitor (connected between PCAP pin and VCCP) for MF = 1.
The recommended value for Cpcap is 400 pF for MF ≤ 4 and 540 pF for MF > 4.
The maximum VCO frequency is limited to the internal operation frequency, defined in Table 2-4.
RESET, STOP, MODE SELECT, AND INTERRUPT TIMING
Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing (CL = 50 pF + 2 TTL Loads)
No.
10
Characteristics
Minimum RESET assertion width:
• PLL disabled
• PLL enabled1
Min
Max
Unit
25 × TC
2500 × ETC
—
—
ns
ns
14
Mode Select Setup Time
21
—
ns
15
Mode Select Hold Time
0
—
ns
16
Minimum Edge-triggered Interrupt Request Assertion
Width
13
—
ns
13
—
ns
12 × TC + TH
—
ns
TL – 31
(2 × TC) + TL – 31
ns
ns
—
ns
16a Minimum Edge-triggered Interrupt Request Deassertion
Width
18
Delay from IRQA, IRQB, NMI Assertion to GPIO Valid
Caused by First Interrupt Instruction Execution
22
Delay from General Purpose Output Valid to Interrupt
Request Deassertion for Level Sensitive Fast Interrupts—
If Second Interrupt Instruction is: 2
• Single Cycle
• Two Cycles
25
2-6
Duration of IRQA Assertion for Recovery from Stop
State
12
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
RESET, Stop, Mode Select, and Interrupt Timing
Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing (CL = 50 pF + 2 TTL Loads)
No.
Characteristics
27
Duration for Level Sensitive IRQA Assertion to ensure
interrupt service (when exiting “STOP”)
• Stable External Clock, OMR Bit 6 = 1
• Stable External Clock, PCTL Bit 17 = 1
Freescale Semiconductor, Inc...
Note:
1.
2.
Min
Max
Unit
6 × TC + TL
12
—
—
ns
ns
This timing requirement is sensitive to the quality of the external PLL capacitor connected to the PCAP
pin. For capacitor values less than or equal to 2 nF, asserting RESET according to this timing requirement
will ensure proper processor initialization for capacitors with a deltaC/C less than 0.5%. (This is typical
for ceramic capacitors.) For capacitor values greater than 2 nF, asserting RESET according to this timing
requirement will ensure proper processor initialization for capacitors with a deltaC/C less than 0.01%.
(This is typical for Teflon, polystyrene, and polypropylene capacitors.) However, capacitors with
values greater than 2 nF with a deltaC/C greater than 0.01% may require longer RESET assertion to
ensure proper initialization.
When using fast interrupts and IRQA and IRQB are defined as level-sensitive, then timing 22 applies to
prevent multiple interrupt service. To avoid these timing restrictions, the Negative Edge-triggered
mode is recommended when using fast interrupts. Long interrupts are recommended when using
Level-sensitive mode.
VIHR
RESET
10
AA0251
Figure 2-2 Reset Timing
VIHR
RESET
14
VIHM
15
VIH
MODA, MODB
MODC
IRQA, IRQB,
NMI
VILM
VIL
AA0252
Figure 2-3 Operating Mode Select Timing
MOTOROLA
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
RESET, Stop, Mode Select, and Interrupt Timing
IRQA, IRQB,
NMI
16
IRQA, IRQB,
NMI
16A
AA0253
Freescale Semiconductor, Inc...
Figure 2-4 External Interrupt Timing (Negative Edge-triggered)
General
Purpose
I/O
(Output)
18
22
IRQA
IRQB
NMI
General Purpose I/O
AA0254
Figure 2-5 External Level-sensitive Fast Interrupt Timing
25
IRQA
AA0255
Figure 2-6 Recovery from Stop State Using IRQA
27
IRQA
AA0256
Figure 2-7 Recovery from Stop State Using IRQA Interrupt Service
2-8
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) DRAM Timing
EXTERNAL MEMORY INTERFACE (EMI) DRAM TIMING
(CL = 50 pF + 2 TTL Loads)
Table 2-8 External Memory Interface (EMI) DRAM Timing
Freescale Semiconductor, Inc...
No.
Characteristics
81 MHz
Timing
Mode
Expression
tPC
slow
fast
Symbol
88 MHz
Unit
Min
Max
Min
Max
4 × TC
3 × TC
49.4
37.0
—
—
45.5
34.1
—
—
ns
ns
41
Page Mode Cycle Time
42
RAS or RD Assertion to Data
Valid
tRAC,
tGA
slow
fast
7 × TC – 16
5 × TC – 16
—
—
70.4
45.7
—
—
63.5
40.8
ns
ns
43
CAS Assertion to Data Valid
tCAC
slow
fast
3 × TC – 10
2 × TC – 10
—
—
27.0
14.7
—
—
24.1
12.7
ns
ns
44
Column Address Valid to
Data Valid
tAA
slow
fast
3 × TC + T L – 7
2 × TC + TL – 7
—
—
36.2
23.8
—
—
32.8
21.4
ns
ns
45
CAS Assertion to Data Active
tCLZ
0
0
—
0
—
ns
46
RAS Assertion Pulse Width1
(Page Mode Access Only)
tRASP
3 × TC –11 +
n × 4 × TC
2 × TC –11 +
n × 3 × TC
125
—
114
—
ns
87.8
—
79.9
—
ns
slow
fast
47
RAS Assertion Pulse Width
(Single Access Only)
tRAS
slow
fast
7 × TC – 11
5 × TC – 11
75.4
50.8
—
—
68.5
45.8
—
—
ns
ns
48
RAS or CAS Deassertion to
RAS Assertion
tRP, tCRP
slow
fast
5 × TC – 5
3 × TC – 5
56.7
32.0
—
—
51.8
29.1
—
—
ns
ns
49
CAS Assertion Pulse Width
tCAS
slow
fast
3 × TC – 10
2 × TC – 10
27.0
14.7
—
—
24.1
12.7
—
—
ns
ns
50
Last CAS Assertion to RAS
Deassertion
(Page Mode Access Only)
tRSH
slow
fast
3 × TC – 15
2 × TC – 15
22.0
9.7
—
—
19.1
7.7
—
—
ns
ns
51
RAS or WR Assertion to CAS
Deassertion
tCSH,
tCWL
slow
fast
7 × TC – 15
5 × TC – 15
71.4
46.7
—
—
64.5
41.8
—
—
ns
ns
52
RAS Assertion to CAS
Assertion
tRCD
slow
fast
4 × TC – 13
3 × TC – 13
36.4
24
—
—
32.5
21.1
—
—
ns
ns
53
RAS Assertion to Column
Address Valid
tRAD
slow
3 × TC + TH –
13
2 × TC + TH –
13
30.2
—
26.8
—
ns
17.9
—
15.4
—
ns
fast
MOTOROLA
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) DRAM Timing
Table 2-8 External Memory Interface (EMI) DRAM Timing (Continued)
Freescale Semiconductor, Inc...
No.
Characteristics
Symbol
Timing
Mode
81 MHz
88 MHz
Expression
Unit
Min
Max
Min
Max
54
CAS Deassertion Pulse Width
(Page Mode Access Only)
tCP
TC – 5
7.3
—
6.4
—
ns
55
Row Address Valid to RAS
Assertion
(Row Address Setup Time)
tASR
TL – 6
0.2
—
0.1
—
ns
56
RAS Assertion to ROW
Address Not Valid
(Row Address Hold Time)
tRAH
3 × TC + TH –
14
2 × TC + TH –
14
29.2
—
25.8
—
ns
16.9
—
14.4
—
ns
57
Column Address Valid to
CAS Assertion
(Column Address Setup
Time)
tASC
TL – 6
0.2
—
0.1
—
ns
58
CAS Assertion to Column
Address Not Valid
(Column Address Hold Time)
tCAH
3 × TC + TH –
14
2 × TC + TH –
14
29.2
—
25.8
—
ns
16.9
—
14.4
—
ns
Last CAS Assertion to
Column Address Not Valid
(Column Address Hold Time)
tCAH
7 × TC + TH –
14
4 × TC + TH –
14
78.6
—
71.2
—
ns
41.6
—
37.1
—
ns
7 × TC + TH –
14
5 × TC + TH –
14
78.6
—
71.2
—
ns
53.9
—
48.5
—
ns
3 × TC + TL – 36.2
7
2 × TC + TL – 7 23.9
—
32.8
—
ns
—
21.2
—
ns
59
60
slow
fast
RAS Assertion to Column
Address Not Valid
slow
fast
slow
fast
tAR
slow
fast
61
Column Address Valid to
RAS Deassertion
tRAL
slow
fast
62
CAS, RAS, RD, or WR
Deassertion to WR or RD
Assertion
tRCH,
tRRH
63
CAS or RD Deassertion to
Data Not Valid
(Data Hold Time)
tOFF, tGZ
64
Random Read or Write Cycle
Time (Single Access Only)
tRC
65
WR Deassertion to CAS
Assertion
tRCS
2-10
5 × TC – 11
3 × TC – 11
50.7
26.0
—
—
45.8
23.1
—
—
ns
ns
0
0
—
0
—
ns
slow
fast
12 × TC
8 × TC
148
98.8
—
—
136.4
91.0
—
—
ns
ns
slow
fast
9 × TC – 11
6 × TC – 11
100
63.1
—
—
91.3
57.2
—
—
ns
ns
slow
fast
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) DRAM Timing
Table 2-8 External Memory Interface (EMI) DRAM Timing (Continued)
Freescale Semiconductor, Inc...
No.
Characteristics
Symbol
66
CAS Assertion to WR
Deassertion
tWCH
67
Data Valid to CAS Assertion
(Data Setup Time)
tDS
68
CAS Assertion to Data Not
Valid (Data Hold Time)
tDH
Expression
slow
fast
slow
fast
69
RAS Assertion to Data Not
Valid
tDHR
81 MHz
Timing
Mode
slow
fast
88 MHz
Unit
Min
Max
Min
Max
3 × TC – 13
2 × TC – 13
24
11.7
—
—
21.1
9.7
—
—
ns
ns
TL – 6
0.2
—
0.1
—
ns
3 × TC + TH –
14
2 × TC + TH –
14
29.2
—
25.8
—
ns
16.8
—
14.4
—
ns
7 × TC + TH –
14
5 × TC + TH –
14
78.6
—
71.2
—
ns
53.9
—
48.5
—
ns
70
WR Assertion to CAS
Assertion
tWCS
slow
fast
4 × TC – 14
3 × TC – 14
35.4
23
—
—
31.4
20.1
—
—
ns
ns
71
WR Assertion Pulse Width
(Single Cycle Only)
tWP
slow
fast
7 × TC – 9
5 × TC – 9
77.4
52.7
—
—
70.5
47.8
—
—
ns
ns
72
RAS Assertion to WR
Deassertion
(Single Cycle Only)
tWCR
slow
fast
7 × TC – 15
5 × TC – 15
71.5
46.7
—
—
64.5
41.8
—
—
ns
ns
73
WR Assertion to Data Active
slow
3 × TC + TH –
13
2 × TC + TH –
13
30.2
—
26.8
—
ns
17.9
—
15.4
—
ns
7 × TC – 13
5 × TC – 13
73.4
48.7
—
—
66.5
43.8
—
—
ns
ns
fast
74
Note:
RD or WR Assertion to RAS
Deassertion
(Single Cycle Only)
1.
tROH,
tRWL
slow
fast
n is the number of successive accesses. n = 2, 3, 4, or 6.
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Specifications
External Memory Interface (EMI) DRAM Timing
48
48
47
64
MRAS
74
52
50
65
49
MCAS
Freescale Semiconductor, Inc...
55
53
59
60
MA0–MA10
Row Address
Last Column Address
56
57
MWR
62
44
61
43
MRD
42
63
45
Data In
MD0–MD7
AA0257
Figure 2-8 DRAM Single Read Cycle
2-12
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) DRAM Timing
48
46
48
60
50
MRAS
65
41
54
54
52
49
49
49
Freescale Semiconductor, Inc...
MCAS
51
61
55
53
MA0–MA10
58
Row Address
58
Col. Address
56
Col. Address
59
Last Column Address
57
57
MWR
62
57
44
44
44
43
43
MRD
43
42
45
MD0–MD7
63
63
45
Data In
63
45
Data In
Data In
AA0263
Figure 2-9 DRAM Page Mode Read Cycle
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) DRAM Timing
64
48
47
48
MRAS
74
52
50
65
49
Freescale Semiconductor, Inc...
MCAS
55
61
53
59
60
MA0–MA10
Row Address
Column Address
56
57
70
66
62
72
MWR
71
MRD
69
68
67
73
MD0–MD7
Data Out
AA0264
Figure 2-10 DRAM Single Write Cycle
2-14
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) DRAM Timing
48
46
48
60
50
MRAS
65
41
54
54
52
49
49
49
Freescale Semiconductor, Inc...
MCAS
51
61
55
53
MA0–MA10
58
Row Address
Col. Address
56
58
Col. Address
59
Last Column Address
66
57
57
62
57
70
MWR
MRD
69
68
67
73
MD0–MD7
68
68
67
Data Out
67
Data Out
Data Out
AA0265
Figure 2-11 DRAM Page Mode Write Cycle
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) DRAM Refresh Timing
EXTERNAL MEMORY INTERFACE (EMI) DRAM REFRESH TIMING
(CL = 50pF + 2 TTL Loads)
Table 2-9 External Memory Interface (EMI) DRAM Refresh Timing
No.
Freescale Semiconductor, Inc...
81
82
83
84
85
86
87
88
89
Note:
2-16
Characteristics
RAS Deassertion to
RAS Assertion
CAS Deassertion to
CAS Assertion
Refresh Cycle Time
RAS Assertion Pulse
Width
RAS Deassertion to
RAS Assertion for
Refresh Cycle1
CAS Assertion to RAS
Assertion on Refresh
Cycle
RAS Assertion to CAS
Deassertion on Refresh
Cycle
RAS Deassertion to
CAS Assertion on a
Refresh Cycle
CAS Deassertion to
Data Not Valid
1.
Timing
Mode
Exp.
tRP
slow
fast
tCPN
slow
fast
slow
fast
slow
fast
slow
fast
Sym.
tRC
tRAS
tRP
tCSR
81 MHz
88 MHz
Unit
Min
Max
Min
Max
6 × TC – 7
4 × TC – 7
67.1
42.4
—
—
61.2
38.5
—
—
ns
ns
5 × TC – 7
3 × TC – 7
13 × TC
9 × TC
7 × TC – 9
5 × TC – 9
5 × TC – 5
3 × TC – 5
54.7
30
160
111
77.4
52.7
55.7
32
—
—
—
—
—
—
—
—
49.8
27.1
147.7
102.3
70.5
47.8
51.8
29.1
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
TC – 7
5.3
—
4.4
—
ns
tCHR
slow
fast
7 × TC – 15
5 × TC – 15
71.4
46.7
—
—
64.5
41.8
—
—
ns
ns
tRPC
slow
fast
5 × TC – 11
3 × TC – 11
50.7
26
—
—
45.8
23.1
—
—
ns
ns
0
0
—
0
—
ns
tOFF
This happens when a refresh cycle is followed by an access cycle.
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) SRAM Timing
83
81
84
85
MRAS
88
82
87
Freescale Semiconductor, Inc...
MCAS
86
89
MD0–MD7
Data In
AA0266
Figure 2-12 CAS before RAS Refresh Cycle
EXTERNAL MEMORY INTERFACE (EMI) SRAM TIMING
(CL = 50pF + 2 TTL Loads)
Table 2-10 External Memory Interface (EMI) SRAM Timing
81 MHz
No.
Characteristics
Symbol
88 MHz
Expression
Unit
Min Max
Min
Max
tRC, tWC
4 × TC – 11 +
Ws × TC
38.4
—
34.5
—
ns
Address Valid to RD or WR
Assertion
tAS
TC + TL – 13
5.5
—
4.4
—
ns
93
RD or WR Assertion Pulse
Width
tWP
2 × TC – 5 +
Ws × TC
20.0
—
17.7
—
ns
94
RD or WR Deassertion to RD
or WR Assertion
—
2 × TC – 11
13.7
—
11.7
—
ns
95
RD or WR Deassertion to
Address not Valid
tWR
TH – 6
0.2
—
0.1
—
ns
96
Address Valid to Input Data
Valid
tAA, tAC
3 × TC + TL –15 +
Ws × TC
—
28.2
—
24.8
ns
97
RD Assertion to Input Data
Valid
tOE
2 × TC – 15 +
Ws × TC
—
9.7
—
7.7
ns
91
Address Valid and CS
Assertion Pulse Width
92
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) SRAM Timing
Table 2-10 External Memory Interface (EMI) SRAM Timing (Continued)
81 MHz
No.
Characteristics
Symbol
Unit
Min Max
98
RD Deassertion to Data Not
Valid (Data Hold Time)
99
Address Valid to WR
Deassertion
tOHZ
Max
—
0
—
ns
tCW, tAW 3 × TC + TL –14 +
Ws × TC
29.2
—
25.8
—
ns
tDS (tDW)
TC + TL – 5 +
Ws × TC
11.0
—
10.0
—
ns
tDH
TH – 6
0.2
—
0.1
—
ns
102 WR Assertion to Data Valid
—
TH + 4
—
10.2
—
9.7
ns
103 WR Deassertion to Data high
impedance1
—
TH + 10
—
16.2
—
15.7
ns
104 WR Assertion to Data Active
—
TH – 6
0.2
—
0.1
—
ns
101 Data Hold Time from WR
Deassertion
Note:
0
Min
0
100 Data Setup Time to WR
Deassertion
Freescale Semiconductor, Inc...
88 MHz
Expression
This value is periodically sampled and not 100% tested.
MA0–MA14
MA15/MCS3
MA16/MCS2/MCAS
MA17/MCS1/MRAS
MCS0
91
92
95
94
93
RD
94
WR
97
98
96
Data In
MD0–MD7
AA0267
Figure 2-13 SRAM Read Cycle
2-18
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Specifications
External Memory Interface (EMI) SRAM Timing
MA0–MA14
MA15/MCS3
MA16/MCS2/MCAS
MA17/MCS1/MRAS
MCS0
91
99
95
93
92
WR
Freescale Semiconductor, Inc...
94
94
RD
100
102
103
Data Out
MD0–MD7
104
101
AA0268
Figure 2-14 SRAM Write Cycle
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Freescale Semiconductor, Inc.
Specifications
Serial Audio Interface (SAI) Timing
SERIAL AUDIO INTERFACE (SAI) TIMING
(CL = 50 pF + 2 TTL Loads)
Table 2-11 Serial Audio Interface (SAI) Timing
81 MHz
No.
Characteristics
Mode
88 MHz
Expression
Unit
Freescale Semiconductor, Inc...
Min Max Min Max
111
Minimum Serial Clock Cycle =
tSAICC (min)
master
slave
4 × TC
3 × TC + 5
49.4
42
—
—
45.5
39.1
—
—
ns
ns
112
Serial Clock High Period
master
slave
0.5 × tSAICC – 8
0.35 × tSAICC
16.7
14.7
—
—
14.7
13.7
—
—
ns
ns
113
Serial Clock Low Period
master
slave
0.5 × tSAICC – 8
0.35 × tSAICC
16.7
14.7
—
—
14.8
13.7
—
—
ns
ns
114
Serial Clock Rise/Fall Time
master
slave
8
0.15 × tSAICC
—
—
8
6.3
—
—
8.0
5.9
ns
ns
115
Data In Valid to SCKR edge
(Data In Set-up Time)
master
slave
26
4
26
4
—
—
26
4
—
—
ns
ns
116
SCKR Edge to Data In Not
Valid (Data In Hold Time)
master
slave
0
14
0
14
—
—
0
14
—
—
ns
ns
117
SCKR Edge to Word Select Out
Valid (WSR Out Delay Time)
master
20
—
20
—
20
ns
118
Word Select In Valid to SCKR
Edge (WSR In Set-up Time)
slave
12
12
—
12
—
ns
119
SCKR Edge to Word Select In
Not Valid (WSR In Hold Time)
slave
12
12
—
12
—
ns
121
SCKT Edge to Data Out Valid
(Data Out Delay Time)
master
slave1
slave2
13
40
TH + 34
—
—
—
13
40
40.2
—
—
—
13
40
39.7
ns
ns
ns
122
SCKT Edge to Word Select Out
Valid (WST Out Delay Time)
master
19
—
19
—
19
ns
123
Word Select In Valid to SCKT
Edge (WST In Set-up Time)
slave
12
12
—
12
—
ns
124
SCKT Edge to Word Select In
Not Valid (WST In Hold Time)
slave
12
12
—
12
—
ns
Note:
2-20
1.
2.
When the Frequency Ratio between Parallel and Serial clocks is 1:4 or greater
When the Frequency Ratio between Parallel and Serial clocks is 1:3 – 1:4
DSP56009/D, Rev. 1
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Audio Interface (SAI) Timing
111
112
114
114
113
SCKR
(RCKP = 1)
111
113
114
Freescale Semiconductor, Inc...
SCKR
(RCKP = 0)
114
112
115
SDI0–SDI1
(Data Input)
116
Valid
119
118
WSR
(Input)
Valid
117
WSR
(Output)
AA0269
Figure 2-15 SAI Receiver Timing
MOTOROLA
DSP56009/D, Rev. 1
For More Information On This Product,
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2-21
Freescale Semiconductor, Inc.
Specifications
Serial Audio Interface (SAI) Timing
111
112
114
114
113
SCKT
(TCKP = 1)
111
113
114
Freescale Semiconductor, Inc...
SCKT
(TCKP = 0)
114
112
121
SDO0–SDO2
(Data Output)
124
123
WST
(Input)
Valid
122
WST
(Output)
AA0270
Figure 2-16 SAI Transmitter Timing
2-22
DSP56009/D, Rev. 1
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) SPI Protocol Timing
SERIAL HOST INTERFACE (SHI) SPI PROTOCOL TIMING
(CL = 50 pF; VIHS = 0.7 × VCC, VILS = 0.3 × VCC)
Table 2-12 Serial Host Interface (SHI) SPI Protocol Timing
No.
Characteristics
Mode
Freescale Semiconductor, Inc...
— Tolerable Spike Width
on Clock or Data In5
CPHA = 0, CPHA = 12
slave
CPHA = 1
slave
CPHA = 1
CPHA = 1
slave
master
slave
Unit
Min
Max
Min
Max
—
—
—
0
20
100
—
—
—
0
20
100
ns
ns
ns
4 × TC
—
—
—
—
ns
bypassed
narrow
wide
bypassed
narrow
wide
bypassed
narrow
wide
6 × TC
1000
2000
3 × TC
3 × TC + 25
3 × TC + 85
3 × TC + 79
3 × TC + 431
3 × TC + 1022
74.1
1000
2000
37
62
122
116
468
1059
—
—
—
—
—
—
—
—
—
68.2
1000
2000
34.1
59.1
119
113
465
1056
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
0.5 × tSPICC –10
27.0
—
24.1
—
ns
TC + 8
TC + 31
TC + 43
TC + TH + 40
TC + TH + 216
TC + TH + 511
20.3
43.3
55.3
58.5
235
530
—
—
—
—
—
—
19.4
42.4
54.4
57.0
233.0
528.0
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
0.5 × tSPICC –10
27.0
—
24.1
—
ns
TC + 8
TC + 31
TC + 43
TC + TH + 40
TC + TH + 216
TC + TH + 511
20.3
43.3
55.3
58.5
235
550
—
—
—
—
—
—
19.4
42.4
54.4
57.0
233.0
528.0
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
10
2000
—
—
10
2000
—
—
10
2000
ns
ns
bypassed
narrow
wide
bypassed
narrow
wide
master
slave
144 Serial Clock Rise/Fall
Time
MOTOROLA
slave
88 MHz
bypassed
master
slave
143 Serial Clock Low
Period
CPHA = 0, CPHA = 12
81 MHz
Expression
bypassed
narrow
wide
141 Minimum Serial Clock
Cycle = tSPICC(min)
For frequency below 33
MHz1
master
For frequency above 33
MHz1
142 Serial Clock High
Period
CPHA = 0, CPHA = 12
Filter
Mode
bypassed
narrow
wide
bypassed
narrow
wide
DSP56009/D, Rev. 1
For More Information On This Product,
Go to: www.freescale.com
2-23
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) SPI Protocol Timing
Table 2-12 Serial Host Interface (SHI) SPI Protocol Timing (Continued)
No.
Characteristics
146 SS Assertion to First
SCK Edge CPHA = 0
Freescale Semiconductor, Inc...
CPHA = 1
Mode
slave
slave
147 Last SCK Edge to SS
Not Asserted
CPHA = 0
CPHA = 13
slave
148 Data In Valid to SCK
Edge (Data In Set-up
Time)
master
slave
Expression
bypassed
narrow
wide
bypassed
narrow
wide
master
slave
Unit
Max
Min
Max
TC + TH + 35
TC + TH + 35
TC + TH + 35
6
0
0
53.5
53.5
53.5
6
0
0
—
—
—
—
—
—
52.0
52.0
52.0
6
0
0
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
bypassed
narrow
wide
bypassed
narrow
wide
TC + 6
TC + 70
TC + 197
2
66
193
18.3
82.4
209
2
66
193
—
—
—
—
—
—
17.4
81.4
208.4
2
66
193
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
bypassed
narrow
0
MAX {(37 –TC),
0}
MAX {(52 –TC),
0}
0
MAX {(38 –TC),
0}
MAX {(53 –TC),
0}
0
25
—
—
0
25.6
—
—
ns
ns
40
—
40.6
—
ns
0
26
—
—
0
26.6
—
—
ns
ns
41
—
41.6
—
ns
41.7
42.7
52.7
41.7
42.7
52.7
—
—
—
—
—
—
39.7
40.7
50.7
39.7
40.7
50.7
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
bypassed
narrow
wide
149 SCK Edge to Data In
Not Valid
(Data In Hold Time)
88 MHz
Min
wide
slave
81 MHz
Filter
Mode
bypassed
narrow
wide
bypassed
narrow
wide
2
2
2
2
2
2
×
×
×
×
×
×
TC + 17
TC + 18
TC + 28
TC + 17
TC + 18
TC + 28
150 SS Assertion to Data
Out Active
slave
4
4
—
4
—
ns
151 SS Deassertion to Data
high impedance4
slave
24
—
24
—
24
ns
152 SCK Edge to Data Out
Valid (Data Out Delay
Time)
CPHA = 0, CPHA = 12
master
41
214
504
41
214
504
TC + TH + 40
TC + TH + 216
TC + TH + 511
—
—
—
—
—
—
—
—
—
41
214
504
41
214
504
58.5
235
530
—
—
—
—
—
—
—
—
—
41
214
504
41
214
504
57.0
233
528
ns
ns
ns
ns
ns
ns
ns
ns
ns
CPHA = 1
2-24
slave
slave
bypassed
narrow
wide
bypassed
narrow
wide
bypassed
narrow
wide
DSP56009/D, Rev. 1
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) SPI Protocol Timing
Table 2-12 Serial Host Interface (SHI) SPI Protocol Timing (Continued)
No.
Characteristics
Mode
153 SCK Edge to Data Out
Not Valid
(Data Out Hold Time)
master
Freescale Semiconductor, Inc...
slave
81 MHz
Filter
Mode
Expression
bypassed
narrow
wide
bypassed
narrow
wide
88 MHz
Unit
Min
Max
Min
Max
0
57
163
0
57
163
0
57
163
0
57
163
—
—
—
—
—
—
0
57
163
0
57
163
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
TC + TH + 35
—
53.5
—
52.0
ns
—
—
—
75
252
550
—
—
—
71.8
248.8
546.8
ns
ns
ns
—
—
—
34.4
91.4
197.4
—
—
—
ns
ns
ns
154 SS Assertion to Data
Out Valid
CPHA = 0
slave
157 First SCK Sampling
Edge to HREQ Output
Deassertion
slave
bypassed 3 × TC + TH + 32
narrow 3 × TC + TH + 209
wide
3 × TC + TH + 507
158 Last SCK Sampling
Edge to HREQ Output
Not Deasserted
CPHA = 1
slave
bypassed 2 × TC + TH + 6 36.9
narrow
2 × TC + TH + 63 93.9
wide
2 × TC + TH + 169 200
159 SS Deassertion to
HREQ Output Not
Deasserted
CPHA = 0
slave
2 × TC + TH + 7
37.9
160 SS Deassertion Pulse
Width CPHA = 0
slave
TC + 4
16.3
—
15.4
—
ns
161 HREQ In Assertion to
First SCK Edge
master
0.5 × tSPICC+
2 × TC + 6
67.7
—
62.8
—
ns
162 HREQ In Deassertion
to Last SCK Sampling
Edge (HREQ In Set-up
Time) CPHA = 1
master
0
0
—
0
—
ns
163 First SCK Edge to
HREQ In Not Asserted
(HREQ In Hold Time)
master
0
0
—
0
—
ns
Note:
1.
2.
3.
4.
5.
35.4
ns
For an Internal Clock frequency below 33 MHz, the minimum permissible Internal Clock to Serial Clock
frequency ratio is 4:1. For an Internal Clock frequency above 33 MHz, the minimum permissible Internal
Clock to Serial Clock frequency ratio is 6:1.
In CPHA = 1 mode, the SPI slave supports data transfers at tSPICC = 3 × TC, if the user assures that the
HTX is written at least TC ns before the first edge of SCK of each word.In CPHA = 1 mode, the SPI slave
supports data transfers at tSPICC = 3 × TC, if the user assures that the HTX is written at least TC ns
before the first edge of SCK of each word.
When CPHA = 1, the SS line may remain active low between successive transfers.
Periodically sampled, not 100% tested
Refer to Section 5.3.5.5 of the DSP56009 User’s Manual for a detailed description of how to
use the different filtering modes.
MOTOROLA
DSP56009/D, Rev. 1
For More Information On This Product,
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2-25
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) SPI Protocol Timing
SS
(Input)
143
141
142
144
144
SCK (CPOL = 0)
(Output)
141
142
144
143
144
SCK (CPOL = 1)
(Output)
Freescale Semiconductor, Inc...
148
149
MISO
(Input)
MSB
Valid
LSB
Valid
152
MOSI
(Output)
149
148
153
MSB
LSB
161
163
HREQ
(Input)
AA0271
Figure 2-17 SPI Master Timing (CPHA = 0)
2-26
DSP56009/D, Rev. 1
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) SPI Protocol Timing
SS
(Input)
143
141
142
144
144
SCK (CPOL = 0)
(Output)
142
141
144
143
144
Freescale Semiconductor, Inc...
SCK (CPOL = 1)
(Output)
148
148
149
MISO
(Input)
149
MSB
Valid
LSB
Valid
152
MOSI
(Output)
153
MSB
LSB
161
162
163
HREQ
(Input)
AA0272
Figure 2-18 SPI Master Timing (CPHA = 1)
MOTOROLA
DSP56009/D, Rev. 1
For More Information On This Product,
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2-27
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) SPI Protocol Timing
SS
(Input)
143
141
142
144
147
144
160
SCK (CPOL = 0)
(Input)
146
141
142
Freescale Semiconductor, Inc...
143
144
144
SCK (CPOL = 1)
(Input)
154
152
153
150
MISO
(Output)
153
151
MSB
LSB
148
148
149
MOSI
(Input)
MSB
Valid
149
LSB
Valid
157
159
HREQ
(Output)
AA0273
Figure 2-19 SPI Slave Timing (CPHA = 0)
2-28
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) SPI Protocol Timing
SS
(Input)
143
141
142
144
147
144
SCK (CPOL = 0)
(Input)
146
142
Freescale Semiconductor, Inc...
143
144
144
SCK (CPOL = 1)
(Input)
152
152
153
151
150
MISO
(Output)
MSB
LSB
148
148
149
MOSI
(Input)
MSB
Valid
149
LSB
Valid
157
158
HREQ
(Output)
AA0274
Figure 2-20 SPI Slave Timing (CPHA = 1)
MOTOROLA
DSP56009/D, Rev. 1
For More Information On This Product,
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2-29
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) I2C Protocol Timing
SERIAL HOST INTERFACE (SHI) I2C PROTOCOL TIMING
(VIHS = 0.7 × VCC, VILS = 0.3 × VCC)
(VOHS = 0.8 × VCC, VOLS = 0.2 × VCC)
(RP (min) = 1.5 kΩ)
Freescale Semiconductor, Inc...
Table 2-13 SHI I2C Protocol Timing
Standard I2C
(CL = 400 pF, RP = 2 kΩ, 100 kHz)
81/88 MHz
No.
—
Characteristics
Symbol
Tolerable Spike Width on SCL or SDA
Filters Bypassed
Narrow Filters Enabled
Wide Filters Enabled
Unit
Min
Max
—
—
—
0
20
100
ns
ns
ns
171
Minimum SCL Serial Clock Cycle
tSCL
10.0
—
µs
172
Bus Free Time
tBUF
4.7
—
µs
173
Start Condition Set-up Time
tSU;STA
4.7
—
µs
174
Start Condition Hold Time
tHD;STA
4.0
—
µs
175
SCL Low Period
tLOW
4.7
—
µs
176
SCL High Period
tHIGH
4.0
—
µs
177
SCL and SDA Rise Time
tr
—
1.0
µs
178
SCL and SDA Fall Time
tf
—
0.3
µs
179
Data Set-up Time
tSU;DAT
250
—
ns
180
Data Hold Time
tHD;DAT
0.0
—
ns
182
SCL Low to Data Out Valid
tVD;DAT
—
3.4
µs
183
Stop Condition Set-up Time
tSU;STO
4.0
—
µs
Note:
2-30
Refer to Section 5.3.5.5 of the DSP56009
the different filtering modes.
User’s Manual for a detailed description of how to use
DSP56009/D, Rev. 1
For More Information On This Product,
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) I2C Protocol Timing
The Programmed Serial Clock Cycle, t I2CCP , is specified by the value of the HDM5–
HDM0 and HRS bits of the HCKR (SHI Clock control Register).
The expression for t I2CCP is:
t
2
I CCP
= [ Tc × 2 × ( HDM[5:0] + 1 ) × ( 7 × ( 1 – HRS ) + 1 ) ]
Freescale Semiconductor, Inc...
where
•
HRS is the Prescaler Rate Select bit. When HRS is cleared, the fixed divide-byeight prescaler is operational. When HRS is set, the prescaler is bypassed.
•
HDM5–HDM0 are the Divider Modulus Select bits.
•
A divide ratio from 1 to 64 (HDM5–HDM0 = 0 to $3F) may be selected.
In I2C mode, you may select a value for the Programmed Serial Clock Cycle from
(HDM5–HDM0 = 2, HRS = 1)
to
6 × TC
(HDM5–HDM0 = $3F, HRS = 0).
1024 × TC
The DSP56009 provides an improved I2C bus protocol. In addition to supporting the
100 kHz I2C bus protocol, the SHI in I2C mode supports data transfers at up to 1000
kHz. The actual maximum frequency is limited by the bus capacitances (CL),the pullup resistors (RP), (which affect the rise and fall time of SDA and SCL, (see table
below)), and by the input filters.
Consideration for programming the SHI Clock Control Register (HCKR)—Clock
Divide Ratio: the master must generate a bus free time greater than T172 slave when
operating with a DSP56009 SHI I2C slave.
The table below describes a few examples:
Table 2-14 Considerations for Programming the SHI Clock control Register (HCKR)
Conditions to be Considered
Bus Load
Master
Operating
Freq.
Slave
Operating
Freq.
Master
Filter
Mode
Resulting Limitations
Slave
Filter
Mode
T172
Slave
Min.
Permissible
tI CCP
T172
Master
Maximum
I2C Serial
Frequency
2
CL = 50 pF,
RP = 2 kΩ
81 MHz 81 MHz
Bypassed
Narrow
Wide
Bypassed 36 ns
Narrow 60 ns
Wide
95 ns
52 × TC
56 × TC
62 × TC
41 ns
66 ns
103 ns
1010 kHz
825 kHz
634 kHz
CL = 50 pF,
RP = 2 kΩ
88 MHz 88 MHz
Bypassed
Narrow
Wide
Bypassed 34 ns
Narrow 58 ns
Wide
93 ns
56 × TC
60 × TC
66 × TC
38.2 ns
61 ns
95 ns
1020 kHz
834 kHz
642 kHz
MOTOROLA
DSP56009/D, Rev. 1
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2-31
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) I2C Protocol Timing
Example: for CL = 50 pF, RP = 2 kΩ, f = 81 MHz, Bypassed Filter mode: The master,
when operating with a DSP56009 SHI I2C slave with an 81 MHz operating frequency,
must generate a bus free time greater than 36 ns (T172 slave). Thus, the minimum
permissible tI2CCP is 52 × TC which gives a bus free time of at least 41 ns (T172 master).
This implies a maximum I2C serial frequency of 1010 kHz.
In general, bus performance may be calculated from the CL and RP of the bus, the
Input Filter modes and operating frequencies of the master and the slave. Table 2-15
contains the expressions required to calculate all relevant performance timing for a
given CL and RP.
Freescale Semiconductor, Inc...
Table 2-15 SHI Improved I2C Protocol Timing
Improved I2C (CL = 50 pF, RP = 2 kΩ)
No.
Char.
Sym.
Mode
— Tolerable Spike
Width on SCL or
SDA4
171 SCL Serial Clock
Cycle
tSCL
81 MHz2
Filter
Mode
Expression
bypassed
narrow
wide
0
20
100
—
—
—
0
20
100
—
—
—
0
20
100
ns
ns
ns
989
1212
1576
466
660
942
—
—
—
—
—
—
981
1199
1557
461
655
937
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
0.5 × t I CCP – 42 – tr
0.5 × t I CCP – 42 – tr
0.5 × t I CCP – 42 – tr
2 × TC + 11
2 × TC + 35
2 × TC + 70
41.1
65.8
103
35.7
59.7
94.7
—
—
—
—
—
—
38.2
60.9
95
33.7
57.7
92.7
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
12
50
150
12
50
150
—
—
—
12
50
150
—
—
—
ns
ns
ns
0.5 × t I CCP + 12 – tf
0.5 × t I CCP + 12 – tf
0.5 × t I CCP + 12 – tf
2 × TC + TH + 21
2 × TC + TH + 100
2 × TC + TH + 200
313
338
375
51.9
131
231
—
—
—
—
—
—
310
333
367
49.4
128
228
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
master bypassed t I CCP + 3 × TC +72 +tr
narrow t I CCP + 3 × TC +245 + tr
wide
t I CCP + 3 × TC +535 + tr
slave bypassed 4 × TC + TH + 172 + tr
narrow
4 × TC + TH + 366 + tr
wide
4 × TC + TH + 648 + tr
2
2
tBUF
master bypassed
narrow
wide
slave bypassed
narrow
wide
173 Start Condition
Set-up Time
tSU;STA
174 Start Condition
Hold Time
tHD;STA master bypassed
narrow
wide
slave bypassed
narrow
wide
2-32
slave
Unit
Min Max Min Max
2
172 Bus Free Time
88 MHz3
2
2
2
bypassed
narrow
wide
2
2
2
DSP56009/D, Rev. 1
For More Information On This Product,
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) I2C Protocol Timing
Table 2-15 SHI Improved I2C Protocol Timing (Continued)
Improved I2C (CL = 50 pF, RP = 2 kΩ)
No.
Char.
Freescale Semiconductor, Inc...
175 SCL Low Period
176 SCL High Period
Sym.
tLOW
tHIGH
Mode
Filter
Mode
master bypassed
narrow
wide
slave bypassed
narrow
wide
81 MHz2
88 MHz3
Expression
Unit
Min Max Min Max
0.5 × t I CCP + 18 – tf
0.5 × t I CCP + 18 – tf
0.5 × t I CCP + 18 – tf
2 × TC + 74 + tr
2 × TC + 286 + tr
2 × TC + 586 + tr
2
2
2
master bypassed 0.5 × t I CCP +2 × TC + 19
narrow
0.5 × t I CCP +2 × TC +
144
wide
0.5 × t I CCP + 2 × TC +
356
slave bypassed
2 × TC + TH – 1
narrow
2 × TC + TH + 18
wide
2 × TC + TH + 30
2
319
344
381
337
536
849
—
—
—
—
—
—
316
339
373
335
534
847
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
365
—
360
—
ns
514
—
507
—
ns
763
30
49
61
—
—
—
—
754
27.4
46.4
58.4
—
—
—
—
ns
ns
ns
ns
2
2
177
SCL Rise Time
Output1
Input
178 SCL Fall Time
Output1
Input
tr
tf
1.7 × RP × (CL + 20)
2000
— 238
— 2000
—
—
238
2000
ns
ns
20 + 0.1 × (CL– 50)
2000
— 20
— 2000
—
—
20
2000
ns
ns
179 Data Set-up Time tSU;DAT
bypassed
narrow
wide
TC + 8
TC + 60
TC + 74
20
72
86
—
—
—
19.4
71.4
85.4
—
—
—
ns
ns
ns
180 Data Hold Time
tHD;DAT
bypassed
narrow
wide
0
0
0
0
0
0
—
—
—
0
0
0
—
—
—
ns
ns
ns
182 SCL Low to Data tVD;DAT
Out Valid
bypassed
narrow
wide
2 × TC + 71 + tr
2 × TC + 244 + tr
2 × TC + 535 + tr
—
—
—
334
507
798
—
—
—
332
505
796
ns
ns
ns
2
351
—
346
—
ns
2
433
—
427
—
ns
2
584
—
575
—
ns
11
50
150
—
—
—
11
50
150
—
—
—
ns
ns
ns
183 Stop Condition
Set-up Time
MOTOROLA
tSU;STO master bypassed 0.5 × t I CCP + TC + TH +
11
narrow 0.5 × t I CCP + TC + TH +
69
wide
0.5 × t I CCP + TC + TH +
183
slave bypassed
11
narrow
50
wide
150
DSP56009/D, Rev. 1
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2-33
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) I2C Protocol Timing
Table 2-15 SHI Improved I2C Protocol Timing (Continued)
Improved I2C (CL = 50 pF, RP = 2 kΩ)
No.
Char.
Freescale Semiconductor, Inc...
184 HREQ In
Deassertion to
Last SCL Edge
(HREQ In Set-up
Time)
Sym.
Mode
81 MHz2
Filter
Mode
88 MHz3
Expression
Unit
Min Max Min Max
master bypassed
narrow
wide
0
0
0
0
0
0
—
—
—
0
0
0
—
—
—
ns
ns
ns
75
252
550
—
—
—
72
249
547
ns
ns
ns
186 First SCL
Sampling Edge
to HREQ Output
Deassertion
slave
bypassed
narrow
wide
3 × TC + TH + 32
3 × TC + TH + 209
3 × TC + TH + 507
—
—
—
187 Last SCL Edge to
HREQ Output
Not Deasserted
slave
bypassed
narrow
wide
2 × TC + TH + 6
2 × TC + TH + 63
2 × TC + TH + 169
37
93.9
200
— 34.4 —
— 91.4 —
— 197.4 —
ns
ns
ns
188 HREQ In
Assertion to First
SCL Edge
master bypassed
narrow
wide
t I CCP + 2 × TC + 6
t I CCP + 2 × TC + 6
t I CCP + 2 × TC + 6
673
722
796
—
—
—
665
711
779
—
—
—
ns
ns
ns
189 First SCL Edge
to HREQ In Not
Asserted (HREQ
In Hold Time)
master
0
0
—
0
—
ns
Note:
1.
2.
2
2
2
CL is in pF, RP is in kΩ, and result is in ns.
A t I CCP of 52 × TC (the maximum permitted for the given bus load) was used for the calculations in the
Bypassed Filter mode.
A t I CCP of 56 × TC (the maximum permitted for the given bus load) was used for the calculations in the
Narrow Filter mode.
A t I CCP of 62 × TC (the maximum permitted for the given bus load) was used for the calculations in the
Wide Filter mode.
A t I CCP of 56 × TC (the maximum permitted for the given bus load) was used for the calculations in the
Bypassed Filter mode.
A t I CCP of 60 × TC (the maximum permitted for the given bus load) was used for the calculations in the
Narrow Filter mode.
A t I CCP of 66 × TC (the maximum permitted for the given bus load) was used for the calculations in the
Wide Filter mode.
Refer to Section 5.3.5.5 of the DSP56009 User’s Manual for a detailed description of how to
use the different filtering modes.
2
2
2
3.
2
2
2
4.
2-34
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications
Serial Host Interface (SHI) I2C Protocol Timing
171
173
176
175
SCL
177
Freescale Semiconductor, Inc...
SDA
Stop
180
178
172
179
Start
MSB
174
LSB
186
182
189
ACK
Stop
183
184
188
187
HREQ
AA0275
Figure 2-21
MOTOROLA
I2C
Timing
DSP56009/D, Rev. 1
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2-35
Freescale Semiconductor, Inc.
Specifications
General Purpose I/O (GPIO) Timing
GENERAL PURPOSE I/O (GPIO) TIMING
(CL = 50 pF + 2 TTL Loads)
Table 2-16 GPIO Timing
81/88 MHz
Freescale Semiconductor, Inc...
No.
Characteristics
Expression
Unit
Min
Max
201
EXTAL Edge to GPIO Out Valid (GPIO Out Delay
Time)
26
—
26
ns
202
EXTAL Edge to GPIO Out Not Valid (GPIO Out Hold
Time)
2
2
—
ns
203
GPIO In Valid to EXTAL Edge (GPIO In Set-up Time)
10
10
—
ns
204
EXTAL Edge to GPIO In Not Valid (GPIO In Hold
Time)
6
6
—
ns
EXTAL
(Input)
(Note 1)
201
202
GPIO0–
GPIO3
(Output)
203
GPIO0–
GPIO3
(Input)
Note:
204
Valid
1. Valid when the ratio between EXTAL frequency and internal clock frequency equals 1
AA0276
Figure 2-22 GPIO Timing
2-36
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications
On-Chip Emulation (OnCE) Timing
ON-CHIP EMULATION (OnCE) TIMING
(CL = 50 pF + 2 TTL Loads)
Table 2-17 OnCE Timing
81/88 MHz
Freescale Semiconductor, Inc...
No.
Characteristics
Unit
Min
Max
230
DSCK Low
40
—
ns
231
DSCK High
40
—
ns
232
DSCK Cycle Time
200
—
ns
233
DR Asserted to DSO (ACK) Asserted
5 TC
—
ns
234
DSCK High to DSO Valid
—
42
ns
235
DSCK High to DSO Invalid
3
—
ns
236
DSI Valid to DSCK Low (Set-up)
15
—
ns
237
DSCK Low to DSI Invalid (Hold)
3
—
ns
238
Last DSCK Low to OS0–OS1, ACK Active
3 TC + TL
—
ns
239
DSO (ACK) Asserted to First DSCK High
2 TC
—
ns
240
DSO (ACK) Assertion Width
4 TC + TH – 3
5 TC + 7
ns
241
DSO (ACK) Asserted to OS0–OS1 High
Impedance1
—
0
ns
242
OS0–OS1 Valid to EXTAL Transition #2
T C – 21
—
ns
243
EXTAL Transition #2 to OS0–OS1 Invalid
0
—
ns
244
Last DSCK Low of Read Register to First DSCK
High of Next Command
7 TC + 10
—
ns
245
Last DSCK Low to DSO Invalid (Hold)
3
—
ns
246
DR Assertion to EXTAL Transition #2 for Wake
Up from Wait State
10
TC – 10
ns
247
EXTAL Transition #2 to DSO After Wake Up
from Wait State
17 TC
—
ns
248
DR Assertion Width
• to recover from WAIT
• to recover from WAIT and enter Debug
mode
15
13 TC + 15
12 TC – 15
—
ns
ns
17 TC
—
ns
249
DR Assertion to DSO (ACK) Valid (Enter Debug
mode) After Asynchronous Recovery from Wait
State
MOTOROLA
DSP56009/D, Rev. 1
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2-37
Freescale Semiconductor, Inc.
Specifications
On-Chip Emulation (OnCE) Timing
Table 2-17 OnCE Timing (Continued)
81/88 MHz
No.
Characteristics
250A
Freescale Semiconductor, Inc...
250B
251
Note:
Unit
Min
Max
15
15
15
65548 TC + TL
20 TC + TL
13 TC + TL
ns
ns
ns
DR Assertion Width to Recover from STOP and
enter Debug mode2
• Stable External Clock, OMR Bit 6 = 0
• Stable External Clock, OMR Bit 6 = 1
• Stable External Clock, PCTL Bit 17 = 1
65549 TC + TL
21 TC + TL
14 TC + TL
—
—
—
ns
ns
ns
DR Assertion to DSO (ACK) Valid (Enter Debug
mode) After Recovery from Stop State2
• Stable External Clock, OMR Bit 6 = 0
• Stable External Clock, OMR Bit 6 = 1
• Stable External Clock, PCTL Bit 17 = 1
65553 TC + TL
25 TC + TL
18 TC + TL
—
—
—
ns
ns
ns
DR Assertion Width to Recover from STOP2
• Stable External Clock, OMR Bit 6 = 0
• Stable External Clock, OMR Bit 6 = 1
• Stable External Clock, PCTL Bit 17 = 1
1.
2.
Maximum TL
Periodically sampled, not 100% tested
246
246
230
DSCK
(input)
231
232
AA0277
Figure 2-23 DSP56009 OnCE Serial Clock Timing
DR
(Input)
233
DSO
(Output)
240
ACK
AA0278
Figure 2-24 DSP56009 OnCE Acknowledge Timing
2-38
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications
On-Chip Emulation (OnCE) Timing
DSCK
(Input)
(Last)
(OS1)
DSO
(Output)
236
237
(ACK)
238
DSI
(Input)
Freescale Semiconductor, Inc...
Note:
(OS0)
(Note 1)
1. High Impedance, external pull-down resistor
AA0279
Figure 2-25 DSP56009 OnCE Data I/O to Status Timing
DSCK
(Input)
(Last)
234
235
(Note 1)
245
DSO
(Output)
Note:
(OS0)
1. High Impedance, external pull-down resistor
AA0280
Figure 2-26 DSP56009 OnCE Read Timing
239
OS1
(Output)
(Note 1)
241
(DSCK Input)
240
DSO
(Output)
(DSO Output)
(DSI Input)
OS0
(Output)
241
Note:
(Note 1)
236
237
1. High Impedance, external pull-down resistor
AA0281
Figure 2-27 DSP56009 OnCE Data I/O Status Timing
MOTOROLA
DSP56009/D, Rev. 1
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2-39
Freescale Semiconductor, Inc.
Specifications
On-Chip Emulation (OnCE) Timing
EXTAL
(Note 2)
242
OS0–OS1
(Output)
(Note 1)
Freescale Semiconductor, Inc...
Note:
243
1. High Impedance, external pull-down resistor
2. Valid when the ratio between EXTAL frequency and clock frequency equals 1
AA0282
Figure 2-28 DSP56009 OnCE EXTAL to Status Timing
DSCK
(Input)
(Next Command)
244
AA0283
Figure 2-29 DSP56009 OnCE DSCK Next Command After Read Register Timing
EXTAL
T0, T2
T1, T3
248
DR
(Input)
246
247
DSO
(Output)
AA0284
Figure 2-30 Synchronous Recovery from Wait State
248
DR
(Input)
249
DSO
(Output)
AA0285
Figure 2-31 Asynchronous Recovery from Wait State
2-40
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications
On-Chip Emulation (OnCE) Timing
250
DR
(Input)
251
DSO
(Output)
AA0286
Freescale Semiconductor, Inc...
Figure 2-32 Asynchronous Recovery from Stop State
MOTOROLA
DSP56009/D, Rev. 1
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2-41
Freescale Semiconductor, Inc.
Specifications
Freescale Semiconductor, Inc...
On-Chip Emulation (OnCE) Timing
2-42
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
SECTION
3
PACKAGING
Freescale Semiconductor, Inc...
PIN-OUT AND PACKAGE INFORMATION
This section provides information about the available packages for this product,
including diagrams of the package pinouts and tables describing how the signals
described in Section 1 are allocated. The DSP56009 is available in an 80-pin Quad
Flat Pack (QFP) package.
MOTOROLA
DSP56009/D, Rev. 1
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3-1
Freescale Semiconductor, Inc.
Packaging
Pin-out and Package Information
QFP Package Description
Freescale Semiconductor, Inc...
DSCK/OS1
DSI/OS0
DSO
SDI0
SDI1
WSR
GNDS
VCCQ
GNDQ
SCKR
WST
SCKT
VCCS
SDO0
SDO1
SDO2
GNDS
HREQ
SS/HA2
MOSI/HA0
Top and bottom views of the QFP package are shown in Figure 3-1 and Figure 3-2
with their pin-outs.
41
61
(Top View)
Orientation Mark
21
1
VCCS
MODC/NMI
MODB/IRQB
MODA/IRQA
RESET
MISO/SDA
GNDS
VCCP
PCAP
GNDP
PINIT
GNDQ
VCCQ
EXTAL
SCK/SCL
MA0
MA1
MA2
MA3
GNDA
GNDA
MCS0
MA15/MCS3
MA14
MA13
VCCA
MA12
GNDA
VCCQ
GNDQ
MA11
MA10
MA9
MA8
GNDA
MA7
VCCA
MA6
MA5
MA4
DR
MD7
MD6
MD5
MD4
GNDD
MD3
MD2
MD1
VCCD
MD0
GNDD
GPIO3
GPIO2
GPIO1
GPIO0
MRD
MWR
MA17/MCS1/MRAS
MA16/MCS2/MCAS
Note: An OVERBAR indicates the signal is asserted when the
voltage = ground (active low). To simplify locating the pins,
each fifth pin is shaded in the illustration.
Figure 3-1 Top View
3-2
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Packaging
41
61
(Bottom View)
Orientation Mark
21
1
DR
MD7
MD6
MD5
MD4
GNDD
MD3
MD2
MD1
VCCD
MD0
GNDD
GPIO3
GPIO2
GPIO1
GPIO0
MRD
MWR
MA17/MCS1/MRAS
MA16/MCS2/MCAS
VCCA
MA7
GNDA
MA8
MA9
MA10
MA11
GNDQ
VCCQ
GNDA
MA12
VCCA
MA13
MA14
MA15/MCS3
MCS0
GNDA
VCCS
MODC/NMI
MODB/IRQB
MODA/IRQA
RESET
MISO/SDA
GNDS
VCCP
PCAP
GNDP
PINIT
GNDQ
VCCQ
EXTAL
SCK/SCL
MA0
MA1
MA2
MA3
GNDA
MA4
MA5
MA6
Freescale Semiconductor, Inc...
MOSI/HA0
SS/HA2
HREQ
GNDS
SDO2
SDO1
SDO0
VCCS
SCKT
WST
SCKR
GNDQ
VCCQ
GNDS
WSR
SDI1
SDI0
DSO
DSI/OS0
DSCK/OS1
Pin-out and Package Information
Note: An OVERBAR indicates the signal is asserted when the
voltage = ground (active low). To simplify locating the pins,
each fifth pin is shaded in the illustration.
Figure 3-2 Bottom View
MOTOROLA
DSP56009/D, Rev. 1
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3-3
Freescale Semiconductor, Inc.
Packaging
Pin-out and Package Information
Table 3-1 DSP56009 Pin Identification by Pin Number
Freescale Semiconductor, Inc...
Pin #
Signal Name
Pin #
Signal Name
Pin #
Signal Name
1
GNDA
28
VCCQ
55
WSR
2
MCS0
29
GNDQ
56
SDI1
3
MA15/MCS3
30
PINIT
57
SDI0
4
MA14
31
GNDP
58
DSO
5
MA13
32
PCAP
59
DSI/OS0
6
VCCA
33
VCCP
60
DSCK/OS1
7
MA12
34
GNDS
61
DR
8
GNDA
35
MISO/SDA
62
MD7
9
VCCQ
36
RESET
63
MD6
10
GNDQ
37
MODA/IRQA
64
MD5
11
MA11
38
MODB/IRQB
65
MD4
12
MA10
39
MODC/NMI
66
GNDD
13
MA9
40
VCCS
67
MD3
14
MA8
41
MOSI/HA0
68
MD2
15
GNDA
42
SS/HA2
69
MD1
16
MA7
43
HREQ
70
VCCD
17
VCCA
44
GNDS
71
MD0
18
MA6
45
SDO2
72
GNDD
19
MA5
46
SDO1
73
GPIO3
20
MA4
47
SDO0
74
GPIO2
21
GNDA
48
VCCS
75
GPIO1
22
MA3
49
SCKT
76
GPIO0
23
MA2
50
WST
77
MRD
24
MA1
51
SCKR
78
MWR
25
MA0
52
GNDQ
79
MA17/MCS1/
MRAS
26
SCK/SCL
53
VCCQ
80
MA16/MCS2/
MCAS
27
EXTAL
54
GNDS
3-4
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Packaging
Pin-out and Package Information
Freescale Semiconductor, Inc...
Table 3-2 DSP56009 Pin Identification by Signal Name
Signal Name
Pin #
Signal Name
Pin #
Signal Name
Pin #
DR
61
MA5
19
MRD
77
DSCK
60
MA6
18
MWR
78
DSI
59
MA7
16
NMI
39
DSO
58
MA8
14
OS0
59
EXTAL
27
MA9
13
OS1
60
GNDA
1
MA10
12
PCAP
32
GNDA
8
MA11
11
PINIT
30
GNDA
15
MA12
7
RESET
36
GNDA
21
MA13
5
SCK
26
GNDD
66
MA14
4
SCKR
51
GNDD
72
MA15
3
SCKT
49
GNDP
31
MA16
80
SCL
26
GNDQ
10
MA17
79
SDA
35
GNDQ
29
MCAS
80
SDI0
57
GNDQ
52
MCS0
2
SDI1
56
GNDS
34
MCS1
79
SDO0
47
GNDS
44
MCS2
80
SDO1
46
GNDS
54
MCS3
3
SDO2
45
GPIO0
76
MD0
71
SS
42
GPIO1
75
MD1
69
VCCA
6
GPIO2
74
MD2
68
VCCA
17
GPIO3
73
MD3
67
VCCD
70
HA0
41
MD4
65
VCCP
33
HA2
42
MD5
64
VCCQ
9
HREQ
43
MD6
63
VCCQ
28
IRQA
37
MD7
62
VCCQ
53
IRQB
38
MISO
35
VCCS
40
MA0
25
MODA
37
VCCS
48
MA1
24
MODB
38
WSR
55
MA2
23
MODC
39
WST
50
MA3
22
MOSI
41
MA4
20
MRAS
79
MOTOROLA
DSP56009/D, Rev. 1
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Freescale Semiconductor, Inc.
Packaging
Pin-out and Package Information
Table 3-3 DSP56009 Power Supply Pins
Pin #
6
Signal Name
VCCA
Circuit Supplied
Address Bus Buffers
17
1
GNDA
8
Freescale Semiconductor, Inc...
15
21
70
VCCD
66
GNDD
Data Bus Buffers
72
9
VCCQ
Internal Logic
28
53
10
GNDQ
29
52
33
VCCP
31
GNDP
40
VCCS
PLL
Serial Ports
48
34
GNDS
44
54
3-6
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Packaging
Pin-out and Package Information
L
60
41
61
M
H
A-B
S
A-B
V
P
DETAIL A
0.20
DETAIL A
0.05
-A,B,D0.20
Freescale Semiconductor, Inc...
M
B
C
L
A-B
-B-
-A-
B
B
S
D S
D S
40
21
80
1
F
20
-D-
A
0.20
M
0.05
A-B
0.20
M
C
A-B S
D S
A-B S
D S
H
DETAIL C
C
-H-
0.20
DATUM
PLANE
M
C
A-B S
D S
SECTION B-B
0.01
SEATING
PLANE
H
M
G
CASE 841B-01
ISSUE O
U
T
DATUM
PLANE
D
M
E
-C-
N
J
S
-H-
R
K
W
X
DETAIL C
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
MILLIMETERS
MIN MAX
13.90 14.10
13.90 14.10
2.15
2.45
0.22
0.38
2.00
2.40
0.22
0.33
0.65 BSC
0.25
0.13
0.23
0.65
0.95
12.35 BSC
55
105
0.13
0.17
0.325 BSC
05
75
0.13
0.30
16.95 17.45
0.13
05
16.95 17.45
0.35
0.45
1.6 REF
Figure 3-3 80-pin Quad Flat Pack (QFP) Mechanical Information
MOTOROLA
DSP56009/D, Rev. 1
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3-7
Freescale Semiconductor, Inc.
Packaging
Ordering Drawings
ORDERING DRAWINGS
Complete mechanical information regarding DSP56009 packaging is available by
facsimile through Motorola's Mfax™ system. Call the following number to obtain
information by facsimile:
(602) 244-6591
Freescale Semiconductor, Inc...
The Mfax automated system requests the following information:
•
The receiving facsimile telephone number including area code or country
code
•
The caller’s Personal Identification Number (PIN)
Note: For first time callers, the system provides instructions for setting up a PIN,
which requires entry of a name and telephone number.
•
The type of information requested:
–
Instructions for using the system
–
A literature order form
–
Specific part technical information or data sheets
–
Other information described by the system messages
A total of three documents may be ordered per call.
The DSP56009 80-pin QFP package mechanical drawing is referenced as 841B-01.
3-8
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
SECTION
4
DESIGN CONSIDERATIONS
Freescale Semiconductor, Inc...
THERMAL DESIGN CONSIDERATIONS
An estimation of the chip junction temperature, TJ, in ˚C can be obtained from the
equation:
Equation 1: T J = T A + ( P D × R θJA )
Where:
TA = ambient temperature ˚C
RθJA = package junction-to-ambient thermal resistance ˚C/W
PD = power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case
thermal resistance and a case-to-ambient thermal resistance:
Equation 2: R θJA = R θJC + R θCA
Where:
RθJA = package junction-to-ambient thermal resistance ˚C/W
RθJC = package junction-to-case thermal resistance ˚C/W
RθCA = package case-to-ambient thermal resistance ˚C/W
RθJC is device-related and cannot be influenced by the user. The user controls the
thermal environment to change the case-to-ambient thermal resistance, RθCA. For
example, the user can change the air flow around the device, add a heat sink, change
the mounting arrangement on the Printed Circuit Board (PCB), or otherwise change
the thermal dissipation capability of the area surrounding the device on a PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow
is dissipated through the case to the heat sink and out to the ambient environment.
For ceramic packages, in situations where the heat flow is split between a path to the
case and an alternate path through the PCB, analysis of the device thermal
performance may need the additional modeling capability of a system level thermal
simulation tool.
MOTOROLA
DSP56009/D, Rev. 1
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4-1
Freescale Semiconductor, Inc.
Design Considerations
Thermal Design Considerations
The thermal performance of plastic packages is more dependent on the temperature
of the PCB to which the package is mounted. Again, if the estimations obtained from
RθJA do not satisfactorily answer whether the thermal performance is adequate, a
system level model may be appropriate.
Freescale Semiconductor, Inc...
A complicating factor is the existence of three common ways for determining the
junction-to-case thermal resistance in plastic packages:
•
To minimize temperature variation across the surface, the thermal resistance
is measured from the junction to the outside surface of the package (case)
closest to the chip mounting area when that surface has a proper heat sink.
•
To define a value approximately equal to a junction-to-board thermal
resistance, the thermal resistance is measured from the junction to where the
leads are attached to the case.
•
If the temperature of the package case (TT) is determined by a thermocouple,
the thermal resistance is computed using the value obtained by the equation
(TJ – TT)/PD.
As noted above, the junction-to-case thermal resistances quoted in this data sheet are
determined using the first definition. From a practical standpoint, that value is also
suitable for determining the junction temperature from a case thermocouple reading
in forced convection environments. In natural convection, using the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on
the case of the package will estimate a junction temperature slightly hotter than
actual temperature. Hence, the new thermal metric, Thermal Characterization
Parameter or ΨJT, has been defined to be (TJ – TT)/PD. This value gives a better
estimate of the junction temperature in natural convection when using the surface
temperature of the package. Remember that surface temperature readings of
packages are subject to significant errors caused by inadequate attachment of the
sensor to the surface and to errors caused by heat loss to the sensor. The
recommended technique is to attach a 40-gauge thermocouple wire and bead to the
top center of the package with thermally conductive epoxy.
4-2
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Design Considerations
Electrical Design Considerations
ELECTRICAL DESIGN CONSIDERATIONS
Freescale Semiconductor, Inc...
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields.
However, normal precautions are advised to avoid
application of any voltages higher than maximum rated
voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an
appropriate logic voltage level (e.g., either GND or VCC).
Use the following list of recommendations to assure correct DSP operation:
MOTOROLA
•
Provide a low-impedance path from the board power supply to each VCC
pin on the DSP, and from the board ground to each GND pin.
•
Use at least four 0.01–0.1 µF bypass capacitors positioned as close as
possible to the four sides of the package to connect the VCC power source
to GND.
•
Ensure that capacitor leads and associated printed circuit traces that
connect to the chip VCC and GND pins are less than 0.5 in per capacitor
lead.
•
Use at least a four-layer Printed Circuit Board (PCB) with two inner layers
for VCC and GND.
•
Because the DSP output signals have fast rise and fall times, PCB trace
lengths should be minimal. This recommendation particularly applies to
the address and data buses as well as the IRQA, IRQB, and NMI pins.
Maximum Printed Circuit Board (PCB) trace lengths on the order of
6 inches are recommended.
•
Consider all device loads as well as parasitic capacitance due to PCB
traces when calculating capacitance. This is especially critical in systems
with higher capacitive loads that could create higher transient currents in
the VCC and GND circuits.
•
All inputs must be terminated (i.e., not allowed to float) using CMOS
levels, except as noted in Section 1.
•
Take special care to minimize noise levels on the VCCP and GNDP pins.
•
If multiple DSP56009 devices are on the same board, check for cross-talk
or excessive spikes on the supplies due to synchronous operation of the
devices.
DSP56009/D, Rev. 1
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4-3
Freescale Semiconductor, Inc.
Design Considerations
Power Consumption Considerations
POWER CONSUMPTION CONSIDERATIONS
Power dissipation is a key issue in portable DSP applications. Some of the factors
which affect current consumption are described in this section. Most of the current
consumed by CMOS devices is Alternating Current (AC), which is charging and
discharging the capacitances of the pins and internal nodes.
Current consumption is described by the formula:
Freescale Semiconductor, Inc...
Equation 3: I = C × V × f
where:
C = node/pin capacitance in farads
V = voltage swing
f = frequency of node/pin toggle in hertz
Example 4-1 Current Consumption
For an I/O pin loaded with 50 pF capacitance, operating at 5.25 V, and with a 88 MHz clock,
toggling at its maximum possible rate (22 MHz), the current consumption is:
Equation 4:
I = 50 × 10
– 12
6
× 5.25 × 22 × 10 = 5.78mA
The Maximum Internal Current (ICCImax) value reflects the typical possible
switching of the internal buses on best-case operation conditions, which is not
necessarily a real application case. The Typical Internal Current (ICCItyp) value
reflects the average switching of the internal buses on typical operating conditions.
For applications that require very low current consumption:
4-4
•
Minimize the number of pins that are switching.
•
Minimize the capacitive load on the pins.
•
Connect the unused inputs to pull-up or pull-down resistors.
•
Disable unused peripherals.
•
Disable unused pin activity.
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
Design Considerations
Power Consumption Considerations
Current consumption test code:
Freescale Semiconductor, Inc...
org
TP1
MOTOROLA
p:RESET
jmp
org
movep
move
move
move
move
nop
rep
move
rep
mov
clr
move
rep
mac
move
jmp
nop
jmp
MAIN
p:MAIN
#$180000,x:$FFFD
#0,r0
#0,r4
#$00FF,m0
#$00FF,m4
#256
r0,x:(r0)+
#256
r4,y:(r4)+
a
l:(r0)+,a
#30
x0,y0,a
x:(r0)+,x0
a,p:(r5)
TP1
y:(r4)+,y0
MAIN
DSP56009/D, Rev. 1
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4-5
Freescale Semiconductor, Inc.
Design Considerations
Power-Up Considerations
POWER-UP CONSIDERATIONS
Freescale Semiconductor, Inc...
To power-up the device properly, ensure that the following conditions are met:
•
Stable power is applied to the device according to the specifications in Table
2-3 (DC Electrical Characteristics).
•
The external clock oscillator is active and stable.
•
RESET is asserted according to the specifications in Table 2-7 (Reset, Stop,
Mode Select, and Interrupt Timing).
•
The following input pins are driven to valid voltage levels: DR, PINIT,
MODA, MODB, and MODC.
Care should be taken to ensure that the maximum ratings for all input voltages obey
the restrictions on Table 2-1 (Maximum Ratings), at all phases of the power-up
procedure. This may be achieved by powering the external clock, hardware reset, and
mode selection circuits from the same power supply that is connected to the power
supply pins of the chip.
At the beginning of the hardware reset procedure, the device might consume
significantly more current than the specified typical supply current. This is because of
contentions among the internal nodes being affected by the hardware reset signal
until they reach their final hardware reset state.
4-6
DSP56009/D, Rev. 1
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MOTOROLA
Freescale Semiconductor, Inc.
SECTION
5
ORDERING INFORMATION
Consult a Motorola Semiconductor sales office or authorized distributor to determine
product availability and to place an order.
Freescale Semiconductor, Inc...
Table 5-1 Ordering Information
Supply
Voltage
Part
DSPE560091
DSPF560092
5V
DSPH560093
DSPI560094
Note:
1.
2.
3.
4.
5V
5V
5V
Pin Count
Frequency
(MHz)
Order Number
Quad Flat Pack
(QFP)
80
81
DSPE56009FJ81
88
DSPE56009FJ88
Quad Flat Pack
(QFP)
80
81
DSPF56009FJ81
88
DSPF56009FJ88
Quad Flat Pack
(QFP)
80
81
DSPH56009FJ81
88
DSPH56009FJ88
Quad Flat Pack
(QFP)
80
81
DSPI56009FJ81
88
DSPI56009FJ88
Package Type
The DSPE56009 includes a generic factory-programmed ROM and may be used for RAM-based
applications. For additional information on future part development, or to request specific ROMbased support, call your local Motorola Semiconductor sales office or authorized distributor.
The DSPF56009 includes factory-programmed ROM containing support for Dolby AC-3 for AudioVideo (A/V) applications. This part can be ordered only by customers licensed for Dolby
AC-3. To request specific support for this chip, call your local Motorola Semiconductor sales office or
authorized distributor.
The DSPH56009 includes factory-programmed ROM containing support for Dolby AC-3 with Digital
Versatile Disc (DVD) specifications. This part can be ordered only by customers licensed for Dolby
AC-3. To request specific support for this chip, call your local Motorola Semiconductor sales office or
authorized distributor.
The DSPI56009 includes factory-programmed ROM containing support for Digital Theater Systems
(DTS). This part can be ordered only by customers licensed for DTS. To request specific support for
this chip, call your local Motorola Semiconductor sales office or authorized distributor.
MOTOROLA
DSP56009/D, Rev. 1
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5-1
Freescale Semiconductor, Inc...
Freescale Semiconductor, Inc.
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are registered trademarks of Motorola, Inc.
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