ETC P0408FC05C

05156
P0408FC3.3C*
thru
P0408FC36C*
. . . engineered solutions for the transient environment™
BIDIRECTIONAL FLIP CHIP
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART Cards & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
0408
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
(Single Chip Shown)
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power Dissipation per Line (8/20µs)
✔ Monolithic Structure
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
CIRCUIT DIAGRAM
* U.S. Patent No. Des. “D456,367 S”
05156.R2 11/02
1
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P0408FC36C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp = 8/20µs) - See Figure 1
PPP
250
Watts
Operating Temperature
TJ
-55°C to 150°C
°C
TSTG
-55°C to 150°C
°C
PARAMETER
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
VWM
VOLTS
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
13.4
19.0
24.0
43.0
64.0
P0408FC3.3C
P0408FC05C
P0408FC08C
P0408FC12C
P0408FC15C
P0408FC24C
P0408FC36C
MAXIMUM
LEAKAGE
CURRENT
TYPICAL
CAPACITANCE
@8/20µs
VC @ IPP
@VWM
ID
µA
0V @ 1 MHz
C
pF
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
75
10
10
1
1
1
1
150
100
75
50
40
30
25
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
120
1,000
250W, 8/20µs Waveform
100
IPP - Peak Pulse Current - % of IPP
PPP - Peak Pulse Current - Watts
10,000
10
0.01
FIGURE 2
PULSE WAVE FORM
tf
100
Peak Value IPP
80
e-t
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
60
40
td = t I /2
PP
20
0
1
10
td - Pulse Duration - µs
100
1,000
0
5
10
15
t - Time - µs
20
25
* U.S. Patent No. Des. “D456,367 S”
05156.R2 11/02
2
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GRAPHS
FIGURE 3
POWER DERATING CURVE
100
Peak Pulse Power
8/20µs
80
% Of Rated Power
FIGURE 4
REFLOW SOLDER PROFILE
225°C
5-10 sec
60
200°C
Instantaneous
to 200°C
40
1-2 Minutes
to 150°C
20
1-2 Minutes to 25°C
100°C
Average Power
0
0
25
50
75
100
125
TL - Lead Temperature - °C
150
Pre-Heat
Time
Soldering
Time
Cool Down
Time
Note: This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR P0408FC05C
40
5 Volts per Division
30
20
10
0
ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0408FC05C
VC - Clamping Voltage - Volts
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
* U.S. Patent No. Des. “D456,367 S”
05156.R2 11/02
3
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P0408FC36C*
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
0408
Picture Not Available
PACKAGE DIMENSIONS
SIDE
A
B
C
G
TOP
E
F
H
END
I
DIM
MILLIMETERS
INCHES
A
0.56 NOM
0.022 NOM
B
0.86 NOM
0.034 NOM
C
0.99 ± 0.0254
0.039 ± 0.001
E
0.15 SQ
0.006 SQ
F
2.0 ± 0.0254
0.079 ± 0.001
G
0.15 NOM
0.006 NOM
H
0.127 MAX
0.005 MAX
I
MOUNTING PAD - Option 1
PAD DIMENSIONS
DIM Millimeters
D
A
C
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.5
Inches
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.02
0.003 MIN
0.406 NOM
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
TAPE & REEL ORIENTATION
NOTE:
Preferred: Using 0.1mm
(0.004”) stencil.
H
G
E
DIE
SOLDER
BUMP
A
C
D
E
F
G
H
I
0.076 MIN
I
F
Quad Die - 0408
SOLDER PADS
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
06021 Rev 3 - 11/02
TAPE & REEL ORDERING INFORMATION:
Surface mount product is taped and reeled in accordance with EIA-481.
Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0408FC05C-T75-1).
Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0408FC05C-T710-2).
* U.S. Patent No. Des. “D456,367 S”
05156.R2 11/02
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P0408FC36C*
PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
COPPER CONTACT 0.009” [0.23] DIA.
PAD DIMENSIONS
A
DIE
SOLDER
BUMP
DIM
Millimeters
Inches
A
F
0.51
0.15 SQ
0.020
0.006 SQ
G
H
0.71
0.99
0.028
0.039
I
0.51
0.020
H
G
NOTES:
1. Controlling dimensions in
inches.
2. Decimal tolerances for
mounting pad and
outline:
.xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”)
I
F
stencil.
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
06021 Rev 3 - 11/02
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without
notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final
judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance,
ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
* U.S. Patent No. Des. “D456,367 S”
05156.R2 11/02
5
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