05192 ULLC0402FC3.3C* thru Only One Name Means ProTek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers ✔ SMART Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns U0402 FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Six Voltage Types Ranging From 3.3V to 24V ✔ Low ESD Overshoot Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ LOW CAPACITANCE: 6pF ✔ LOW LEAKAGE CURRENT ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0402 ✔ Weight 0.73 milligrams (Approximate) ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb: 240-245°C Lead-Free: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel PIN CONFIGURATION *U.S. Patent No. 6,867,436 05192.R2 10/05 1 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature SYMBOL TJ VALUE -55°C to 150°C UNITS °C TSTG -55°C to 150°C °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1) ULLC0402FC3.3C ULLC0402FC05C ULLC0402FC08C ULLC0402FC12C ULLC0402FC15C ULLC0402FC24C RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE VWM VOLTS @ 1mA V(BR) VOLTS @VWM ID µA @0V, 1 MHz C pF 3.3 5.0 8.0 12.0 15.0 24.0 4.0 6.0 8.5 13.3 16.7 26.7 75 1.0 0.1 0.1 0.1 0.1 6 6 6 6 6 6 Note 1: All devices are bidirectional. *U.S. Patent No. 6,867,436 05192.R2 10/05 2 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* GRAPHS FIGURE 2 OVERSHOOT & CLAMPING VOLTAGE FOR ULLC0402FC05C 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 3 CAPACITANCE VS REVERSE VOLTAGE FOR ULLC0402FC05C 10 Cj - Capacitance - pF 8 6 4 2 0 0 1 2 3 4 5 6 VR - Reverse Voltage - Volts *U.S. Patent No. 6,867,436 05192.R2 10/05 3 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-265°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Temperature - °C Ramp-up Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat t 25°C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down *U.S. Patent No. 6,867,436 05192.R2 10/05 4 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* PACKAGE OUTLINE & DIMENSIONS U0402 SIDE B TOP C A PACKAGE OUTLINE PACKAGE DIMENSIONS D E F Metalized Die Contacts END DIM MILLIMETERS INCHES A B C D E F I 0.61 NOM 0.86 NOM 0.99 ± 0.0254 0.10 NOM 0.35 NOM 0.483 ± 0.0254 0.406 NOM 0.024 NOM 0.034 NOM 0.039 ± 0.001 0.004 NOM 0.014 NOM 0.019 ± 0.001 0.016 NOM NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”). I MOUNTING PAD PAD DIMENSIONS C D B SOLDER PAD A F E H DIE DIE CONTACTS MILLIMETERS INCHES A B C D E F G H I 0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13 0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005 NOTE: 1. Top view of tape. Metal contacts are face down in tape package. TAPE & REEL ORIENTATION G I SOLDER PRINT DIAMETER 0.010” 0.012” DIM Single Die - 0402 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULLC0402FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULLC0402FC05C-T710-2). NOTE: 1. Preferred: Using 0.1mm (0.004”) stencil. Outline & Dimensions: Rev 4 - 10/05, 06020 COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com *U.S. Patent No. 6,867,436 05192.R2 10/05 5 www.protekdevices.com