AN1603‐433 Multilayer Chip Antenna for 433MHz Wireless Communication 技术：＋８６ １５８－１０６２－２７０５ 销售：＋８６ １３１－４６７１－３３３１ RainSun Corporation http://www.rainsun.com 1 of 9 Jun, 2008 Ver.1.4 AN1603 Multilayer Chip Antenna ◆ Features y Light Li h weight i h andd low l profile fil 16.0mm(L)X3.1mm(W)X1.65mm(H) 16 0 (L)X3 1 (W)X1 65 (H) y Omni‐directional in azimuth Lead (Pb) Free ◆ Applications y 433MHz wireless communications y 433MHz Modules y Other ISM band 420MHz~660MHz Wireless Application Specifications Center frequency Peak gain Operation temperature Storage temperature VSWR Input Impedance Power handling Bandwidth Azimuth beamwidth Polarization RainSun Corporation http://www.rainsun.com 433MHz 0.5dBi -40 ~ +85 ˚C -40 ~ +85 ˚C 2.0 (Max) 50 Ohm 3W (Max) 8MHz Omni-directional Linear 2 of 9 Jun, 2008 Ver.1.4 Pin configuration 1 2 Pin No Pin assignment 1 Feed termination Feed termination 2 Feed point mark 3 Solder termination 3 Dimensions Symbol Dimensions (mm) A 16.00±0.10 B 3.10±0.10 C 0.60±0.05 H 1.65±0.20 PCB foot printer RainSun Corporation http://www.rainsun.com 3 of 9 Jun, 2008 Ver.1.4 Recommended Test Board Pattern Top view Bottom view 50 Ohm Transmission line Unit : cm Board thickness : 0.6mm Board material : FR4 Ground Plane SMA connector Fig-1 Testing Setup Measurement Testing Instrument: Anritsu 37369C VNA(Vector Network Anritsu 37369C VNA(Vector Network Analyzer) VNA calibrate with 1 path reflection only calibration sequence on test board feed point. The test board dimension and it’s layout is the same as recommended Test Board. RainSun Corporation http://www.rainsun.com 4 of 9 Jun, 2008 Ver.1.4 Typical Electrical Characteristics Return loss 433 MHz Smith Chart Marker data: 1 : f 430 MHz 1 : f=430 MHz 2 : f=433 MHz 3 : f=436 MHz RainSun Corporation http://www.rainsun.com 5 of 9 Jun, 2008 Ver.1.4 3D P tt 3D Pattern Theta Free-Spec, 433 MHz Phi Free-Spec, 433 MHz Total Free-Spec, 433 MHz RainSun Corporation http://www.rainsun.com 6 of 9 Jun, 2008 Ver.1.4 Typical Soldering Profile for Lead‐free Process Peak temp 340°C Temperature ( °C ) 340°C 300°C 150°C 5 sec. 25 sec. Pre-heating Time (sec.) Do not exceed 30 secs. Reflow Soldering 10 sec, max Teemperature ( °C ) 260°C 230°C 180°C 30 sec. 60 sec. Pre-heating Time (sec.) RainSun Corporation http://www.rainsun.com 7 of 9 Jun, 2008 Ver.1.4 Packing Blister Tape Specifications Symbol Dimension Tolerance Unit W 24.00 ± 0.30 mm P 8.00 ± 0.10 mm P2 2.00 ± 0.10 mm Ao 4.70 + 0.10 ‐3.20 mm Bo 16.20 ± 0.10 mm Ko 1.90 ± 0.10 mm F 11.50 ± 0.10 mm E 1.75 ± 0.10 mm D 1.50 + 0.10 ‐ 0.00 mm P Po 4 00 4.00 ± 0.10 0 10 mm t 0.30 ± 0.05 mm RainSun Corporation http://www.rainsun.com 8 of 9 Jun, 2008 Ver.1.4 Reel Specifications Quantity Tape Width Per Reell ( (mm) ) 3,000 24 RainSun Corporation http://www.rainsun.com A ( (mm) ) C ( (mm) ) B (mm) B (mm) E ( (mm) ) W ( (mm) ) W1 ( (mm) ) 330±1 13.0±0.5 100.0±0.5 2.2±0.5 24.0±0.5 28.9±0.2 9 of 9 Jun, 2008 Ver.1.4