TFMM5..0 Vishay Telefunken Photo Modules for PCM Remote Control Systems Available types for different carrier frequencies Type TFMM 5300 TFMM 5360 TFMM 5380 TFMM 5560 fo 30 kHz 36 kHz 38 kHz 56 kHz Type TFMM 5330 TFMM 5370 TFMM 5400 fo 33 kHz 36.7 kHz 40 kHz Description The TFMM5..0 – series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on PC board, the epoxy package is designed as IR filter. The demodulated output signal can directly be decoded by a microprocessor. The main benefit is the reliable function even in disturbed ambient and the protection against uncontrolled output pulses. 95 10266 Features Photo detector and preamplifier in one package 5 Volt supply voltage, low power consumption Output active low TTL and CMOS compatibility Internal filter for PCM frequency Continuous transmission possible (tpi/T0.4) High immunity against ambient light SMD High shielding against electric field disturbance Block Diagram 2 Control Circuit Input 100 k 3 PIN AGC Band Pass VS OUT Demodulator 1 GND 94 8136 Document Number 82003 Rev. 3, 14-Sep-00 www.vishay.com 1 (10) TFMM5..0 Vishay Telefunken Absolute Maximum Ratings Tamb = 25_C Parameter Supply Voltage Supply Current Output Voltage Output Current Junction Temperature Storage Temperature Range Operating Temperature Range Power Consumption Soldering Temperature Test Conditions (Pin 2) (Pin 2) (Pin 3) (Pin 3) (Tamb 85 C) t 10 s, 1 mm from case Symbol VS IS VO IO Tj Tstg Tamb Ptot Tsd Value –0.3...6.0 5 –0.3...6.0 5 100 –40...+85 –25...+85 50 230 Unit V mA V mA C C C mW C Typ 0.5 1.0 35 Max 0.8 Unit mA mA m 250 mV Basic Characteristics Tamb = 25_C Parameter Supply Su ly Current (Pin 2) Transmission Distance Output Voltage Low (Pin 3) Irradiance (30 – 40 kHz) Irradiance (56 kHz) Irradiance Directivity Test Conditions VS = 5 V, Ev = 0 VS = 5 V, Ev = 40 klx, sunlight Ev = 0, test signal see fig.7, IR diode TSIP5201, IF = 1.5 A IOSL = 0.5 mA,Ee = 0.7 mW/m2, f = fo, tp/T = 0.4 Pulse width tolerance: tpo = tpii±160 ms, ms test signal (see fig.7) Angle of half transmission distance Symbol ISD ISH d Min 0.4 VOSL Ee min 0.6 mW/m 2 Ee min 0.8 mW/m 2 ±40 W/m 2 deg Ee max ϕ1/2 20 Application Circuit 330 W *) 2 TFM. 5..0 TSUS 5... TSIP 5... 3 4.7 mF *) + 5V **) >10 kW optional mC 1 94 8137 GND *) only necessary to suppress power supply disturbances **) tolerated supply voltage range : 4.5V< VS < 5.5 V www.vishay.com 2 (10) Document Number 82003 Rev. 3, 14-Sep-00 TFMM5..0 Vishay Telefunken Typical Characteristics (Tamb = 25_C unless otherwise specified) 0.8 0.6 0.4 E e min 0.2 4 Ee min – Threshold Irradiance ( mW/m 2 ) /e E – Rel. Responsitivity 1.0 f = f0"5% Df ( 3 dB ) = f0 / 10 3 2 1 0.0 0 0.7 0.8 0.9 1.0 1.1 1.3 1.2 f / f0 – Relative Frequency 94 8143 Input Burst Duration 600 400 200 l = 950 nm, Optical Test Signal, Fig.7 0 1 10 100 Ee – Irradiance ( 95 10187 1000 2.0 1.6 100 f = f0 10 10 kHz 1 100 Hz mW / m2 10000 ) Ee min – Threshold Irradiance ( mW/m 2 ) 1 0.1 1 E – Irradiance ( 10 W / m2 ) Figure 3. Sensitivity in Bright Ambient Document Number 82003 Rev. 3, 14-Sep-00 1 10 1000 100 DVs RMS – AC Voltage on DC Supply Voltage ( mV ) Figure 5. Sensitivity vs. Supply Voltage Disturbances 10 0.1 0.01 0.1 95 10194 Figure 2. Sensitivity in Dark Ambient Ee min – Threshold Irradiance ( mW/m 2 ) 1.2 0.1 0.1 95 10189 0.8 Figure 4. Sensitivity vs. Electric Field Disturbances Ee min – Threshold Irradiance ( mW/m2 ) tpo – Output Pulse Length ( m s ) 1000 0.4 E – Field Strength of Disturbance ( kV / m ) 95 10188 Figure 1. Frequency Dependence of Responsivity 800 0 100 1.0 0.8 Sensitivity in dark Ambient 0.6 0.4 0.2 0.0 –30 95 10195 0 30 90 60 Tamb – Ambient Temperature ( °C ) Figure 6. Sensitivity vs. Ambient Temperature www.vishay.com 3 (10) TFMM5..0 Vishay Telefunken Optical Test Signal ( IR diode TSIP 5201, IF = 1.5 A, 30 pulses, f = f0, T = 10 ms ) t tpi * T * tpi w 400 ms is recommended for optimal function Output Signal VO VOH 94 8133 1.0 T on ,T off - Output Pulse Length ( ms ) Ee tpo = tpi "160 ms 0.8 Ton 0.6 Toff 0.4 0.2 l = 950 nm, Optical Test Signal, Fig.8 0.0 0.1 VOL t 1 10 100 1000 10000 Ee – Irradiance ( mW / m2 ) 95 10191 tpo Figure 10. Output Pulse Diagram Figure 7. Output Function Optical Test Signal 1.0 600 ms t 600 ms T = 60 ms 94 8134 VO Output Signal, ( see Fig.10 ) Is – Supply Current ( mA ) Ee Vs = 5 V 0.8 0.6 0.4 0.2 VOH 0.0 –30 VOL Ton t Toff S ( l )rel – Relative Spectral Sensitivity Ee min – Threshold Irradiance ( mW/m 2 ) 8 6 4 2 0.15 0.25 0.35 tp / T – Duty Cycle 95 10190 Figure 9. Sensitivity vs. Duty Cycle www.vishay.com 4 (10) 30 60 90 Figure 11. Supply Current vs. Ambient Temperature Figure 8. Output Function 0 0.05 0 Tamb – Ambient Temperature ( °C ) 94 8150 1.2 1.0 0.8 0.6 0.4 0.2 0 750 0.45 94 8408 850 950 1050 1150 l – Wavelength ( nm ) Figure 12. Relative Spectral Sensitivity vs. Wavelength Document Number 82003 Rev. 3, 14-Sep-00 TFMM5..0 Vishay Telefunken –20 –10 0 10 –20 20 –30 –10 0 0.2 0 10 20 –30 fy fx –40 –40 0.6 0.4 0.2 0 0.2 0.6 0.4 drel – Relative Transmission Distance 0.6 95 10192 Figure 13. Vertical Directivity ϕy 95 10193 0.4 0.2 0.4 0.6 drel – Relative Transmission Distance Figure 14. Horizontal Directivity ϕx Soldering Pads for Reflow Soldering 2.2 2.8 2.8 2.2 2.0 1.6 1.7 GND1 (Case GND) 1.7 1.6 1.6 Note: Mounting area on the PC board for TFMM.... series has to be solid grounded and has to be insulated by resist. 95 10185 Pinning Light Receiving Window Case GND Vcc GND1 Out GND2 95 10186 Document Number 82003 Rev. 3, 14-Sep-00 www.vishay.com 5 (10) TFMM5..0 Vishay Telefunken Dimensions in mm 15904 www.vishay.com 6 (10) Document Number 82003 Rev. 3, 14-Sep-00 TFMM5..0 Vishay Telefunken Operating Instructions Reflow Soldering DReflow soldering must be done within 48 hoursstored under max. 30°C, 80% RH after opening envelop DRecommended soldering paste (composition: SN 63%, Pb 37%) Melting temperature 178 to 192°C DApply solder paste to the specified soldering padsusing a dispenser or by screen printing. DRecommended thickness of metal mask is 0.2 mmfor screen printing. DThe recommended reflow furnace is a combinationtype with upper and lowewr heaters. DSet the furnace temperatures for pre-heating andheating in accordance with the reflow temperatureprofile as schown below. Excercise extreme care tokeep the maximum temperature below 230_C. Thefollowing temperature profile means the temperature at the device surface. Since temperature difference occurs between the work and the surface of the circuit board depending on the pes of circuit board or reflow furnace, the operating conditions should be verified prior to start of operation. DHandling after reflow should be done only after the work surface has been cooled off. Manual Soldering DUse the 6/4 solder or the solder containing silver. DUse a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300_C. DFinish soldering within three seconds. DHandle products only after the temperature is cooled off. Cleaning DPerform cleaning after soldering strictly in conformance to the following conditions: Cleaning agent: 2-propanol (isopropyl alcohol). Commercially available grades (industrial use) should be used. Demineralized or distilled water having a resistivity of not less than 500 m corresponding to a conductivity of 2 mS/m. DTemperature and time: 30 seconds under the temperature below 50_C or 3 minutes below 30_C. DUltrasonic cleaning: Below 20 W. 94 8625 300 max. 240 °C ca. 230 °C 10 s 250 215 °C Temperature (° C ) 200 150 max. 160 °C max. 40 s 100 90 – 120 s full line : typical dotted line : process limits 50 2–4 K / s Lead Temperature 0 50 100 150 200 250 Time ( s ) Document Number 82003 Rev. 3, 14-Sep-00 www.vishay.com 7 (10) TFMM5..0 Vishay Telefunken Taping Specifications (1) Shape and dimensions of reels (in accordance with EIAJRC-1009B); unit in mm ∅ 13.5 12.5 ∅ 24.8 23.2 2.6 1.4 ∅ 101 99 ∅ 332 328 2.5 1.5 (2) 18.4 16.4 Label 95 10204 Dimensions of tape 8.8 8.6 95 10200 4.1 3.9 1.85 1.65 R=0.80 0.75 7,6 7,4 16.3 15.7 8.4 8.2 0.35 0.25 3.7 www.vishay.com 8 (10) 2.05 1.95 12.1 11.9 Direction of Pulling Out Document Number 82003 Rev. 3, 14-Sep-00 TFMM5..0 Vishay Telefunken (3) Configuration of tapes Empty Parts mounted Empty Leader End Start < > < 40 mm min. (4) > < > 40 mm min. 200 mm min. Quantity 1000 pcs. per reel Packing (1) Dampproof packing Products will be packed in anti-humidity aluminium bags to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant with moisture indicators. In the event bags absorb moisture, the indicators change their color from blue to pink. Aluminiumbag Desiccant Label Reel 95 10203 (2) Recommended method of storage Dry box storage is recommended to prevent the parts from moisture absorption. The following conditions should be preserved if dry boxes are not available. Storage temperature: 10 – 30_C Storage humidity: 60% RH max In case of moisture absorption the device will recover to the former conditon by drying under the following recommended conditions: taped version: untaped version: 60_C/48 h 125_C/2 h Lot Number 3 digits 5 18 Last digit of calendar year Month code Lot number is labeled on the aluminum bag and also indicated on the reverse side of each part. Document Number 82003 Rev. 3, 14-Sep-00 www.vishay.com 9 (10) TFMM5..0 Vishay Telefunken Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 )7131 67 2831, Fax number: 49 ( 0 )7131 67 2423 www.vishay.com 10 (10) Document Number 82003 Rev. 3, 14-Sep-00