RSG CX-7-SM1

CX-7-SM CRYSTAL
20 MHz to 50 MHz
Ultra-Miniature, Low Profile
AT-Cut Surface Mount Crystal
™
actual size
DESCRIPTION
side view
STATEK’s ultra-miniature, low profile CX-7-SM AT-cut crystals
in leadless ceramic packages are designed for surface
mounting on printed circuit boards or hybrid circuits. These
crystals are low profile and have a very small land pattern.
Maximum process temperature should not exceed 260OC.
PACKAGE DIMENSIONS
FEATURES
Designed for surface mount applications using infrared,
vapor phase, wave solder or epoxy mount techniques
Low profile (less than 1.2mm) hermeitcally sealed
ceraminc package
A
TOP
BOTTOM
Excellent aging characteristics
D
Available with glass or ceramic lid
High shock and vibration resistance
B
Custom designs available
C
Full military testing available
Designed and manufactured in the USA
APPLICATIONS
Industrial, Computer & Communications
General purpose clock oscillator
TYP.
MAX.
DIM
INCHES
mm
INCHES
mm
A
.157
4.00
.162
4.11
B
.072
1.83
.085
2.16
C
-
-
D
.035
0.89
DIM “C”
GLASS LID
see below
.045
1.14
CERAMIC LID
PCMCIA
MAX
INCHES
mm
INCHES
mm
Fax, Modem and LAN
SM1
.045
1.14
.050
1.27
Smart card
SM2
.046
1.17
.051
1.30
PDA and notebook computers
SM3
.048
1.22
.053
1.35
Handheld instrumentation
Cellular
SUGGESTED LAND PATTERN
PCS
GRID COURTYARD
Military & Aerospace
.177[4.50]
Airborne hybrid computer
.121[3.07]
Military high speed modem
MCM
.092
[2.34]
.055[1.40]
.067[1.70]
10155 - Rev A
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany www.rsg-electronic.de
SPECIFICATIONS
TERMINATIONS
Specifications are typical at 25oC unless otherwise noted.
Specifications are subject to change without notice.
49 MHz
Designation
SM1
SM2
SM3
Motional Resistance R1(k⍀)
14
Motional Capacitance C1 (fF)
2.4
Quality Factor Q (k)
Termination
Gold Plated
Nickel, Solder Plated
Nickel, Solder Plated and Solder Dipped
100
Shunt Capacitance Co (pF)
0.8
PACKAGING
Load Capacitance
A +_ 0.01% ( +_ 100ppm)
B +_ 0.1%
C +_ 1.0%
10pF (unless specified by customer)
Drive Level
200 ␮W MAX.
Frequency-Temperature
Stability**
-10OC to +70OC from
Calibration Tolerance*
+
_
10ppm
-40 C to +85 C from
+
_
35ppm
-55OC to +125OC from
+
_
50ppm
O
O
Aging, first year
5ppm MAX.
Shock, survival***
5,000g peak 0.3 msec., 1/2 sine
Vibration, survival
20g rms, 10-2,000 Hz random
Operating Temperature
-10OC to +70OC Commercial
-40OC to +85OC Industrial
-55OC to +125OC Military
Storage Temperature
-55OC to +125OC
CX-7-SM
-Tray Pack (Standard)
-16mm tape, 7” or 13” reels (Optional)
Per EIA 481 (see data sheet 10109)
EQUIVALENT CIRCUIT
C0
1
L1
C1
R1
2
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
CONVENTIONAL CMOS
PIERCE OSCILLATOR CIRCUIT
Max Process Temperature 260OC for 20 sec.
Rf
Note: The characteristics of the frequency temperature stability
follow that of AT-Cut thickness-shear mode.
BUFFER
AMPLIFIER
CS
* Tighter tolerances available as low as +_ 5 ppm
** Does not include calibration tolerance
*** Higher shock version available
CG
OSC
Freq (fO)
RA
Contact factory for
design guidelines
CX-7
CD
CX-1
HOW TO ORDER CX-7-SM CRYSTALS
CX-7
“S” if special or
custom design.
*Other calibration fill in ppm.
C=Ceramic Lid
Blank=Glass Lid
SM1
49 MHz
SM1
SM2
SM3
Frequency
(
50
*Calibration
Tolerance
@25OC
(A)
(B)
(C)
/
50
/
100
/
I
)
*Frequency
Total Frequency Temp. Range:
Stability over Tolerance
C = Commercial
Temp. Range
I = Industrial
M = Military
S = Specify
10155 - Rev A
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de