FOX FVXO

Model: FVXO-HC52 SERIES
HCMOS 5 x 3.2mm 2.5V V C X O
Freq: 0.75 MHz to 180MHz
Rev. 04/08/2008
Features
XTREMELY Low Jitter
Low Cost
XPRESS Delivery
Frequency Resolution to six decimal places
Absolute Pull Range (APR) of ±50ppm
-20 to +70°C or -40 to +85°C operating temperatures
Tri-State Enable / Disable Feature
Industry Standard Package, Footprint & Pin-Out
Fully RoHS compliant
Gold over Nickel Termination Finish
Serial ID with Comprehensive Traceability
V DD
VC
Enable / Disable
FOX
X PRESSO
Frequency
Control
Circuit
OUTPUT
ASICs
Applications
•
•
•
•
•
•
•
•
•
ANY application requiring an oscillator
SONET
Ethernet
Storage Area Network
Broadband Access
Microprocessors / DSP / FPGA
Industrial Controllers
Test and Measurement Equipment
Fiber Channel
GND
For more information -- Click on the drawing
Description
The Fox XPRESSO Crystal Oscillator is a
breakthrough in configurable Frequency Control
Solutions. XPRESSO utilizes a family of
proprietary ASICs, designed and developed by
Fox, with a key focus on noise reduction
technologies.
The 3rd order Delta Sigma Modulator reduces
noise to the levels that are comparable to
traditional Bulk Quartz and SAW oscillators.
The ASICs family has ability to select the output
type, input voltages, and temperature
performance features.
With the XPRESS lead-time, low cost, low noise,
wide frequency range, excellent ambient
performance, XpressO is an excellent choice
over the conventional technologies.
Contents
page
Model Selection & Part Number Guide
2
Electrical Characteristic
3
Absolute Maximums
4
Output Wave Characteristics
4
Phase Noise
5
Jitter
5
Pin Assignment
6
Recommended Circuit
6
Reflow
6
Mechanical Drawing and Pad Layout
7
Tape and Reel Specification
8
Label
8
Traceability – LOT Number & Serial Identification 9
RoHS Material Declaration
10
SGS Report
11 & 12
Mechanical Test
13
Burn-In Test
13
MTTF / FITS calculations
14
15
Other XPRESSO Links
Fox Contact Information
15
Finished XPRESSO parts are 100% final tested.
Page 1 of 15
FOXElectronics 5570 Enterprise Parkway Fort Myers, Florida 33905 USA +1.239.693.0099 FAX +1.239.693.1554 http://www.foxonline.com
EMEA Tel/Fax: +44 .1767.312632 | Asia Hong Kong Tel: +852.2854.4285 Fax +852.2854.4282
Taiwan Tel: +886.2.22073427 Fax +886.2.22073486 | Japan Tel: +81.3.3374.2079 Fax: +81.3.3374.5221
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
Model Selection Guide & Fox Part Number
STEP #1: Customer selects the Model Description and provides to Fox Customer Service
Model Description
FVXO – H C 5 2 B R – 35.328
Frequency (in MHz)
Resolutions to 6 places
past the decimal point
blank = -20°C to +70°C
H = HCMOS
C = Ceramic
Q = Quartz
L = LVDS
P = LVPECL
X = HCMOS (comp 2nd Output)
5 = 5 x 3.2mm
7 = 7 x 5mm
3 = 3.3 V
2 = 2.5 V
R = -40°C to +85°C
B = ±50ppm Absolute Pull Range
STEP #2: The Fox Customer Service team provides a customer specific Part Number
for use on their Bill Of Materials (BOM).
Fox Part Number
(The assigned Fox Part Number must be on the BOM – not the above Model Description)
(This will ensure receipt of the proper part)
The 1st Field
Product Code #
793A = FVXO–HC52
793 = FVXO–HC53
7 9 3A – 3 5 . 3 2 8 – 2
The 3rd Field
Fox Internally Generated Number
The 2nd Field
The Customer’s Frequency
(If any specification changes,
the last digits change)
(The same specs for a different customer
also changes the last digits)
This example, FVXO-HC52BR-35.328 = Voltage Controlled, HCMOS Output, Ceramic, 5 x 3.2mm Package, 2.5V,
±50 PPM Absolute Pull Range, -40 to +85°C Temperature Range, at 35.328 MHz
Absolute Maximum Ratings
(Useful life may be impaired. For user guidelines only, not tested.
Operation is only guaranteed for voltage and temperature specifications in Electrical Characteristics section.)
Parameters
Input Voltage
Operating Temperature
Storage Temperature
Junction Temperature
ESD Sensitivity
Symbol
(unless otherwise noted)
Human Body Model
–0.5V to +5.0V
–55°C to +105°C
–55°C to +125°C
150°C
> 1 kV
VDD
TAMAX
TSTG
HBM
Maximum Value
Condition
Page 2 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
Electrical Characteristics
Parameters
Symbol
Frequency Range
Absolute Pull Range Note 1
FO
APR
TO
Standard operating
Optional operating
Storage
Standard
0.75 ~ 20 MHz
20+ ~ 50 MHz
50+ ~ 100 MHz
100+ ~ 130 MHz
130+ ~ 160 MHz
160+ ~ 180 MHz
Standard
Temperature Range
TSTG
VDD
Supply Voltage
Input Current (@ 15pF LOAD)
IDD
Output Load
Start-Up Time
Output Enable / Disable Time
Moisture Sensitivity Level
Termination Finish
Condition
HCMOS
TS
MSL
JEDEC J-STD-20
Maximum Value
(unless otherwise noted)
0.750 to 180.000 MHz
± 50 ppm MIN
-20°C to +70°C
-40°C to +85°C
-55°C to +125°C
2.5V ± 5%
22 mA
25 mA
29 mA
32 mA
35 mA
37 mA
15 pF
10 mS
100 nS
1
Au
Note 1 – Inclusive of 25°C tolerance, operating temperature range, input voltage change, load change, aging, shock and vibration.
Frequency Control (VC) Input -Parameters
Symbol
pin # 1
Condition
1
Control Voltage Tuning Slope
2
Control Voltage Linearity
Control Voltage Tuning Range
Modulation Bandwidth
Nominal Control Voltage
0V to VDD
LVC
VC
BW
VCNOM
@ f0
Maximum Value
(unless otherwise noted)
40 ~ 75 ppm/V Typ
± 10%
0V ~ 2.5V
10 kHz Min
1.25V
NOTES:
Actual slope is affected by frequency and accuracy settings.
For an example of linearity, see the graph below. (The middle line represents the default Fox factory setting)
FVXO Oscillator Pull
@25°C - (range of typical responses)
200.0
150.0
100.0
50.0
0.0
-50.0
-100.0
-150.0
0.
00
0
0.
12
5
0.
25
0
0.
37
5
0.
50
0
0.
62
5
0.
75
0
0.
87
5
1.
00
0
1.
12
5
1.
25
0
1.
37
5
1.
50
0
1.
62
5
1.
75
0
1.
87
5
2.
00
0
2.
12
5
2.
25
0
2.
37
5
2.
50
0
2
Pull from Vc = 1.25V (PPM)
1
Vc = Voltage applied to Pin #1
Page 3 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
2
FVXO-HC52 Series
Output Wave Characteristics
Parameters
Symbol
Output LOW Voltage
VOL
Output HIGH Voltage
VOH
Output Symmetry (See Drawing Below)
Output Enable (PIN # 2) Voltage
VIH
Output Disable (PIN # 2) Voltage
VIL
Cycle Rise Time (See Drawing Below)
TR
Cycle Fall Time (See Drawing Below)
TF
Maximum Value
Condition
(unless otherwise noted)
0.75 to 160 MHz
160+ to 180 MHz
0.75 to 160 MHz
160+ to 180 MHz
@ 50% VDD Level
10% VDD
20% VDD
90% VDD MIN
80% VDD MIN
45% ~ 55%
≥ 70% VDD
0.75 to 160 MHz
160+ to 180 MHz
0.75 to 160 MHz
160+ to 180 MHz
≤ 30% VDD
3.5 nS (10%~90% VDD)
2.5 nS (20%~80% VDD)
3.5 nS (90%~10% VDD)
2.5 nS (80%~20% VDD)
If 30% to 70% times are used, Rise and Fall times change to 1.5 nS from 0.75 to 250MHz
If 20% to 80% times are used, Rise and Fall times change to 2 nS from 0.75 to 150MHz
Rise Time / Fall Time Measurements
10% to 90%
0V to VDD
30% to 70%
20% to 80%
90% - 10%
10% - 90%
Rise Time
80 - 20
Times
Fall Time
Oscillator Symmetry
Off Time
1/2 Period
On Time
1/2 Period
50% VDD
Period
Ideally, Symmetry should be 50/50 -- Other expressions are 45/55 or 55/45
Page 4 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
70 - 30
Times
FVXO-HC52 Series
Phase Noise
0 dBc
2.5V Phase Noise Graphs
-10dBc
(dBc / Hz) vs. offset frequency
-20dBc
-30dBc
-40dBc
-50dBc
Data Collected using HP 3048A
Four Frequencies from Jitter Tables
156.25MHz
-60dBc
62.5 MHz only to 2 MHz offset Equipment Limitation
-70dBc
125MHz
-80dBc
-90dBc
-100dBc
62.5 MHz
-110dBc
-120dBc
-130dBc
156.25MHz
62.5 MHz
-140dBc
-150dBc
106.25 MHz
125MHz
-160dBc
10
100
1k
10k
Offset Frequency
100k
1M
10M
40M
(10Hz to 40MHz)
Jitter is frequency dependent. Below are typical values at select frequencies.
Phase Jitter & Time Interval Error (TIE)
Frequency
Phase Jitter
TIE
(12kHz to 20MHz)
(Sigma of Jitter Distribution)
Units
62.5 MHz
106.25 MHz
125 MHz
156.25 MHz
2.1
1.2
1.1
0.8
3.1
3.5
2.7
3.7
pS RMS
pS RMS
pS RMS
pS RMS
Phase Jitter is integrated from HP3048 Phase Noise Measurement System; measured directly into 50 ohm input; VDD = 2.5V.
TIE was measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software; VDD = 2.5V.
Per MJSQ spec (Methodologies for Jitter and Signal Quality specifications)
Random & Deterministic Jitter Composition
Frequency
62.5 MHz
106.25 MHz
125 MHz
156.25 MHz
Random (Rj)
Deterministic (Dj)
Total Jitter (Tj)
(pS RMS)
(pS P-P)
1.3
1.4
1.3
1.4
8.4
8.3
6.7
9.7
(14 x Rj) + Dj
27.6 pS
27.7 pS
25.6 pS
29.5 pS
Rj and Dj, measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software.
Per MJSQ spec (Methodologies for Jitter and Signal Quality specifications)
Page 5 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
Pin Description and Recommended Circuit
Pin #
Name
1
2
3
4
5
6
Type
VC
Function
Control
Logic
Ground
Output
Hi Z
Power
1
E/D
GND
Output
N. C.
2
VDD
Frequency Control by changing voltage
Enable / Disable Control of Output (0 = Disabled)
Electrical Ground for VDD
HCMOS Oscillator Output
No Connection (Factory Use ONLY)
Power Supply Source Voltage
NOTES:
1
2
VC
E/D
GND
1
2
3
Includes pull-up resistor to VDD to provide output when the pin (2) is No Connect.
Installation should include a 0.01µF bypass capacitor placed between VDD
(Pin 6) and GND (Pin 3) to minimize power supply line noise.
6
5
4
VDD
0.01 F
VC
#1
#6
E/D
#2
#5
#3
#4
VDD
N. C.
Output
GND
NC
OUT
HCMOS LOAD
(15 pF)
Terminations as viewed from the Top
Enable / Disable Control
Pin # 2 (state)
Output (Pin # 4)
OPEN (No Connection)
“1” Level VIH ≥ 70% VDD
“0” Level VIL ≤ 30% VDD
ACTIVE Output
ACTIVE Output
High Impedance
Soldering Reflow Profile
(2 times Maximum at 260°C for 10 seconds MAX)
tp
260°C
225°C
Ramp-Up
3°C/s Max
50±10 Seconds
Above 225°C Reflow Area
180°C
160°C
10 Seconds Max
within 5°C of 260°C peak
120 ± 20 Seconds
In Pre-heating Area
25°C
400 Seconds MAX from +25°C to 260°C peak
Page 6 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
Ramp Down
Not to exceed 6°C/s
FVXO-HC52 Series
Mechanical Dimensional Drawing & Pad Layout
5.15 Max
#6
TOP
VIEW
#5
#4
X PRESS O
#1
#2
3.35 Max
Actual part marking
is depicted.
See Traceability (pg. 9)
for more information
#3
0.5
1.4 Max
2.54
1.27
#1
#6
#2
#5
#3
#4
1.2
0.64
Recommended
Solder Pad Layout
2.54
0.8
1.29
2.25
1.27
1.24
Pin Connections
#1) VC
#4) Output
#2) E/D
#5) NC
#3) GND
#6) VDD
Drawing is for reference to critical specifications defined by size measurements.
Certain non-critical visual attributes, such as side castellations, reference pin shape, etc. may vary
Page 7 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
Tape and Reel Dimensions
4.0mm
Ø1.5mm
7.5mm
5.5mm
16mm
12mm
2.15mm
8.0mm
2k Reel Dimensions
in mm
1k Reel Dimensions
in mm
2.0
2.0
Ø13.0
Ø21.0
178.0
62.0
120°
Ø21.0
Ø13.0
2.0
2.0
255.0
80.0
2.0
17.5
17.5
Labeling
(Reels and smaller packaging are labeled with the below)
793A-35.328-2
• Fox Part Number: 793A-35.328-2
• Quantity:
• Description:
• Date Code
2000 pieces
FVXO-HC52BR-35.328
0745
FVXO-HC52BR-35.328
th
(YYWW 2007 45 wk)
•
LOT #
24435
If traceability should become necessary
An additional identification code is contained internally if tracking should ever be necessary
Page 8 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
Traceability – LOT Number & Serial Identification
LOT Number
The LOT Number has direct ties to the customer purchase order. The LOT Number is marked on the
“Reel” label, and also stored internally on non-volatile memory inside the XPRESSO part. XPRESSO parts
that are shipped Tape and Reel, are also placed in an Electro Static Discharge (ESD) bag and will have the
LOT Number labeled on the exterior of the ESD bag.
It is recommended that the XPRESSO parts remain in this ESD bag during storage for protection and
identification.
If the parts become separated from the label showing the LOT Number, it can be retrieved from inside one
of the parts, and the information that can be obtained is listed below:
•
•
•
•
•
Customer Purchase Order Number
Internal Fox Sales Order Number
Dates that the XPRESSO part was shipped from the factory
The assigned customer part number
The specification that the part was designed for
Serial Identification
The Serial ID is the individualized information about the configuration of that particular XPRESSO part. The
Serial ID is unique for each and every XPRESSO part, and can be read by special Fox equipment.
With the Serial ID, the below information can be obtained about that individual, XPRESSO part:
•
•
•
•
•
•
•
Equipment that the XPRESSO part was configured on
Raw material used to configure the XPRESSO part
Traceability of the raw material back to the foundries manufacturing lot
Date and Time that the part was configured
Any optimized electrical parameters based on customer specifications
Electrical testing of the actual completed part
Human resource that was monitoring the configuration of the part
Fox has equipment placed at key Fox locations World Wide to read the Lot Identification and Serial
Number of any XPRESSO part produced and can then obtain the information from above within 24 hours
Page 9 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
RoHS Material Declaration
Material Name
Cover
Base
Kovar
Ceramic
+ Metallization
+ Nickel Plating
+ Gold Plating
+Seal ring
Crystal
Content
(mg)
Content
(wt%)
(CAS Number)
Nickel (Ni)
1.890
3.09%
7440-02-0
Cobalt (Co)
1.113
1.82%
7440-48-4
Iron (Fe)
3.540
5.78%
7439-89-6
Alumina (Al2O3)
35.484
57.98%
1344-28-1
Silicon Oxide (SiO2)
1.733
2.83%
14808-60-7
Chromium Oxide (Cr2O3)
0.268
0.44%
1308-38-9
Molybdenum Oxide (MoO2)
0.364
0.59%
18868-43-4
Magnesium Oxide (MgO)
0.234
0.38%
1309-48-4
Calcium Oxide (CaO)
0.253
0.41%
1305-78-8
Tungsten (W)
6.290
10.28%
7440-33-7
Molybdenum (Mo)
0.195
0.32%
7439-98-7
Nickel (Ni)
0.810
1.32%
7440-02-0
Cobalt (Co)
0.203
0.33%
7440-48-4
Gold (Au)
0.281
0.46%
7440-57-5
Iron (Fe)
2.438
3.98%
7439-89-6
Nickel (Ni)
1.309
2.14%
7440-02-0
Cobalt (Co)
0.768
1.25%
7440-48-4
Silver (Ag)
1.191
1.95%
7440-22-4
Copper (Cu)
0.210
0.34%
7440-50-8
Aluminum (Al)
0.0021
0.00343%
7429-90-5
Silicon (Si)
0.950
1.55%
7440-21-3
Gold
Gold (Au)
0.480
0.784%
7440-57-5
Adhesive
Silver (Ag)
0.000210
0.000343%
7440-22-4
Epoxy
0.0000700
0.0001144%
1.170
1.91%
+silver solder
IC
Component
IC
Crystal
Silicon Dioxide (SiO2)
Electrode
Silver (Ag)
0.019
0.0310%
7440-22-4
Nickel (Ni)
0.000159
0.000260%
7440-02-0
Silver (Ag)
0.00037
0.000605%
7440-22-4
Silicon (Si)
0.000125
0.000204%
7440-21-3
Adhesive
TOTAL
61.196
Page 10 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
100.00%
14808-60-7
FVXO-HC52 Series
3rd Party (SGS) Material Report
Page 11 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
3rd Party (SGS) Material Report (continued)
Page 12 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
Mechanical Testing
Parameter
Mechanical Shock
Mechanical Vibration
High Temperature Burn-in
Hermetic Seal
Test Method
Drop from 75cm to hardwood surface – 3 times
10~55Hz, 1.5mm amplitude, 1 Minute Sweep
2 Hours each in 3 Directions (X, Y, Z)
Under Power @ 125°C for 2000 Hours (results below)
He pressure: 4 ±1 kgf / cm2 2 Hour soak
2,000 Hour Burn-In
Frequency Drift (PPM)
Burn-In Testing – under power 2000 Hours, 125°C
10
XpressO HCMOS Burn-In (Power on)
Freq = 10MHz, N = 120
5
0
-5
-10
Initial
250 hours 500 hours
1000
hours
Page 13 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
2000
hours
FVXO-HC52 Series
MTTF / FITS Calculations
Products are grouped together by process for MTTF calculations.
(All XpressO output and package types are manufactured with the same process)
Number of Parts Tested:
360 (120 of each output type: HCMOS, LVDS, LVPECL)
Number of Failures: 0
Test Temperature: 125°C
Number of Hours:
2000
MTTF was calculated using the following formulas:
[1.] Device Hours (devhrs) = (number of devices) x (hours at elevated temperature in °K)
[2.] MTTF =
[3.] FITS =
devhrs × af × 2
χ2
1
MTTF
Where:
Label
* 109
Name
Formula/Value
eV
1 1
( )×( − )
k
t1 t2
e
af
Acceleration Factor
eV
Activation Energy
0.40 V
k
Bolzman’s Constant
8.62 X 10-5 eV/°K
t1
Operating Temperature (°K)
t2
Accelerated Temperature (°K)
Θ
Theta
Confidence Level (60% industry standard)
r
Failures
Number of failed devices
χ2
Chi-Square
statistical significance for bivariate tabular analysis [table lookup] based on assumed Θ (Theta – confidence) and number of
failures (r) For zero failures (60% Confidence): χ2 = 1.830
DEVICE-HOURS = 360 x 2000 HOURS = 720,000
(
ACCELERATION FACTOR =
e
1
1
0.40
)
)×(
−
298 398 = 49.91009
8.625
MTTF = 720,000 × 49.91009 × 2 = 39,209,238 Hours
1.833
Failure Rate =
1.833
= 2.55E-8
720,000 × 49.91009 × 2
FITS = Failure Rate *1E9 = 26
Page 14 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FVXO-HC52 Series
Notes :
For the complete product line of XPRESSO products visit
http://www.foxonline.com/xpressomain.htm
Patent Numbers:
US 6,664,860, US 5,960,403, US 5,952,890; US 5,960,405; US 6,188,290;
Foreign Patents: R.S.A. 98/0866, R.O.C. 120851; Singapore 67081, 67082; EP 0958652
China ZL 98802217.6, Malaysia MY-118540-A, Philippines 1-1998-000245, Hong Kong #HK1026079, Mexico #232179
US and Foreign Patents Pending
XpressO™ Fox Electronics
Contact Information
Fox Hong Kong
Fox Japan
Tel: +852.2854.4285,
Tel:+81.3.3374.2079,
(USA)-Worldwide Headquarters
Fax:+852.2854.4282
Fax: +81.3.3377.5221
Tel: 888-GET-2-FOX
Email: www.foxonline.com/email.htm
Email: www.foxonline.com/email.htm
Fax:+1.239.693.1554
Fox EMEA
Fox Taiwan
Email: www.foxonline.com/email.htm
Tel/Fax: +44.1767.312632
Tel:+886-2-22073427,
Email: www.foxonline.com/email.htm
Fax:+886-2-22073486
Outside US: +1.239.693.0099,
Email: www.foxonline.com/email.htm
The above specifications, having been carefully prepared and checked, is believed to be accurate at the time of publication; however, no
responsibility is assumed by Fox Electronics for inaccuracies.
Page 15 of 15
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified