GA1A2S100SS/GA1A2S100LY GA1A2S100SS/ GA1A2S100LY OPIC™ Linear Output Ambient Light Sensor ■ Features ■ Agency Approvals/Compliance 1. Linear output, suitable for indoor or outdoor use 2. Light sensitivity and response curve similar to that of the human eye 3. OPIC light detector: integrated photodiode and signal processing circuit 4. Lead frame packages: Straight leads: GA1A2S100SS L-bend: GA1A2S100LY 5. Stable over specified temperature range 6. Lead-free and RoHS-directive compliant 1. Compliant with RoHS directive (2002/95/EC) 2. Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS) (Chinese: ); refer to page 7. ■ Applications 1. 2. 3. 4. 5. Auto-dimming circuits Office automation equipment Audio visual equipment Home appliances Touch panels OPIC is a trademark of Sharp Corporation. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D1-A00501EN Date: October 1, 2007 ©SHARP Corporation GA1A2S100SS/GA1A2S100LY ■ External Dimensions GA1A2S100SS 1.8 1.27 φ1.60 3-φ0.90 1.27 1.27 0.7 Center of light detection (4°) 0.7 0.50 (4°) (4°) R0.5 2.6 1.4 1.4 MAX. resin burr φ1.5E.PIN 0.1 MAX. 0.15 4.0 1.45 0.3 MAX. Gate burr 2-C0.5 (4°) 3.0 2 - 0.9 (1.7) 16.8 ±2.0 0.2 MAX. Resin burr (52°) 3 - 0.4 +0.3 -0.1 3 - 0.45+0.3 -0.1 (2.54) (1.27) (6°) Pin Arrangement (6°) 3 1 (6°) (6°) No. Name 1 VCC 2 GND 3 IO 2 NOTES: 1. Units: mm 2. Unspecified tolerence: ±0.2 mm 3. ( ): Reference dimensions 4. Package: Transparent 5. The thin burr thickness (0.05 mm MAX.) and the gate burr (0.3 mm MAX.) are not included in outline dimensions 6. Resin protrusion: 1.4 mm MAX. however, the thin burr adheres to the lead 1.4 mm MAX. from the resin Sheet No.: D1-A00501EN 2 GA1A2S100SS/GA1A2S100LY GA1A2S100LY 1.8 0.7 Center of light detection 2 - C0.5 3.0 (4°) (4°) 1.45 0.3 MAX. Gate burr 0.7 4.0 0.1 MAX. 0.15 (4°) (4°) 0.4 +0.30 -0.10 0.87 2.20 (3.70) 1.5 1.4 1.4 MAX. Resin burr R0.7 (1.7) R0.7 (2.54) PCB layout pattern 0.2 MAX. Resin burr 2.54 φ1.80 2.54 (6°) 2.20 (6°) 3 1 Pin Arrangement No. Name 1 VCC 2 GND 3 IO 1.27 1.27 16.7 ±1.5 14.5 ±1.5 2 3 - φ1.0 3 - 0.45 +0.3 -0.1 NOTES: 1. Units: mm 2. Unspecified tolerance: ±0.2 mm 3. ( ): Reference dimensions 4. Package: Transparent 5. Burr thickness (0.05 mm MAX.) and gate burr thickness (0.3 mm MAX.) are not included in the outline dimensions. 6. Resin protrusion: 1.4 mm MAX. however, the thin burr adheres to the lead 1.4 mm MAX. from the resin. Sheet No.: D1-A00501EN 3 GA1A2S100SS/GA1A2S100LY ■ Detector Shape Center of light detection (PDB center) 88 88 Detector chip 328 PDA center 328 PDC center NOTE: Unit: µm ■ Absolute Maximum Ratings Parameter (Ta = 25°C) Symbol Rating Unit Supply voltage VCC -0.3 to +7.0 V Output current IO 5 mA Operating temperature Topr -40 to +85 °C Storage temperature Tstg -40 to +85 °C Soldering temperature *1 Tsol 260 °C *1 Within 5 s (MAX.), no closer than 1.4 mm from edge. ■ Recommended Operating Conditions Parameter (Ta = 0°C to 70°C) Symbol MIN. MAX. Unit Operating Supply Voltage VCC 2.7 3.6 V Output Voltage VOUT 0 VCC – 1.0 V EV 10 10000 lx Illuminance Range Sheet No.: D1-A00501EN 4 GA1A2S100SS/GA1A2S100LY ■ Electro-optical Characteristics Parameter Symbol Supply current Output current *1 (Ta = 25°C, VCC = 3.3 V) Condition Fall time (10% to 90%)*2 Max. Unit ICC EV = 1000 lx 325 500 675 µA EV = 1000 lx 312 480 648 µA IO2 EV = 100 lx 31.2 48 64.8 µA IO3 EV = 10 lx 3.12 4.8 6.48 µA IO4 EV = 0 lx — — 1 µA EV = 1000 lx Ta = -20°C to +60°C -10 — +10 % — 555 — nm — — 10 ms λP Rise time (10% to 90%)*2 Typ. IO1 Output current temperature coefficient *2 Peak sensitivity Min. tr1 EV = 10 to 100 lx, RL = 1 kΩ tr2 EV = 100 to 1000 lx, RL = 1 kΩ — — 2 ms tr3 EV = 1000 to 10000 lx, RL = 100 kΩ — — 500 µs tf1 EV = 10 to 100 lx, RL = 1 kΩ — — 10 ms tf2 EV = 100 to 1000 lx, RL = 1 kΩ — — 1 ms tf3 EV = 1000 to 10000 lx, RL = 100 Ω — — 250 µs Ev = Illuminance by CIE standard light source A (tungsten lamp). *12 Illuminance is white LED. * Fig. 1 Output Current Characteristics (Typ.) 10000 Output Current IO (µA) 1000 100 10 1 1 10 100 1000 10000 100000 Illuminance EV (lx) Sheet No.: D1-A00501EN 5 GA1A2S100SS/GA1A2S100LY Fig. 2 Block Diagram (Equivalent Circuit) VCC Main PD (PDA, PDC) Current AMP 2 (With temperature compensation function) Current AMP 1 OUT PD for spectral sensitivity compensation (PDB) GND ■ Design Considerations Design Guidelines 1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant. 2. Sharp recommends bypass capacitors of at least 0.01 µF between VCC and ground, as close as possible to the device. 3. This device contains three photodiodes and amplifies the differential of the photocurrent in each diode. Sharp recommends that the light which falls on the device illuminate it as uniformly as possible. 4. For the most reliable sensing, Sharp recommends guarding the device from stray incident light. ■ Manufacturing Guidelines Soldering Instructions 1. Sharp does not recommend soldering this part using methods that include preheat or solder reflow. 2. When mounting, care should be taken to avoid boundary exfoliation (pad lifting) between the solder and the circuit board. 3. If hand soldering, use temperatures ≤ 260°C for ≤ 5 seconds. 4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process. Cleaning Instructions 1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the optical characteristics. 2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less. 3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning time, PCB size and device mounting circumstances. Sharp recommends testing using actual production conditions to confirm the harmlessness of the ultrasonic cleaning methods. 4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol. Sheet No.: D1-A00501EN 6 GA1A2S100SS/GA1A2S100LY ■ Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product: • Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). • Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). • Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese: ) Toxic and Hazdardous Substances Category OPIC Light Sensors Lead (Pb) mercury (Hg) Cadmium (Cd) ✓ ✓ ✓ Hexavalent chromiun (Cr6+) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) ✓ ✓ ✓ NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. ■ Packing Specifications 1. Box shape and general dimensions for GA1A2S100SS conform to those shown in Fig. 3, and to those shown in Fig. 4 for GA1A2S100LY. 2. Inner packing is as shown in the Figures. 3. For GA1A2S100SS: Average quantity per bag = 1000 pcs. Average quantity per box = 2000 pcs. 4. For GA1A2S100LY: Average quantity per sleeve = 100 pcs. Average quantity per box = 2000 pcs. 5. Product mass: 0.1 g (approximately) Sheet No.: D1-A00501EN 7 GA1A2S100SS/GA1A2S100LY ■ Packing Specification Fig. 3 GA1A2S100SS Packing Composition Inner packing Product (1000 pieces) Antistatic zipper bag NOTES: 1. Inner packing material : Antistatic zipper bag (Polyethylene) 2. Quantity: 1000 pieces/bag Outer packing Cushioning material (2 sheets) Antistatic zipper bag with products (2 bags) Cushioning material (2 sheets) Packing case Cellophane tape NOTES: 1. Outer material : Packing case (Corrugated cardboard), Cushioning material (Urethane), Cellophane tape 2. Quantity: 2000 pieces/box 3. Regular packaged mass: Approximately 280 g 4. Indication: Model No., Quantity, and Lot No. Model No., Quantity, and Lot No. Sheet No.: D1-A00501EN 8 GA1A2S100SS/GA1A2S100LY Fig. 4 GA1A2S100LY Packing Composition Inner packing Tabless stopper GA1A2S100LY Sleeve Tabbed stopper NOTES: 1. Inner packing material: Sleeve (HIPS), Stopper (SBR) 2. Quantity: 100 pieces/sleeve Sleeve (5 each in 4 rows) Outer packing Packing case Packing tape Model number Quantity Inspection date NOTES: 1. Outer material: Packing case (Corrugated cardboard), Packing tape 2. Quantity: 2000 pieces/box 3. Label: Model number, quantity, and inspection date Sheet No.: D1-A00501EN 9 GA1A2S100SS/GA1A2S100LY ■ Important Notices --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba) · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: Sheet No.: D1-A00501EN 10