ETC HCPL-7851#200

Hermetically Sealed Analog
Isolation Amplifier
Technical Data
HCPL-7850
HCPL-7851
5962-97557
Features
Applications
• Performance Guaranteed
over Full Military
Temperature Range: –55˚C
to +125˚C
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• Hermetically Sealed
Packages
• Dual Marked with Device
Part Number and DSCC
Drawing Number
• QML-38534, Class H
• HCPL-7840 Function
Compatibility
• High Common Mode
Rejection (CMR):
8 kV/µs at VCM = 1000 V
• 5% Gain Tolerance
• 0.1% Nonlinearity
• Low Offset Voltage and
Offset Temperature
Coefficient
• 100 kHz Bandwidth
• Industrial and Military
• High Reliability Systems
• Harsh Industrial
Environments
• Transportation, Medical,
and Life Critical Systems
• General Purpose Analog
Signal Isolation
• Motor Phase and Rail
Current Sensing
• Inverter Current Sensing
• Switched Mode Power
Supply Signal Isolation
• General Purpose Current
Sensing and Monitoring
Description
The HCPL-7850/7851 is an
isolation amplifier that provides
accurate, electrically isolated and
amplified representations of
voltage and current. When used
with a shunt resistor to monitor
the motor phase current in a high
speed motor drive, the device will
offer superior reliability
compared with the traditional
solutions such as current
transformers and Hall-effect
sensors. The HCPL-7850/7851
Schematic Diagram
IDD1
VDD1
1
VIN+
2
+
VIN–
3
–
GND1
4
IDD2
8
VDD2
+
7
VOUT+
–
6
VOUT–
5
GND2
SHIELD
consists of a sigma-delta analogto-digital converter optically
coupled to a digital-to-analog
converter in a hermetically sealed
package. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either commercial product or
with full MIL-PRF-38534 Class H
testing or from the appropriate
DSCC drawing. All devices are
manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC
Qualified Manufacturers List,
QML-38534 for Hybrid
Microcircuits.
A 0.1 F bypass capacitor must be connected between pins 1 and 4 and between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
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2
Superior performance in design
critical specifications such as
common-mode rejection, offset
voltage, nonlinearity, and
operating temperature make the
HCPL-7850/7851 an excellent
choice for designing reliable
products such as motor
controllers and inverters.
Common-mode rejection of
8 kV/µs makes the HCPL-7850/
7851 suitable for noisy electrical
environments such as those
generated by the high switching
rates of power IGBTs.
Selection Guide-Package Styles and Lead
Configuration Options
Agilent Part Number and Options
Commercial
HCPL-7850
MIL-PRF-38534, Class H
HCPL-7851
Standard Lead Finish
Gold Plate
Solder Dipped
Option #200
Butt Cut/Gold Plate
Option #100
Gull Wing/Soldered
Option #300
SMD Part Number
Prescript for all below
5962-
Either Gold or Solder
9755701HPX
Gold Plate
9755701HPC
Solder Dipped
9755701HPA
Butt Cut/Gold Plate
9755701HYC
Butt Cut/Soldered
9755701HYA
Gull Wing/Soldered
9755701HXA
Device Marking
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXXXX
XXXXXXXXX
XXX
XXX
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent FSCN*
* QUALIFIED PARTS ONLY
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Low offset voltage together with
a low offset voltage temperature
coefficient permits accurate use
of auto-calibration techniques.
Gain tolerance of 5% with 0.1%
nonlinearity further provide the
performance necessary for
accurate feedback and control.
3
Outline Drawing
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
2.29 (0.090)
2.79 (0.110)
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option
is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and
hi-rel product in 8 pin DIP. DSCC Drawing part numbers contain provisions for lead finish.
300
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details). This option has solder dipped leads.
5.57 (0.180)
MAX.
0.51 (0.020)
MIN.
1.40 (0.055)
1.65 (0.065)
5° MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
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5.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4
Absolute Maximum Ratings
Storage Temperature (TS) ............................................. –65 to +150˚C
Operating Temperature (TA) .......................................... –55 to +125˚C
Supply Voltages (VDD1, VDD2 ) ......................................... 0.0 to +5.5 V
Steady-State Input Voltage (VIN+, VIN–) ...... –2.0 V to VDD1 +0.5 V (1/)
2 Second Transient Input Voltage ...... –6.0 V to V DD1 +0.5 V (1/)
Output Voltages (VOUT+, VOUT–) ...........................–0.5 to VDD2 +0.5 V
Lead Soldering Temperature (soldering, 10 seconds max.) ...... +260˚C
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-7850/7851 ..... (▲); Class 1
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Supply Voltages
VDD1,
VDD2
4.5
5.5
Volts
Input Voltage (See Note 1)
VIN+,
VIN–
–200
+200
mV
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5
DC Electrical Specifications
Over recommended operating conditions (TA = –55˚C to +125˚C, VIN+ = 0 V, VIN– = 0 V, VDD1 = 5 V and
VDD2 = 5 V, unless otherwise specified).
Parameter
Input Offset
Voltage
Gain
200 mV
Nonlinearity
100 mV
Nonlinearity
Symbol
Group A[12]
Subgroups
Min.
VOS
1,2,3
–1.0
0.6
5.0
mV
4.5 V ≤ V DD1, VDD2)
≤ 5.5 V
G
2,3
7.36
8.00
8.64
V/V
–200 mV ≤ VIN+ ≤ 200 mV 5,6,
4.5 V ≤ (V DD1, VDD2)
7
≤ 5.5 V
1
7.60
8.00
8.4
2,3
0.05
0.8
%
–200 mV ≤ VIN+ ≤ 200 mV 5,8,
4.5 V ≤ (V DD1, VDD2)
9,10,
≤ 5.5 V
12
1
0.05
0.2
2,3
0.01
0.2
1
0.01
0.1
2.56
2.80
V
NL200
NL100
2.20
Typ.* Max. Units
Test Conditions
Fig. Note
1,2,
3
3
–100 mV ≤ VIN+ ≤ 100 mV 5,8,
4.5 V ≤ (V DD1, VDD2)
9,11,
≤ 5.5 V
12
–400 mV ≤ VIN+ ≤ 400 mV
4.5 V ≤ (V DD1, VDD2)
≤ 5.5 V
Output
Common-Mode
Voltage
VOCM
1,2,3
Input Supply
Current
IDD1
1,2,3
10.7
15.5
mA
14,17
Output Supply
Current
IDD2
1,2,3
9.4
14.5
mA
15,17
Input-Output
Insulation
Leakage
Current
II–O
1
1.0
µA
Maximum
Input Voltage
Before Output
Clipping
|VIN+|
MAX
320
mV
4,12
Average Input
Bias Current
IIN
–0.57
µA
13
Average Input
Resistance
RIN
480
kΩ
Input DC
CMRRIN
Common-Mode
Rejection Ratio
69
dB
Output
Resistance
RO
1
Ω
Output Low
Voltage
VOL
1.28
V
VIN+ = 400 mV
Output High
Voltage
VOH
3.84
V
VIN+ = –400 mV
Output ShortCircuit Current
|IOSC|
11
mA
Resistance
(Input-Output)
RI–O
1012
Capacitance
(Input–Output)
CI–O
2.7
RH = 45%, t = 5 sec.
VI–O = 1500 Vdc,
TA = 25˚C
11
4
5
4
6
VOUT = 0 V or VDD2
7
Ω
VI–O = 500 Vdc
11
pF
f = 1 MHz
VI–O = 0 Vdc
*All typicals are at the nominal operating conditions of VIN+ = 0 V, VIN– = 0 V, TA = 25˚C, V DD1 = 5 V and VDD2 = 5 V.
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6
AC Electrical Specifications
Over recommended operating conditions (TA = –55˚C to +125˚C, VIN+ = 0 V, VIN– = 0 V, VDD1 = 5 V and
VDD2 = 5 V, unless otherwise specified).
Symbol
Group A[12]
Subgroups
Min.
Common Mode
Rejection
CMR
9
5
Propagation
Delay to 50%
tPD50
9,10,11
3.7
7.5
Propagation
Delay to 90%
tPD90
9,10,11
5.7
11.0
tR/F
9,10,11
3.4
7.5
Small-Signal
Bandwidth
(–3 dB)
f–3 dB
9,10,11
Small-Signal
Bandwidth
(–45˚)
f–45˚
31
RMS InputReferred Noise
VN
0.6
mVrms In recommended
application circuit
Power Supply
Rejection
PSR
570
mVP–P
Parameter
Rise/Fall
Time (10-90%)
45
Typ.* Max. Units
8
100
Test Conditions
Fig. Note
kV/
µs
VCM = 1 kV
4.5 V ≤ (V DD1, VDD2)
≤ 5.5 V, TA = 25˚C
µs
VIN+ = 0 to 100 mV step 18,19
4.5 V ≤ (V DD1, VDD2)
≤ 5.5 V
kHz
4.5 V ≤ (V DD1, VDD2)
≤ 5.5 V
16
8,13
18,20, 14
21
22,24
9
10
*All typicals are at the nominal operating conditions of VIN+ = 0 V, VIN– = 0 V, TA = 25˚C, V DD1 = 5 V and VDD2 = 5 V.
Notes:
1. If V IN– is brought above VDD1 –2 V with respect to GND1 an internal test mode may be activated. This test mode is not intended for
customer use.
2. Exact offset value is dependent on layout of external bypass capacitors. The offset value in the data sheet corresponds to Agilent’s
recommended layout (see Figures 26 and 27).
3. Nonlinearity is defined as half of the peak-to-peak output deviation from the best-fit gain line, expressed as a percentage of the full-scale
differential output voltage.
4. Because of the switched capacitor nature of the sigma-delta A/D converter, time averaged values are shown.
5. CMRRIN is defined as the ratio of the gain for differential inputs applied between pins 2 and 3 to the gain for both common mode inputs
applied to both pins 2 and 3 with respect to pin 4.
6. When the differential input signal exceeds approximately 320 mV, the outputs will limit at the typical values shown.
7. Short-circuit current is the amount of output current generated when either output is shorted to VDD2 or ground. Agilent does not
recommend operations under these conditions.
8. CMR (also known as IMR or Isolation Mode Rejection) specifies the minimum rate of rise of a common mode signal applied across the
isolation boundary at which small output perturbations begin to occur. These output perturbations can occur with both the rising and
falling edges of the common mode waveform and may be of either polarity. A CMR failure is defined as a perturbation exceeding 200 mV
at the output of the recommended application circuit (Figure 24). See Applications section for more information on CMR.
9. Output noise comes from two primary sources: chopper noise and sigma-delta quantization noise. Chopper noise results from chopper
stabilization of the output op-amps. It occurs at a specific frequency (typically 500 kHz) and is not attenuated by the on-chip output
filter. The on-chip filter does eliminate most, but not all, of the sigma-delta quantization noise. An external filter circuit may be easily
added to the external post-amplifier to reduce the total RMS output noise. See Applications section for more information.
10. Data sheet value is the amplitude of the transient at the differential output of the HCPL-7850 when a 1 VP–P , 1 MHz square wave with
100 ns rise and fall times (measured at pins 1 and 8) is applied to both VDD1 and VDD2.
11. Device considered a two-terminal device: Pins 1, 2, 3, and 4 are shorted together and pins 5, 6, 7, and 8 are shorted together.
12. Commercial parts receive 100% testing at 25˚C (Subgroups 1 and 9). Hi-Rel and SMD parts receive 100% testing at 25˚C, +125˚C and
–55˚C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively).
13. Parameters are tested as part of device initial characterization and after design and process changes only. Parameters are guaranteed to
limits specified for all lots not specifically tested.
14. The f-3dB test is guaranteed by the TRISE test.
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7
VDD2
VDD1
+15 V
0.1 µF
1
8
0.1 µF
2
10 K
7
+
HCPL-7850
0.1 µF
3
6
4
5
VOUT
10 K
–
0.47
µF
AD624CD
GAIN = 100
0.1 µF
0.47
µF
-15 V
VDD1 = 5 V
VDD2 = 5 V
1.5
1.0
0.5
0
-0.5
-60
-20
20
60
100
140
TA – TEMPERATURE – °C
Figure 2. Input Offset Change vs.
Temperature.
4.0
0.9
vs. VDD1 (VDD2 = 5 V)
VO – OUTPUT VOLTAGE – V
2.0
∆VOS – INPUT OFFSET CHANGE – mV
∆VOS – INPUT OFFSET CHANGE – mV
Figure 1. Input Offset Voltage Test Circuit.
vs. VDD2 (VDD1 = 5 V)
0.6
TA = 25°C
0.3
0
-0.3
4.4
4.6
4.8
5.0
5.2
5.4
VDD – SUPPLY VOLTAGE – V
Figure 3. Input Offset Change vs.
V DD1 and VDD2.
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5.6
3.5
NEGATIVE
OUTPUT
POSITIVE
OUTPUT
3.0
2.5
2.0
VDD1 = 5 V
VDD2 = 5 V
TA = 25°C
1.5
1.0
-0.6
-0.4
-0.2
0
0.2
0.4
VIN – INPUT VOLTAGE – V
Figure 4. Output Voltages vs. Input
Voltage.
0.6
8
VDD1
VDD2
+15 V
+15 V
0.1 µF
1
0.1 µF
0.1 µF
404
VIN
0.1 µF
8
2
10 K
7
+
HCPL-7850
13.2
3
6
4
5
+
VOUT
10 K
–
0.01 µF
0.47
µF
–
AD624CD
GAIN = 4
AD624CD
GAIN = 10
0.1 µF
0.47
µF
0.1 µF
-15 V
-15 V
10 K
0.47
µF
Figure 5. Gain and Nonlinearity Test Circuit.
0.05
0
-0.05
-0.10
-0.15
vs. VDD1 (VDD2 = 5 V)
vs. VDD2 (VDD1 = 5 V)
NL ERROR – % OF FULL SCALE
0.08
∆G – GAIN CHANGE – %
∆G – GAIN CHANGE – %
0.15
0.10
VDD1 = 5 V
VDD2 = 5 V
0.06
TA = 25°C
0.04
0.02
0
-0.02
-0.04
-0.20
-60
-20
20
60
100
140
-0.06
4.4
TA – TEMPERATURE – °C
Figure 6. Gain Change vs.
Temperature.
4.6
4.8
5.0
5.2
5.4
VDD – SUPPLY VOLTAGE – V
Figure 7. Gain Change vs. V DD1 and
V DD2.
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5.6
200 mV ERROR
100 mV ERROR
0.10
VDD1 = 5 V
VDD2 = 5 V
VIN– = 0 V
TA = 25°C
0.05
0
-0.05
-0.10
-0.2
-0.1
0
0.1
0.2
VIN+ – INPUT VOLTAGE – V
Figure 8. Nonlinearity Error Plot vs.
Input Voltage.
9
0.025
0.07
0.2
0.1
0
-60
-20
20
60
100
vs. VDD1 (VDD2 = 5 V)
vs. VDD2 (VDD1 = 5 V)
vs. VDD2 (VDD1 = 5 V)
0.06
TA = 25°C
0.05
0.04
0
4.4
140
vs. VDD1 (VDD2 = 5 V)
NL – NONLINEARITY – %
0.3
200 mV
100 mV
TA – TEMPERATURE – °C
4.6
4.8
5.0
5.2
5.4
Figure 10. 200 mV Nonlinearity vs.
V DD1 and VDD2.
IIN – INPUT CURRENT – mA
NL – NONLINEARITY – %
TA = 25°C
0.50
0.05
VDD1 = 5 V
VDD2 = 5 V
±0.20
±0.30
0.010
-2
-4
FS – FULL-SCALE INPUT VOLTAGE – V
VDD1 = 5 V
VDD2 = 5 V
VIN– = 0 V
TA = 25°C
-8
-10
-6
±0.40
Figure 12. Nonlinearity vs. Full-Scale
Input Voltage.
0
-6
-4
-2
0
2
4
VIN+ – INPUT VOLTAGE – V
Figure 13. Input Current vs. Input
Voltage.
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4.6
4.8
5.0
5.2
5.4
5.6
Figure 11. 100 mV Nonlinearity vs.
VDD1 and VDD2.
2
±0.10
0.015
VDD – SUPPLY VOLTAGE – V
5.00
0
TA = 25°C
VDD – SUPPLY VOLTAGE – V
Figure 9. Nonlinearity vs.
Temperature.
0.01
0.020
0.005
4.4
5.6
6
IDD1 – INPUT SUPPLY CURRENT – mA
VDD1 = 5 V
VDD2 = 5 V
VIN– = 0 V
TA = 25 °C
NL – NONLINEARITY – %
NL – NONLINEARITY – %
0.4
11
TA = 25°C
10
9
8
VDD1 = 5 V
VDD2 = 5 V
VIN– = 0 V
7
6
-0.4
-0.2
0
0.2
0.4
VIN+ – INPUT VOLTAGE – V
Figure 14. Input Supply Current vs.
Input Voltage.
10
10 K
150 pF
VDD2
78L05
+15 V
IDD2 – OUTPUT SUPPLY CURRENT – mA
IN OUT
0.1
µF
10.0
VDD1 = 5 V
VDD2 = 5 V
VIN– = 0 V
9.5
1
0.1
µF
0.1 µF
8
0.1 µF
2
2K
7
–
HCPL-7850
9V
3
6
4
5
VOUT
2K
+
MC34081
9.0
TA = 25°C
0.1 µF
10 K
8.5
150
pF
PULSE GEN.
8.0
-0.4
-0.2
0.2
0
–
+
0.4
-15 V
VCM
VIN+ – INPUT VOLTAGE – V
Figure 15. Output Supply Current vs.
Input Voltage.
Figure 16. Common Mode Rejection Test Circuit.
10 K
VDD2
IDD – POWER SUPPLY CURRENT – mA
VDD1
+15 V
0.1 µF
20
IDD1
IDD2
VDD1 = 5 V
VDD2 = 5 V
VIN+ = 320 mV
VIN– = 0 V
15
0.1 µF
VIN
1
8
0.1 µF
2
7
–
HCPL-7850
10
0.01 µF
5
0
-60
2K
3
6
4
5
2K
VOUT
+
MC34081
0.1 µF
10 K
-20
20
60
100
-15 V
140
TA – TEMPERATURE – °C
Figure 17. Input and Output Supply
Current vs. Temperature.
VIN IMPEDANCE LESS THAN 10 Ω.
Figure 18. Propagation Delay, Rise/Fall Time and Bandwidth Test Circuit.
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11
10
t – TIME – µs
7
VDD1 = 5 V
VDD2 = 5 V
6
5
4
3
VIN– = 0 V
VIN+ = 0 TO 100 mV STEP
2
-60 -40 -20 0 20 40 60 80 100 120 140
RELATIVE AMPLITUDE – dB
9
8
0
DELAY TO 90%
DELAY TO 50%
RISE/FALL TIME
-1
VDD1 = 5 V
VDD2 = 5 V
TA = 25 °C
-2
-3
-4
1
5
TA – TEMPERATURE – °C
f (-3 dB) – 3 dB BANDWIDTH – kHz
160
140
VDD1 = 5 V
VDD2 = 5 V
120
100
80
60
40
-60 -40 -20 0
20 40 60 80 100 120 140
TA – TEMPERATURE – °C
Figure 21. 3 dB Bandwidth vs.
Temperature.
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500
Figure 20. Amplitude Response vs.
Frequency.
VN – RMS INPUT-REFERRED NOISE – mV
Figure 19. Propagation Delays and
Rise/Fall Time vs. Temperature.
50 100
10
f – FREQUENCY – kHz
2.5
VIN+ = 200 mV
VIN+ = 100 mV
VIN+ = 0 mV
2.0
TA = 25°C
VDD1 = 5 V
VDD2 = 5 V
1.5
1.0
0.5
0
5
10
50
100
500
f – FREQUENCY – KHz
Figure 22. RMS Input-Referred Noise
vs. Recommended Application Circuit
Bandwidth.
12
VOLTAGE
REGULATOR
CLOCK
GENERATOR
VOLTAGE
REGULATOR
ISOLATION
BOUNDARY
ISO-AMP
INPUT
Σ∆
MODULATOR
LED DRIVE
CIRCUIT
ENCODER
DETECTOR
CIRCUIT
DECODER
AND D/A
FILTER
ISO-AMP
OUTPUT
Figure 23. HCPL-7850 Block Diagram.
POSITIVE
FLOATING
SUPPLY
C5
150 pF
HV+
GATE DRIVE
CIRCUIT
R3
• • •
10.0 K
U1
78L05
IN
+5 V
+15 V
C8
0.1 µF
OUT
C1
C2
0.1
µF
0.1
µF
R5
68
1
8
2
7
C4
0.1 µF
R1
2.00 K
C3
0.01
3
µF
U2
6
R2
–
U3
+ MC34081
2.00 K
MOTOR
• • •
+
–
4
C7
5
C6
150 pF
RSENSE
HCPL-7850
• • •
HV–
Figure 24. Recommended Application Circuit.
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R4
10.0 K
-15 V
0.1 µF
VOUT
13
Application Circuit
The recommended application
circuit is shown in Figure 24. A
floating power supply (which in
many applications could be the
same supply that is used to drive
the high-side power transistor) is
regulated to 5 V using a simple
three-terminal voltage regulator
(U1). The voltage from the
current sensing resistor, or shunt
(Rsense), is applied to the input
of the HCPL-7850 through an RC
anti-aliasing filter (R5, C3). And
finally, the differential output of
the isolation amplifier is
converted to a ground-referenced
Applications Information
Functional Description
Figure 23 shows the primary
functional blocks of the HCPL7850. In operation, the sigmadelta modulator converts the
analog input signal into a highspeed serial bit stream. The time
average of this bit stream is
directly proportional to the input
signal. This stream of digital data
is encoded and optically
transmitted to the detector
circuit. The detected signal is
decoded and converted back into
an analog signal, which is filtered
to obtain the final output signal.
single-ended output voltage with
a simple differential amplifier
circuit (U3 and associated
components). Although the
application circuit is relatively
simple, a few recommendations
should be followed to ensure
optimal performance.
Supplies and Bypassing
As mentioned above, an
inexpensive three-terminal
regulator can be used to reduce
the gate-drive power supply
voltage to 5 V. To help attenuate
high frequency power supply
noise or ripple, a resistor or
C5
150 pF
+5 V
R3
10.0 K
+5 V
8
2
7
C4
C8
0.1 µF
R4A
20.0 K
1
C2
R5
+5 V
C3
C4
0.1 µF
R1
–
U3
+ MC34071
10.0 K
U2
R2
6
3
Figure 26. Top Layer of Printed
Circuit Board Layout.
VOUT
10.0 K
4
5
C6
150 pF
HCPL-7850
R4B
20.0 K
TO VDD1
TO RSENSE+
TO RSENSE–
TO VDD2
VOUT+
VOUT–
Figure 25. Single-Supply Post-Amplifier Circuit.
Figure 27. Bottom Layer of a Printed
Circuit Board Layout.
27 Ω
1k
27 Ω
VDD
VDD
2
1k
8
1
+
VIN+
VIN–
3
–
+
–
1k
7
VOUT+
6
0.1 µF
1k
(+)
(–)
VOUT–
4
GND
5
GND
CONDITIONS: I CC=17.5mA
T A=+125˚C
Figure 28. Operating Circuit for Burn-In and Steady State Life Tests.
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VDD
5.5 VDC
14
inductor can be used in series
with the input of the regulator to
form a low-pass filter with the
regulator’s input bypass
capacitor.
As shown in Figure 24, a 0.1 µF
bypass capacitor (C2, C4) should
be located as close as possible to
the input and output power
supply pins of the HCPL-7850.
The bypass capacitors are
required because of the highspeed digital nature of the signals
inside the isolation amplifier. A
0.01 µF bypass capacitor (C3) is
also recommended at the input
pin(s) due to the switchedcapacitor nature of the input
circuit. The input bypass
capacitor should be at least
1000 pF to maintain gain
accuracy of the isolation
amplifier.
Inductive coupling between the
input power-supply capacitor and
the input circuit, including the
input bypass capacitor and the
input leads of the HCPL-7850,
can introduce additional DC
offset in the circuit. Several steps
can be taken to minimize the
mutual coupling between the two
parts of the circuit, thereby
improving the offset performance
of the design. Separate the two
bypass capacitors C2 and C3 as
much as possible (even putting
them on opposite sides of the PC
board), while keeping the total
lead lengths, including traces, of
each bypass capacitor less than
20 mm. PC board traces should
be made as short as possible and
placed close together or over
ground plane to minimize loop
area and pickup of stray magnetic
fields. Avoid using sockets, as
they will typically increase both
loop area and inductance. And
finally, using capacitors with
small body size and orienting
them perpendicular to each other
on the PC board can also help.
For more information concerning
this effect, see Application Note
1078, Designing with Agilent
Technologies Isolation
Amplifiers.
Shunt Resistor Selections
The current-sensing shunt
resistor should have low
resistance (to minimize power
dissipation), low inductance (to
minimize di/dt induced voltage
spikes which could adversely
affect operation), and reasonable
tolerance (to maintain overall
circuit accuracy). The value of
the shunt should be chosen as a
compromise between minimizing
power dissipation by making the
shunt resistance smaller and
improving circuit accuracy by
making it larger and utilizing the
full input range of the HCPL7850. Agilent Technologies
recommends four different shunts
which can be used to sense
average currents in motor drives
up to 35 A and 35 hp. Table 1
shows the maximum current and
horsepower range for each of the
LVR-series shunts from Dale.
Even higher currents can be
sensed with lower value shunts
available from vendors such as
Dale, IRC, and Isotek
(Isabellenhuette). When sensing
currents large enough to cause
significant heating of the shunt,
the temperature coefficient of the
shunt can introduce nonlinearity
due to the signal dependent
temperature rise of the shunt.
Using a heat sink for the shunt or
using a shunt with a lower
tempco can help minimize this
effect. The Application Note
1078, Designing with Agilent
Technologies Isolation
Amplifiers, contains additional
information on designing with
current shunts.
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The recommended method for
connecting the isolation amplifier
to the shunt resistor is shown in
Figure 24. Pin 2 (VIN+) is
connected to the positive
terminal of the shunt resistor,
while pin 3 (VIN–) is shorted to
pin 4 (GND1), with the powersupply return path functioning as
the sense line to the negative
terminal of the current shunt.
This allows a single pair of wires
or PC board traces to connect the
isolation amplifier circuit to the
shunt resistor. In some
applications, however, supply
currents flowing through the
power-supply return path may
cause offset or noise problems. In
this case, better performance
may be obtained by connecting
pin 3 to the negative terminal of
the shunt resistor separate from
the power supply return path.
When connected this way, both
input pins should be bypassed.
Whether two or three wires are
used, it is recommended that
twisted-pair wire or very close PC
board traces be used to connect
the current shunt to the isolation
amplifier circuit to minimize
electromagnetic interference to
the sense signal.
The 68 Ω resistor in series with
the input lead forms a low-pass
anti-aliasing filter with the input
bypass capacitor with a 200 kHz
bandwidth. The resistor
performs another important
function as well; it dampens any
ringing which might be present in
the circuit formed by the shunt,
the input bypass capacitor, and
the wires or traces connecting the
two. Undampened ringing of the
input circuit near the input
sampling frequency can alias into
the baseband producing what
might appear to be noise at the
output of the device. To be
15
effective, the damping resistor
should be at least 39 Ω.
the output offset of the HCPL7850, or less than about 5 mV.
PC Board Layout
In addition to affecting offset, the
layout of the PC board can also
affect the common mode
rejection (CMR) performance of
the isolation amplifier, due
primarily to stray capacitive
coupling between the input and
the output circuits. To obtain
optimal CMR performance, the
layout of the printed circuit board
(PCB) should minimize any stray
coupling by maintaining the
maximum possible distance
between the input and output
sides of the circuit and ensuring
that any ground plane on the PCB
does not pass directly below the
HCPL-7850. Using surface mount
components can help achieve
many of the PCB objectives
discussed in the preceding
paragraphs. An example throughhole PCB layout illustrating some
of the more important layout
recommendations is shown in
Figures 26 and 27. See
Applications Note 1078,
Designing with Agilent
Technologies Isolation
Amplifiers, for more information
on PCB layout consideration.
To maintain overall circuit
bandwidth, the post-amplifier
circuit should have a bandwidth
at least twice the minimum
bandwidth of the isolation
amplifier, or about 200 kHz. To
obtain a bandwidth of 200 kHz
with a gain of 5, the op-amp
should have a gain-bandwidth
greater than 1 mHz. The postamplifier circuit includes a pair of
capacitors (C5 and C6) that form
a single-pole low-pass filter.
These capacitors allow the
bandwidth of the post-amp to be
adjusted independently of the
gain and are useful for reducing
the output noise from the
isolation amplifier (doubling the
capacitor values halves the circuit
bandwidth). The component
values shown in Figure 24 form a
differential amplifier with a gain
of 5 and a cutoff frequency of
approximately 100 kHz, and were
chosen as a compromise between
low noise and fast response
times. The overall recommended
application circuit has a
bandwidth of 66 kHz, a rise time
of 5.2 µs and a delay to 90% of
8.5 µs.
Post-Amplifier Circuit
The recommended application
circuit (Figure 24) includes a
post-amplifier circuit that serves
three functions: to reference the
output signal to the desired level
(usually ground), to amplify the
signal to appropriate levels, and
to help filter output noise. The
particular op-amp used in the
post-amp is not critical; however,
it should have low enough offset
and high enough bandwidth and
slew rate so that it does not
adversely affect circuit
performance. The offset of the
op-amp should be low relative to
The gain-setting resistors in the
post-amp should have a tolerance
of 1% or better to ensure
adequate CMRR and gain
tolerance for the overall circuit.
Resistor networks with even
better ratio tolerances can be
used which offer better
performance, as well as reducing
the total component count and
board space.
The post-amplifier circuit can be
easily modified to allow for
single-supply operation. Figure
25 shows a schematic for a post
amplifier for use in 5 V single
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supply applications. One
additional resistor is needed and
the gain is decreased to 1 to
allow circuit operation over the
full input voltage range. See
Application Note 1078,
Designing with Agilent
Technologies Isolation
Amplifiers, for more information
on the post-amplifier circuit.
Other Information
As mentioned above, reducing the
bandwidth of the post amplifier
circuit reduces the amount of
output noise. Figure 22 shows
how the output noise changes as
a function of the post-amplifier
bandwidth. The post-amplifier
circuit exhibits a first-order lowpass filter characteristic. For the
same filter bandwidth, a higherorder filter can achieve even
better attenuation of modulation
noise due to the second-order
noise shaping of the sigma-delta
modulator. For more information
on the noise characteristics of the
HCPL-7850, see Application Note
1078, Designing with Agilent
Technologies Isolation
Amplifiers.
The HCPL-7850 can also be used
to isolate signals with amplitudes
larger than its recommended
input range through the use of a
resistive voltage divider at its
input. The only restrictions are
that the impedance of the divider
be relatively small (less than 1 KΩ
so that the input resistance (480
KΩ) and input bias current (0.6
A) do not affect the accuracy of
the measurement. An input
bypass capacitor is still required,
although the 68 Ω series damping
resistor is not. (The resistance of
the voltage divider provides the
same function.) The low pass
filter formed by the divider
resistance and the input bypass
capacitor may limit the
achievable bandwidth.
Table 1. Current Shunt Summary.
Shunt Resistor Part Number
Shunt
Resistance
Maximum
Power
Dissipation
Maximum
Average
Current
Maximum
Horsepower
Range
LVR-3.05-1%
50 mΩ
3W
3A
0.8 to 3.0 hp
LVR-3.02-1%
20 mΩ
3W
8A
2.2 to 8.0 hp
LVR-3.01-1%
10 mΩ
3W
15 A
4.1 to 15 hp
LVR-5.005-1%
5 mΩ
5W
35 A
9.6 to 35 hp
MIL-PRF-38534 Class H and
DSCC SMD Test Program
Agilent Technologies’ Hi-Rel
Optocouplers are in compliance
with MIL-PRF-38534 Class H.
Class H devices are also in
compliance with DSCC drawing
5962-97557.
Testing consists of 100%
screening and quality
conformance inspection to
MIL-PRF-38534.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 1999 Agilent Technologies
5966-2716E (11/99)
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