Agilent HDSP-A4xC Series Alphanumeric Display, 0.54" (13.7 mm) 4 Character As AlInGaP Red Data Sheet Features • As AlInGaP red color • Gray face paint Gray package gives optimum contrast • Design flexibility Common anode or common cathode Description These 0.54” (13.7 mm) AS AlInGaP displays are available in either common anode or common cathode. Devices As AlInGaP Red HDSP-A42C HDSP-A47C Package Dimensions Description Common Anode Common Cathode Applications • Suitable for alphanumeric • Operating temperature range –40˚C to 105˚C 0.160 (0.063) 6.48 (0.255) 5º 0.95 (0.038) 10.95 (0.431) 16.79 (0.661) 12.10 (0.476) PIN 1 10.08 (0.397) 10.08 (0.397) 10.08 (0.397) 5.10 (0.201) 1.46 (0.057) 40.45 (1.593) 6.19 (0.244) 2.94 (0.116) 1.94 (0.076) 0.50 (0.020) 4.32 (0.170) 2.02 (0.079) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES) 2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25mm Part Numbering System 5082 -X X X X-X X X X X HDSP-X X X X-X X X X X Mechanical Options[1] 00: No Mechanical Option Color Bin Options[1,2] 0: No Color Bin Limitation Maximum Intensity Bin[1,2] 0: No Maximum Intensity Bin Limitation Minimum Intensity Bin[1,2] 0: No Minimum Intensity Bin Limitation Device Configuration/Color[1] C: AlInGaP Red Device Specific Configuration[1] Refer to Respective Datasheet Package[1] Refer to Respective Datasheet Notes: 1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details. 2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1 bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information. 2 Internal Circuit DIG 1 DIG 2 DIG 3 DIG 4 DP1 DP2 COM 2 DIG 2 30 A 28 B A 9 C 7 D B 1 E C 36 F D E 33 G F 32 H G 6 5 J H K 4 L J 2 M K L 31 8 COM 1 DIG 1 34 29 COM 3 DIG 3 11 16 P N M 35 COM 4 DIG 4 DP1 P N 25 20 DP2 A A 19 B B 18 C C D COM 3 DIG 3 20 25 19 18 12 10 27 D F E E 22 20 G F G 12 10 27 H H 13 17 15 14 24 23 J K L N P J K L M M P N COMMON ANODE COM 2 COM 2 DIG 2 DIG 2 30 A 28 B A 9 C B 7 D C 1 E D 36 F E 33 G F 32 5 J H G 4 H K J 6 L K 2 M L 31 8 COM 1 DIG 1 34 29 P N M 35 N 11 COM 4 DIG 4 16 DP1 P A A DP2 B B C C D D E E F F 22 20 G G H H J COMMON CATHODE Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 3 Pin Configuration A Common Anode 1E/2E Cathode 1M/2M Cathode No Connection 1L/2L Cathode 1K/2K Cathode 1J/2J Cathode 1D/2D Cathode DP2 Cathode 1C/2C Cathode 3E/4E Cathode DIGIT No. 3 Common 3D/4D Cathode 3J/4J Cathode 3M/4M Cathode 3L/4L Cathode DIGIT No. 4 Common 3K/4K Cathode 3C/4C Cathode 3B/4B Cathode 3H/4H Cathode No Connection 3G/4G Cathode 3P/4P Cathode 3N/4N Cathode 3A/4A Cathode DP1 Cathode 3F/4F Cathode 1B/2B Cathode DIGIT No. 2 Common 1A/2A Cathode 1N/2N Cathode 1H/2H Cathode 1G/2G Cathode DIGIT No. 2 Common 1P/2P Cathode 1F/2F Cathode Anode Anode Anode Anode Pin Configuration B Common Cathode 1E/2E Anode 1M/2M Anode No Connection 1L/2L Anode 1K/2K Anode 1J/2J Anode 1D/2D Anode DP2 Anode 1C/2C Anode 3E/4E Anode DIGIT No. 3 Common 3D/4D Anode 3J/4J Anode 3M/4M Anode 3L/4L Anode DIGIT No. 4 Common 3K/4K Anode 3C/4C Anode 3B/4B Anode 3H/4H Anode No Connection 3G/4G Anode 3P/4P Anode 3N/4N Anode 3A/4A Anode DP1 Anode 3F/4F Anode 1B/2B Anode DIGIT No. 2 Common 1A/2A Anode 1N/2N Anode 1H/2H Anode 1G/2G Anode DIGIT No. 2 Common 1P/2P Anode 1F/2F Anode Cathode Cathode Cathode Cathode 13 17 15 14 24 23 J L N P K K L M M N P Absolute Maximum Ratings at TA = 25˚C Description DC Forward Current per Segment or DP[1,2,3] Peak Forward Current per Segment or DP[2,3] Average Forward Current[3] Reverse Voltage per Segment or DP (IR = 100 µA) Operating Temperature Storage Temperature Lead Soldering Conditions Symbol IF IPEAK IAVE VR TO TS Temperature Time HDSP-A42C/HDSP-A47C 50 100 30 5 –40 to +105 –40 to +120 260 3 Units mA mA mA V ˚C ˚C ˚C s Notes: 1. Derate linearly as shown in Figure 1. 2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E). 3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information. Optical/Electrical Characteristics at TA = 25˚C Device Series HDSPA42C A47C Parameter Forward Voltage Reverse Voltage Symbol IV VR Peak Wavelength λPEAK Dominant Wavelength[3] Spectral Halfwidth λd ∆λ1/2 Speed of Response τs 20 ns Capacitance C 40 pF Intensity Bin Limits[1] (mcd at 10 mA) Bin Name Min.[2] T 18.0 U 25.0 Max.[2] 25.0 36.0 Notes: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. 2. Tolerance for each bin limit is ± 10%. 4 Min. 1.70 5 Typ. 1.90 20 Max. 2.20 635 622.5 626 17 630 Units V V Test Conditions IF = 20 mA IF = 100 µA nm Peak Wavelength of Spectral Distribution at IF = 20 mA nm nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA Exponential Time Constant, e-tτs VF = 0, f = 1 MHz 40 30 20 10 0 20 0 40 60 80 100 120 TA – AMBIENT TEMPERATURE – ˚C Figure 1. Maximum forward current vs. ambient temperature. Derating based on T JMAX = 130˚C. 100 80 60 40 20 0 0.0 1.0 1.5 2.0 2.5 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forwrad voltage. 1.4 RELATIVE EFFICIENCY (NORMALIZED TO 1 AT 10 mA) 3.5 120 RELATIVE LUMINOUS INTENSITY (NORMALIZED TO 1 AT 10 mA) 50 IF – FORWARD CURRENT PER SEGMENT – mA IF – MAXIMUM AVERAGE CURRENT – mA 60 3.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 50 IF – FORWARD CURRENT PER SEGMENT – mA Figure 3. Relative luminous intensity vs. DC forward current. Contrast Enhancement For information on contrast enhancement, please see Application Note 1015. 1.2 1.0 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 60 IPEAK – PEAK FORWARD CURRENT PER SEGMENT – mA Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. Soldering/Cleaning Cleaning agents from ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. For information on soldering LEDs, please refer to Application Note 1027. 5 60 www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. November.20, 2001 5988-4822EN