HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 ® Data Sheet May 2002 +5V Powered RS-232 Transmitters/Receivers with 0.1Microfarad External Capacitors FN3980.13 Features • Meets All RS-232E and V.28 Specifications • Requires Only 0.1µF or Greater External Capacitors The HIN202-HIN213 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where ±12V is not available. They require a single +5V power supply and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply The family of devices offers a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). • High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s • Two Receivers Active in Shutdown Mode (HIN213) • Requires Only Single +5V Power Supply • Onboard Voltage Doubler/Inverter • Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA • Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1µA • Three-State TTL/CMOS Receiver Outputs The HIN206, HIN211 and HIN213 feature a low power shutdown mode to conserve energy in battery powered applications. In addition, the HIN213 provides two active receivers in shutdown mode allowing for easy “wakeup” capability. • Multiple Drivers - ±10V Output Swing for +5V lnput - 300Ω Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible - 30V/µs Maximum Slew Rate The drivers feature true TTL/CMOS input compatibility, slew rate-limited output, and 300Ω power-off source impedance. The receivers can handle up to ±30V input, and have a 3kΩ to 7kΩ input impedance. The receivers also feature hysteresis to greatly improve noise rejection. • Multiple Receivers - ±30V Input Voltage Range - 3kΩ to 7kΩ Input Impedance - 0.5V Hysteresis to Improve Noise Rejection Applications • Any System Requiring RS-232 Communications Port - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation - Modems Selection Table POWER SUPPLY VOLTAGE NUMBER OF RS-232 DRIVERS NUMBER OF RS-232 RECEIVERS NUMBER OF 0.1µF EXTERNAL CAPACITORS LOW POWER SHUTDOWN/TTL THREE-STATE NUMBER OF RECEIVERS ACTIVE IN SHUTDOWN HIN202 +5V 2 2 4 Capacitors No/No 0 HIN206 +5V 4 3 4 Capacitors Yes/Yes 0 HIN207 +5V 5 3 4 Capacitors No/No 0 HIN208 5V 4 4 4 Capacitors No/No 0 HIN211 +5V 4 5 4 Capacitors Yes/Yes 0 HIN213 +5V 4 5 4 Capacitors Yes/Yes 2 PART NUMBER 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002. All Rights Reserved HIN202 thru HIN213 Ordering Information (Continued) Ordering Information TEMP. RANGE (oC) PART NO. PACKAGE PART NO. PKG. NO. TEMP. RANGE (oC) PACKAGE PKG. NO. HIN208CA 0 to 70 24 Ld SSOP M24.209 HIN208IA -40 to 85 24 Ld SSOP M24.209 HIN208CB 0 to 70 24 Ld SOIC M24.3 HIN208CB-T 0 to 70 Tape and Reel M16.3 HIN208CP 0 to 70 24 Ld PDIP (N) E24.3 16 Ld PDIP E16.3 HIN211CA 0 to 70 28 Ld SSOP M28.209 0 to 70 24 Ld SOIC M24.3 HIN211CA-T 0 to 70 Tape and Reel 0 to 70 Tape and Reel HIN202CBN 0 to 70 16 Ld SOIC (N) HIN202CBN-T 0 to 70 Tape and Reel HIN202CB 0 to 70 16 Ld SOIC (W) HIN202CB-T 0 to 70 Tape and Reel HIN202IB -40 to 85 16 Ld SOIC (W) HIN202CP 0 to 70 HIN206CB HIN206CB-T M16.15 M16.3 HIN211IA -40 to 85 28 Ld SSOP Tape and Reel HIN206IB -40 to 85 24 Ld SOIC M24.3 HIN211IA-T -40 to 85 HIN207CA 0 to 70 24 Ld SSOP M24.209 HIN211CB 0 to 70 28 Ld SOIC HIN207CB 0 to 70 24 Ld SOIC M24.3 HIN211CB-T 0 to 70 Tape and Reel HIN207CB-T 0 to 70 Tape and Reel HIN213CA 0 to 70 28 Ld SSOP HIN213CA-T 0 to 70 Tape and Reel HIN207IB -40 to 85 HIN207CP 0 to 70 24 Ld SOIC M24.3 24 Ld PDIP (N) E24.3 M28.209 M28.3 M28.209 Pin Descriptions PIN VCC V+ V- FUNCTION Power Supply Input 5V ±10%, (5V ±5% HIN207). Internally generated positive supply (+10V nominal). Internally generated negative supply (-10V nominal). GND Ground Lead. Connect to 0V. C1+ External capacitor (+ terminal) is connected to this lead. C1- External capacitor (- terminal) is connected to this lead. C2+ External capacitor (+ terminal) is connected to this lead. C2- External capacitor (- terminal) is connected to this lead. TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead. TOUT RIN ROUT Transmitter Outputs. These are RS-232 levels (nominally ±10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. EN, EN Enable Input. This is an active low input which enables the receiver outputs. With EN = 5V, (HIN213 EN = 0V), the outputs are placed in a high impedance state. SD, SD Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state (except R4 and R5 of HIN213) and the transmitters are shut off. NC No Connect. No connections are made to these leads. 2 HIN202 thru HIN213 Pinouts HIN202 (PDIP, SOIC, SSOP) TOP VIEW C1+ 1 16 VCC V+ 2 15 GND HIN206 (PDIP, SOIC, SSOP) TOP VIEW C1- 3 14 T1OUT C2+ 4 13 R1IN C2- 5 12 R1OUT T3OUT 1 24 T4OUT T1OUT 2 23 R2IN T2OUT 3 22 R2OUT R1IN 4 21 SD R1OUT 5 20 EN 19 T4IN T2IN 6 6 11 T1IN T1IN 7 18 T3IN T2OUT 7 10 T2IN GND 8 17 R3OUT VCC 9 16 R3IN V- 9 R2OUT R2IN 8 C1+ 10 15 V- V+ 11 14 C2- C1- 12 13 C2+ +5V +5V 9 16 0.1µF 1 0.1µF + 3 4 0.1µF T1IN T2IN + 5 11 10 VCC C1+ C1C2+ C2- +5V TO 10V VOLTAGE INVERTER V+ +10V TO -10V VOLTAGE INVERTER +5V 400kΩ +5V 400kΩ 2 + 0.1µF 0.1µF T1IN V- 6 + 14 T1OUT T3IN T2 7 12 T2OUT +10V TO -10V VOLTAGE INVERTER V- 15 T2 +5V 400kΩ 18 T3 +5V 400kΩ T4 19 R1IN 2 3 1 24 R2OUT R2IN T4OUT R2IN 16 R3IN R3OUT 20 5kΩ R3 21 SD EN GND 8 3 T3OUT 5kΩ R2 15 T2OUT 23 17 GND T1OUT 5kΩ R2OUT 5kΩ R2 0.1µF R1IN R1OUT R1 8 0.1µF 4 22 9 + + +5V 400kΩ 5kΩ R1 +5V TO 10V VOLTAGE DOUBLER T1 6 11 V+ 5 13 R1OUT T4IN VCC +5V 400kΩ 7 0.1µF T2IN T1 10 C1+ + 12 C113 C2+ + 14 C2- HIN202 thru HIN213 Pinouts (Continued) HIN207 (PDIP, SOIC, SSOP) TOP VIEW HIN208 (PDIP, SOIC, SSOP) TOP VIEW T3OUT 1 24 T4OUT T2OUT 1 24 T3OUT T1OUT 2 23 R2IN T1OUT 2 23 R3IN T2OUT 3 22 R2OUT R2IN 3 22 R3OUT R2OUT 4 21 T4IN T1IN 5 20 T4OUT R1OUT 6 19 T3IN R1IN 4 R1OUT 21 T5IN 20 T5OUT 5 T2IN 6 19 T4IN T1IN 7 18 T3IN R1IN 7 18 T2IN GND 8 17 R3OUT GND 8 17 R4OUT VCC 9 16 R3IN VCC 9 16 R4IN 15 V- C1+ 10 C1+ 10 14 C2- V+ 11 14 C2- C1- 12 13 C2+ C1- 12 13 C2+ +5V +5V 9 0.1µF 0.1µF T1IN T2IN T3IN T4IN T5IN 15 V- V+ 11 10 C1+ + 12 C113 C2+ + 14 C2- VCC 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 +5V 400kΩ 7 +5V 400kΩ 6 +5V 400kΩ 18 9 0.1µF + 0.1µF + T1 2 0.1µF T1OUT 0.1µF T1IN 10 C1+ + 12 C113 C2+ + 14 C2- 3 T3 +5V 400kΩ 19 T4 +5V 400kΩ 21 T5 1 24 20 5 T2OUT T3OUT T4OUT T2IN T3IN T4IN V+ +10V TO -10V VOLTAGE INVERTER V- 15 + + T1 +5V 400kΩ T2 18 19 +5V 400kΩ T3 +5V 400kΩ 21 T4 2 1 24 20 6 T5OUT 11 +5V TO 10V VOLTAGE DOUBLER +5V 400kΩ 5 T2 0.1µF VCC 0.1µF T1OUT T2OUT T3OUT T4OUT 7 R1IN R1OUT 5kΩ R1 4 R1IN R1OUT 4 5kΩ R1 22 R2IN R2IN R2OUT 5kΩ 17 22 R3IN 5kΩ 5kΩ R3 R3IN R3 23 R3OUT 16 R3OUT 5kΩ R2 23 R2 3 R2OUT 17 16 R4IN R4OUT 5kΩ R4 GND 8 GND 8 4 HIN202 thru HIN213 Pinouts (Continued) HIN211 (SOIC, SSOP) TOP VIEW HIN213 (SOIC, SSOP) TOP VIEW T3OUT 1 28 T4OUT T3OUT 1 28 T4OUT T1OUT 2 27 R3IN T1OUT 2 27 R3IN T2OUT 3 26 R3OUT T2OUT 3 26 R3OUT R2IN 4 25 SD R2IN 4 25 SD R2OUT 5 24 EN R2OUT 5 24 EN T2IN 6 23 R4IN T2IN 6 23 R4IN T1IN 7 22 R4OUT T1IN 7 22 R4OUT R1OUT 8 21 T4IN R1OUT 8 21 T4IN R1IN 9 20 T3IN R1IN 9 20 T3IN GND 10 19 R5OUT GND 10 19 R5OUT VCC 11 18 R5IN VCC 11 18 R5IN C1+ 12 17 V- C1+ 12 17 V- V+ 13 16 C2- V+ 13 16 C2- C1- 14 15 C2+ C1- 14 15 C2+ NOTE: R4 and R5 active in shutdown. +5V +5V 11 0.1µF 0.1µF T1IN T2IN T3IN T4IN R1OUT 12 C1+ + 14 C115 C2+ + 16 C2- VCC 13 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 17 + 0.1µF 0.1µF + +5V 400kΩ 7 T1 +5V 400kΩ T2 6 20 +5V 400kΩ T3 21 +5V 400kΩ T4 2 3 1 28 9 8 0.1µF T1OUT T1IN T2OUT T2IN T3OUT T3IN T4OUT T4IN R1IN R1OUT 5 4 R2IN 26 R3IN +5V 400kΩ T2 6 20 +5V 400kΩ T3 21 +5V 400kΩ T4 R4IN SD R1IN 5kΩ 4 5kΩ 27 R3IN 5kΩ 22 23 R4IN R4OUT 5kΩ 19 18 R5IN R5OUT 24 5kΩ R5 25 EN GND 10 T4OUT 9 26 25 GND 28 R2IN 5kΩ EN T3OUT R3OUT 18 R5 T2OUT 1 R4 R5IN T1OUT 3 8 5kΩ R5OUT 0.1µF 2 5 23 19 + R3 R4OUT R4 V- 17 T1 5kΩ 22 +10V TO -10V VOLTAGE INVERTER + R2OUT 27 R3 V+ R2 R3OUT 13 +5V TO 10V VOLTAGE DOUBLER +5V 400kΩ 7 5kΩ R2 0.1µF VCC R1 R2OUT 5 12 C1+ + 14 C115 C2+ + 16 C2- 5kΩ R1 24 11 0.1µF 10 SD HIN202 thru HIN213 Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V) Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Thermal Resistance (Typical, Note 1) θJA (oC/W) 16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 115 16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100 16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135 24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC and SSOP - Lead Tips Only) Operating Conditions Temperature Range HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF; TA = Operating Temperature Range Electrical Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS SUPPLY CURRENTS Power Supply Current, ICC No Load, TA = 25oC HIN202 - 8 15 mA HIN206 - HIN213 - 11 20 mA Shutdown Supply Current, ICC(SD) TA = 25oC HIN206, HIN211 - 1 10 µA HIN213 - 15 50 µA - - 0.8 V LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS Input Logic Low, VlL TIN , EN, SD, EN, SD Input Logic High, VlH TIN 2.0 - - V EN, SD, EN, SD 2.4 - - V Transmitter Input Pullup Current, IP TIN = 0V - 15 200 µA TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA (HIN202, IOUT = 3.2mA) - 0.1 0.4 V TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1mA 3.5 4.6 - V TTL/CMOS Receiver Output Leakage EN = VCC , EN = 0, 0V < ROUT < VCC - 0.05 ±10 µA -30 - +30 V RECEIVER INPUTS RS-232 Input Voltage Range, VIN Receiver Input Impedance, RIN TA = 25oC, VIN = ±3V 3.0 5.0 7.0 kΩ Receiver Input Low Threshold, VIN (H-L) VCC = 5V, TA = 25oC Active Mode 0.8 1.2 - V Shutdown Mode HIN213 R4 and R5 0.6 1.5 - V VCC = 5V, TA = 25oC Active Mode - 1.7 2.4 V Shutdown Mode HIN213 R4 and R5 - 1.5 2.4 V Receiver Input High Threshold, VIN (L-H) 6 HIN202 thru HIN213 Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF; TA = Operating Temperature Range (Continued) Electrical Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS VCC = 5V No Hysteresis in Shutdown Mode 0.2 0.5 1.0 V Baud Rate 1 Transmitter Switching 120 - - kbps Output Enable Time, tEN HIN206, HIN211, HIN213 - 400 - ns Output Disable Time, tDIS HIN206, HIN211, HIN213 - 200 - ns Transmitter, Receiver Propagation Delay, tPD HIN213 SD = 0V, R4, R5 - 0.5 40 µs HIN213 SD = VCC , R1 - R5 - 0.5 10 µs HIN202 - HIN211 - 0.5 10 µs RL = 3kΩ, CL = 2500pF Measured from +3V to -3V or -3V to +3V, 1 Transmitter Switching (Note 2) 3 - 30 V/µs Output Voltage Swing, TOUT Transmitter Outputs, 3kΩ to Ground ±5 ±9 ±10 V Output Resistance, ROUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - - Ω RS-232 Output Short Circuit Current, ISC TOUT Shorted to GND - ±10 - mA Receiver Input Hysteresis, VHYST TIMING CHARACTERISTICS Transition Region Slew Rate, SRT RL = 3kΩ TRANSMITTER OUTPUTS NOTE: 2. Guaranteed by design. VOLTAGE DOUBLER S1 VOLTAGE INVERTER S2 C1+ V+ = 2VCC S5 C2+ S6 VCC GND + GND C1- S3 + C1 - + C3 VCC S4 - GND S7 RC OSCILLATOR FIGURE 1. CHARGE PUMP 7 + C2 C2- C4 V- = - (V+) S8 HIN202 thru HIN213 Detailed Description Receivers The HIN202 thru HIN213 family of RS-232 transmitters/receivers are powered by a single +5V power supply feature low power consumption, and meet all ElA RS232C and V.28 specifications. The circuit is divided into three sections: The charge pump, transmitter, and receiver. Charge Pump An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 125kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase two, C2 is also charged to 2VCC , and then during phase one, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200Ω, and the output impedance of the voltage inverter section (V-) is approximately 450Ω. A typical application uses 0.1µF capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. During shutdown mode (HIN206 and HIN211, SD = VCC , HIN213, SD = 0V) the charge pump is turned off, V+ is pulled down to VCC , V- is pulled up to GND, and the supply current is reduced to less than 10µA. The transmitter outputs are disabled and the receiver outputs (except for HIN213, R4 and R5) are placed in the high impedance state. Transmitters The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC , or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ - 0.6V). Each transmitter input has an internal 400kΩ pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of ±5V minimum with the worst case conditions of: all transmitters driving 3kΩ minimum load impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/µs. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300Ω with ±2V applied to the outputs and VCC = 0V. 8 The receiver inputs accept up to ±30V while presenting the required 3kΩ to 7kΩ input impedance even if the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the ±3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis (except during shutdown) to improve noise rejection. The receiver Enable line (EN on HIN206 and HIN211, EN on HIN213) when unasserted, disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode (except HIN213 R4 and R5). V+ VCC 400kΩ 300Ω TXIN TOUT GND < TXIN < VCC V- < VTOUT < V+ V- FIGURE 2. TRANSMITTER VCC RXIN -30V < RXIN < +30V ROUT GND < VROUT < VCC 5kΩ GND FIGURE 3. RECEIVER TIN OR RIN TOUT OR ROUT VOL VOL tPHL tPLH tPHL + tPLH 2 AVERAGE PROPAGATION DELAY = FIGURE 4. PROPAGATION DELAY DEFINITION HIN213 Operation in Shutdown The HIN213 features two receivers, R4 and R5, which remain active in shutdown mode. During normal operation the receivers propagation delay is typically 0.5µs. This propagation delay may increase slightly during shutdown. When entering shut down mode, receivers R4 and R5 are not valid for 80µs after SD = VIL. When exiting shutdown mode, all receiver outputs will be invalid until the charge pump circuitry reaches normal operating voltage. This is typically less than 2ms when using 0.1µF capacitors. HIN202 thru HIN213 Typical Performance Curves 12 0.1µF SUPPLY VOLTAGE (|V|) V- SUPPLY VOLTAGE (V) 12 10 8 6 4 10 V+ (VCC = 5V) 8 6 V+ (VCC = 4V) V- (VCC = 4V) 4 TA = 25oC 2 2 0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0 5 10 VCC FIGURE 5. V- (VCC = 5V) TRANSMITTER OUTPUTS OPEN CIRCUIT 15 20 25 30 35 |ILOAD| (mA) V- SUPPLY VOLTAGE vs VCC FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD Test Circuits (HIN202) +4.5V TO +5.5V INPUT - 0.1µF C3 0.1µF C1 + + - 0.1µF + C2 - + 0.1µF C4 3kΩ 1 C1+ VCC 16 2 V+ GND 15 3kΩ 3 C1- T1OUT 14 4 C2+ R1IN 13 RS-232 ±30V INPUT 5 C2- R1OUT 12 TTL/CMOS OUTPUT T1 OUTPUT 6 V- T1IN 11 TTL/CMOS INPUT 7 T2OUT T2IN 10 TTL/CMOS INPUT 8 R2IN R2OUT 9 1 C1+ VCC 16 2 V+ GND 15 3 C1- T1OUT 14 4 C2+ R1IN 13 5 C2- R1OUT 12 6 V7 T2OUT 8 R2IN ROUT = VIN /I T1IN 11 T2IN 10 R2OUT 9 T2OUT TTL/CMOS OUTPUT T2 OUTPUT T1OUT VIN = ±2V A RS-232 ±30V INPUT FIGURE 7. GENERAL TEST CIRCUIT FIGURE 8. POWER-OFF SOURCE RESISTANCE CONFIGURATION Application Information The HIN2XX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where ±12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5kW resistor connected to V+. 9 In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters. HIN202 thru HIN213 +5V + 16 1 C1 + 0.1µF - 3 HIN202 6 4 C2 + 0.1µF - 5 TD INPUTS OUTPUTS TTL/CMOS CTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT RTS T1 11 14 T2 10 7 13 12 RD CTS + R2 9 R1 8 15 RS-232 INPUTS AND OUTPUTS TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7) FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING 1 C1 + 0.1µF TD INPUTS OUTPUTS TTL/CMOS RTS 4 HIN202 3 T1 11 - 14 T2 10 + C2 0.1µF 5 12 TD (2) TRANSMIT DATA 7 RTS (4) REQUEST TO SEND 13 RD (3) RECEIVE DATA RD 9 CTS R2 R1 8 CTS (5) CLEAR TO SEND 15 VCC 16 2 - C3 + + C4 6 V- V+ 0.2µF 0.2µF 2 6 - VCC 16 +5V RS-232 INPUTS AND OUTPUTS HIN202 C1 + 0.1µF DTR INPUTS OUTPUTS TTL/CMOS DSRS 1 4 3 5 T1 11 14 T2 10 7 13 12 DCD R1 9 R2 R1 15 8 + C2 0.1µF - DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7) FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS 10 HIN202 thru HIN213 Die Characteristics DIE DIMENSIONS: PASSIVATION: 160 mils x 140 mils Type: Nitride over Silox Nitride Thickness: 8kÅ Silox Thickness: 7kÅ METALLIZATION: Type: Al Thickness: 10kÅ ±1kÅ SUBSTRATE POTENTIAL V+ TRANSISTOR COUNT: 238 PROCESS: CMOS Metal Gate Metallization Mask Layout HIN211 SHD EN R4IN R4OUT T4IN T3IN R5OUT R5IN R3OUT V- C2R3IN T4OUT C2+ T3OUT C1T1OUT V+ T2OUT C1+ R2IN VCC R2OUT T2IN T1IN R1OUT 11 R1IN GND HIN202 thru HIN213 Dual-In-Line Plastic Packages (PDIP) E16.3 (JEDEC MS-001-BB ISSUE D) N 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AE D BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 C D 0.735 0.775 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 0.005 - 0.13 - 5 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC eA 0.300 BSC eB - 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. L 0.115 N 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 12 5 E 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 0.355 19.68 D1 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 0.204 18.66 16 2.54 BSC 7.62 BSC 0.430 - 0.150 2.93 16 6 10.92 7 3.81 4 9 Rev. 0 12/93 HIN202 thru HIN213 Dual-In-Line Plastic Packages (PDIP) E24.3 (JEDEC MS-001-AF ISSUE D) N 24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 N/2 INCHES -B- SYMBOL -AD E BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 eA A1 eC B 0.010 (0.25) M C L C A B S C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 13 MILLIMETERS MIN MAX MIN MAX - NOTES A - 0.210 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8 C 0.008 0.014 0.204 0.355 - D 1.230 1.280 31.24 D1 0.005 - 0.13 32.51 5 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC 6 eB - 0.430 L 0.115 0.150 N 24 2.93 24 10.92 7 3.81 4 9 Rev. 0 12/93 HIN202 thru HIN213 Small Outline Plastic Packages (SOIC) M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA 0.25(0.010) M H 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- µα e A1 B 0.25(0.010) M 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3859 0.3937 9.80 10.00 3 E 0.1497 0.1574 3.80 4.00 4 e C B S 0.050 BSC 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 14 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N NOTES: MILLIMETERS α 16 0o 16 8o 0o 7 8o Rev. 0 12/93 HIN202 thru HIN213 Small Outline Plastic Packages (SSOP) M16.209 (JEDEC MO-150-AC ISSUE B) N INDEX AREA 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M 2 SYMBOL GAUGE PLANE 3 0.25 0.010 SEATING PLANE -A- INCHES E -B- 1 B M A D -C- µα e A1 B 0.25(0.010) M L C 0.10(0.004) C A M B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 15 MIN MAX NOTES A - 0.078 - 2.00 - 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.233 0.255 5.90 6.50 3 E 0.197 0.220 5.00 5.60 4 0.026 BSC 0.65 BSC - H 0.292 0.322 7.40 8.20 - L 0.022 0.037 0.55 0.95 6 8o 0o N α NOTES: MAX A1 e A2 MILLIMETERS MIN 16 0o 16 7 8o Rev. 2 3/95 HIN202 thru HIN213 Small Outline Plastic Packages (SOIC) M16.3 (JEDEC MS-013-AA ISSUE C) N 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.3977 0.4133 10.10 10.50 3 E 0.2914 0.2992 7.40 7.60 4 e µα B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 16 0.050 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N α NOTES: MILLIMETERS 16 0o 16 8o 0o 7 8o Rev. 0 12/93 HIN202 thru HIN213 Small Outline Plastic Packages (SOIC) M24.3 (JEDEC MS-013-AD ISSUE C) N 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e µα B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 17 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N α NOTES: MILLIMETERS 24 0o 24 8o 0o 7 8o Rev. 0 12/93 HIN202 thru HIN213 Shrink Small Outline Plastic Packages (SSOP) M24.209 (JEDEC MO-150-AG ISSUE B) N 24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E GAUGE PLANE -B1 2 3 L 0.25 0.010 SEATING PLANE -A- A D -C- µα e B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - 0.05 - - 0.072 1.65 1.85 - A1 0.002 A2 0.065 B S B 0.009 0.014 0.22 0.38 9 0.004 0.009 0.09 0.25 - D 0.312 0.334 7.90 8.50 3 E 0.197 0.220 5.00 5.60 4 0.026 BSC H 0.292 L 0.022 N α NOTES: - C e A2 A1 MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 24 0o - 8.20 - 0.95 6 24 8o 0o 7 8o Rev. 1 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 18 3/95 HIN202 thru HIN213 Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 19 MILLIMETERS MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 0.05 BSC 10.00 h 0.01 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 8o 0o 28 0o 10.65 - 0.394 N 0.419 1.27 BSC H α NOTES: MAX A1 e µα MIN 28 - 7 8o Rev. 0 12/93 HIN202 thru HIN213 Shrink Small Outline Plastic Packages (SSOP) M28.209 (JEDEC MO-150-AH ISSUE B) N 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E GAUGE PLANE -B1 2 3 L 0.25 0.010 SEATING PLANE -A- A D -C- µα e B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.390 0.413 9.90 10.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B S 0.026 BSC H 0.292 L 0.022 N α NOTES: MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 28 0o - 0.95 6 28 8o 0o 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. - 8.20 7 8o Rev. 1 3/95 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 20