MICROSEMI 1N5770

1N5770
Isolated Diode Array with
HiRel MQ, MX, MV, and MSP Screening Options
SCOTTSDALE DIVISION
APPEARANCE
10-PIN Ceramic
Flat Pack
WWW . Microsemi .C OM
DESCRIPTION
These low capacitance diode arrays with common anode are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 10-PIN package for use as
steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by directing
them to ground (see figure 1). This circuit application is further complimented by the
1N5768 (separate data sheet) that has a common cathode. An external TVS diode may
be added between the positive supply line and ground to prevent overvoltage on the
supply rail. They may also be used in fast switching core-driver applications. This
includes computers and peripheral equipment such as magnetic cores, thin-film
memories, plated-wire memories, etc., as well as decoding or encoding applications.
These arrays offer many advantages of integrated circuits such as high-density
packaging and improved reliability. This is a result of fewer pick and place operations,
smaller footprint, smaller weight, and elimination of various discrete packages that may
not be as user friendly in PC board mounting.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
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APPLICATIONS / BENEFITS
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Hermetic Ceramic Package
Isolated Diodes To Eliminate Cross-Talk Voltages
High Breakdown Voltage VBR > 60 V at 10 μA
Low Leakage IR< 100nA at 40 V
Low Capacitance C < 8.0 pF
Options for screening in accordance with MIL-PRF19500/474 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For example, designate
MX1N5770 for a JANTX screen.
High Frequency Data Lines
RS-232 & RS-422 Interface Networks
Ethernet: 10 Base T
Computer I/O Ports
LAN
Switching Core Drivers
IEC 61000-4 Compatible (see circuit in figure 1)
61000-4-2 ESD : Air 15kV, contact 8kW
61000-4-4 (EFT) : 40A – 5/50 ns
61000-4-5 (surge): 12A 8/20 μs
MAXIMUM RATINGS
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MECHANICAL AND PACKAGING
VBR Reverse Breakdown Voltage 60 V min (Notes 1 & 2)
IO Continuous Forward Current 300 mA (Notes 1 & 3)
IFSM Forward Surge Current (tp=1/120 s) 500 mA (Note 1)
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400 mW Power Dissipation per Junction @ 25 C
500 mW Power Dissipation per Package @ 25oC (Note 4)
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Operating Junction Temperature range –65 to +150 C
Storage Temperature range of –65 to +200oC
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
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10-PIN Ceramic Flat Pack
Weight 0.25 grams (approximate)
Marking: Logo, part number, date code and dot
identifying pin #1
Carrier Tubes; 19 pcs (standard)
Each Diode
Pulsed: PW = 100 ms max; duty cycle <20%
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Derate at 2.4 mA/ C above +25 C
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Derate at 4.0 mW/ C above +25 C
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25oC unless otherwise specified
1N5770
MAXIMUM
FORWARD
VOLTAGE
VF2
IF = 500 mA
(Note 1)
MAXIMUM
REVERSE
CURRENT
MAXIMUM
CAPACITANCE
(PIN TO PIN)
IR1
VR = 40 V
VR = 0 V
F = 1 MHz
Vdc
Vdc
μAdc
pF
ns
ns
1
1.5
0.1
8.0
40
20
Ct
MAXIMUM
FORWARD
RECOVERY TIME
tfr
IF = 500 mA
NOTE 1: Pulsed: PW = 300 µs +/- 50 µs, duty cycle <2%, 90 µs after leading edge.
Copyright © 2006
01-24-2006 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
1N5770
PART
NUMBER
MAXIMUM
REVERSE
RECOVERY TIME
trr
IF = IR = 200 mA
irr = 20 mA
RL = 100 ohms
MAXIMUM
FORWARD
VOLTAGE
VF1
IF = 100 mA
(Note 1)
1N5770
Isolated Diode Array with
HiRel MQ, MX, MV, and MSP Screening Options
SCOTTSDALE DIVISION
IR
IFSM
Ct
WWW . Microsemi .C OM
SYMBOLS & DEFINITIONS
Symbol
VBR
VF
DEFINITION
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
Maximum Reverse Current: The maximum reverse current that will flow at the specified voltage and
temperature.
Forward Surge Current: The peak forward surge current at a specified pulse width
Capacitance: The capacitance of the diode as defined @ 0 volts at a frequency of 1 MHz and stated in
picofarads.
SCHEMATIC
PACKAGE DIMENSIONS
CIRCUIT
Supply rail (+VCC)
I/O Port
1N5770
GND (or -VCC)
Steering Diode Application
FIGURE 1
Copyright © 2006
01-24-2006 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2