HITTITE HMC135_09

HMC135
v04.0909
Typical Applications
Features
The HMC135 is suitable for:
Chip Integrates Directly into MIC Designs
• Wireless Local Loop
Carrier Suppression: 30 dB
• LMDS & VSAT
Direct Modulation in the 1.8 - 5.2 GHz Band
• Point-to-Point Radios
Functions also as a Phase Detector
Die Size: 1.45 x 1.45 x 0.1 mm
• Test Equipment
MODULATORS - BI-PHASE - CHIP
5
GaAs MMIC BI-PHASE
MODULATOR, 1.8 - 5.2 GHz
Functional Diagram
General Description
The HMC135 Bi-Phase Modulator is designed to
phase-modulate an RF signal into reference and
180 degree states. Device input is at the RF port
and output is at the LO port. The polarity of the
bias current at the control port (IF port) defines the
phase states. Excellent amplitude and phase balance
provided by closely matched monolithic balun and
diode circuits delivers 30 dB of carrier suppression in
a tiny monolithic chip.
The device also functions as a demodulator or phase
comparator. As a demodulator, data emerges at the
control port when a modulated signal at the RF port
is compared to a reference signal at the LO port.
As a phase comparator, the phase angle between
two signals applied to the RF and LO ports is
represented by an analog voltage at the control port.
Except for carrier suppression, the data presented
here was measured under static conditions in which
a DC bias current (nominally 5 mA) is applied to the
control port.
Electrical Specifi cations, TA = +25° C, 5 mA Bias Current
Parameter
Min.
Frequency Band
Insertion Loss
9
Return Loss, RF and LO Ports
2.5
Amplitude Balance
Phase Balance
Carrier Suppression (When driven with a 1 MHz square wave, 1.4 Vp-p)
5-2
Typ.
Max.
1.8 - 5.2
25
Units
GHz
11
dB
0.2
0.5
dB
2.5
5.0
Deg
3.0
dB
30
dBc
Input Power for 1 dB Compression
0
8
dBm
Third Order Intercept, Input
5
10
dBm
Second Order Intercept, Input
15
30
dBm
Bias Current (Bias current forward biases internal Schottky diodes providing approximately 0.6 V
at the control port).
2
5
10
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
mA
HMC135
v04.0909
GaAs MMIC BI-PHASE
MODULATOR, 1.8 - 5.2 GHz
Insertion Loss
Amplitude Balance
0
2
AMPLITUDE BALANCE (dB)
-10
-15
1
0
-1
-20
-2
1
2
3
4
5
6
1
2
3
Phase Balance
5
6
Carrier Suppression *
50
CARRIER SUPPRESSION (dBc)
10
8
6
PHASE BALANCE (Deg)
4
4
2
0
-2
-4
-6
-8
40
30
20
10
0
-10
1
2
3
4
5
2
6
3
4
5
CARRIER FREQUENCY (GHz)
FREQUENCY (GHz)
Return Loss
0
RETURN LOSS (dB)
5
FREQUENCY (GHz)
FREQUENCY (GHz)
-5
6
MODULATORS - BI-PHASE - CHIP
INSERTION LOSS (dB)
-5
-10
-15
-20
0
1
2
3
4
5
6
7
8
FREQUENCY (GHz)
* (For 1.4 Vp-p Square Wave Modulation at 1 MHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5-3
HMC135
v04.0909
GaAs MMIC BI-PHASE
MODULATOR, 1.8 - 5.2 GHz
Input Compression vs Frequency *
Input Compression vs Bias at 4 GHz
12
14
10
12
P1dB (dBm)
P1dB (dBm)
10
8
6
4
0
0
2
3
4
5
CARRIER FREQUENCY (GHz)
6
0
Input Third Order Intercept vs Frequency *
1
2
3
4
5
6
7
BIAS CURRENT (mA)
8
9
10
Input Third Order Intercept vs Bias at 4 GHz
25
25
20
20
IP3 (dBm)
IP3 (dBm)
MODULATORS - BI-PHASE - CHIP
2
15
10
5
15
10
5
0
0
0
1
2
3
4
5
6
7
BIAS CURRENT (mA)
8
9
10
0
1
2
3
4
5
6
7
BIAS CURRENT (mA)
8
* (For 5 mA Bias Current)
Suggested TTL Driver for a Bi-Phase Modulator
+2.5 Vdc
+5 Vdc
MODULATOR
I, Q PORTS
.01 uF
VCC
VCC
HC04
HCT04
*R 1
VA
0.6V
TTL
V Z = 2V
GND
GND
2.2K
-2.5 Vdc
Notes
1. VA Alternates Between
+ 2.4 Vdc
± IA = 2.4 - 0.6 = ± 5 mA
360 Ohm
5-4
6
4
2
5
8
IA
.01 uF
HITTITE
MODULATOR
2. HCT04 and HC04 are QMOS HEX
Inverters.
*R1 =300 to 620 ± 2% Select R1 To
Supply ±3 to ±6 mA to the IF Port.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9
10
HMC135
v04.0909
GaAs MMIC BI-PHASE
MODULATOR, 1.8 - 5.2 GHz
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
WP-3 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BOND PAD SPACING IS .006” CENTER TO CENTER.
MODULATORS - BI-PHASE - CHIP
5
4. BACKSIDE METALIZATION: GOLD.
5. BACKSIDE METAL IS GROUND.
6. BOND PAD METALIZATION: GOLD.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5-5
HMC135
v04.0909
GaAs MMIC BI-PHASE
MODULATOR, 1.8 - 5.2 GHz
Pad Descriptions
Pad Number
Function
Description
1
IF
This pin is DC coupled. For applications not requiring
operation to DC, this port should be DC blocked externally
using a series capacitor whose value has been chosen to
pass the necessary IF frequency range. For operation to
DC this pin must not source or sink more than 10mA of current or die non-function and possible die failure will result.
2
RF
DC coupled and matched to 50 Ohms.
3
LO
DC coupled and matched to 50 Ohms.
Interface Schematic
MODULATORS - BI-PHASE - CHIP
5
5-6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC135
v04.0909
GaAs MMIC BI-PHASE
MODULATOR, 1.8 - 5.2 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Ribbon Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should be placed as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD
strikes.
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pickup.
0.102mm (0.004”) Thick GaAs MMIC
Ribbon Bond
0.076mm
(0.003”)
RF Ground Plane
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010” Thick Alumina
Thin Film Substrate
Figure 2.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a
tool temperature of 265 deg. C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290
deg. C. DO NOT expose the chip to a temperature greater than 320 deg. C for more than 20 seconds. No more than
3 seconds of scrubbing should be required for attachment.
5
MODULATORS - BI-PHASE - CHIP
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded
with a force of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended.
Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made
with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve
reliable bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm).
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5-7