ISSI IS42SM81600E

IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
16Mx8, 8Mx16, 4Mx32
128Mb Mobile Synchronous DRAM
APRIL 2011
DESCRIPTION
FEATURES
• Fully synchronous; all signals referenced to a positive
clock edge
• Internal bank for hiding row access and precharge
• Programmable CAS latency: 2, 3
• Programmable Burst Length: 1, 2, 4, 8, and Full Page
• Programmable Burst Sequence:
• Sequential and Interleave
• Auto Refresh (CBR)
• TCSR (Temperature Compensated Self Refresh)
• PASR (Partial Arrays Self Refresh): 1/16, 1/8, 1/4, 1/2,
and Full
• Deep Power Down Mode (DPD)
• Driver Strength Control (DS): 1/4, 1/2, and Full
ISSI's 128Mb Mobile Synchronous DRAM achieves highspeed data transfer using pipeline architecture. All input
and output signals refer to the rising edge of the clock
input. Both write and read accesses to the SDRAM are
burst oriented. The 128Mb Mobile Synchronous DRAM
is designed to minimize current consumption making it
ideal for low-power applications. Both TSOP and BGA
packages are offered, including industrial grade products.
KEY TIMING PARAMETERS
Parameter
-6
-7
-75E
Unit
CLK Cycle Time
CAS Latency = 3
6
7
–
ns
CAS Latency = 2
10
10
7.5
ns
OPTIONS
CLK Frequency
• Configurations:
- 16M x 8 - 8M x 16
- 4M x 32 • Power Supply IS42SMxxx – Vdd/Vddq = 3.3 V
IS42RMxxx – Vdd/Vddq = 2.5 V
• Packages:
x8 / x16 –TSOP II (54), BGA (54) [x16 only]
x32 – TSOP II (86), BGA (90)
• Temperature Range: Commercial (0°C to +70°C) Industrial (–40 ºC to 85 ºC)
CAS Latency = 3
166
143
–
Mhz
CAS Latency = 2
100
100
133
Mhz
CAS Latency = 3
5.4
5.4
–
ns
CAS Latency = 2
8
8
5.4
ns
Access Time from CLK
ADDRESSING TABLE
Parameter
16M x 8
8M x 16
4M x 32
Configuration
4M x 8 x 4 banks
2M x 16 x 4 banks
1M x 32 x 4 banks
Refresh Count
4K/64ms
4K/64ms
4K/64ms
Row Addressing
A0-A11
A0-A11
A0-A11
Column Addressing
A0-A9
A0-A8
A0-A7
BA0, BA1
BA0, BA1
BA0, BA1
A10
A10
A10
Bank Addressing
Precharge Addressing
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon
Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
1
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
General Description
ISSI’s 128Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 3.3V – 2.5V
VDD and 3.3V – 2.5V VDDQ memory systems containing 134,271,728 bits. Internally configured as a quad-bank
DRAM with a synchronous interface. The 128Mb SDRAM includes an AUTO REFRESH MODE, and a power-saving,
power-down mode. All signals are registered on the positive edge of the clock signal, CLK. All inputs and outputs are
LVTTL (VDD = 3.3V) or LVCMOS (VDD = 2.5V) compatible. The 128Mb SDRAM has the ability to synchronously
burst data at a high data rate with automatic column-address generation, the ability to interleave between internal
banks to hide precharge time and the capability to randomly change column addresses on each clock cycle during
burst access.
A self-timed row precharge initiated at the end of the burst sequence is available with the AUTO PRECHARGE
function enabled. Precharge one bank while accessing one of the other three banks will hide the precharge cycles
and provide seamless, high-speed, random-access operation. SDRAM read and write accesses are burst oriented
starting at a selected location and continuing for a programmed number of locations in a programmed sequence. The
registration of an Active command begins accesses, followed by a Read or Write command. The ACTIVE command
in conjunction with address bits registered are used to select the bank and row to be accessed (BA0, BA1 select the
bank; A0-A11 (x8, x16 and x32) select the row). The READ or WRITE commands in conjunction with address bits
registered are used to select the starting column location for the burst access. Programmable READ or WRITE burst
lengths consist of 1, 2, 4 and 8 locations, or full page, with a burst terminate option.
Functional Block Diagram (8Mx16)
16
16
REFRESH
CONTROLLER
MODE
REGISTER
12
2
SELF
REFRESH
A10
CONTROLLER
A11
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
DQML
DQMH
DATA IN
BUFFER
COMMAND
DECODER
&
CLOCK
GENERATOR
16
DQ 0-15
VDD/VDDQ
DATA OUT
BUFFER
Vss/VssQ
16
12
MULTIPLEXER
REFRESH
COUNTER
ROW
ADDRESS
LATCH
12
12
COLUMN
ADDRESS LATCH
ROW
ADDRESS
BUFFER
ROW DECODER
CLK
CKE
CS
RAS
CAS
WE
4096
4096
4096
4096
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
512
(x 16)
BANK CONTROL LOGIC
9
BURST COUNTER
COLUMN
ADDRESS BUFFER
2
COLUMN DECODER
9
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
PIN CONFIGURATIONS
54 pin TSOP - Type II for x8
VDD
1
54
VSS
DQ0
2
53
DQ7
VDDQ
3
52
VSSQ
NC
4
51
NC
DQ1
5
50
DQ6
VSSQ
6
49
VDDQ
NC
7
48
NC
DQ2
8
47
DQ5
VDDQ
9
46
VSSQ
NC
10
45
NC
DQ3
11
44
DQ4
VSSQ
12
43
VDDQ
NC
13
42
NC
VDD
14
41
VSS
NC
15
40
NC
WE
16
39
DQM
CAS
17
38
CLK
RAS
18
37
CKE
CS
19
36
NC
BA0
20
35
A11
BA1
21
34
A9
A10
22
33
A8
A0
23
32
A7
A1
24
31
A6
A2
25
30
A5
A3
26
29
A4
VDD
27
28
VSS
PIN DESCRIPTIONS: 16Mx8
A0-A11 A0-A9 BA0, BA1
DQ0 to DQ7
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
WE
DQM
Vdd
Vss
Vddq
Vssq
NC
Write Enable
Data Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
3
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
PIN CONFIGURATIONS
54 pin TSOP - Type II for x16
VDD
1
54
VSS
DQ0
2
53
DQ15
VDDQ
3
52
VSSQ
DQ1
4
51
DQ14
DQ2
5
50
DQ13
VSSQ
6
49
VDDQ
DQ3
7
48
DQ12
DQ4
8
47
DQ11
VDDQ
9
46
VSSQ
DQ5
10
45
DQ10
DQ6
11
44
DQ9
VSSQ
12
43
VDDQ
DQ7
13
42
DQ8
VDD
14
41
VSS
DQML
15
40
NC
WE
16
39
DQMH
CAS
17
38
CLK
RAS
18
37
CKE
CS
19
36
NC
BA0
20
35
A11
BA1
21
34
A9
A10
22
33
A8
A0
23
32
A7
A1
24
31
A6
A2
25
30
A5
A3
26
29
A4
VDD
27
28
VSS
PIN DESCRIPTIONS: 8Mx16
A0-A11 A0-A8 BA0, BA1
DQ0 to DQ15
CLK
CKE
CS
RAS
CAS
4
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQML
DQMH
Vdd
Vss
Vddq
Vssq
NC
Write Enable
x16 Lower Byte, Input/Output Mask
x16 Upper Byte, Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
PIN CONFIGURATION
54-ball fBGA for x16 (Top View) (8.00 mm x 8.00 mm Body, 0.8 mm Ball Pitch)
package code: B 1 2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
VSS DQ15 VSSQ
VDDQ DQ0 VDD
DQ14 DQ13 VDDQ
VSSQ DQ2 DQ1
DQ12 DQ11 VSSQ
VDDQ DQ4 DQ3
DQ10 DQ9 VDDQ
VSSQ DQ6 DQ5
DQ8
NC
VSS
VDD DQML DQ7
DQMH CLK
CKE
CAS
RAS
WE
NC
A11
A9
BA0
BA1
CS
A8
A7
A6
A0
A1
A10
VSS
A5
A4
A3
A2
VDD
PIN DESCRIPTIONS: 8Mx16
A0-A11 A0-A8 BA0, BA1
DQ0 to DQ15
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
WE
DQML
DQMH
Vdd
Vss
Vddq
Vssq
NC
Write Enable
x16 Lower Byte Input/Output Mask
x16 Upper Byte Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
5
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
PIN CONFIGURATIONS
86 pin TSOP - Type II for x32
VDD
1
86
VSS
DQ0
2
85
DQ15
VDDQ
3
84
VSSQ
DQ1
4
83
DQ14
DQ2
5
82
DQ13
VSSQ
6
81
VDDQ
DQ3
7
80
DQ12
DQ4
8
79
DQ11
VDDQ
9
78
VSSQ
DQ5
10
77
DQ10
DQ6
11
76
DQ9
VSSQ
12
75
VDDQ
DQ7
13
74
DQ8
NC
14
73
NC
VDD
15
72
VSS
DQM0
16
71
DQM1
WE
17
70
NC
CAS
18
69
NC
RAS
19
68
CLK
CS
20
67
CKE
A11
21
66
A9
BA0
22
65
A8
BA1
23
64
A7
A10
24
63
A6
A0
25
62
A5
A1
26
61
A4
A2
27
60
A3
DQM2
28
59
DQM3
VDD
29
58
VSS
NC
30
57
NC
DQ16
31
56
DQ31
VSSQ
32
55
VDDQ
DQ17
33
54
DQ30
DQ18
34
53
DQ29
VDDQ
35
52
VSSQ
DQ19
36
51
DQ28
DQ20
37
50
DQ27
VSSQ
38
49
VDDQ
DQ21
39
48
DQ26
DQ22
40
47
DQ25
VDDQ
41
46
VSSQ
DQ23
42
45
DQ24
VDD
43
44
VSS
PIN DESCRIPTIONS: 4Mx32
A0-A11 A0-A7 BA0, BA1
DQ0 to DQ31
CLK
CKE
CS
RAS
CAS
6
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQM0-DQM3
Vdd
Vss
Vddq
Vssq
NC
Write Enable
x32 Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
PIN CONFIGURATION
package code: B 90 bALL fbga (Top View) (8.00 mm x 13.00 mm Body, 0.8 mm Ball Pitch)
1 2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
DQ26 DQ24
VSS
VDD DQ23 DQ21
DQ28 VDDQ VSSQ
VDDQ VSSQ DQ19
VSSQ DQ27 DQ25
DQ22 DQ20 VDDQ
VSSQ DQ29 DQ30
DQ17 DQ18 VDDQ
VDDQ DQ31
NC
NC
DQ16 VSSQ
VSS DQM3
A3
A2
DQM2 VDD
A4
A5
A6
A10
A0
A1
A7
A8
NC
NC
BA1
A11
CLK
CKE
A9
BA0
CS
RAS
DQM1
NC
NC
CAS
WE DQM0
VDDQ DQ8
VSS
VDD
DQ7 VSSQ
VSSQ DQ10 DQ9
DQ6
DQ5 VDDQ
VSSQ DQ12 DQ14
DQ1
DQ3 VDDQ
DQ11 VDDQ VSSQ
DQ13 DQ15
VSS
VDDQ VSSQ DQ4
VDD
DQ0
DQ2
PIN DESCRIPTIONS: 4Mx32
A0-A11 A0-A7 BA0, BA1
DQ0 to DQ31
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
WE
DQM0-DQM3
Vdd
Vss
Vddq
Vssq
NC
Write Enable
x32 Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
7
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Mobile SDRAM Functionality
ISSI’s 128Mb Mobile SDRAMs are pin compatible and have similar functionality with ISSI’s standard SDRAMs, but
offer lower operating voltages and power saving features. For detailed descriptions of pin functions, command truth
tables, functional truth tables, device operation as well as timing diagrams please refer to ISSI document “Mobile
Synchronous DRAM Device Operations & Timing Diagrams” listed at www.issi.com
REGISTER DEFINITION
Mode Register (MR) & Extended Mode Register (EMR)
There are two mode registers in the Mobile SDRAM; Mode Register (MR) and Extended Mode Register (EMR). The
Mode Register is discussed below, followed by the Extended Mode Register. The Mode Register is used to define
the specific mode of operation of the SDRAM. This definition includes the selection of burst length, a burst type, CAS
Latency, operating mode, and a write burst mode. The mode register is programmed via the LOAD MODE REGISTER
command and will retain the stored information until it is programmed again or the device loses power.
The EMR controls the functions beyond those controlled by the MR. These additional functions are special features
of the Mobile SDRAM. They include temperature-compensated self refresh (TCSR) control, partial-array self refresh
(PASR), and output drive strength. The EMR is programmed via the MODE REGISTER SET command with BA1
= 1 and BA0 = 0 and retains the stored information until it is programmed again or the device loses power. Not
programming the extended mode register upon initialization will result in default settings for the low-power features.
The extended mode will default with the temperature sensor enabled, full drive strength, and full array (all 4 banks)
refresh.
Mode Register Definition
The MR is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a
burst length, a burst type, a CAS latency, an operating mode and a write burst mode, as shown in Figure MODE
REGISTER DEFINITION. The mode register is programmed via the LOAD MODE REGISTER command and will
retain the stored information until it is programmed again or the device loses power.
Mode register bits M0 - M2 specify the burst length, M3 specifies the type of burst (sequential or interleaved), M4 M6 specify the CAS latency, M7 and M8 specify the operating mode, M9 specifies the WRITE burst mode, and M10,
M11, and M12 are reserved for future use.
The mode register must be loaded when all banks are idle, and the controller must wait the specified time before
initiating the subsequent operation. Violating either of these requirements will result in unspecified operation.
8
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
MODE REGISTER DEFINITION
BA1 BA0
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Address Bus (Ax)
Mode Register (Mx)
Burst Length
(1)
Reserved
M2
M1
M0
M3=0
M3=1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
2
4
8
Reserved
Reserved
Reserved
Full Page
1
2
4
8
Reserved
Reserved
Reserved
Reserved
Burst Type
M3
Type
0
1
Sequential
Interleaved
Latency Mode
M6 M5 M4
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
CAS Latency
Reserved
Reserved
2
3
Reserved
Reserved
Reserved
Reserved
Operating Mode
M8 M7
M6-M0
Mode
0 0
— —
Defined
—
Standard Operation
All Other States Reserved
Write Burst Mode
BA1
BA0
0
0
Mode Register Definition
Program Mode Register
0
1
Reserved
1
1
0
1
Program Extended Mode Register
Reserved
M9
0
1
Mode
Programmed Burst Length
Single Location Access
To ensure compatibility with future devices,
should program A11, A10 = "0"
Burst Length
Read and write accesses to the SDRAM are burst oriented, with the burst length being programmable, as shown in
MODE REGISTER DEFINITION. The burst length determines the maximum number of column locations that can
be accessed for a given READ or WRITE command. Burst lengths of 1, 2, 4 or 8 locations are available for both the
sequential and the interleaved burst types, and a full-page burst is available for the sequential type. The full-page burst
is used in conjunction with the BURST TERMINATE command to generate arbitrary burst lengths. Reserved states
should not be used, as unknown operation or incompatibility with future versions may result.
When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All
accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is
reached. The block is uniquely selected by A1-A7 (x32), A1-A8 (x16) or A1-A9 (x8) when the burst length is set to two;
by A2-A7 (x32), A2-A8 (x16) or A2-A9 (x8) when the burst length is set to four; and by A3-A7 (x32), A3-A8 (x16) or
A3-A9 (x8) when the burst length is set to eight. The remaining (least significant) address bit(s) are used to select the
starting location within the block. Full-page bursts wrap within the page if the boundary is reached.
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
9
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Burst Type
Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the
burst type and is selected via bit M3.
The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column
address, as shown in BURST DEFINITION table.
Burst Definition
BurstStarting Column
Order of Accesses Within a Burst
Length
Address
Type = Sequential
Type = Interleaved
A0
2
0
0-1
0-1
1
1-0
1-0
A1
A0
0
0
0-1-2-3
0-1-2-3
4
0
1
1-2-3-0
1-0-3-2
1
0
2-3-0-1
2-3-0-1
1
1
3-0-1-2
3-2-1-0
A2
A1
A0
0
0
0
0-1-2-3-4-5-6-7
0-1-2-3-4-5-6-7
0
0
1
1-2-3-4-5-6-7-0
1-0-3-2-5-4-7-6
0
1
0
2-3-4-5-6-7-0-1
2-3-0-1-6-7-4-5
8
0
1
1
3-4-5-6-7-0-1-2
3-2-1-0-7-6-5-4
1
0
0
4-5-6-7-0-1-2-3
4-5-6-7-0-1-2-3
1
0
1
5-6-7-0-1-2-3-4
5-4-7-6-1-0-3-2
1
1
0
6-7-0-1-2-3-4-5
6-7-4-5-2-3-0-1
1
1
1
7-0-1-2-3-4-5-6
7-6-5-4-3-2-1-0
Full n = A0-A7 (x32)
Cn, Cn + 1, Cn + 2
Not Supported
Page n = A0-A8 (x16) Cn + 3, Cn + 4...
(y) n = A0-A9 (x8) …Cn - 1,
(location 0-y) Cn…
CAS Latency
The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the
first piece of output data. The latency can be set to two or three clocks.
If a READ command is registered at clock edge n, and the latency is m clocks, the data will be available by clock
edge n + m. The DQs will start driving as a result of the clock edge one cycle earlier (n + m - 1), and provided that
the relevant access times are met, the data will be valid by clock edge n + m. For example, assuming that the clock
cycle time is such that all relevant access times are met, if a READ command is registered at T0 and the latency
is programmed to two clocks, the DQs will start driving after T1 and the data will be valid by T2, as shown in CAS
Latency diagrams.
Reserved states should not be used as unknown operation or incompatibility with future versions may result.
Operating Mode
The normal operating mode is selected by setting M7 and M8 to zero; the other combinations of values for M7 and M8
are reserved for future use and/or test modes. The programmed burst length applies to both READ and WRITE bursts.
10
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Test modes and reserved states should not be used because unknown operation or incompatibility with future
versions may result.
Write Burst Mode
When M9 = 0, the burst length programmed via M0-M2 applies to both READ and WRITE bursts; when M9 = 1, the
programmed burst length applies to READ bursts, but write accesses are single-location (nonburst) accesses.
CAS Latency
T0
T1
T2
T3
READ
NOP
NOP
CLK
COMMAND
tAC
DOUT
DQ
tOH
tLZ
CAS Latency - 2
T0
T1
T2
T3
T4
READ
NOP
NOP
NOP
CLK
COMMAND
tAC
DOUT
DQ
tLZ
tOH
CAS Latency - 3
DON'T CARE
UNDEFINED
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
11
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Extended Mode Register Definition
BA1
BA0
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Address Bus (Ax)
Ext. Mode Reg. (Ex)
PASR
E2 E1 E0 Partial Array Self Refresh Coverage
0 0 0 Fully array (4 banks) - (Default)
0 0 1 Half array (banks 0, 1)
0 1 0 Quarter array (bank 0)
0 1 1 Reserved
1 0 0 Reserved
1 0 1 One-eighth array (1/2 bank 0)
1 1 0 One-sixteenth array (1/4 bank 0)
1 1 1 Reserved
TCSR
E4
0
0
1
1
DS
E6
0
0
1
1
set to "0"
E11 E10 E9
0
0
0
–
–
–
E8
0
–
E7
0
–
E5
0
1
0
1
E3
0
1
0
1
Max. Case Temp.
70oC
45oC
15oC
85oC (Default)
Driver Strength
Full strength driver (Default)
Half strength driver
Quarter strength driver
Reserved
E6-E0
Valid Normal operation
–
All other states reserved
BA1 BA0 Mode Register Definition
0
0 Program Mode Register
0
1 Reserved
1
0 Program Extended mode Register
1
1 Reserved
The extended mode register is programmed via the MODE REGISTER SET command (BA1 = 1, BA0 = 0) and
retains the stored information until it is programmed again or the device loses power. The extended mode register
must be programmed with E7 through E11 set to “0.” The extended mode register must be loaded when all banks are
idle and no bursts are in progress, and the controller must wait the specified time before initiating any subsequent
operation. Violating either of these requirements results in unspecified operation. The extended mode register must be
programmed to ensure proper operation.
Temperature-Compensated Self Refresh (TCSR)
TCSR allows the controller to program the refresh interval during self refresh mode, according to the case temperature
of the mobile device. This allows great power savings during self refresh during most operating temperature ranges.
Only during extreme temperatures would the controller have to select a higher TCSR level that will guarantee data
during self refresh.
12
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Every cell in the DRAM requires refreshing due to the capacitor losing its charge over time. The refresh rate is
dependent on temperature. At higher temperatures a capacitor loses charge quicker than at lower temperatures,
requiring the cells to be refreshed more often. Historically, during self refresh, the refresh rate has been set to
accommodate the worst case, or highest temperature range, expected. Thus, during ambient temperatures, the
power consumed during refresh was unnecessarily high because the refresh rate was set to accommodate the higher
temperatures. Setting E4 and E3 allows the DRAM to accommodate more specific temperature regions during self
refresh. The default for ISSI 128Mb Mobile SDRAM is TCSR = 85°C to guarantee refresh operation. This mode of
operation has a higher current consumption because the self refresh oscillator is set to refresh the SDRAM cells
more often than needed. By using an external temperature sensor to determine the operating temperature the Mobile
SDRAM can be programmed for lower temperature and refresh rates, effectively reducing current consumption by
a significant amount. There are four temperature settings, which will vary the self refresh current according to the
selected temperature. This selectable refresh rate will save power when the Mobile DRAM is operating at normal
temperatures.
Partial-Array Self Refresh (PASR)
For further power savings during self refresh, the PASR feature allows the controller to select the amount of memory
that will be refreshed during self refresh. The refresh options are all banks (banks 0, 1, 2, and 3); two banks (banks
0 and 1); and one bank (bank 0). In addition partial amounts of bank 0 (half or quarter of the bank) may be selected. WRITE and READ commands occur to any bank selected during standard operation, but only the selected banks in
PASR will be refreshed during self refresh. It’s important to note that data in banks 2 and 3 will be lost when the twobank option is used. Data will be lost in banks 1, 2, and 3 when the one-bank option is used.
Driver Strength (DS)
Bits E5 and E6 of the EMR can be used to select the driver strength of the DQ outputs. This value should be set
according to the application’s requirements. The default is Full Driver Strength.
Deep Power Down (DPD)
Deep power down mode is for maximum power savings and is achieved by shutting down power to the entire memory
array of the mobile device. Data will be lost once deep power down mode is executed.
DPD mode is entered by having all banks idle, CS and WE held low, with RAS and CAS HIGH at the rising edge of
the clock, while CKE is LOW. CKE must be held LOW during DPD mode. To exit DPD mode, CKE must be asserted
HIGH. Upon exit from DPD mode, at least 200ms of valid clocks with either NOP or COMMAND INHIBIT commands
are applied to the command bus, followed by a full Mobile SDRAM initialization sequence, is required.
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
13
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Electrical Specifications
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Parameters
Vdd max
Maximum Supply Voltage
Vddq max
Maximum Supply Voltage for Output Buffer
Vin
Input Voltage
Vout
Output Voltage
Pd max
Allowable Power Dissipation
IcsOutput Shorted Current
Topr
Operating Temperature
Com.
Ind.
Tstg
Storage Temperature
Rating
–0.5 to +4.6
–0.5 to +4.6
–0.5 to Vddq + 0.5
–1.0 to Vddq + 0.5
1
50
0 to +70
–40 to +85
–65 to +150
Unit
V
V
V
V
W
mA
°C
°C
°C
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. All voltages are referenced to Vss.
Capacitance Characteristics - x8, x16
Symbol
Cin1
Cin2
Ci/o
Parameters
Input Capacitance: CLK
Input Capacitance: All Other Input Pins
Data Input/Output Capacitance: I/Os
Min.
2.5
2.5
4.0
Max.
3.5
3.8
6.5
Unit
pF
pF
pF
Min.
2.5
2.5
4.0
Max.
3.5
3.8
6.5
Unit
pF
pF
pF
Capacitance Characteristics - x32
Symbol
Cin1
Cin2
Ci/o
14
Parameters
Input Capacitance: CLK
Input Capacitance: All Other Input Pins
Data Input/Output Capacitance: I/Os
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
DC RECOMMENDED OPERATING CONDITIONS
IS42SMxxx - 3.3V Operation
Symbol
Vdd
Vddq
Vih(1)
Vil(2)
Iil
Iol
Voh
Vol
Parameters
Supply Voltage
I/O Supply Voltage
Input High Voltage
Input Low Voltage
Input Leakage Current (0V ≤ Vin ≤ Vdd)
Output Leakage Current (Output disabled, 0V ≤ Vout ≤ Vdd)
Output High Voltage Current (Ioh = -2mA)
Output Low Voltage Current (Iol = 2mA)
Min.
3.0
3.0
2.0
-0.3
-5
-5
2.4
–
Typ.
3.3
3.3
–
–
–
–
–
–
Max.
3.6
3.6
Vddq+0.3
0.8
+5
+5
–
0.4
Unit
V
V
V
V
µA
µA
V
V
Max.
2.7
2.7
Vdd+0.3
0.55
+5
+5
0.2
Unit
V
V
V
V
µA
µA
V
V
IS42RMxxx - 2.5V Operation
Symbol
Vdd
Vddq
Vih(1)
Vil(2)
Iil
Iol
Voh
Vol
Parameters
Supply Voltage
I/O Supply Voltage
Input High Voltage
Input Low Voltage
Input Leakage Current (0V ≤ Vin ≤ Vdd)
Output Leakage Current (Output disabled, 0V ≤ Vout ≤ Vdd)
Output High Voltage Current (Ioh = -2mA)
Output Low Voltage Current (Iol = 2mA)
Min.
2.3
2.3
2.0
-0.3
-5
-5
Vdd-0.2
-
Typ.
2.5
2.5
–
–
–
–
Notes:
1. Vih (overshoot): Vih (max) = Vddq +1.2V (pulse width < 3ns).
2. Vil (undershoot): Vih (min) = -1.2V (pulse width < 3ns).
3. All voltages are referenced to Vss.
Contact Product Marketing for 3.0V + 10% support.
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
15
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
DC ELECTRICAL CHARACTERISTICS VDD = 3.3V/2.5V, x8 and x16
Symbol
Parameter
Test Condition
–6
–7
–75E
Unit
Idd1(1)
Operating Current
One Bank Active, CL = 3, BL = 1,
tCLK = tCLK(min), tRC = tRC(min)
90
85
90
mA
Idd2p (4)
Precharge Standby Current
(In Power-Down Mode)
CKE ≤ Vil (max), tCK = 15ns
CS ≥ Vdd - 0.2V
1
1
1
mA
Idd2ps (4)
Precharge Standby Current With Clock Stop
(In Power-Down Mode)
CKE ≤ Vil (max), CLK ≤ Vil (max)
CS ≥ Vdd - 0.2V
1
1
1
mA
Idd2n(2)
Precharge Standby Current
(In Non Power-Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
tCK = 15 ns
35
35
35
mA
Idd2ns
Precharge Standby Current With Clock Stop
(In Non-Power Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
All Inputs Stable
20
20
20
mA
Idd3p(2)
Active Standby Current
(In Power-Down Mode)
CKE ≤ Vil (max), CS ≥ Vdd - 0.2V
tCK = 15 ns
2
2
2
mA
Idd3ps
Active Standby Current
With Clock Stop
(In Power-Down Mode)
CKE ≤ Vil (max), CLK ≤ Vil (max)
CS ≥ Vdd - 0.2V
2
2
2
mA
Idd3n(2)
Active Standby Current
(In Non Power-Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
tCK = 15 ns
40
40
40
mA
Idd3ns
Active Standby Current
With Clock Stop
(In Non Power-Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
All Inputs Stable
25
25
25
mA
Idd4
Operating Current
All Banks Active, BL =4, CL = 3
tCK = tCK(min)
120
110
120
mA
Idd5
Auto-Refresh Current
tRC = tRC(min), tCLK = tCLK(min)
180
140
180
mA
Idd6
Self-Refresh Current
CKE ≤ 0.2V
1.2
1.2
1.2
mA
Idd7
Self-Refresh: CKE = LOW; tCK = tCK (MIN);
Address, Control, and Data bus inputs are
stable
Full Array, 85oC
Full Array, 45oC
Half Array, 85oC
Half Array, 45oC
1/4th Array, 85oC
1/4th Array, 45oC
1/8th Array, 85oC
1/8th Array, 45oC
1/16th Array, 85oC
1/16th Array, 45oC
Izz (3,4)
Deep Power Down Current
CKE ≤ 0.2V
μA
1200
900
1000
750
900
675
850
640
800
600
15
15
15
μA
Notes:
1. Idd (max) is specified at the output open condition.
2. Input signals are changed one time during 30ns.
3. Izz values shown are nominal at 25oC. Izz is not tested.
4. Tested after 500ms delay.
16
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
DC ELECTRICAL CHARACTERISTICS VDD = 3.3V/2.5V, x32
Symbol
Parameter
Test Condition
–65
–7
Unit
Idd1
Operating Current
One Bank Active, CL = 3, BL = 1,
tCLK = tCLK(min), tRC = tRC(min)
140
135
mA
Idd2p (4)
Precharge Standby Current
(In Power-Down Mode)
CKE ≤ Vil (max), tCK = 15ns
CS ≥ Vdd - 0.2V
1
1
mA
Idd2ps (4)
Precharge Standby Current With Clock Stop
(In Power-Down Mode)
CKE ≤ Vil (max), CLK ≤ Vil (max)
CS ≥ Vdd - 0.2V
1
1
mA
Idd2n(2)
Precharge Standby Current
(In Non Power-Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
tCK = 15 ns
45
45
mA
Idd2ns
Precharge Standby Current With Clock Stop
(In Non-Power Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
All Inputs Stable
30
30
mA
Idd3p(2)
Active Standby Current
(In Power-Down Mode)
CKE ≤ Vil (max), CS ≥ Vdd - 0.2V
tCK = 15 ns
4
4
mA
Idd3ps
Active Standby Current
With Clock Stop
(In Power-Down Mode)
CKE ≤ Vil (max), CLK ≤ Vil (max)
CS ≥ Vdd - 0.2V
3
3
mA
Idd3n(2)
Active Standby Current
(In Non Power-Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
tCK = 15 ns
55
55
mA
Idd3ns
Active Standby Current
With Clock Stop
(In Non Power-Down Mode)
CS ≥ Vdd - 0.2V, CKE ≥ Vih (min)
All Inputs Stable
30
30
mA
Idd4
Operating Current
All Banks Active, BL =4, CL = 3
tCK = tCK(min)
180
170
mA
Idd5
Auto-Refresh Current
tRC = tRC(min), tCLK = tCLK(min)
180
170
mA
Idd6
Self-Refresh Current
CKE ≤ 0.2V
1.2
1.2
mA
(1)
o
Idd7
Self-Refresh: CKE = LOW; tCK = tCK (MIN);
Address, Control, and Data bus inputs are
stable
Full Array, 85 C
Full Array, 45oC
Half Array, 85oC
Half Array, 45oC
1/4th Array, 85oC
1/4th Array, 45oC
1/8th Array, 85oC
1/8th Array, 45oC
1/16th Array, 85oC
1/16th Array, 45oC
Izz (3,4)
Deep Power Down Current
CKE ≤ 0.2V
μA
1200
900
1000
750
900
675
850
640
800
600
15
15
μA
Notes:
1. Idd (max) is specified at the output open condition.
2. Input signals are changed one time during 30ns.
3. Izz values shown are nominal at 25oC. Izz is not tested.
4. Tested after 500ms delay.
5. Not available for 2.5V, x32 option
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
17
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
AC ELECTRICAL CHARACTERISTICS (1, 2, 3)
-64
Min. Max.
6
–
Symbol Parameter
tCK3
Clock Cycle Time
CAS Latency = 3
tCK2
tAC3
Access Time From CLK
CAS Latency = 2
CAS Latency = 3
10
–
tAC2
tCHI
tCL
tOH3
CAS Latency = 2
CLK HIGH Level Width
CLK LOW Level Width
Output Data Hold Time
-7
-75E
Min. Max. Unit
–
–
ns
Min.
7
Max.
–
–
5.4
10
–
–
5.4
7.5
–
–
–
ns
ns
CAS Latency = 3
–
2.5
2.5
2.7
8
–
–
–
–
2.5
2.5
2.7
8
–
–
–
–
2.5
2.5
2.7
5.5
–
–
–
ns
ns
ns
ns
tOH2
tLZ
tHZ
CAS Latency = 2
Output LOW Impedance Time
Output HIGH Impedance Time CAS Latency = 3
2.7
0
2.7
–
–
5.4
2.7
0
2.7
–
–
5.4
2.7
0
2.7
–
–
–
ns
ns
ns
CAS Latency = 2
tDS
tDH
tAS
tAH
tCKS
tCKH
tCS
Input Data Setup Time (2)
Input Data Hold Time (2)
Address Setup Time (2)
Address Hold Time (2)
CKE Setup Time (2)
CKE Hold Time (2)
Command Setup Time (CS,
RAS, CAS, WE, DQM)(2)
Command Hold Time (CS,
RAS, CAS, WE, DQM)(2)
Command Period (REF to REF
/ ACT to ACT)
Command Period (ACT to
PRE)
Command Period (PRE to
ACT)
Active Command to Read/
Write Command Delay Time
Command Period (ACT [0] to
ACT [1])
Input Data to Precharge
Command Delay Time
Input Data to Active/Refresh
Command Delay Time (During
Auto-Precharge)
Mode Register Program Time
Power Down Exit Setup Time
Self-Refresh Exit Time
Transition Time
Refresh Cycle Time (4096)
2.7
1.5
1.0
1.5
1.0
1.5
1.0
1.5
8
–
–
–
–
–
–
–
2.7
1.5
1.0
1.5
1.0
1.5
1.0
1.5
8
–
–
–
–
–
–
–
2.7
1.5
1.0
1.5
1.0
1.5
1.0
1.5
5.5
–
–
–
–
–
–
–
ns
ns
ns
ns
ns
ns
ns
1.0
–
1.0
–
1.0
–
ns
60
–
67.5
–
67.5
–
ns
42
100K
45
100K
45
100K
ns
18
–
20
–
15
–
ns
18
–
20
–
15
–
ns
12
–
14
–
15
–
ns
12
–
14
–
15
–
ns
30
–
35
–
30
–
ns
12
6
70
0.3
–
–
–
–
1.2
64
14
7
70
0.3
–
–
–
–
1.2
64
15
7.5
70
0.3
–
–
–
–
1.2
64
ns
ns
ns
ns
ms
tCH
tRC
tRAS
tRP
tRCD
tRRD
tDPL
tDAL
tMRD
tDDE
tSRX
tT
tREF
Notes:
1. The power-on sequence must be executed before starting memory operation.
2. Measured with tT = 1 ns. If clock rising time is longer than 1ns, (tR /2 - 0.5) ns should be added to the parameter.
3. The reference level is 1.4V when measuring input signal timing. Rise and fall times are measured between
Vih(min.) and Vil (max).
4. Not available for 2.5V, x32 option.
18
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
OPERATING FREQUENCY/LATENCY RELATIONSHIPS
Symbol
Parameter
-6
-7
-75E
Units
—
Clock Cycle Time
6
7
7.5
ns
—
Operating Frequency
166
143
133
MHz
tcac
CAS Latency
3
3
2
cycle
trcd
Active Command To Read/Write Command Delay Time
3
3
2
cycle
trac
RAS Latency (trcd + tcac)
6
6
4
cycle
trc
Command Period (REF to REF / ACT to ACT)
10
10
9
cycle
tras
Command Period (ACT to PRE)
7
7
6
cycle
trp
Command Period (PRE to ACT)
3
3
2
cycle
trrd
Command Period (ACT[0] to ACT [1])
2
2
2
cycle
tccd
Column Command Delay Time
1
1
1
cycle
(READ, READA, WRIT, WRITA)
tdpl
Input Data To Precharge Command Delay Time
2
2
2
cycle
tdal
Input Data To Active/Refresh Command Delay Time
5
5
4
cycle
3
3
2
cycle
0
0
0
cycle
3
3
2
cycle
0
0
0
cycle
(During Auto-Precharge)
trbd
Burst Stop Command To Output in HIGH-Z Delay Time
(Read)
twbd
Burst Stop Command To Input in Invalid Delay Time
(Write)
trql
Precharge Command To Output in HIGH-Z Delay Time
(Read)
twdl
Precharge Command To Input in Invalid Delay Time
(Write)
tpql
Last Output To Auto-Precharge Start Time (Read)
–2
–2
–2
cycle
tqmd
DQM To Output Delay Time (Read)
2
2
2
cycle
tdmd
DQM To Input Delay Time (Write)
0
0
0
cycle
tmrd
Mode Register Set To Command Delay Time
2
2
2
cycle
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
19
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Ordering Information – Vdd = 3.3V
Commercial Range: (0°C to +70°C)
Configuration
16Mx8
8Mx16
4Mx32
Frequency (MHz)
143
166
Speed (ns)
7
6
143
7
166
6
143
7
Order Part No.
IS42SM81600E-7TL
IS42SM16800E-6TL
IS42SM16800E-6BL
IS42SM16800E-7TL
IS42SM16800E-7BL
IS42SM32400E-6TL
IS42SM32400E-6BL
IS42SM32400E-7TL
IS42SM32400E-7BL
Package
54-pin TSOP II, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA, Lead-free
86-pin TSOP II, Lead-free
90-Ball BGA, Lead-free
86-pin TSOP II, Lead-free
90-Ball BGA, Lead-free
Order Part No.
IS42SM81600E-7TLI
IS42SM16800E-6TLI
IS42SM16800E-6BLI
IS42SM16800E-7TLI
IS42SM16800E-7BI
IS42SM16800E-7BLI
IS42SM16800E-75EBLI
IS42SM32400E-6TLI
IS42SM32400E-6BLI
IS42SM32400E-7TLI
IS42SM32400E-7BI
IS42SM32400E-7BLI
Package
54-pin TSOP II, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA
54-Ball BGA, Lead-free
54-Ball BGA, Lead-free
86-pin TSOP II, Lead-free
90-Ball BGA, Lead-free
86-pin TSOP II, Lead-free
90-Ball BGA
90-Ball BGA, Lead-free
Industrial Range: (–40ºC to 85ºC)
Configuration
16Mx8
8Mx16
4Mx32
Frequency (MHz)
143
166
Speed (ns)
7
6
143
7
133
166
7.5
6
143
7
*Contact ISSI for Leaded Parts Support.
20
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Ordering Information – Vdd = 2.5V
Commercial Range: (0°C to +70°C)
Configuration
16Mx8
8Mx16
4Mx32
Frequency (MHz)
143
166
Speed (ns)
7
6
143
7
143
7
Order Part No.
IS42RM81600E-7TL
IS42RM16800E-6TL
IS42RM16800E-6BL
IS42RM16800E-7TL
IS42RM16800E-7BL
IS42RM32400E-7TL
IS42RM32400E-7BL
Package
54-pin TSOP II, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA, Lead-free
86-pin TSOP II, Lead-free
90-Ball BGA, Lead-free
Order Part No.
IS42RM81600E-7TLI
IS42RM16800E-6TLI
IS42RM16800E-6BLI
IS42RM16800E-7TLI
IS42RM16800E-7BI
IS42RM16800E-7BLI
IS42RM32400E-7TLI
IS42RM32400E-7BI
IS42RM32400E-7BLI
Package
54-pin TSOP II, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA, Lead-free
54-pin TSOP II, Lead-free
54-Ball BGA
54-Ball BGA, Lead-free
86-pin TSOP II, Lead-free
90-Ball BGA
90-Ball BGA, Lead-free
Industrial Range: (–40ºC to 85ºC)
Configuration
16Mx8
8Mx16
4Mx32
Frequency (MHz)
143
166
Speed (ns)
7
6
143
7
143
7
*Contact Product Marketing for Leaded Parts Support.
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
21
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Θ
NOTE :
1. Controlling dimension : mm
Θ
2. Dimension D and E1 do not include mold protrusion .
3. Dimension b does not include dambar protrusion/intrusion.
09/01/2006
4. Formed leads shall be planar with respect to one another within 0.1mm
at the seating plane after final test.
Package Outline
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
22
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Package Outline
10/17/2007
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
23
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
Θ
NOTE :
1. Controlling dimension : mm
Θ
2. Dimension D and E1 do not include mold protrusion .
3. Dimension b does not include dambar protrusion/intrusion.
09/26/2006
4. Formed leads shall be planar with respect to one another within 0.1mm
at the seating plane after final test.
Package Outline
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
24
IS42SM81600E / IS42SM16800E / IS42SM32400E
IS42RM81600E / IS42RM16800E / IS42RM32400E
D1
0.80
Package Outline
0.45
NOTE :
1. CONTROLLING DIMENSION : MM .
2. Reference document : JEDEC MO-207
08/14/2008
Integrated Silicon Solution, Inc. - www.issi.com
Rev. B
04/15/2011
25