KEC KPF201G03

SEMICONDUCTOR
KPF500G03 ~ KPF102G03
TECHNICAL DATA
Semiconductor Pressure Sensor
FEATURES
Broad Pressure Range : 50~1,000kPa.
High Sensitivity, Excellent Linearity.
Highly Stable in Temperature Change.
APPLICATIONS
Medical Deivces.
Industrial Instrumentations.
Pressure Switch, Water Height Control, Pneumatic Devices etc.
Home Appliances.
MODEL NUMBER FOR ORDERING
KP F 000 G 00 A
Package Pin Configuration
No Mark : Standard
A : Type 1
Silicon Pressure Sensor
ON/OFF Chip
N:ON Chip (Amplified)
Rated Pressure
F:OFF Chip (Not Amplified) 123
12 103=12,000kPa
Measuring Pressure
A : Absolute Pressure
D : Differential Pressure
G : Gage Pressure
Package Type
00 : Die
01~ : Package Series
PSM1
MAXIMUM RATING
ITEM
SPEC.
UNIT
Model No.
KPF500G03
KPF101G03
KPF201G03
KPF401G03
KPF601G03
KPF801G03
KPF102G03
-
Classification
500
101
201
401
601
801
102
-
50
100
200
400
600
800
1000
kPa
0.51
1.02
2.04
4.08
6.12
8.16
10.20
-50 ~ 50
-100 ~ 100
-100 ~ 200
-100 ~ 400
-100 ~ 600
-100 ~ 800
-100 ~ 1000
Rated Pressure
Measurable Pressure Range
Maximum Pressure Load
Twice of Rated Pressure
1.5 Times of Reated Pressure
Bridge Impedance
3000 ~ 6000
Operating Temperature
-20 ~ 100
Storage Temperature
-40 ~ 120
kgf/
kPa
kPa(kgf/ )
ELECTRICAL CHARACTERISTICS
ITEM
SPEC.
Classification
Test Condition
500
101
201
Operating Input Current 1.5
401
601
801
constant, Ambient Temperature Ta=25
Compensational Temperature Range
0 ~ 50
Full Scale Voltage
60 ~ 140
Offset Voltage
UNIT
102
-
mV
20
mV
Linearity
0.3
%FS
Pressure Hysteresis
0.5
%FS
2
msec
Temperature Coefficient Of Offset (TCO)
5.0
%FS
Temperature Coefficient Of Sensitivity (TCS)
2.5
%FS
Mechanical Response Time
Comment) 1. Operating humidity 25~80%RH. (unless otherwise noted)
2. Please, consult us when you use any other pressure media except air.
2007. 6. 15
Revision No : 8
1/4
KPF500G03 ~ KPF102G03
RELIABILITY TEST
ITEMS
TEST CONDITIONS
High Temp. Storage
120
Low Temp. Storage
-40 , 1000hrs
, 1000hrs
Steady State Operating
25
Low Temp. Operating
-20 , 1 million times, Rated Pressure
Life Test
High Temp. Operating
100
Temperature / Humidity Operating
40
Heat Resistance
260
Environment Test
Temp. Cycle
5
, 1 million times, Rated Pressure
, 1 million times, Rated Pressure
, 90%RH, 1 million times, Rated Voltage
, 10 seconds
-40 ~120 , 30minutes/1Cycle, 100Cycles
Amplitude : 1.5mm, Frequency : 10~55Hz,
X, Y, Z(3-directions), 2 hrs each direction
Vibration
Drop
75cm height, 2 times
Mechanical Test
Lead Fatigue
Tensile Strength : 9.8N(1kgf), 10seconds
Bending Strength : 4.9N(0.5kgf), Right/Left 90 , 1time
Solderability
230
, 5 seconds
CHARACTERISTIC GRAPHS
2. Temperature Coefficient of Offset (TCO)
Operating Input Current : 1.5mA, Spec. : +_ 5.0 %FS
120
80
TCO (%FS)
Full Scale Voltage (mV)
100
60
40
20
0
5.0
2.5
4.0
2.0
3.0
1.5
2.0
1.0
1.0
0
-1.0
0
1/2Pr
0.5
0
-0.5
-2.0
-1.0
-3.0
-1.5
-4.0
-2.0
-5.0
-20
3. Temperature Coefficient of Sensitivity (TCS)
Operating Input Current : 1.5mA, Spec. : +_ 2.5%FS
TCS (%FS)
1. Full Scale Voltage Characteristics
Operating Input Current : 1.5mA, Temperature : 25 C
Pr
-2.5
0
Rated Pressure (kPa)
25
Temperature ( C)
50
0
25
50
Temperature ( C)
4. High Temperature continuous Operating Test
100°C, 1 million times : After testing, offset and full scale voltage variation is very small.
Offset Voltage Variation
Full Scale Voltage Variation
3
Full Scale Voltage Variation (%FS)
Offset Voltage Variation (%FS)
3
2
1
0
-1
-2
-3
2
1
0
-1
-2
-3
0
500,000
1,000,000
Pressure Cycle
2007. 6. 15
0
500,000
1,000,000
Pressure Cycle
Revision No : 8
2/4
KPF500G03 ~ KPF102G03
PACKAGE DIMENSIONS AND PC BOARD PATTERN (Unit :mm)
Pressure Inlet Φ1.1
7
7
Φ3
10.5
3
0.8
3.5
0.25
Max 15
0.8
0.15
_ 0.25
2.5 +
_ 0.25
2.5 +
1.7
6
1
1.4
Logo
2.5
Model No
2
5
Remark
Lot No
2.5
3
4
Land-pads
9.4
PIN CONFIGURATION
i = 1.5mA
Terminal No.
Meaning
1
(+)Input
2
(+)Output
1
3
(-)Input
4
(-)Input
5
(-)Output
R1
R4
Constant
current
source
+
2
5
R2
R3
V
4
6
Open
3
-
2007. 6. 15
Revision No : 8
3/4
KPF500G03 ~ KPF102G03
Note
1. Mounting on printed circuit boards
When mounting a transistor on a printed circuit, it is assumed that
lead wires will be processed or reformed due to space limitation or
relations with other components. Even if no such special
processing reforming is conducted exercise care on the following
points :
(a) Make the spaces of lead wire inserting holes on the printed
circuit board the same as those of lead wires on a transistor.
(b) Even if The spaces are not the same, do not pull the lead
wires or push heavily against the sensor element.
(c) Use a spacer for form a lead maintain space between a sensor
and a printed circuit board, rather than closely contacting
them with each other.
(d) When forming a lead prior to mounting onto a board
- Bend the lead at a point 3mm or more apart from the
body(Lead root).
- Bend one lead wire after securing the other lead wire. (near
the main body)
- Keep space between the sensor main body and and a fixing
jig.
- When bending the lead along the jig, be careful not to
damage it with an edge of the jig.
- Follow other precautions described in respective standard
(e) When mounting a sensor onto a heat sink
- Use the specified accessory.
- Drill threaded holes on the heat kink as per specifications
and keep the surface free from burrs and undulations.
- Use KEC’s recommended silicon grease.
- Tighten the screw within the specified torque.
- Never apply a pneumatic screwdriver to a transistor main
body.
(f) Do not bend or stretch the lead wires repeatedly.
When pulling in the axial directions, apply 500g or 600g
power, depending on the shapes of lead wires.
2. Soldering
When soldering a sensor to a printed circuit board, the soldering
temperature is usually so high that it adversely affects the sensor.
Normally, tests are conducted at a soldering temperature of 265
for 10 seconds or 300
for 3 seconds. Be sure to complete
soldering procedures under these conditions of temperature and
time.
Be careful to select a type of flux that will neither corrode the
lead wires nor affect the electrical characteristics of a sensor.
The basic precautions for soldering procedures are as follows :
(a) Complete soldering procedures in a time as short as possible.
(b) Do not apply stress to a sensor after soldering by correcting
or modifying its location or direction.
(c) For a sensor employing a heat sink, mount it on the heat sink
first: then solder this unit to a printed circuit board after
confirming that it is fully secured.
(d) Do not directly solder the heat-radiating portion of a sensor
to a printed circuit board.
(e) In flow solder jobs, sensors are apt to float on the solder due
to solder surface tension. When adjusting the locations of
sensor, be careful not to apply excessive stress to the roots of
the sensor lead wires.
(f) When using a soldering iron select those which have less
leakage, and be sure to ground the soldering iron.
3. Cleaning a circuit board
After soldering, circuit boards must be cleaned to remove flux.
Observe the following precautions while cleaning them
(a) When cleaning circuit boards to remove flux, make sure that
no residual reactive ions such as Na or Cl ions remain. Note
that organic solvents react with water to generate hydrogen
chloride and other corrosive gases which can degrade device
performance.
(b) Do not rub the indication marks with a brush or one’s fingers
when cleaning or while a cleaning agent is applied to the
markings.
(c) There are ultrasonic wave cleaning methods which offer a
high cleaning effect within a short time. Since there methods
involve a complicated combination of factors such as the
cleaning bath size, ultrasonic wave vibrator output, and
printed circuit board mounting method, there is fear that the
service life of airtight seal-type sensors may be extremely
shortened. Therefore, as far as possible avoid using the
ultrasonic wave cleaning method.
- Basic requirements of ultrasonic wave cleaning method.
Frequency : 27~29kHz
Output : 300W or less (300W/ or less)
Recommended solvents : Refer to details above
Cleaning time : 30seconds or less
Constant Current
Circuit Unit
Application circuit
The Pressure sensor is designed to convert a voltage by means of
constant current drive and then, if nesessary, it amplifies the
Pressure
Sensor
Amplifier Circuit Unit
OP
AMP
voltage for use. The circuit shown below is a typical example of a
OP
AMP
circuit in which the pressure sensor is used.
OP
AMP
2007. 6. 15
Revision No : 8
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